JPH11219420A - Ic card module, ic card and their manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card module and an IC card capable of being made thin, easily holding and connecting an antenna line to a bump on a pad and improving the reliability of connection between the pad and the antenna line, and a manufacturing method therefor. SOLUTION: This IC card module having an IC chip 1, pads 2 to be electrodes formed on the IC chip 1, Au bumps 4 formed on respective pads 2, and antenna lines 3 connected to the bumps 4 is stored in a core material 5 having the same dimension as the thickness of the chip 1 and a hot melt material 6 is stuck to the outsides of the module and the core material 5 so that the thickness of the chip 1 is the same as that of the module.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card module, an IC card and a method of manufacturing the same,
The present invention relates to a connection structure and a connection method between an IC chip and an antenna wire (antenna coil) of an IC card module used for a non-contact type IC card, an IC card using the IC card module, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, technically established in this field,
The most frequently used method is printed circuit board (wiring board)
Is a COB method in which an IC chip is mounted on a printed circuit board and connected to a printed circuit board by a bonding wire. Via the wiring on the printed circuit board, a pad serving as an electrode for antenna line connection and the antenna line are connected with a solder material.

On the other hand, another method uses a method in which a gold (Au) bump is formed on a pad of an IC chip irrespective of a bonding line and connected to a printed board by flip chip technology.

[0004]

However, the COB method is
There is a drawback that the loop height is 200 μm and the module cannot be made thin.

On the other hand, in the method using an Au bump, the shape of the torn portion on the upper surface of the bump is not stable, and since the upper surface has a protruding shape, it is not stable when the antenna wire is connected by soldering. There were drawbacks.

Therefore, the present invention can be made thinner,
An object of the present invention is to provide an inexpensive IC card module, an IC card, and a method of manufacturing the same, which can easily hold and connect an antenna wire to a bump on a pad and improve connection reliability between the pad and the antenna wire.

[0007]

According to the present invention, there is provided an IC chip, a pad serving as an electrode formed on the IC chip,
An IC module having a gold bump formed on the pad and an antenna line connected to the bump, wherein the bump has a groove for connecting the antenna line.
It is a card module.

Further, according to the present invention, a gold bump is formed on a pad serving as an electrode of an IC chip by a bonding method, and the bump is flattened. Then, a groove having an angle coincident with the mounting direction of the antenna line is formed, and the antenna line is connected to the groove flat and at a predetermined height from the IC chip. The solder is supplied to the bumps, and is connected by heating from the lower surface of the IC chip.
This is a method for manufacturing a C card module.

The present invention is also an IC card comprising the above-mentioned IC card module, a core material for accommodating the IC card module, and a hot melt material provided outside the IC card module and the core material. And the I
The thickness of the C chip is the same as the core material, and the thickness of the IC card module is the same as the core material and the hot melt material.

[0010] Further, according to the present invention, the above-mentioned IC card module is housed in a core material having the same dimension as the thickness of the IC chip, and the thickness with the IC chip is the same as the thickness of the IC card module. A hot melt material is bonded to the outside of the IC card module and the core material.

According to the present invention, the antenna wire can be connected to the IC pad by metal bonding, and the printed circuit board and the conductive adhesive are not used. Further, since the mounting height is stabilized, the thickness of the IC card can be controlled, which is advantageous for a method of manufacturing a thin card. Further, since the antenna wire is temporarily fixed, it is easy to automate. Aluminum (A
1) Since the material such as Sn does not contact the pad, the connection reliability is high. In addition, since the IC chip is accommodated in the core material, it is resistant to external pressure, and furthermore, the flatness of the IC card is good, and the degree of freedom in card design and the like is high, and the effect is great.

[0012]

Embodiments of the present invention will be specifically described below with reference to the drawings.

As shown in FIG. 1, first, an IC chip 1
Then, a pad 2 made of Al or an Al alloy was formed by vapor deposition or the like. A non-contact type IC card requires an antenna line, and reliability and cost greatly differ depending on a connection method between a pad and an antenna line. Therefore, here, the Au bump 4 was formed on the surface of the pad 2 by the bonding bump method which has the lowest processing cost, the highest reliability, and the good mass productivity. afterwards,
The surface was pressed at about 20 g per bump to form a flat portion. The flat portion was pressed again with a U-shaped jig having the same diameter as the wire used for the antenna wire 3 to form a groove. This U-shaped surface pressing was made the same as the mounting angle of the antenna wire 3 to the chip. At this time, the U-shaped jig may be V-shaped or the like.

On the other hand, according to the specification,
A Cu wire of 30 to 150 μm can be used. The surface of the Cu wire is previously plated with Sn or a Sn alloy. The plating thickness is preferably 3 to 5 μm. Also, C
The u line may be a pure Cu line. Here, a Sn-Bi plated wire was used to prevent whiskers, and a thin polyurethane coating was used for insulation between wires. With such a thin coating, the connection is
It can be easily removed with an electric torch or the like.

Next, since a sheet or the like made of a hot melt material used in the next step generally has a material in steps of 25 μm, the height of the mounting of the antenna wire 3 on the IC chip 1 is set to 50 μm. The antenna wire 3 on 4 was pushed in slowly. The bump 4 and the antenna wire 3 were made of Au and Cu, respectively, both of which were soft, the indentation load per bump was about 25 g, and the above dimensions could be easily obtained.

Since the antenna wire 3 and the bump 4 are mechanically attached to each other, a small amount of Pb-free Sn-Ag solder paste is applied to the upper surface of the IC chip 1 by a transfer method using a rubber plate or the like. By heating at 250 ° C. for about 5 to 10 seconds from the lower surface of the substrate, metal bonding was performed to obtain an IC module of the present invention.

Next, the IC module shown in FIG.
C card 11 was produced. As shown in FIG.
Was the same as the thickness of the IC chip 1. The hot melt material 6 is 50 μm in the same manner as the mounting height of the antenna wire 3.
And The mounting portion of the antenna wire was absorbed by a layer made of the hot melt material 6. That is, when the surface layer is laminated with the cover member 7 made of plastic in this dimensional configuration, no stress is applied to the IC chip 1 and no useless cavity is formed. Can be prevented and the flatness can be improved.

[0018]

According to the present invention, the thickness can be reduced.
An inexpensive IC card module, an IC card, and a method of manufacturing the same, which can easily hold and connect an antenna wire to a bump on a pad and improve connection reliability between the pad and the antenna wire, can be provided.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of an IC module according to an embodiment of the present invention. FIG. 1A is a perspective view. FIG. 1B is a sectional view.

FIG. 2 is an explanatory diagram of an IC card according to the embodiment of the present invention. FIG. 2A is a plan view. FIG. 2 (b) is the same as FIG.
Xx sectional view of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 2 Pad 3 Antenna wire 4 (Au) bump 5 Core material 6 Hot melt material 7 Cover material 11 IC card

Claims (4)

[Claims] 1. An IC comprising an IC chip, a pad serving as an electrode formed on the IC chip, a gold bump formed on the pad, and an antenna line connected to the bump.
In the C module, the bump has a groove for connecting the antenna line. 2. A gold bump is formed on a pad serving as an electrode of an IC chip by a bonding method, and after flattening the bump, the bump having the same diameter as the antenna wire to be connected is formed on the bump. Forming a groove having an angle corresponding to the mounting direction of the wire, and flattening the antenna wire in the groove,
The connection is made at a predetermined height from the IC chip, and then the solder is supplied to the antenna and the bump.
A method for manufacturing an IC card module, wherein heating and connection are performed from the lower surface of a C chip. 3. The IC card module according to claim 1, further comprising: a core material for containing the IC card module;
An IC card having a C card module and a hot melt material provided outside the core material, wherein the thickness of the IC chip is the same as the core material, and the thickness of the IC card module is An IC card, wherein the core material is the same as the hot melt material. 4. The IC card module according to claim 1, which is housed in a core material having the same dimension as the thickness of the IC chip.
The hot melt material is mixed with the IC chip so that the thickness of the IC chip is the same as the thickness of the IC card module.
A method for manufacturing an IC card, wherein a C card module and a core material are bonded outside.