JP2007080153A - Non-contact data carrier inlet, non-contact data carrier inlet roll, non-contact data carrier, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make thin a metal dealing type non-contact data carrier while improving its productivity. <P>SOLUTION: A non-contact data carrier 1 of the present invention mainly includes: a magnetic substrate J1 formed from a magnetic material such as Ni-Zn ferrite; an IC chip C on which a storage circuit and a communication control circuit are packaged; and an antenna coil A formed on one principal surface 19a of the magnetic substrate J1 and electrically connected to the IC chip. Thus, the non-contact data carrier 1 itself can be made thin without increasing manufacturing stages such as sticking a magnetic substance later. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a non-contact type data carrier, and relates to a non-contact type data carrier inlet, a non-contact type data carrier inlet roll and the non-contact type data carrier, and manufacturing methods thereof.

  If there is a conductor such as a metal in the field of the AC magnetic field, an eddy current is generated inside the conductor, and this eddy current becomes a demagnetizing field in a direction to cancel the AC magnetic field. For this reason, the non-contact type data carrier employing the electromagnetic induction method may not be able to respond to the reader / writer in an environment where eddy currents may be generated.

Therefore, in order to prevent electromagnetic waves from passing through a conductor such as a metal, a magnetic material such as ferrite having a high magnetic permeability is disposed between the conductor and the antenna coil on the non-contact data carrier side. Techniques for preventing the generation of current have been proposed. (For example, refer to Patent Document 1).
Japanese Patent No. 3262948

  Here, in the existing technology, a metal-compatible non-contact type that prevents the generation of the eddy current described above, for example, by attaching a magnetic material to the non-contact type data carrier inlet on which the IC chip is mounted, for example. A data carrier inlet has been created. However, such a manufacturing method has a problem that the number of manufacturing processes increases due to the retrofitting of a magnetic material, and a problem that a non-contact data carrier as a product becomes thick.

  Accordingly, the present invention has been made to solve the above-described problems, and improves the productivity of a metal-compatible non-contact data carrier while realizing a reduction in thickness of the non-contact data carrier inlet and non-contact data. It is an object of the present invention to provide a carrier inlet roll, a non-contact type data carrier, and a manufacturing method thereof.

  In order to achieve the above object, a non-contact type data carrier inlet according to the present invention includes a magnetic substrate formed of a magnetic material, an IC chip on which at least a memory circuit and a communication control circuit are mounted, and the magnetic substrate. And an antenna electrically connected to the IC chip.

  A non-contact type data carrier inlet according to the present invention is formed of a magnetic material and includes a first main surface and a second main surface located on a side opposite to the first main surface. And an antenna coil formed on the first main surface of the magnetic base material, and one antenna coil formed on the first main surface of the magnetic base material and at one end of the antenna coil. A pair of chip mounting patterns to which the patterns are connected; an IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns; and a surrounding portion of the antenna coil as the magnetic substrate. It is formed on the second main surface of the magnetic base so as to straddle over, one end is connected to the other end of the antenna coil, and the other end is the other of the chip mounting pattern. And layers Characterized by comprising a relay pattern connected.

  Furthermore, the non-contact type data carrier inlet according to the present invention includes a magnetic base material formed of a magnetic material, an antenna coil formed on the main surface of the magnetic base material, and one end and the other end of the antenna coil. A pair of chip mounting patterns formed on the main surface of the magnetic base material in a state where one and the other patterns are connected to the part, respectively, and provided at positions straddling the surrounding portion of the antenna coil, and And an IC chip on which at least a memory circuit and a communication control circuit are mounted on a pair of chip mounting patterns.

  A non-contact type data carrier inlet according to the present invention is formed of a magnetic material and includes a first main surface and a second main surface located on a side opposite to the first main surface. And the antenna coil formed on the first main surface of the magnetic base material, and the outer peripheral side and the inner peripheral side of the surrounding portion of the antenna coil are provided so as to straddle the magnetic base material. In addition, the base ends of the one and other patterns and the inner and outer peripheral ends of the antenna coil are individually connected to each other and disposed at the distal ends of the one and the other patterns, respectively. Each land portion is mounted on a pair of chip mounting patterns provided on the second main surface at a position facing the circumferential portion with the magnetic base material interposed therebetween, and the pair of chip mounting patterns. At least memory circuit An IC chip to be mounted fine communication control circuit, characterized by comprising a.

In these inventions, the magnetic material is applied to the constituent material of the base material of the non-contact type data carrier inlet, the antenna coil is formed on a predetermined main surface of the magnetic base material, and the IC chip is further mounted. As a result, the metal-compatible non-contact data carrier can be manufactured without increasing the number of manufacturing processes such as attaching a magnetic material to the non-contact data carrier inlet, and by reducing the thickness of the product itself. Can be produced. Therefore, according to these inventions, it is possible to reduce the thickness of the metal-compatible non-contact data carrier that prevents the generation of eddy currents while improving the productivity.
Here, the magnetic base material (magnetic body) formed of the above-described magnetic material is a so-called soft magnetic body or metal-based magnetic body. Further, in the non-contact type data carrier manufactured using the non-contact type data carrier inlet of the present invention, the non-formation surface side of the antenna coil (around portion) in the magnetic base is attached to the conductor such as metal. Become.

The non-contact type data carrier inlet according to the present invention is connected to the antenna coil on the magnetic base material, and adjusts the capacitance of the entire LC circuit by removing at least part of the magnetic base material. It further comprises a possible capacitance adjustment pattern.
In this invention, the resonance frequency of the non-contact type data carrier inlet can be tuned by selectively removing at least a part of the capacitance adjustment pattern from the magnetic base material.

Further, the non-contact type data carrier inlet according to the present invention has a circular portion patterned so that the antenna circulates on a predetermined main surface of the magnetic base material, and further, over the magnetic base material. Further, a metal layer is laminated on a non-formation surface side of the surrounding portion of the magnetic base so as to substantially cover a formation region of the surrounding portion of the antenna.
In the present invention, the resonance frequency including the metal layer is taken into consideration in consideration of the use environment of the non-contact type data carrier in which a conductor such as metal is in the close position, that is, the fluctuation of the resonance frequency of the non-contact type data carrier. Can be tuned by a single data carrier, which improves communication sensitivity and other characteristics.
In the present invention, since the mechanical strength of the magnetic base material itself can be improved by the metal layer laminated on the magnetic base material, in the supply of the manufacturing parts of the metal-compatible non-contact data carrier, for example, Therefore, it is possible to suitably supply components in the form of a roll to which a relatively high tensile stress or bending stress can be applied, thereby increasing the productivity of the non-contact type data carrier.

Furthermore, in the non-contact type data carrier inlet according to the present invention, the magnetic base material is characterized in that a reinforcing layer having electrical insulation for reinforcing the base material itself is laminated.
In the present invention, similarly to the above, component supply in the form of a roll can be easily realized, and the productivity of the non-contact type data carrier can be improved.

In the non-contact type data carrier inlet according to the present invention, the antenna is formed on the reinforcing layer side laminated on the magnetic base material.
According to the present invention, in addition to improving the strength of the magnetic base material, it is possible to increase the distance between the magnetic layer portion of the magnetic base material and the antenna coil. Communication distance can be extended and communication sensitivity characteristics can be improved.

Further, in the non-contact type data carrier inlet according to the present invention, the magnetic base material has a plurality of magnetic layers formed of a magnetic material, and the reinforcing layer is between the plurality of magnetic layers. It is characterized by being interposed in.
In this invention, in addition to the improvement of the strength of the magnetic layer described above, a laminated structure composed of a plurality of magnetic layers and reinforcing layers without forming a thick magnetic layer that is generally difficult to manufacture. In this portion, an effect almost equivalent to that of a single magnetic layer having a thickness corresponding to the total thickness of the laminated structure portion can be expected.
That is, according to the present invention, the communication distance of the non-contact type data carrier as a product can be substantially extended as well as the case where a relatively thick magnetic layer is formed, and the shield against a conductor such as metal is possible. (Eddy current generation prevention function) can be improved.

In the non-contact type data carrier inlet according to the present invention, the antenna and / or the metal layer are directly formed on the magnetic base material by plating or vapor deposition.
According to the present invention, it is possible to further reduce the thickness of the produced non-contact data carrier.
Furthermore, in this invention, since the antenna and metal layer which have electroconductivity are directly formed on a magnetic base material, it has high insulation as a magnetic material for forming a magnetic base material. For example, it is desirable to apply Mn—Zn ferrite, Ni—Zn ferrite, or the like.

Furthermore, in the non-contact type data carrier inlet according to the present invention, the antenna and / or the metal layer are laminated on the magnetic base material via an adhesive layer. Here, the adhesive layer is preferably made of a material having resistance to an etching process.
That is, according to the above-described invention, it is possible to suppress the corrosion of the magnetic base material due to the influence of, for example, an etching solution used in the etching process by the above-described adhesive layer.

Further, the non-contact type data carrier inlet roll according to the present invention is characterized in that a sheet-like member carrying a plurality of non-contact type data carrier inlets is wound into a roll shape. To do.
According to this invention, the magnetic substrate is reinforced by the reinforcing layer or the metal layer so that it can withstand relatively high tensile stress and bending stress. In this way, it is possible to increase the productivity of non-contact data carriers.

  Furthermore, the non-contact type data carrier according to the present invention is configured by covering any of the non-contact type data carrier inlets described above with an exterior.

  In addition, the method of manufacturing a non-contact type data carrier inlet according to the present invention includes a step of forming an antenna base by forming an antenna on a main surface of a magnetic base made of a magnetic material, and the antenna base Mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted so as to be electrically connected to the antenna.

  Furthermore, in the method for manufacturing a non-contact type data carrier inlet according to the present invention, an antenna coil and a pair of chip mounting patterns in which one pattern is connected to one end of the antenna coil are formed of a magnetic material. A first pattern forming step formed on the first main surface of the magnetic substrate, one end of which is connected to the other end of the antenna coil, and the other end of the pair of chip mounting patterns; The relay pattern to be connected to the other layer is connected to the side opposite to the first main surface of the magnetic base so that the surrounding portion of the antenna coil extends over the magnetic base. A second pattern manufacturing step formed on the second main surface positioned, and the first and second pattern manufacturing steps, or after passing through these steps, one end of the relay pattern and the antenna A step of producing an antenna substrate by performing interlayer connection with the other end of the coil and interlayer connection between the other end of the relay pattern and the other of the pair of chip mounting patterns; and the produced antenna Mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns of the base material.

  The non-contact type data carrier inlet manufacturing method according to the present invention includes an antenna coil, and one and the other pattern connected to one end and the other end of the antenna coil, respectively, and A step of producing an antenna substrate by forming a pair of chip mounting patterns respectively arranged at straddling positions on the main surface of the magnetic substrate formed of a magnetic material, and the produced antenna substrate And a chip mounting step of mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns.

  Furthermore, the manufacturing method of the non-contact type data carrier inlet according to the present invention includes a first pattern manufacturing step of forming an antenna coil on a first main surface of a magnetic base formed of a magnetic material, one and the other. A pair of chip mounting patterns provided at positions where each land portion arranged at the tip of each pattern is opposed to the surrounding portion of the antenna coil with the magnetic base material interposed therebetween are arranged on the surrounding portion of the antenna coil. A second main surface formed on the second main surface of the magnetic base material on the side facing the first main surface so as to straddle between the outer peripheral side and the inner peripheral side over the magnetic base material; And after the first and second pattern fabrication steps or after these steps, the base ends of the pair of chip mounting patterns and the inner and outer circumferential sides of the antenna coil End of Forming an antenna base by individually connecting the layers, and mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns of the manufactured antenna base And a process.

Furthermore, the manufacturing method of the non-contact type data carrier inlet roll according to the present invention comprises a roll of a sheet-like member carrying a plurality of non-contact type data carrier inlets produced by the method described above. A non-contact type data carrier inlet roll is produced by winding.
The non-contact type data carrier inlet manufacturing method of the present invention is characterized in that the non-contact type data carrier inlet manufactured by the above-described method is covered with an exterior.

  As described above, according to the present invention, the non-contact type data carrier inlet, the non-contact type data carrier inlet roll, and the non-contact type that realize the thinning while improving the productivity of the metal-compatible non-contact type data carrier. Data carriers as well as methods of manufacturing these can be provided.

The best mode for carrying out the present invention will be described below with reference to the drawings.
(First embodiment)
1 is a view of the non-contact type data carrier inlet according to the first embodiment of the present invention as viewed from one main surface side, and FIG. 2 is a cross-sectional view of the non-contact type data carrier inlet as viewed from the side. These are the figures which looked at this non-contact-type data carrier inlet from the other main surface side. FIG. 4 is a block diagram functionally showing the configuration of this non-contact type data carrier inlet, and FIG. 5 shows a non-contact type data carrier constructed by covering the non-contact type data carrier inlet with an exterior. FIG. 6 is a cross-sectional view of the non-contact data carrier of FIG. 5 as viewed from the side. 1, 3 and 5 show the conductor pattern including the antenna coil in the form of hatching. In each figure, the conductor pattern located on the near side and the conductor located on the far side from the near side are shown. Each pattern is distinguished by changing the direction of hatching with the pattern. Moreover, about the conductor pattern located in the side (back side) far from the near side, the outline is shown with the broken line.

  As shown in FIGS. 1 to 4, the non-contact type data carrier inlet 2 a according to this embodiment is a rectangular and plate-shaped (sheet-shaped) magnetic substrate (magnetic) formed of a magnetic material (magnetic material). Substrate) J1, an antenna coil A formed on one main surface of the magnetic substrate J1, and a pair of connection patterns 8a and 8b connected in parallel to the antenna coil A on the magnetic substrate J1. Further, the non-contact type data carrier inlet 2a includes an IC chip C mounted on a pair of chip mounting patterns 5a and 5b formed on one main surface on the magnetic substrate J1, and a magnetic substrate J1. A plurality of pairs of tuning patterns (capacitance adjustment patterns) 15a, 15b, 16a, 16b, 17a, 17b, 18a respectively wired on one main surface and the other main surface via a pair of connection patterns 8a, 8b. , 18b and through-hole-forming regions (tunable execution regions) 15, 16, 17, 18 are provided.

  The magnetic substrate J1 includes two main surfaces, one main surface (first main surface) 19a and the other main surface (second main surface) 19b. The antenna coil A is patterned so as to circulate a plurality of times on one main surface 19a of the magnetic substrate J1. Further, the pair of connection patterns 8a and 8b are electrically connected to the antenna coil A on the magnetic substrate J1, respectively, and extend on one main surface 19a and the other main surface 19b of the magnetic substrate J1, respectively. Wired to Specifically, the one end 3a of the antenna coil A and the base end portion of the one connection pattern 8a are connected to the one chip mounting pattern 5a described above, and on the one chip mounting pattern 5a. One of the connection bumps 9a of the IC chip C is connected.

The other end portion 3b of the antenna coil A is connected to one end portion Ya of a jumper wire Y as a relay pattern wired on the other main surface 19b of the magnetic base material J1 via a caulking portion 6a. The other end portion Yb of the jumper wire Y is connected to the base end portion of the other chip mounting pattern 5b wired on the one main surface 19a of the magnetic substrate J1 through the crimping portion 6b. The other end of the connection bump 9a of the IC chip C is connected to the tip of the other chip mounting pattern 5b. Furthermore, the other end portion Yb of the jumper wire Y is connected to the base end portion of the other connection pattern 8b on the other main surface 19b of the magnetic substrate J1.
That is, the jumper wire Y wired in this way is formed on the other main surface 19b side of the magnetic base material J1 so as to straddle the surrounding portion of the antenna coil A over the magnetic base material J1, and one end portion thereof. Ya is interlayer-connected via the other end 3b of the antenna coil A and the crimping portion 6a, and the other end Yb is interlayer-connected via the other chip mounting pattern 5b and the crimping portion 6b.

  In addition, each pair of tuning patterns 15a, 15b, 16a, 16b, 17a, 17b, 18a, and 18b is connected to each of the pair of connection patterns 8a and 8b on one and the other main surfaces 19a and 19b of the magnetic substrate J1. Each is connected to the tip portion and disposed at a position facing each other across the magnetic base material J1. Each pair of tuning patterns is formed in a substantially circular shape and functions as a capacitor pattern. Here, each pair of tuning patterns may be formed in a rectangular (quadrangle) shape. In addition, the IC chip C is mounted with a capacitor 9b in addition to a rewritable nonvolatile memory and an RF circuit for wireless communication that do not require power supply backup (see FIG. 4). As shown in FIG. 4, the antenna coil A, the capacitor 9b in the IC chip C, and the tuning patterns 15a, 15b, 16a, 16b, 17a, 17b, 18a, and 18b that are respectively connected on the magnetic substrate J1 as described above. In addition, an LC resonance circuit is configured.

  Further, the through-hole-formable regions 15, 16, 17, and 18 on the magnetic substrate J1 provided for adjusting the resonance frequency of the entire antenna are respectively paired tuning patterns 15a, 15b, 16a, 16b, 17a, and 17b. , 18a, 18b is secured as an area where a through-hole can be drilled for pulling out one set from the magnetic base material J1 (or any set tuning pattern may not be pulled out). Yes. These through-hole-formable regions 15, 16, 17, and 18 are outer peripheral edges of the tuning patterns 15b, 16b, 17b, and 18b that are formed slightly larger in outer shape than the tuning patterns 15a, 16a, 17a, and 18a. Is a circular region surrounded by an outer peripheral edge slightly offset to the outside. In the present embodiment, it is assumed that a frequency approximate to the resonance frequency target value of 13 and 56 MHz is obtained in a state in which neither set of tuning patterns is removed, and the through hole is not perforated. Is illustrated.

  Here, as shown in FIGS. 5 and 6, the non-contact data carrier (also referred to as RFID [Radio Frequency Identification] tag or the like) 1 of the present embodiment is a metal-compatible type having a function of preventing the generation of eddy currents. Non-contact data carrier. That is, as shown in FIGS. 2 and 6, the above-described magnetic substrate J1 of the non-contact type data carrier inlet 2a is made of a magnetic material having a high magnetic permeability such as ferrite.

  Further, the non-contact type data carrier inlet 2a configured by mounting the antenna coil A, the jumper wire Y, the pair of chip mounting patterns 5a and 5b, the tuning pattern, the IC chip C, and the like on the magnetic substrate J1. As shown in FIG. 5 and FIG. 6, the non-contact type data carrier 1 is configured by covering with a sheath. In the present embodiment, a card-type non-contact type data carrier (by using a pair of protective films 7a and 7b made of a rectangular vinyl chloride resin so as to sandwich the magnetic base material J1 from both sides, thereby providing a card-type non-contact type data carrier ( IC card) 1 is configured. In this non-contact type data carrier 1 of the metal type, the non-formation surface side of the antenna coil A on the magnetic base material J1 (the other main surface 19b side of the magnetic base material J1) is the attachment side to a conductor such as metal. It becomes. Here, in addition to the card-type form, for example, a pouch-type non-contact data carrier obtained by pouching, a label type provided with an adhesive layer obtained by labeling or a release paper covering it Non-contact type data carrier of high temperature resistance obtained by processing molded products using so-called engineering plastics such as PPS (polyphenylene sulfide) and PSF (polysulfone) Can also be configured.

  Next, a manufacturing method of the metal-compatible non-contact type data carrier inlet 2a which is a component of the non-contact type data carrier 1 configured as described above will be described with reference to FIGS. 7a to 7g and FIGS. 8a to 8e. Give an explanation. Here, FIGS. 7a to 7g are sectional views for explaining each manufacturing process of the non-contact type data carrier inlet 2a of this embodiment, and FIG. 8a is for forming the magnetic base sheet F2 of FIG. 7a. It is a figure which shows a manufacturing apparatus schematically. 8b schematically shows a manufacturing apparatus used in the manufacturing process of FIGS. 7a to 7f, and FIG. 8c shows an IC chip C mounted on the antenna substrate (antenna substrate sheet) M1 of FIG. 7f. It is sectional drawing which shows the manufacturing apparatus for this. 8d is a plan view showing the non-contact type data carrier inlet sheet F3 produced by the manufacturing apparatus of FIG. 8c, and FIG. 8e is a non-contact type of the non-contact type data carrier inlet sheet F3 in FIG. 8d. It is sectional drawing which shows the manufacturing apparatus for obtaining the data carrier inlet 2a single-piece | unit.

  First, as shown in FIGS. 7a and 8a, after applying the magnetic material F1 on the base 28a from the coating device 28, the magnetic material F1 is pressed and dried by the press machine 29a of the drying / pressing device 29, for example, 50 A magnetic substrate sheet F2 (magnetic substrate J1) having a thickness of ˜500 μm is obtained.

  Here, as a constituent material of the magnetic substrate J1, for example, a magnetic material having high insulation properties such as Mn—Zn ferrite and Ni—Zn ferrite is suitable. In forming the magnetic base material J1, a resin binder mixed with the ferrite magnetic powder or the like may be applied. This resin binder is mainly composed of a thermoplastic resin, and if necessary, coupling agents such as silane, titanate and aluminum which improve the affinity between the magnetic powder and the resin, phthalic acid and sulfone which improve the fluidity of the resin. Acidic, phosphoric acid and epoxy plasticizers, stearic acid, stearates, fatty acid amides, waxes and other lubricants that increase the fluidity of the mixture, and hindered phenols to prevent oxidation of fillers, sulfur Those to which antioxidants such as those based on phosphorus and phosphorus are appropriately added are suitable.

  Next, as shown in FIG. 7b and FIG. 8b, using a vapor deposition apparatus 30 such as a vacuum vapor deposition apparatus, for example, 15 to 45 μm made of copper or the like as a material on one and the other main surfaces on the magnetic substrate J1. A metal layer (conductor layer) K1 having a thickness and a metal layer K2 having a thickness of, for example, 5 to 15 μm are deposited. Further, as shown in FIGS. 7c and 8b, resist T is printed using rollers 31a and 31b of resist printing device 31 at predetermined positions on metal layers K1 and K2 formed on each surface of magnetic base material J1. . Thereafter, as shown in FIGS. 7d and 8b, the metal layers K1 and K2 on the magnetic base material J1 on which the resist T is printed are etched through the etching tank 32, and further, the resist is peeled, washed and dried. In the chamber 33, the resist T is peeled off from the magnetic base material J1, and then washed and further dried.

  Thus, as shown in FIGS. 7e and 8b, the antenna coil A and the pair of chips are mounted on one main surface 19a of the magnetic base material J1 (for a plurality of non-contact data carriers [see FIG. 8d]). The patterns 5a and 5b and one tuning pattern (capacitance adjustment pattern) 15a, 16a, 17a, and 18a are formed (see FIGS. 1 to 3). On the other hand, on the other main surface 19b of the magnetic substrate J1, (a plurality of non-contact data carriers [see FIG. 8d]) jumper wire Y, the other tuning pattern (capacitance adjustment pattern) 15b, 16b, 17b and 18b are formed (see FIGS. 1 to 3). As shown in FIGS. 7f and 8b, the magnetic base material J1 on which the respective conductor patterns are formed is passed through the caulking portion 6a between the other end portion 3b of the antenna coil A and the one end portion Ya of the jumper wire Y, as shown in FIGS. Interlayer connection and interlayer connection through the caulking portion 6b between the base end portion of the other chip mounting pattern 5b and the other end portion Yb of the jumper wire Y are performed using a caulking machine 34 (see FIGS. 2 and 6).

  Thus, the antenna coil A (the other end portion 3b) and the chip mounting pattern (5b) formed on one main surface side of the magnetic base material J1 and the other main surface side of the magnetic base material J1. The formed jumper line Y is interlayer-connected, and an antenna base (antenna base sheet) M1 is obtained as shown in FIGS. 7f and 8b. Further, thereafter, as shown in FIGS. 7g and 8c, for example, by using the mounting device 37 including the suction type handling device 37a and the crimping device 38, the antenna coil A on the antenna coil A forming surface side is used. By mounting the IC chip C on the pair of chip mounting patterns 5a and 5b, a plurality of metal-compatible data carrier inlets (2a) are arranged vertically and horizontally as shown in FIGS. 8c and 8d. A non-contact type data carrier inlet sheet F3 in a state is formed. Thereafter, as shown in FIGS. 7g and 8e, the non-contact type data carrier inlet sheet F3 is cut into a predetermined size by using a cutting device 51 having a plurality of blade portions 51a as a reference, and a plurality of metal A corresponding non-contact data carrier inlet 2a is produced.

  As described above, in the non-contact type data carrier inlet 2a (non-contact type data carrier 1) of this embodiment, the magnetic material F1 is applied to the constituent material of the base material, and the antenna coil is provided on the magnetic base material J1. In addition, since an IC chip is mounted, it is possible to increase the number of manufacturing processes such as attaching a magnetic material to the non-contact type data carrier inlet 2a afterwards, and as a product. The non-contact type data carrier 1 itself can be manufactured in a thin state. Therefore, according to the present embodiment, it is possible to reduce the thickness of the metal-compatible non-contact data carrier 1 that prevents the generation of eddy currents while increasing the productivity.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. 9a to 9h and FIG. Here, FIGS. 9a to 9h are sectional views for explaining each manufacturing process of the non-contact type data carrier inlet 2b according to this embodiment, and FIG. 10 is a manufacturing apparatus used for the manufacturing process of FIGS. 9a to 9g. FIG.

  As shown in FIG. 9h, the non-contact type data carrier inlet 2b of the present embodiment replaces the configuration of the non-contact type data carrier inlet 2a of the first embodiment with reference to FIGS. 2 and 6 of the first embodiment. 7f and FIG. 7g, the caulking portions 6a and 6b that connect the antenna coil A (or the other chip mounting pattern 5b) and the jumper wire Y to each other between the layers are deleted. Further, as shown in FIG. 10, the manufacturing apparatus for the non-contact type data carrier inlet 2b of this embodiment does not require the caulking machine 34 of the manufacturing apparatus shown in FIG. 8b of the first embodiment, and FIG. In place of the vapor deposition apparatus 30 shown in FIG. 1, a perforation apparatus 25 having a laser irradiation apparatus 25a, a sputtering apparatus 26, and a plating tank 27 are provided.

  That is, in this embodiment, first, as shown in FIGS. 9 a, 9 b, and 10, through holes G <b> 1 and G <b> 2 are formed using the punching device 25 at two positions on the magnetic base material J <b> 1 where the interlayer connection is to be performed. Perforate each. Next, as shown in FIG. 9c and FIG. 10, on the surface layer of the magnetic base material J1, that is, one or the other main surface of the magnetic base material J1 and the inner wall surface of the through holes G1 and G2, as an underlayer, for example, copper or the like Metal layers (conductor layers) K3 and K4 are formed using a sputtering apparatus 26. Next, as shown in FIG. 9d and FIG. 10, on the metal layers (including the inner wall surfaces of the through holes G1 and G2) K3 and K4 formed as the base layer, the metal made of copper or the like as the main conductor layer is used. Layers (conductor layers) K5 and K6 are stacked through the plating tank 27. As a result, through holes G3 and G4 for connecting the antenna coil A (or the other chip mounting pattern 5b) and the jumper wire Y to each other are formed.

  Thereafter, as shown in FIGS. 9e to 9h and FIG. 10, by performing the same manufacturing process as that of the first embodiment in the form of eliminating the caulking process, the antenna substrate M2 for mounting a pair of chips A non-contact type data carrier inlet 2b in which the IC chip C is mounted on the patterns 5a and 5b can be obtained.

  Therefore, according to the manufacturing method of the non-contact type data carrier inlet 2b (non-contact type data carrier) of this embodiment, the interlayer connection of each layer is performed by the through holes G3 and G4. Can be improved. In this embodiment, since the base layer (the main conductor layer) is formed after the base layer is formed, the antenna coil A and the like formed as the main conductor layer are connected to the magnetic substrate J1. High adhesion strength can be obtained.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIGS. Here, FIG. 11 is a sectional view showing a non-contact type data carrier inlet 2c according to this embodiment, and FIG. 12 schematically shows a manufacturing apparatus for producing the non-contact type data carrier inlet 2c of FIG. FIG.

  As shown in FIG. 11, the non-contact type data carrier inlet 2c of the present embodiment is a magnetic including an antenna coil A, a jumper wire Y, etc. instead of the configuration of the non-contact type data carrier inlet 2a of the first embodiment. All conductor patterns on the substrate J1 are laminated on the magnetic substrate J1 (on one and the other main surface of the magnetic substrate J1) via adhesive layers S1 and S2 having a thickness of about 2 to 20 μm, for example. Has been. Moreover, the manufacturing apparatus of the non-contact type data carrier inlet 2c of this embodiment replaces with the vapor deposition apparatus 30 with which the manufacturing apparatus shown in FIG. 8b of 1st Embodiment is equipped, as shown in FIG. The rotating rollers 23a and 23b, metal layer winding rollers 24a and 24b, and pasting rollers 22a and 22b are provided.

An adhesive sheet formed of a material having high resistance (corrosion resistance) to the etching solution used in the etching tank 32 is wound around the adhesive layer winding rollers 23a and 23b. Here, the adhesive sheet for forming the adhesive layers S1 and S2 is suitable for use in so-called dry lamination, and is a two-component polyester polyurethane adhesive containing a curing agent. Etc. are applied as the material. Specifically, this adhesive sheet is prepared by diluting the adhesive to a predetermined viscosity with a solvent such as ethyl acetate, MEK (Methyl Ethyl Ketone), IPA (Isopropyl Alcohol), and the like on one substrate to be laminated. It is obtained by applying and then drying. The above-mentioned adhesive layers S1 and S2 constituted by such an adhesive sheet exhibit good solvent resistance and chemical resistance against either alkaline or acidic etching solution, and thereby the adhesive layer S1. , S2 lower magnetic base material J1 is inhibited from being corroded by the influence of the etching solution.
A metal foil sheet made of copper or the like is wound around the metal layer winding rollers 24a and 24b. The adhering rollers 22a and 22b are attached to the magnetic base material J1 while pulling out the adhesive sheet and the metal foil sheet wound around the adhesive layer winding rollers 23a and 23b and the metal layer winding rollers 24a and 24b, respectively. Thereby, the metal layers K7 and K8 are laminated on the respective surfaces of the magnetic base material J1 via the adhesive layers S1 and S2.

  Here, in this embodiment, an antenna base is applied by applying the same manufacturing method as in the first embodiment except for the step of laminating the metal layers K7 and K8 on the magnetic substrate J1 via the adhesive layers S1 and S2. The material (antenna substrate sheet) M3 is formed, and further, the non-contact type data carrier inlet 2c (and the non-contact type data carrier as the final product) shown in FIG. The Therefore, according to the non-contact type data carrier inlet 2c of the present embodiment, the adhesive layers S1 and S2 described above that the magnetic base material J1 is corroded by the influence of, for example, an etching solution used in the etching process. Can be suppressed.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described mainly based on FIGS. 13 and 14a to 14c. Here, FIG. 13 is a cross-sectional view showing the non-contact type data carrier inlet 2d according to this embodiment, and FIGS. 14a to 14c schematically show a manufacturing apparatus for producing the non-contact type data carrier inlet 2c of FIG. FIG. Specifically, FIG. 14a is a diagram showing a manufacturing apparatus for producing a reinforcing magnetic substrate roll R5 in which a reinforcing magnetic substrate (reinforcing magnetic substrate sheet) H1 is wound in a roll shape. FIG. 14b is a diagram showing a manufacturing apparatus for producing the antenna base roll R2 produced based on the reinforcing magnetic base roll R5. Further, FIG. 14c is a view showing a manufacturing apparatus for producing a non-contact type data carrier inlet roll R3 produced based on the antenna base roll R2.

  The non-contact type data carrier inlet 2d of the present embodiment is replaced with the base material of the non-contact type data carrier inlet 2d as shown in FIG. 13 instead of the configuration of the non-contact type data carrier inlet 2c of the third embodiment. A reinforced magnetic substrate H1 is applied. That is, the non-contact type data carrier inlet 2d has a structure for suitably responding to component supply in the form of a roll that can generate a relatively high tensile stress or bending stress. This reinforced magnetic base material H1 has at least one main part of the magnetic base material J1 to which the reinforcing layer (PET layer) P2 having electrical insulation that reinforces the base material itself is applied in the first to third embodiments. It is comprised in the form laminated | stacked on the surface (In FIG. 13, the formation surface side of the antenna coil A).

  Here, as the insulating resin material for constituting the reinforcing layer P2, in addition to the above PET (polyethylene terephthalate), for example, phenol resin, urea resin, melamine resin, polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, polyether Sulphone, polyphenylene sulfide, PBT, polyarylate, silicon resin, diallyl phthalate, polyimide and the like can also be applied.

  Next, a method for manufacturing the non-contact type data carrier inlet 2d according to this embodiment will be described. First, as shown in FIG. 14a, for example, a PET reinforcing sheet (reinforcing layer forming sheet) P2 having a thickness of about 30 to 100 μm is reinforced from a PET roll R4 wound in a roll shape through an unwinding roller 40. The continuous feeding of the sheet P2 is started. Next, a magnetic layer (a constituent part of the magnetic base material) J1 is formed on one main surface of the fed reinforcing sheet P2 using the coating device 41 provided with calendar rollers 41a, 41b, 41c. As the constituent material of the magnetic layer, for example, the magnetic material F1 that is the constituent material of the magnetic substrate J1 described in the first embodiment is used. In addition, although the manufacturing method which forms a magnetic body layer directly with respect to the reinforcement sheet | seat (reinforcement layer) P2 is illustrated here, instead of this, a sheet-like magnetic body is passed through an adhesive etc. For example, you may make it stick on the reinforcement layer side. In this case, high adhesion strength can be obtained between the magnetic layer and the reinforcing layer adjacent to the magnetic layer.

  Further, as shown in FIG. 14 a, after the thickness of the magnetic layer J <b> 1 is adjusted to a thickness of about 50 to 500 μm, for example, by the pressing device 42, the magnetic layer J <b> 1 is dried through the drying furnace 43. Done. In this way, the reinforcing magnetic substrate (reinforcing magnetic substrate sheet) H1 obtained by integrating the reinforcing sheet (reinforcing layer) P2 and the magnetic layer J1 in a manner to reinforce the magnetic layer J1, Winding through the take-up roller 45 to produce a reinforced magnetic base roll R5. At this time, the reinforcing magnetic substrate (reinforcing magnetic substrate sheet) H1 is wound so that the reinforcing layer P2 is on the outer peripheral side (the surface on which the antenna A is formed on the reinforcing magnetic substrate H1). By reinforcing the magnetic substrate portion in this way, the reinforced magnetic substrate roll R5 can be formed with a long roll length. Here, the roll length of the reinforced magnetic base roll R5 is required to be longer than the distance (path) from the PET roll R4 to the reinforced magnetic base roll R5 of the manufacturing apparatus, and the roll is easy to handle. For example, it is about 5 to 500 m.

  Next, as shown in FIG. 14b, continuous feeding of the reinforcing magnetic substrate (reinforcing magnetic substrate sheet) H1 is started from the reinforcing magnetic substrate roll R5 manufactured as described above through the unwinding roller 40. . Thereafter, a manufacturing process similar to the manufacturing process described with reference to FIG. 12 of the third embodiment is performed, and the antenna substrate (antenna substrate sheet) M4 obtained thereby is wound through the winding roller 35. The antenna base roll R2 is produced. Furthermore, continuous feeding of the antenna base material (reinforcing magnetic base material sheet) M4 from the antenna base material roll R2 through the unwinding roller 36 is started, and a pair of antenna coil A forming surfaces on the antenna base material M4 is started. The IC chip C is mounted on the chip mounting patterns 5a and 5b by using the mounting device 37 and the pressure bonding device 38. Next, as shown in FIG. 14c, in this way, the antenna base (antenna base sheet) M4 on which the IC chip C is mounted is taken up through the take-up roller 39, and the non-contact type data carrier inlet roll R3 is taken up. Form. Thereafter, the non-contact type data carrier inlet roll R3 is used as a constituent material to produce a non-contact type data carrier inlet 2d (and a non-contact type data carrier as the final product) shown in FIG.

  As described above, according to the non-contact type data carrier inlet 2d according to this embodiment, at least one main surface of the magnetic base material J1 applied in the first to third embodiments (in FIG. 13, the antenna Since the reinforced magnetic base material H1 in which the reinforcing layer P2 is laminated on the coil A forming surface side) is applied, it is possible to suitably supply components in the form of a roll, and the productivity of the non-contact type data carrier. Can be improved. Further, in the non-contact type data carrier inlet 2d of this embodiment, as shown in FIG. 13, the antenna coil A is formed on the reinforcing layer P2 side laminated on the magnetic layer J1 constituting the reinforcing magnetic substrate H1. Therefore, in addition to the improvement of the strength of the base material, the separation distance between the component part of the magnetic layer J1 and the antenna coil A in the reinforced magnetic base material H1 can be taken long, and thereby the non-contact which becomes the product The communication distance of the data carrier can be increased and the communication sensitivity characteristic can be improved.

  Here, by applying the manufacturing method of the first and second embodiments based on the manufacturing method of the non-contact type data carrier inlet 2d according to the present embodiment, as shown in FIG. It is also possible to form a non-contact type data carrier inlet 2e in which the adhesive layers S1 and S2 are deleted from the formula data carrier inlet 2d.

  Further, as shown in FIG. 16, a reinforced magnetic substrate H2 in which a plurality of, for example, two magnetic layers J1 and J2 are provided and a reinforcing layer P2 is interposed between these magnetic layers J1 and J2 is applied. By doing so, the non-contact type data carrier inlet 2f can be obtained. In the non-contact type data carrier inlet 2f, in addition to the improvement in the strength of the magnetic part described above, a plurality of magnetic layers J1, J2 and the like can be obtained without forming a thick magnetic layer that is generally difficult to manufacture. In the laminated structure portion constituted by the reinforcing layer P2, an effect substantially equivalent to that of a single magnetic layer having a thickness corresponding to the total thickness of the laminated structure portion can be expected. That is, according to the non-contact type data carrier inlet 2f, the communication distance of the non-contact type data carrier to be a product can be substantially extended as in the case of forming a relatively thick magnetic layer, and the metal or the like. This can improve the shielding property (the function of preventing generation of eddy currents) with respect to the conductor. Further, by applying the manufacturing methods of the third and fourth embodiments to the non-contact type data carrier inlet 2f, as shown in FIG. 17, the adhesive layers S1 and S2 are interposed on the reinforcing magnetic substrate H2, as shown in FIG. Thus, the non-contact type data carrier inlet 2g in which the antenna coil A and the jumper wire Y are laminated can be formed.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described mainly based on FIGS. 18, 19a and 19b. Here, FIG. 18 is a cross-sectional view showing the non-contact type data carrier inlet 2h according to this embodiment, and FIG. 19a is a sheet shape as a base material for producing the non-contact type data carrier inlet 2h of FIG. Sectional view showing the non-contact type data carrier inlet roll R7 (or the antenna base roll before mounting the IC chip C) in the drawn-out state, FIG. 19b is a plan view showing the non-contact type data carrier inlet roll of FIG. 19a It is.

  That is, as shown in FIG. 18, FIG. 19a, and FIG. 19b, the non-contact type data carrier inlet 2h covers the magnetic substrate so as to substantially cover the formation region (circular portion) of the antenna coil A over the magnetic base material J1. A metal layer K9 is laminated as a conductor layer on the other main surface on the material J1 (on the non-formation surface side of the surrounding portion of the antenna coil A in the magnetic substrate J1 [see FIGS. 2 and 6)] 19b. The metal layer K9 is formed in the same process as the process of forming the jumper line Y and one tuning pattern (capacitance adjustment pattern) 15b, 16b, 17b, 18b described in the first and second embodiments. Is done. The metal layer K9 is formed on the entire surface of the region that slightly avoids the jumper line Y and the tuning pattern formation region.

  Here, in FIG. 20, the change of the resonance frequency in the case where the magnetic material layer is provided in the non-contact type data carrier inlet and in the case where the magnetic material layer and the metal layer are provided is shown in a graph. Specifically, FIG. 20 shows that the resonance frequency of a non-contact type data carrier inlet without a magnetic layer and a metal layer is set as a reference X, and this magnetic property is obtained when only the magnetic layer is provided for the non-contact type data carrier inlet. The change of the resonance frequency according to the change of the thickness of the body layer is indicated by W. On the other hand, the metal having a predetermined thickness (fixed thickness) in addition to the magnetic layer for the non-contact type data carrier inlet. 5 is a graph showing a change in resonance frequency V according to a change in thickness of the magnetic layer when a layer and a magnetic layer are provided.

  As is apparent from FIG. 20, in the non-contact type data carrier inlet 2h, the use environment of the non-contact type data carrier in which a conductor such as a metal is in the close position is considered, that is, the resonance frequency of the non-contact type data carrier. Considering fluctuations (in the example in which a metal layer having a predetermined thickness is provided in addition to the magnetic layer, when the thickness of the magnetic layer is close to 0.05 mm, the resonance frequency is greatly increased), Since the resonance frequency including the metal layer K9 can be tuned in advance by a single data carrier, characteristics such as communication sensitivity can be improved.

  In the non-contact type data carrier inlet 2h of the present embodiment, since the mechanical strength of the magnetic base material itself can be improved by the metal layer K9 laminated on the magnetic base material J1, (the above-described reinforcing layer P2 In the subsequent process after the formation of the metal layer K9, the parts are preferably supplied in the form of a roll that can be applied with a relatively high tensile stress or bending stress. Increase data carrier productivity.

Although the present invention has been specifically described with the embodiments, the present invention is not limited to these embodiments, and various modifications can be made without departing from the scope of the invention. For example, in the first to third embodiments described above, non-contact type data can be obtained by supplying parts with sheets such as the magnetic base sheet F2, the antenna base sheets M1, M2, and M3, and the non-contact type data carrier inlet sheet F3. Although the production method for producing the carrier inlets 2a, 2b, and 2c has been exemplified, instead of this, the magnetic base sheet F2 shown in FIG. 8a is wound so that the roll length is about 5 m to 500 m, for example. You may apply the roll-shaped components which turned, and the roll-shaped components of the antenna base material sheet M1, M2, M3 produced based on this roll-shaped component, and the non-contact-type data carrier inlet sheet F3 in each manufacturing process.
Further, as shown in FIGS. 5 and 6, the non-contact type data carrier 1 is configured by covering the non-contact type data carrier inlet with an exterior. The non-contact type data carrier inlet is covered with the exterior. The non-contact type data carrier inlet roll can also be used in post-processing and printing on the surface of the non-contact type data carrier. In such post-processing and printing, since the path of the processing machine or the printing machine is short, a roll length of the non-contact type data carrier inlet roll to be used can be as short as about 2 m.

  In the fourth embodiment, as shown in FIG. 14a, the calender roll is used to form the magnetic layer J1 on the reinforcing layer (PET layer) P2, but instead of this, a magnetic body is used. The magnetic layer may be formed using a coating apparatus that can be dropped, or the magnetic layer may be formed using electrostatic coating or the like.

  Moreover, in the said embodiment, the conductor pattern which secured the position of the chip | tip mounting pattern of IC chip C using the jumper wire Y and interlayer connection which straddle the surrounding part of the antenna coil A over the magnetic base material J1 is two layers. Although the non-contact type data carrier has been exemplified, the present invention can be applied to a non-contact type data carrier having a single conductor pattern as shown in FIG. That is, in FIG. 21, on one main surface side on the magnetic substrate, one and the other chip mounting patterns 62a and 62b connected to the one end 61a and the other end 61b of the antenna coil 61 are connected to the antenna coil 61. It is provided in the position which straddles the surrounding part. The IC chip C is mounted on the chip mounting patterns 62a and 62b across the circumference of the antenna coil 61.

  Here, in the tuning of the resonance frequency of the non-contact type data carrier in which the above-described conductor pattern is one layer, a line that continuously circulates with respect to the antenna coil 15 that circulates on one main surface of the magnetic substrate J1. An extended pattern is provided, and this extended portion (linear pattern) functions as a capacitance pattern, and the length of the linear pattern of the extended portion is adjusted (cutting / non-cutting from a predetermined position is selected). Examples include a configuration that can adjust the resonance frequency of the entire LC circuit.

  Furthermore, in the present invention, as shown in FIG. 22, a pair of chip mounting patterns 5c and 5d are formed on the other main surface 19b of the magnetic base material J1 (on the non-formation surface side of the surrounding portion of the antenna coil A). The formed non-contact type data carrier inlet 2j can also be configured. That is, the pair of chip mounting patterns 5c and 5d are provided so as to straddle between the outer peripheral side and the inner peripheral side of the winding portion of the antenna coil A over the magnetic base material J1, and one and the other pattern. The base ends 5e, 5f of (5c, 5d) and the inner and outer ends 5e, 5f of the antenna coil are individually connected to each other through, for example, caulking portions 6c, 6d. Further, the chip mounting patterns 5c and 5d are arranged at the tip portions of one and the other patterns (5c and 5d), respectively, and the land portions Ca and Cb on which the IC chip C is directly mounted are magnetic base materials. On the other main surface 19b of J1, it is provided at a position facing the surrounding portion of the antenna coil A across the magnetic base material J1.

Also, the other end portion 3b of the antenna coil A and the other end pattern 5b of the other chip mounting pattern 5d connected to each other and the other connection pattern 8b connected to the tuning pattern magnetically surround the antenna coil A. They are connected by jumper wires Y2 that are patterned on the other main surface 19b of the magnetic base material J1 so as to cross over the base material J1.
Therefore, in the non-contact type data carrier inlet 2j having such a structure, the pair of chip mounting patterns 5c and 5d including the land portions Ca and Cb are opposed to the surrounding portion of the antenna coil A with the magnetic base material J1 interposed therebetween. As a result, the space (area) on one and the other main surfaces 19a19b of the magnetic base material J1 is effectively utilized, thereby contributing to the miniaturization of the non-contact type data carrier. can do.

  In the above description of the embodiment, a coil-shaped antenna (antenna coil) is used as the antenna shape. For example, a dipole antenna having a pair of linear conductors on one main surface of a magnetic substrate is used. Thus, the antenna can be designed in various shapes, and in this application, these various shapes are collectively referred to as an antenna. Furthermore, if the antenna base material is formed on one main surface of the magnetic base material, such as an antenna base material on which a coiled antenna or a dipole antenna is formed, the present invention is used. Can be applied.

The figure which looked at the non-contact-type data carrier inlet which concerns on the 1st Embodiment of this invention from the one main surface side. Sectional drawing which looked at the non-contact-type data carrier inlet of FIG. 1 from the side. The figure which looked at the non-contact-type data carrier inlet of FIG. 1 from the other main surface side. The block diagram which shows the structure of the non-contact-type data carrier inlet of FIG. 1 functionally. The figure which looked at the non-contact-type data carrier comprised by covering the non-contact-type data carrier inlet of FIG. 1 with the exterior from one main surface side. Sectional drawing which looked at the non-contact-type data carrier of FIG. 5 from the side. It is a figure for demonstrating the manufacturing process of the non-contact-type data carrier inlet of FIG. 1, Comprising: The figure which shows the cross section of a magnetic base material. Sectional drawing which shows the state by which the metal layer was laminated | stacked on the magnetic base material of FIG. FIG. 7B is a cross-sectional view showing a state in which a resist layer is formed on the metal layer of FIG. Sectional drawing which shows the state which etched the magnetic base material in which the resist layer was formed on the metal layer of FIG. 7c. Sectional drawing which shows the state which removed the resist layer from the magnetic base material with which the etching of FIG. 7d was given. Sectional drawing which shows the state which performed the crimping process to the magnetic base material from which the resist layer of FIG. 7e was removed. Sectional drawing which shows typically the structure of the non-contact-type data carrier inlet produced by mounting an IC chip on the magnetic base material which performed the crimping process of FIG. The figure which shows schematically the manufacturing apparatus for forming the magnetic base material sheet of FIG. 7a. The figure which shows schematically the manufacturing apparatus used for the manufacturing process of FIG. Sectional drawing which shows the manufacturing apparatus for mounting an IC chip on the antenna base material sheet of FIG. 7f. The top view which shows the non-contact-type data carrier inlet sheet produced with the manufacturing apparatus of FIG. 8c Sectional drawing which shows the manufacturing apparatus for obtaining the non-contact-type data carrier inlet single-piece | unit from the non-contact-type data carrier inlet sheet | seat of FIG. 8d. It is a figure for demonstrating the manufacturing process of the non-contact-type data carrier inlet which concerns on the 2nd Embodiment of this invention, Comprising: The figure which shows the cross section of a magnetic base material. Sectional drawing which shows the state by which the through-hole was drilled in the magnetic base material of FIG. 9a. FIG. 9B is a cross-sectional view showing a state in which an underlayer is formed on the surface layer of the magnetic substrate of FIG. 9B. Sectional drawing which shows the state by which this conductor layer (metal layer) was laminated | stacked on the base layer of FIG. 9c. 9D is a cross-sectional view illustrating a state in which a resist layer is formed on the metal layer in FIG. 9D. Sectional drawing which shows the state which etched the magnetic base material in which the resist layer was formed on the metal layer of FIG. 9e. Sectional drawing which shows the state which removed the resist layer from the magnetic base material to which the etching of FIG. 9f was given. Sectional drawing which shows typically the structure of the non-contact-type data carrier inlet produced by mounting an IC chip on the magnetic base material which removed the resist layer of FIG. 9g. The figure which shows schematically the manufacturing apparatus used for the manufacturing process of FIGS. 9a-9g. Sectional drawing which shows typically the structure of the non-contact-type data carrier inlet which concerns on the 3rd Embodiment of this invention. The figure which shows schematically the manufacturing apparatus for producing the non-contact-type data carrier inlet of FIG. Sectional drawing which shows typically the structure of the non-contact-type data carrier inlet which concerns on the 4th Embodiment of this invention. The figure which shows the manufacturing apparatus for producing the reinforcement magnetic base material roll by which the reinforcement magnetic base material sheet of the non-contact-type data carrier inlet of FIG. 13 was wound by roll shape. The figure which shows the manufacturing apparatus for producing the antenna base material roll produced based on the reinforcement magnetic base material roll of FIG. 14a. The figure which shows the manufacturing apparatus for producing the non-contact-type data carrier inlet roll produced based on the antenna base material roll. FIG. 14 is a cross-sectional view schematically showing another non-contact type data carrier inlet having a structure different from that of the non-contact type data carrier inlet of FIG. 13 in the fourth embodiment of the present invention. FIG. 16 is a cross-sectional view schematically showing another non-contact type data carrier inlet having a different structure from the non-contact type data carrier inlet of FIGS. 13 and 15. FIG. 17 is a cross-sectional view schematically showing another non-contact type data carrier inlet having a different structure from the non-contact type data carrier inlet of FIGS. 13, 15, and 16. Sectional drawing which shows typically the structure of the non-contact-type data carrier inlet which concerns on the 5th Embodiment of this invention. Sectional drawing which shows the non-contact-type data carrier inlet roll of the state pulled out by the sheet form used as the base material for producing the non-contact-type data carrier inlet of FIG. FIG. 19B is a plan view showing the non-contact data carrier inlet roll of FIG. 19A. The graph which shows the change of the resonant frequency with the case where a magnetic body layer is provided in a non-contact-type data carrier inlet, and the case where a magnetic body layer and a metal layer are provided. The figure for demonstrating the structure of the non-contact-type data carrier with one conductor pattern. The figure for demonstrating the structure of the other non-contact-type data carrier from which the structure of a non-contact-type data carrier shown in FIG.5 and FIG.21 differs in a conductor pattern.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Non-contact-type data carrier, 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2j ... Non-contact-type data carrier inlet, 3a ... One end part of antenna coil, 3b ... Other end part of antenna coil, 5a, 5b, 5c, 5d ... chip mounting pattern, 6a, 6b, 6c, 6d ... caulking part, 7a, 7b ... protective film, 15a, 15b, 16a, 16b, 17a, 17b, 18a, 18b ... tuning pattern ( Capacitance adjustment pattern), 19a... One main surface (first main surface) of the magnetic substrate, 19b... The other main surface (second main surface) of the magnetic substrate, 22a and 22b. 26 ... Sputtering device, 27 ... Plating tank, 28, 41 ... Coating device, 29 ... Drying / pressing device, 30 ... Deposition device, 37 ... Mounting device, 51 ... Cutting device, A ... Antenna coil, C IC chip, F1 ... magnetic material, F2 ... magnetic substrate sheet, F3 ... non-contact data carrier inlet sheet, H1, H2 ... reinforced magnetic substrate (reinforced magnetic substrate sheet), J1 ... magnetic substrate (magnetic layer) ), J2 ... magnetic layer, K9 ... metal layer, M1, M2, M3, M4 ... antenna substrate (antenna substrate sheet), P2 ... reinforcement layer (reinforcement sheet / PET layer), R2 ... antenna substrate roll, R3, R7: Non-contact type data carrier inlet roll, R5: Reinforced magnetic base roll, S1, S2 ... Adhesive layer, Y, Y2 ... Jumper wire, Ya ... One end of jumper wire, Yb ... Other end of jumper wire .

Claims (28)

A magnetic substrate formed of a magnetic material;
An IC chip on which at least a memory circuit and a communication control circuit are mounted;
An antenna formed on the main surface of the magnetic substrate and electrically connected to the IC chip;
A non-contact type data carrier inlet. A magnetic base material formed of a magnetic material and comprising a first main surface and a second main surface located on the side opposite to the first main surface;
An antenna coil formed on the first main surface of the magnetic substrate;
A pair of chip mounting patterns each formed on the first main surface of the magnetic base and having one pattern connected to one end of the antenna coil;
An IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns;
The antenna coil is formed on the second main surface of the magnetic base so as to straddle the surrounding portion of the magnetic base, and one end is interlayer-connected to the other end of the antenna coil. A relay pattern in which an end portion is interlayer-connected to the other of the chip mounting patterns;
A non-contact type data carrier inlet. A magnetic substrate formed of a magnetic material;
An antenna coil formed on the main surface of the magnetic substrate;
One and the other pattern are connected to one end and the other end of the antenna coil, respectively, and are formed on the main surface of the magnetic base material and provided at positions straddling the surrounding portion of the antenna coil. A pair of chip mounting patterns;
An IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns;
A non-contact type data carrier inlet. A magnetic base material formed of a magnetic material and comprising a first main surface and a second main surface located on the side opposite to the first main surface;
An antenna coil formed on the first main surface of the magnetic substrate;
The outer circumference side of the antenna coil is provided so as to straddle between the inner circumference side over the magnetic base material, and the base end portion of one and the other pattern and the inner circumference side of the antenna coil, Each of the land portions that are individually connected to each other on the outer peripheral side and are disposed at the tip portions of the one and the other patterns, respectively, sandwich the magnetic base material on the second main surface. A pair of chip mounting patterns provided at positions facing the part;
An IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns;
A non-contact type data carrier inlet.   It further comprises a capacitance adjustment pattern that is connected to the antenna coil on the magnetic substrate and that can adjust the capacitance of the entire LC circuit by removing at least part of the magnetic substrate. The non-contact type data carrier inlet according to any one of claims 2 to 4. The antenna has a circular portion patterned so as to circulate on a predetermined main surface of the magnetic substrate,
Furthermore, a metal layer is laminated on the non-formation surface side of the surrounding portion of the magnetic base so as to substantially cover the formation region of the surrounding portion of the antenna through the magnetic base. The non-contact type data carrier inlet according to any one of 1 to 5.   The non-contact type data carrier inlet according to any one of claims 1 to 6, wherein the magnetic base material is laminated with a reinforcing layer having electrical insulation that reinforces the base material itself.   The non-contact type data carrier inlet according to claim 7, wherein the antenna is formed on a side of the reinforcing layer laminated on the magnetic base material. The magnetic substrate has a plurality of magnetic layers each formed of a magnetic material,
9. The non-contact type data carrier inlet according to claim 7, wherein the reinforcing layer is interposed between the plurality of magnetic layers.   The contactless data according to any one of claims 1 to 8, wherein the antenna and / or the metal layer is formed directly on the magnetic substrate by plating or vapor deposition. Carrier inlet.   The non-contact type data carrier inlet according to any one of claims 1 to 9, wherein the antenna and / or the metal layer is laminated on the magnetic substrate via an adhesive layer.   The non-contact type data carrier inlet according to claim 11, wherein the adhesive layer is made of a material having resistance to an etching process.   A non-contact type data carrier inlet according to any one of claims 6 to 12, wherein a plurality of sheet-like members are wound in a roll shape and configured. Contact type data carrier inlet roll.   A non-contact type data carrier configured by covering the non-contact type data carrier inlet according to any one of claims 1 to 12 with an exterior. Producing an antenna substrate by forming an antenna on the main surface of the magnetic substrate formed of a magnetic material;
Mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted so as to be electrically connected to the antenna of the antenna substrate;
A method for producing a non-contact type data carrier inlet. A first pattern for forming an antenna coil and a pair of chip mounting patterns in which one pattern is connected to one end of the antenna coil on a first main surface of a magnetic substrate made of a magnetic material Production process;
One end portion is interlayer-connected to the other end portion of the antenna coil, and the other end portion is interlayer-connected to the other of the pair of chip mounting patterns. A second pattern production step of forming on the second main surface located on the side of the magnetic base material facing the first main surface so as to straddle the surrounding portion of the antenna coil;
Interlayer connection between one end of the relay pattern and the other end of the antenna coil, and the other end of the relay pattern during or after the first and second pattern manufacturing steps And making an antenna substrate by performing interlayer connection between the other of the pair of chip mounting patterns, and
Mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns of the manufactured antenna substrate;
A method for producing a non-contact type data carrier inlet. An antenna coil and a pair of chip mounting patterns respectively connected to one end portion and the other end portion of the antenna coil and disposed at positions straddling the surrounding portion of the antenna coil are magnetically connected. Producing an antenna substrate by forming on the main surface of the magnetic substrate formed of the material;
A chip mounting step of mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns of the manufactured antenna substrate;
A method for producing a non-contact type data carrier inlet. A first pattern manufacturing step of forming an antenna coil on a first main surface of a magnetic base material formed of a magnetic material;
A pair of chip mounting patterns provided at positions where the land portions respectively disposed at the tip portions of the one and other patterns are opposed to the surrounding portions of the antenna coil with the magnetic base material interposed therebetween, Formed on the second main surface located on the side opposite to the first main surface of the magnetic base material so that the outer peripheral side and the inner peripheral side of the circulating portion are straddled over the magnetic base material A second pattern making process,
During the first and second pattern manufacturing steps or after these steps, the base ends of the pair of chip mounting patterns and the inner and outer ends of the antenna coil are individually separated. Connecting the layers to each other to produce an antenna substrate,
Mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns of the manufactured antenna substrate;
A method for producing a non-contact type data carrier inlet. An electrostatic capacity adjustment pattern connected to the antenna coil on the magnetic base material and capable of adjusting the electrostatic capacity of the entire LC circuit by removing at least part of the magnetic base material on the magnetic base material Forming, and
Selecting removal or non-removal of at least a portion of the formed capacitance adjustment pattern from the magnetic substrate;
The method of manufacturing a non-contact type data carrier inlet according to any one of claims 16 to 18, further comprising: The antenna has a circular portion patterned so as to circulate on a predetermined main surface of the magnetic substrate,
Furthermore, the method further comprises a step of forming a metal layer on the non-forming surface side of the surrounding portion of the magnetic base so as to substantially cover the formation region of the surrounding portion of the antenna through the magnetic base. The method for manufacturing a non-contact type data carrier inlet according to any one of claims 15 to 19.   The non-contact type data carrier inlet according to any one of claims 15 to 20, wherein the magnetic base material is laminated with a reinforcing layer having electrical insulating properties that reinforces the base material itself. Production method.   The method of manufacturing a non-contact type data carrier inlet according to claim 21, wherein the antenna is formed on a side of the reinforcing layer laminated on the magnetic base material. The magnetic substrate has a plurality of magnetic layers each formed of a magnetic material,
The method for manufacturing a non-contact type data carrier inlet according to claim 21 or 22, wherein the reinforcing layer is interposed between the plurality of magnetic layers.   The non-contact type data carrier according to any one of claims 15 to 23, wherein the antenna and / or the metal layer is directly formed on the magnetic substrate by plating or vapor deposition. Inlet manufacturing method.   The non-contact type data carrier inlet according to any one of claims 15 to 24, wherein the antenna and / or the metal layer is laminated on the magnetic substrate via an adhesive layer. Method.   26. The method of manufacturing a non-contact type data carrier inlet according to claim 25, wherein the adhesive layer is made of a material having resistance to an etching process.   27. A non-contact type data carrier inlet in which a sheet-like member mounted with a plurality of non-contact type data carrier inlets manufactured by the method according to any one of claims 20 to 26 is wound in a roll shape. A method for producing a non-contact type data carrier inlet roll, comprising producing a roll.   27. A method of manufacturing a non-contact type data carrier, comprising: covering the non-contact type data carrier inlet manufactured by the method according to any one of claims 15 to 26 with an exterior.

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