JPH11328352A - Connection structure between antenna and ic chip, and ic card - Google Patents
Connection structure between antenna and ic chip, and ic cardInfo
- Publication number
- JPH11328352A JPH11328352A JP10136768A JP13676898A JPH11328352A JP H11328352 A JPH11328352 A JP H11328352A JP 10136768 A JP10136768 A JP 10136768A JP 13676898 A JP13676898 A JP 13676898A JP H11328352 A JPH11328352 A JP H11328352A
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- chip
- resin layer
- card
- coining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
- Support Of Aerials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＩＣチップとアンテ
ナとの接続構造、及びＩＣチップとアンテナとを用いる
非接触型のＩＣカード、ＩＣチップとアンテナとの接続
方法、及びＩＣカードの製造方法に属する。The present invention relates to a connection structure between an IC chip and an antenna, a non-contact type IC card using the IC chip and an antenna, a method for connecting an IC chip to an antenna, and a method for manufacturing an IC card. Belong.
【０００２】[0002]
【従来の技術】従来、このＩＣチップとアンテナとを接
続するための技術分野において、もっとも多く用いられ
る接続方法として、プリント基板にＩＣチップをマウン
トしワイヤボンディング線にてプリント基板上へ接続す
るＣＯＢ法が確立されている。このプリント配線を経由
しコイル接続用のパッドとコイルＣｕ（銅）線を半田材
で接続する方法が用いられる。2. Description of the Related Art Conventionally, in a technical field for connecting an IC chip to an antenna, a COB that mounts an IC chip on a printed circuit board and connects the printed circuit board to the printed circuit board by wire bonding wires is the most frequently used connection method. The law has been established. A method of connecting a coil connection pad and a coil Cu (copper) wire with a solder material via the printed wiring is used.
【０００３】さらに、別の方法としては、ワイヤボンデ
ィング線の他に、ＩＣチップのパッド上にバンプを形成
し、フィリップチップ技術によってプリント基板と半田
とを接続する方法が用いられる。そのほか、基板との接
続に異方性導電シートや導電ペーストで接続する方法も
ある。Further, as another method, a method is used in which a bump is formed on a pad of an IC chip in addition to a wire bonding wire, and a printed circuit board and solder are connected by a flip chip technique. In addition, there is a method of connecting to the substrate with an anisotropic conductive sheet or conductive paste.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、ワイヤ
ボンディング法は、ループ高さが２００μあり、モジュ
ールを薄くできなく、ＣＯＢ用の基板は材料費が高いと
いう問題がある。However, the wire bonding method has a problem that the loop height is 200 μm, the module cannot be made thin, and the substrate for the COB has a high material cost.
【０００５】一方、Ａｕ（金）などの金属バンプを用い
る方法は、バンプ上面の引きちぎり部分の形状が安定し
ないという問題がある。On the other hand, the method using a metal bump such as Au (gold) has a problem that the shape of the tearing portion on the upper surface of the bump is not stable.
【０００６】また、バンプは上面形状が突起状になって
いることから、半田や接着剤などで接続する場合に安定
しないという問題がある。また、導電ペースト等では接
合部に抵抗を持ち、電気的特性が悪いという問題があ
る。Further, since the bumps have a protruding upper surface, there is a problem that the bumps are not stable when they are connected with solder or an adhesive. In addition, there is a problem that a conductive paste or the like has resistance at a joint portion and has poor electrical characteristics.
【０００７】それ故に、本発明の課題は、ＩＣチップと
アンテナ線を容易に接続でき、パッドとアンテナ線との
接続信頼性を高めることができるＩＣチップとアンテナ
との接続構造、およびＩＣカード、ＩＣチップとアンテ
ナとの接続方法、及びＩＣカードの製造方法を提供する
ことにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a connection structure between an IC chip and an antenna, which can easily connect an IC chip to an antenna line and improve the connection reliability between a pad and an antenna line, and an IC card. An object of the present invention is to provide a method for connecting an IC chip to an antenna and a method for manufacturing an IC card.
【０００８】また、ＩＣカードを構成する樹脂材が変質
しない低温によって組立でき、環境に配慮した安価なＩ
Ｃカードのモジュールを得ることができるＩＣチップと
アンテナとの接続構造、ＩＣカード、ＩＣチップとアン
テナとの接続方法、及びＩＣカードの製造方法を提供す
ることにある。[0008] In addition, the resin material constituting the IC card can be assembled at a low temperature at which the resin material is not deteriorated, and is an inexpensive and environmentally friendly IC card.
An object of the present invention is to provide a connection structure between an IC chip and an antenna that can obtain a C card module, an IC card, a method for connecting an IC chip and an antenna, and a method for manufacturing an IC card.
【０００９】[0009]
【課題を解決するための手段】本発明によれば、アンテ
ナとＩＣチップとの接続構造において、前記アンテナは
アンテナ線をコイル状に巻くことによって作られている
アンテナコイニング部を有し、該アンテナコイニング部
が平坦形状を呈しており、前記ＩＣチップと前記アンテ
ナコイニング部とが金属バンプを介して相互に接続され
ていることを特徴とするアンテナとＩＣチップとの接続
構造が得られる。According to the present invention, in a connection structure between an antenna and an IC chip, the antenna has an antenna coining portion formed by winding an antenna wire in a coil shape. A connection structure between an antenna and an IC chip is obtained, wherein the coining portion has a flat shape, and the IC chip and the antenna coining portion are connected to each other via a metal bump.
【００１０】また、本発明によれば、アンテナとＩＣチ
ップとを含むＩＣカードにおいて、前記アンテナはアン
テナ線をコイル状に巻くことによって作られているアン
テナコイニング部を有し、該アンテナコイニング部が平
坦形状を呈しており、前記ＩＣチップと前記アンテナコ
イニング部とが金属バンプを介して相互に接続されてお
り、さらに、前記アンテナ及び前記ＩＣチップが樹脂層
によって覆われており、該樹脂層上の少なくとも一方面
に外被樹脂層が設けられていることを特徴とするＩＣカ
ードが得られる。According to the present invention, in an IC card including an antenna and an IC chip, the antenna has an antenna coining portion formed by winding an antenna wire in a coil shape, and the antenna coining portion is It has a flat shape, the IC chip and the antenna coining part are connected to each other via metal bumps, and the antenna and the IC chip are covered with a resin layer. An IC card characterized in that an outer resin layer is provided on at least one surface of the IC card.
【００１１】また、本発明によれば、アンテナとＩＣチ
ップとの接続方法において、前記アンテナはアンテナ線
をコイル状のアンテナコイニング部を有し、前記ＩＣチ
ップ上に設けた導電パッド上に金属バンプを形成し、前
記アンテナ線をコイル状に巻くことによって前記アンテ
ナコイニング部を形成し、前記バンプを実装する前記ア
ンテナコイニング部を平坦化し、コイニングされた前記
アンテナコイニング部の実装エリアに前記バンプを接続
することを特徴とするＩＣチップの接続方法が得られ
る。According to the present invention, in the method for connecting an antenna to an IC chip, the antenna has a coil-shaped antenna coining portion for an antenna wire, and a metal bump is formed on a conductive pad provided on the IC chip. And forming the antenna coining part by winding the antenna wire in a coil shape, flattening the antenna coining part on which the bump is mounted, and connecting the bump to the mounting area of the coined antenna coining part. Thus, a method of connecting an IC chip is obtained.
【００１２】さらに、本発明によれば、アンテナとＩＣ
チップとを含むＩＣカードの製造方法において、前記ア
ンテナはアンテナ線をコイル状に巻くことによって作ら
れているアンテナコイニング部を有し、前記ＩＣチップ
上に設けた導電パッド上に金属バンプを形成し、アンテ
ナ線をコイル状に巻くことによって前記アンテナコイニ
ング部を形成し、前記バンプを実装する前記アンテナコ
イニング部を平坦化し、コイニングされた実装エリアに
前記バンプを接続し、前記アンテナ及び前記ＩＣチップ
を樹脂層によって覆い、該樹脂層上の少なくとも一方面
に樹脂材を設け、該樹脂層上に仮固定して、前記アンテ
ナコイニングに前記ＩＣチップに形成された前記バンプ
を接続し、その後、カバー樹脂層で積層張り合わせるこ
とを特徴とするＩＣカードの製造方法が得られる。Further, according to the present invention, an antenna and an IC
In a method for manufacturing an IC card including a chip, the antenna has an antenna coining portion formed by winding an antenna wire in a coil shape, and a metal bump is formed on a conductive pad provided on the IC chip. Forming the antenna coining part by winding an antenna wire in a coil shape, flattening the antenna coining part on which the bump is mounted, connecting the bump to the coined mounting area, and connecting the antenna and the IC chip. Covering with a resin layer, providing a resin material on at least one surface on the resin layer, temporarily fixing the resin material on the resin layer, connecting the bump formed on the IC chip to the antenna coining, and then forming a cover resin. An IC card manufacturing method characterized by laminating and laminating layers is obtained.
【００１３】[0013]
【作用】本発明では、ＩＣチップ１上への金などの金属
バンプの形成は、加工費の最も安価なワイヤボンディン
グバンプ形成法を用いる。バンプ形成後、加工せずその
ままの形状で接続する。According to the present invention, the formation of a metal bump such as gold on the IC chip 1 uses a wire bonding bump forming method which is the least expensive in processing cost. After the bumps are formed, they are connected in the same shape without processing.
【００１４】アンテナに接続する際に圧力をかけて面押
し状態にした後、超音波にてバンプとアンテナの端部と
を接続する。形成されたアンテナは樹脂材へ仮固定す
る。仮固定には樹脂層としてホットメルト接着材を用い
る。構成材料が変形や変質しない作業温度、条件を採用
する。[0014] After connecting the antenna to the antenna to apply a pressure to the surface in a pressed state, the ultrasonic wave is used to connect the bump to the end of the antenna. The formed antenna is temporarily fixed to a resin material. For the temporary fixing, a hot melt adhesive is used as a resin layer. Adopt working temperature and conditions under which the constituent materials are not deformed or deteriorated.
【００１５】アンテナ線は樹脂材に仮固定されるので、
自動化しやすく、バンプを介しての接続は接続信頼性も
高くなる。接合部分は金属接合の為、電気的な特性が良
い。また、アンテナの仮固定に樹脂層を用いることで、
基層へのダメージ無く、面押しと超音波を併用し低温で
の接続を行う。Since the antenna wire is temporarily fixed to the resin material,
It is easy to automate, and connection via bumps increases connection reliability. Since the joining portion is a metal joint, it has good electrical characteristics. Also, by using a resin layer to temporarily fix the antenna,
The connection is made at low temperature by using both surface pressing and ultrasonic waves without damaging the base layer.
【００１６】[0016]
【発明の実施の形態】以下、本発明の非接触型のＩＣカ
ードの一実施の形態例を図面を参照して説明する。図１
は、非接触型のＩＣカードにおける具体的な実施の形態
例を示している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a non-contact type IC card according to the present invention will be described below with reference to the drawings. FIG.
Shows a specific embodiment of a non-contact type IC card.
【００１７】図１を参照して、ＩＣカードは、ＩＣチッ
プ１と、このＩＣチップ１上に設けたＡｕ（金）などの
複数の金属バンプ２と、バンプ２に接続した複数のアン
テナ（アンテナ部３およびアンテナコイニング部４）
と、アンテナおよびＩＣチップ１を上下から挟むように
に設けた外被樹脂層５およびカバー層６と、外被樹脂層
５およびカバー層６間に設けた樹脂層７とを有してい
る。Referring to FIG. 1, an IC card includes an IC chip 1, a plurality of metal bumps 2 such as Au (gold) provided on the IC chip 1, and a plurality of antennas (antennas) connected to the bumps 2. Unit 3 and antenna coining unit 4)
And a cover resin layer 5 and a cover layer 6 provided so as to sandwich the antenna and the IC chip 1 from above and below, and a resin layer 7 provided between the cover resin layer 5 and the cover layer 6.
【００１８】ＩＣチップ１上には、電極となる導電パッ
ド（図示せず）がＡｌ（アルミニウム）やＡｌ合金を蒸
着等で形成されている。なお、非接触型のＩＣカードで
は、アンテナコイルが必要であり、ＩＣチップ１のパッ
ドとアンテナ線の接続方式によって信頼性とコストとが
大きく異なる。On the IC chip 1, conductive pads (not shown) serving as electrodes are formed by depositing Al (aluminum) or an Al alloy. Note that a non-contact type IC card requires an antenna coil, and reliability and cost greatly differ depending on a connection method between a pad of the IC chip 1 and an antenna line.
【００１９】この実施の形態例では、信頼性も高く、量
産性の良いワイヤボンディングバンプ方式によってＡｌ
パッド面にバンプ２を形成する。ＩＣチップ１上にバン
プ２を形成後、加工せずそのままの形状でアンテナを接
続する。In this embodiment, the Al bonding is performed by a wire bonding bump method having high reliability and good mass productivity.
The bump 2 is formed on the pad surface. After the bumps 2 are formed on the IC chip 1, the antenna is connected in the same shape without processing.
【００２０】アンテナコイニング部４は、０．０５μｍ
以上の金属層を有している。アンテナコイニング部４に
バンプ２を接続する際には、圧力を１バンプ当たり１５
〜２０ｇかけてアンテナコイニング部４へ面押し状態に
した後、超音波にてバンプ２とＡｕ（金）処理されたア
ンテナの端部分を接続する。形成されたアンテナは、樹
脂層７へ仮固定する。仮固定にはホットメルト材を用い
る。構成材料が変形や変質しない作業温度、条件を採用
する。The antenna coining unit 4 has a thickness of 0.05 μm.
It has the above metal layer. When connecting the bump 2 to the antenna coining part 4, the pressure should be set to 15 per bump.
After the surface is pressed to the antenna coining unit 4 by ２０20 g, the bump 2 and the end of the Au (gold) -treated antenna are connected by ultrasonic waves. The formed antenna is temporarily fixed to the resin layer 7. A hot melt material is used for temporary fixing. Adopt working temperature and conditions under which the constituent materials are not deformed or deteriorated.
【００２１】一方、アンテナを形成するためのアンテナ
線は、仕様に応じて３０〜１５０μのＣｕ（銅）線を使
用する。一般的には、５０μ線が巻き性や埋め込み性か
ら採用される。アンテナ線は、巻き線機によって巻かれ
てアンテナが形成される。その後、アンテナの先端部分
を３０〜５０μに叩いて平坦化してアンテナコイニング
部４を形成する。On the other hand, an antenna wire for forming an antenna uses a Cu (copper) wire of 30 to 150 μm depending on the specification. Generally, a 50 μm wire is employed because of its winding property and embedding property. The antenna wire is wound by a winding machine to form an antenna. After that, the tip portion of the antenna is flattened by hitting it to 30 to 50 μ to form the antenna coining portion 4.
【００２２】アンテナの先端は、簡単な方法としてスポ
ット無電解の金めっきによってＡｕ処理をしておく。通
常は、インレットと呼ばれる中間層にアンテナが仮固
定、もしくは埋め込まれるが、本実施の形態例では一方
の表面に使用される樹脂層７に仮固定する。The tip of the antenna is Au-treated by spot electroless gold plating as a simple method. Usually, the antenna is temporarily fixed or embedded in an intermediate layer called an inlet, but in the present embodiment, it is temporarily fixed to the resin layer 7 used on one surface.
【００２３】実際のＩＣチップ１の搭載は、一般的なフ
ィリップチップ実装機を用いて、フェイスダウンで実装
する。ＩＣチップ１は、２つのパッドしかないため、ア
ンテナの先端位置精度もそれほど厳しくなく、ワーク押
さえでアンテナの端部を固定して実装する。アンテナ線
を固定する樹脂層７としてのホットメルト材は、８０℃
以上で軟化することと超音波接続でパワーが逃げやすい
ので常温条件で作業する。The actual mounting of the IC chip 1 is performed face down using a general flip chip mounting machine. Since the IC chip 1 has only two pads, the positional accuracy of the tip of the antenna is not so strict, and the end of the antenna is fixed by a work holder and mounted. The hot melt material as the resin layer 7 for fixing the antenna wire is 80 ° C.
As described above, power is easily released by softening and ultrasonic connection, so work under normal temperature conditions.
【００２４】基本的にはＡｕ−Ａｕの超音波接続で、常
温接続であることからＰＥＴフィルム等も変形しないこ
とから、実装の反対面は表層として利用できる。Basically, the Au-Au ultrasonic connection is performed at room temperature, so that the PET film or the like is not deformed. Therefore, the opposite surface of the mounting can be used as a surface layer.
【００２５】[0025]
【発明の効果】本発明によれば、ＩＣパッドにアンテナ
コイルを金属結合で接続でき、配線基板や、導電接着剤
を使用しないので安価にできる効果がある。According to the present invention, the antenna coil can be connected to the IC pad by metal bonding, and the cost can be reduced because the wiring board and the conductive adhesive are not used.
【００２６】また、インレットと呼ばれる中間層を省略
できるので高さ方向を十分にコントロール出来、薄型化
ＩＣカードを安定して生産することができる。Further, since the intermediate layer called the inlet can be omitted, the height direction can be sufficiently controlled, and a thin IC card can be stably produced.
【００２７】また、ＩＣチップとアンテナ線を容易に接
続することができ、パッドとアンテナ線との接続信頼性
を高めることができる。Further, the IC chip and the antenna line can be easily connected, and the connection reliability between the pad and the antenna line can be improved.
【００２８】さらに、ＩＣカードを構成する樹脂材が変
質しない低温で組立られ、環境に配慮した安価なＩＣカ
ードのモジュールを提供することができる。Further, it is possible to provide an inexpensive IC card module that is assembled at a low temperature at which the resin material constituting the IC card is not deteriorated and is environmentally friendly.
【図１】本発明のＩＣカードの一実施の形態例を示す断
面図である。FIG. 1 is a sectional view showing an embodiment of an IC card according to the present invention.
１ ＩＣチップ ２ バンプ ３ アンテナ材 ４ アンテナコイニング部 ５ 外被樹脂層 ６ カバー層 ７ 樹脂層 DESCRIPTION OF SYMBOLS 1 IC chip 2 Bump 3 Antenna material 4 Antenna coining part 5 Outer resin layer 6 Cover layer 7 Resin layer
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ // Ｈ０１Ｌ 25/00 Ｇ０６Ｋ 19/00 Ｈ Continued on the front page (51) Int.Cl. 6 Identification symbol FI // H01L 25/00 G06K 19/00 H
Claims (12)
いて、前記アンテナはアンテナ線をコイル状に巻くこと
によって作られているアンテナコイニング部を有し、該
アンテナコイニング部が平坦形状を呈しており、前記Ｉ
Ｃチップと前記アンテナコイニング部とが金属バンプを
介して相互に接続されていることを特徴とするアンテナ
とＩＣチップとの接続構造。1. In a connection structure between an antenna and an IC chip, the antenna has an antenna coining portion formed by winding an antenna wire in a coil shape, and the antenna coining portion has a flat shape. Said I
A connection structure between an antenna and an IC chip, wherein the C chip and the antenna coining unit are connected to each other via a metal bump.
の接続構造において、前記アンテナ及び前記ＩＣチップ
が樹脂層によって覆われていることを特徴とするアンテ
ナとＩＣチップとの接続構造。2. The connection structure between an antenna and an IC chip according to claim 1, wherein the antenna and the IC chip are covered with a resin layer.
の接続構造において、前記アンテナコイニング部は、
０．０５μｍ以上の金属層を有していることを特徴とす
るアンテナとＩＣチップとの接続構造。3. The connection structure between an antenna and an IC chip according to claim 1, wherein said antenna coining section comprises:
A connection structure between an antenna and an IC chip, which has a metal layer of 0.05 μm or more.
ドにおいて、前記アンテナはアンテナ線をコイル状に巻
くことによって作られているアンテナコイニング部を有
し、該アンテナコイニング部が平坦形状を呈しており、
前記ＩＣチップと前記アンテナコイニング部とが金属バ
ンプを介して相互に接続されており、さらに、前記アン
テナ及び前記ＩＣチップが樹脂層によって覆われてお
り、該樹脂層上の少なくとも一方面に外被側樹脂層が設
けられていることを特徴とするＩＣカード。4. An IC card including an antenna and an IC chip, wherein the antenna has an antenna coining portion formed by winding an antenna wire in a coil shape, and the antenna coining portion has a flat shape. ,
The IC chip and the antenna coining portion are connected to each other via a metal bump, and the antenna and the IC chip are covered with a resin layer. An IC card comprising a side resin layer.
記樹脂層がホットメルト接着材であることを特徴とする
ＩＣカード。5. The IC card according to claim 4, wherein said resin layer is a hot melt adhesive.
記アンテナコイニング部は、０．０５μｍ以上の金属コ
ーティング層を有していることを特徴とするＩＣカー
ド。6. The IC card according to claim 4, wherein said antenna coining section has a metal coating layer of 0.05 μm or more.
いて、前記アンテナはアンテナ線をコイル状のアンテナ
コイニング部を有し、前記ＩＣチップ上に設けた導電パ
ッド上に金属バンプを形成し、前記アンテナ線をコイル
状に巻くことによって前記アンテナコイニング部を形成
し、前記バンプを実装する前記アンテナコイニング部を
平坦化し、コイニングされた前記アンテナコイニング部
の実装エリアに前記バンプを接続することを特徴とする
アンテナとＩＣチップの接続方法。7. A method of connecting an antenna to an IC chip, wherein the antenna has a coil-shaped antenna coining portion for an antenna wire, and a metal bump is formed on a conductive pad provided on the IC chip. The antenna coining portion is formed by winding a wire in a coil shape, the antenna coining portion on which the bump is mounted is flattened, and the bump is connected to a mounting area of the coined antenna coining portion. How to connect antenna and IC chip.
接続方法において、前記アンテナ及び前記ＩＣチップを
樹脂層によって覆い、該樹脂層上の少なくとも一方面に
外被樹脂層を設けることを特徴とするアンテナとＩＣチ
ップの接続方法。8. The method for connecting an antenna and an IC chip according to claim 7, wherein the antenna and the IC chip are covered with a resin layer, and a covering resin layer is provided on at least one surface of the resin layer. To connect the antenna to the IC chip.
接続方法において、前記アンテナ線と前記ＩＣチップに
形成された前記バンプを８０℃以下の温度にて、圧接と
超音波とを併用して接続することを特徴とするアンテナ
とＩＣチップの接続方法。9. The method for connecting an antenna and an IC chip according to claim 7, wherein the antenna wire and the bumps formed on the IC chip are pressed at a temperature of 80 ° C. or less by using both pressure welding and ultrasonic waves. A method for connecting an antenna and an IC chip, characterized by connecting.
ードの製造方法において、前記アンテナはアンテナ線を
コイル状に巻くことによって作られているアンテナコイ
ニング部を有し、前記ＩＣチップ上に設けた導電パッド
上に金属バンプを形成し、アンテナ線をコイル状に巻く
ことによって前記アンテナコイニング部を形成し、前記
バンプを実装する前記アンテナコイニング部を平坦化
し、コイニングされた実装エリアに前記バンプを接続
し、前記アンテナ及び前記ＩＣチップを樹脂層によって
覆い、該樹脂層上の少なくとも一方面に外被樹脂層を設
け、前記樹脂層上に仮固定して、前記アンテナコイニン
グに前記ＩＣチップに形成された前記バンプを接続し、
その後、カバー樹脂層で積層張り合わせることを特徴と
するＩＣカードの製造方法。10. A method for manufacturing an IC card including an antenna and an IC chip, wherein the antenna has an antenna coining portion formed by winding an antenna wire in a coil shape, and a conductive member provided on the IC chip. Forming a metal bump on the pad, forming the antenna coining portion by winding an antenna wire in a coil shape, flattening the antenna coining portion for mounting the bump, connecting the bump to the coined mounting area. The antenna and the IC chip were covered with a resin layer, an outer resin layer was provided on at least one surface of the resin layer, and temporarily fixed on the resin layer, and the IC chip was formed on the antenna coining. Connecting the bumps,
Thereafter, a method of manufacturing an IC card, comprising laminating and laminating with a cover resin layer.
法において、前記アンテナコイニング部に０．０５μｍ
以上の金属コーティング層を形成することを特徴とする
ＩＣカードの製造方法。11. The method for manufacturing an IC card according to claim 10, wherein said antenna coining portion has a thickness of 0.05 μm.
A method for manufacturing an IC card, comprising forming the above metal coating layer.
法において、前記アンテナ線と前記ＩＣチップに形成さ
れた前記バンプを８０℃以下の温度にて、圧接と超音波
とを併用して接続することを特徴とするＩＣカードの製
造方法。12. The method for manufacturing an IC card according to claim 10, wherein the antenna wire and the bump formed on the IC chip are connected at a temperature of 80 ° C. or less by using both pressure welding and ultrasonic waves. A method for producing an IC card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10136768A JPH11328352A (en) | 1998-05-19 | 1998-05-19 | Connection structure between antenna and ic chip, and ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10136768A JPH11328352A (en) | 1998-05-19 | 1998-05-19 | Connection structure between antenna and ic chip, and ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11328352A true JPH11328352A (en) | 1999-11-30 |
Family
ID=15183069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10136768A Withdrawn JPH11328352A (en) | 1998-05-19 | 1998-05-19 | Connection structure between antenna and ic chip, and ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11328352A (en) |
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-
1998
- 1998-05-19 JP JP10136768A patent/JPH11328352A/en not_active Withdrawn
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