JP2003067711A - Article provided with ic chip mounting body or antenna part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-cost article having a simple constitution and prevented from doing fraud such as integrally stripping an RF-ID (radio- frequency identification) media from the article or sticking the RF-ID media to another article. SOLUTION: This article is provided with, at least, a conductive pattern with a connecting conductive part in a substrate and disposed with an IC chip mounting body, which is formed by mounting an IC chip on the connecting conductive part, by directly fixed to a prescribed position, or disposed with an antenna part composed of a conductive pattern, which is formed of an antenna conductive part and a connecting conductive part positioned in the end part of the antenna conductive part, by directly fixed to a prescribed position. The IC chip mounting body or the antenna part is detachably formed with the antenna part or the IC chip mounting body, which is formed into the RF-ID media by assembled with the antenna part or the IC chip mounting body.

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an article having an IC chip mounted body or an antenna, and more particularly, to a thin article such as a non-contact type data transceiver. RF-ID (Ra) used for information transmission / reception type recording media
dio Frequency IDentificat
(ion) It relates to an article provided with an IC chip mounted body or an antenna part capable of forming a medium. 2. Description of the Related Art Recent methods for forming an RF-ID medium tend to employ an IC chip mounted body instead of directly mounting an IC chip on an antenna portion. In this method, for example, a conductive portion for connection corresponding to an antenna portion (land portion) on an RF-ID media base material is formed on a small sheet, and an IC chip mounted body on which an IC chip is mounted is used. . A conventional method for forming an RF-ID medium will be described with reference to FIGS. In this method, the configuration of the antenna circuit body is divided into an IC chip mounted body and an antenna part, and the IC chip mounted body and the antenna part are formed in advance, and the antenna circuit body is formed using these. Has become. FIG. 4 shows one IC chip mounted body A1.
First, a base material 1 having a predetermined size is prepared so as to cover a terminal portion of an antenna portion described later (A). A pair of conductive patterns 4 continuous with the conductive portions 3 are provided (b). Thereafter, the IC chip 5 is mounted so as to straddle the IC chip mounting conductive portion 2 to form an IC chip mounted body A1 (c), and a conductive adhesive is applied to the entire surface on one side where the IC chip 5 is mounted. 6 is applied (d). FIG. 5 shows a process of forming the other antenna B1. A substrate 7 having a predetermined size is prepared (a).
The antenna conductive portion 8 and the antenna conductive portion 8
A conductive pattern (antenna portion) 10 composed of a terminal portion and a connecting conductive portion 9 is provided at the end of the terminal (b), thereby forming the antenna B1. The connection conductive portion 9 is provided so as to correspond to the connection conductive portion 3 of the IC chip mounting body A1. 11 is an insulating part. Then, the IC chip mounted body A1 and the antenna B1 were overlapped with each other so that the connecting conductive portions 3 and 9 face each other using the conductive adhesive 6, and the IC chip mounted body A1 and the antenna B1 were joined. Thereafter, the insulating adhesive 12 is applied to the entire surface to obtain the RF-ID medium C1 shown in FIG. [0005] Such an RF-ID medium C1 is used by being adhered to an article a such as a product via an insulating adhesive 12. However, the attached RF-ID media C1
From the article a, and the other article b is RF-I
There is a problem that the D media C1 can be stuck and the article b appears to the article a. Further, there is a problem that the RF-ID medium C1 is discarded after being used once and is not recycled because it is not recycled. [0006] A first object of the present invention is to solve the conventional problems, to remove the RF-ID medium C1 from the article a integrally, and to transfer the RF-ID medium C1 to another article b. An article with an inexpensive eco-friendly IC chip mounted body or antenna part, which can prevent illegal acts such as adhering the article b to the article a by sticking the medium C1 and can be reused without being discarded after being used once. It is to provide. The inventor of the present invention has conducted intensive studies in order to solve the above-mentioned problems, and as a result, it has been found that an IC chip mounting body A1 and an antenna B1 are conventionally formed integrally with each other.
The IC chip mounting body A1 and the antenna B1 of the F-ID medium C1 are separately provided, one of which is fixed and disposed directly at a predetermined place of the article, and the other is detachably mounted at the time of use to perform RF.
-It has been found that the problem can be solved if the ID medium C1 is constructed and used and is detached after use, and the present invention has been accomplished. According to a first aspect of the present invention, there is provided an IC chip mounted body or an article provided with an antenna portion, wherein a conductive pattern having at least a conductive portion for connection is provided on a base material, and an IC chip is mounted on the conductive portion for connection. Or an article in which an IC chip mounted body is directly fixed to a predetermined position and disposed, or an antenna section made of a conductive pattern including an antenna conductive section and a connection conductive section located at an end of the antenna conductive section Is directly fixed to a predetermined location and is disposed, wherein the IC chip mounted body or the antenna portion is the IC chip.
An antenna unit that forms RF-ID media by combining with a chip mounting body, or an IC chip mounting body that forms RF-ID media by combining with the antenna unit is detachably formed. . The article provided with the IC chip mounted body or the antenna section of the present invention has a simple structure and is inexpensive. For example, the article is directly connected to the IC chip mounted body which is directly fixed to the article. The connection conductive portions of the antenna portion that is not disposed on the article are overlapped so that the respective connection conductive portions face each other, and the IC chip mounted body and the antenna portion are conductively joined to each other to produce an RF-ID medium. Can be formed and provided for use. After use, if the antenna section is detached, the RF-ID media is integrally peeled off from the article,
Unauthorized acts such as sticking RF-ID media to other articles will not be possible, and the IC chip mounted body and the antenna unit will be reusable. If the parts can be used in the same manner, the IC chip mounted body can be reused. An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram schematically illustrating an antenna unit that is directly fixed and disposed at a predetermined position of an article. FIG. 2 is an explanatory view schematically illustrating a state in which an IC chip mounting body is mounted on the antenna section shown in FIG.
FIG. 3 is an explanatory view schematically illustrating a state in which an IC chip mounting body is mounted at a predetermined position of the antenna section shown in FIG. Reference numeral 20 denotes an article, 21 denotes an antenna section fixed and disposed directly on a predetermined portion of the article 20, 22 denotes an IC chip mounted body, and 23 denotes an RF-ID medium. 1 and 2
As shown in FIG. 1, an antenna portion 21 is provided by being fixed directly by printing or the like on an article 20, and an IC chip mounting body 22 is mounted at a predetermined position during use to mount the IC chip mounting body 2.
The IC chip mounting body 22 and the antenna unit 21 are conductively connected by superposing the connection conductive unit (not shown) of the antenna unit 21 on the connection conductive unit (not shown) of FIG. RF-ID media 23
To form In the above example, an example is shown in which the antenna portion 21 is fixedly provided by printing directly on the article 20 or the like.
The method of disposition is not limited to this. For example, an antenna B1 shown in FIG. 5 with an adhesive applied to the back surface is used, and the antenna B1 is directly fixed to a predetermined portion of the article 20 via the adhesive. It may be an antenna unit. The method of detachably mounting the IC chip mounting body 22 at a predetermined position of the antenna unit 21 is not particularly limited, and the IC chip mounting body A1 shown in FIG.
May be mounted via the conductive adhesive 6, or the IC chip mounting body 22 formed in the form of a card may be mounted by an insertion method or a sandwiching method. In the above example, an example is shown in which the antenna section 21 is fixed and fixed by, for example, printing directly on the article 20.
The IC chip mounting body 22 is replaced with the article 20 instead of the antenna section.
The antenna unit 21 is fixed at a predetermined position in advance, and the antenna unit 21 is attached to a predetermined portion of the IC chip
The IC chip mounting body 22 and the antenna part 21 are superimposed on the connection conductive part (not shown) of the C chip mounting body 22 so that the connection conductive parts (not shown) of the antenna part 21 face each other. And the RF-
An ID medium 23 can also be formed. The antenna unit 21 is detachably mounted on a predetermined portion of the IC chip mounting body 22 so that the RF-ID medium 2
3 is not particularly limited, either.
May be mounted via an adhesive, or the antenna section 21 formed in a card form may be mounted by a plug-in method or a sandwiching method. After the use of the RF-ID medium 23 shown in FIG. 3, the IC chip mounting body 22 can be detached and attached.
The RF-ID medium 23 is integrally peeled off from the article 20, and illegal acts such as sticking the RF-ID medium 23 to other articles cannot be performed.
IC chip package 2 whose design has been changed
If the antenna unit 21 is detachably attached to the antenna unit 21 for use, the antenna unit 21 can be reused without any design change. The article used in the present invention is not limited as long as the antenna section or the IC package can be directly fixed and arranged. Specifically, for example, home appliances, luggage such as luggage, glass bottles, Containers such as plastic containers, various products such as frames, semi-finished products, and the like can be given, but are not limited thereto. The base material 1 or base material 7 may be made of a woven fabric made of inorganic or organic fibers such as glass fiber, alumina fiber, polyester fiber, polyamide fiber, and the like.
Nonwoven fabric, mat, paper, or a combination of these, or a composite substrate formed by impregnating them with a resin varnish, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate , Ethylene-vinyl alcohol copolymer base, polyvinyl alcohol base, polyvinyl chloride base, polyvinylidene chloride base, polystyrene base, polycarbonate base, acrylonitrile butadiene styrene base Plastic substrates such as polymer resin substrates and polyethersulfone resin substrates, or surface treatments such as corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment. Selected from known ones such as Can. When an IC chip mounting body or an antenna portion is formed on a base material, it may be formed using the same material or different base materials. Further, when the IC chip mounting body or the antenna portion is provided on the article, the number is not limited to one, and one or more can be provided. 1
There is an advantage that more data can be transmitted and received in a non-contact manner by disposing more than one. The formation of the conductive pattern on the IC chip mounting body and the formation of the conductive pattern on the antenna portion can be performed by known methods. For example, a method of printing and fixing a conductive paste by screen printing or ink jet printing and drying and fixing, attaching coated or uncoated metal wire, etching, dispensing, attaching metal foil, direct metal deposition, metal deposited film transfer, Examples include, but are not limited to, formation of a conductive polymer layer. The mounting of the IC chip in the process of forming the IC chip mounting body includes wire bonding (WB), anisotropic conductive film (ACF), conductive paste (ACP), insulating resin (NCP), insulating resin The connection can be made by a known method such as a film (NCF) or one using a cream solder ball. If necessary, use a well-known underfill material or potting material to protect the connection.
Reinforcement may be performed. The adhesive and the insulating adhesive used in the present invention are not particularly limited. Specifically, adhesive,
Examples thereof include a thermoplastic adhesive such as a hot melt type, a thermosetting adhesive, and a photocurable adhesive. Specific examples of pressure-sensitive adhesives and adhesives include, for example, natural rubber (N
R), styrene / butadiene copolymer rubber (SBR), polyisobutylene (PIB), isobutylene / isoprene copolymer (butyl rubber, IIR), isoprene rubber, butadiene polymer (BR), styrene / butadiene copolymer (HSR) , Styrene / isoprene copolymer, styrene / isoprene / styrene block polymer (SI
S), styrene / butadiene / styrene block polymer (SBS), chloroprene rubber (CR), butadiene / acrylonitrile copolymer rubber (NBR), butyl rubber, acrylic polymer, vinyl ether polymer, polyvinyl alcohol (PVA), polyvinyl butyral (PVB) , Polyvinylpyrrolidone (PVP), vinylpyrrolidone / vinyl acetate copolymer, dimethylaminoethyl / methacrylic acid / vinylpyrrolidone copolymer, polyvinylcaprolactam, polyvinylpyrrolidone, maleic anhydride copolymer, silicone adhesive (polyvinylsiloxane) , Polyurethane, polyvinyl chloride, gelatin,
Shellac, gum arabic, rosin, rosin ester,
Ethyl cellulose, carboxymethyl cellulose, paraffin, tristearin, polyethylene, polypropylene, acrylic resin, vinyl resin, polyisobutene,
Examples thereof include one or a mixture of two or more of polybutadiene, epoxy resin, phenol resin, polyurethane resin, polyester, polyamide, silicone, polystyrene, and melamine resin. To these, a softening agent such as liquid polybutene, mineral oil, liquid polyisobutylene and liquid polyacrylate, and a tackifier such as rosin, rosin derivative, polyterpene resin, terpene phenol resin and petroleum resin can be added. Specific examples of the photocurable adhesive include, for example, acrylate compounds, methacrylate compounds, propenyl compounds, allyl compounds, vinyl compounds, acetylene compounds, unsaturated polyesters, epoxy poly (meth) acrylates, poly (meth) acrylates. ) Acrylate polyurethanes, polyester polyol poly (meth) acrylates, polyether polyol poly (meth) acrylates, phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, styrene,
One type or a mixture of two or more types such as α-alkylstyrene, and a mixture thereof with a known photopolymerization initiator, photopolymerization accelerator, or the like can be given. These photocurable adhesives include softeners such as liquid polybutene, mineral oil, liquid polyisobutylene, and liquid polyacrylate, and tackifiers such as rosin, rosin derivatives, polyterpene resins, terpene phenol resins, and petroleum resins. Can be added. If necessary, it can be diluted with an organic solvent or a reactive organic solvent. The epoxy resin of the thermosetting adhesive may be any as long as it has two or more epoxy groups in one molecule and is cured to form a resin.
Epoxy resin, bisphenol F epoxy resin, tetrabromobisphenol A epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, glycidyl ester epoxy resin, alicyclic epoxy resin, hydantoin epoxy resin, etc. . Examples of the curing agent include a phenol resin, an acid anhydride, and an amine compound. Examples of the phenol resin include a phenol novolak resin, a cresol novolak resin, a naphthol-modified phenol resin, a dicyclopentadiene-modified phenol resin, and a para-xylene-modified phenol resin. If necessary, a curing accelerator such as an imidazole type, a tertiary amine type, a phosphorus compound type, or a mixture of two or more of these can be added. If necessary, a solvent, a flame retardant such as a bromine compound or a phosphorus compound, a defoaming agent such as a silicone compound, a coloring agent such as carbon black or an organic pigment, or a coupling agent can be added. . Also, silica, alumina, calcium carbonate,
One or more powders such as titanium oxide and carbon black can be added as a filler. The conductive adhesive used in the present invention is not particularly limited, and specifically, for example, the above-mentioned hot melt adhesive, pressure-sensitive adhesive, thermoplastic resin adhesive or thermosetting resin adhesive Alternatively, an adhesive curable by ultraviolet rays, an electron beam, or the like, a natural rubber-based adhesive, a synthetic rubber-based adhesive, or a combination of two or more of these and a conductive powder may be used. Can be. The method of applying the adhesive, insulating adhesive, or conductive adhesive used in the present invention to a predetermined location is not particularly limited. For example, a method of manually applying such as brushing, or a method of applying automatically Printing, coating, and tape attaching methods can be used. In the present invention, an insulating layer is not always necessary, but an insulating layer can be provided on the IC chip mounting body side and / or the antenna section side by a known method such as printing, coating, or tape bonding. The conductive portion for connection between the above-mentioned IC chip mounting body and the antenna portion may be formed by an arbitrary method which is easy to manufacture and process in design, and has a processing tolerance which does not require the precision as high as that of the IC chip mounting portion. A high structure is sufficient. Since the present invention is not limited to the above embodiment, various modifications can be made without departing from the spirit of the present invention. The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. (Example 1) Silver paste (product name: LS-411AW,
An appropriate amount of isophorone and butyl cellosolve acetate as viscosity modifiers was added to Asahi Chemical Laboratory to produce a silver paste ink for silk printing. Using this silver paste ink, silk printing was performed on a PET film (substrate) having a thickness of 0.1 mm, and dried at 150 ° C. for 30 minutes to form an antenna portion. This antenna portion was directly fixed to an article (plastic container) 20 as shown in FIG. 1 by a known method, and an antenna portion 21 was provided.
On the other hand, an IC chip mounted body (IC) in which an IC chip is mounted on label paper (base material) of 70 kg continuous weight by a known method.
Card) 22. As shown in FIG. 2 and FIG. 3, the IC chip package (IC card) 22 is inserted into a predetermined place and is removably attached to the IC chip package (I) during use.
(C card) 22 is superimposed on a not-shown connecting conductive part of the antenna unit 21 such that the connecting conductive parts face each other. When the antenna section 21 was conductively joined, it was confirmed that the antenna section 21 functioned as a non-contact type data transmitting / receiving body (RF-ID medium) 23. After confirmation I
The C chip mounted body (IC card) 22 could be easily detached from the non-contact type data transmitting / receiving body (RF-ID media) 23, and could be reused similarly. Example 2 An article (plastic) shown in FIG. 1 was formed in the same manner as in Example 1 except that when forming the antenna part in Example 1, aluminum was etched on the PET film to form an antenna part. The antenna unit 21 is fixed directly to the container 20 and an IC chip mounted body (IC card) 22 is formed. As shown in FIGS. 2 and 3, the IC chip mounted body (IC card) 2
2 was inserted into a predetermined place and mounted, and it was confirmed that the device functioned as a non-contact type data transmitter / receiver (RF-ID medium) 23. After the confirmation, the IC chip mounted body (IC card) 22 could be easily detached from the non-contact type data transmitting / receiving body (RF-ID media) 23, and could be reused similarly. Example 3 The article (plastic) shown in FIG. 1 was formed in the same manner as in Example 1 except that when forming the antenna portion in Example 1, the copper plate was etched on the PET film to form the antenna portion. The antenna unit 21 is directly fixed to the container 20, and an IC chip mounted body (IC card) 22 is formed. As shown in FIGS. 2 and 3, the IC chip mounted body (IC card) 22 is used. Was inserted into a predetermined place and attached, and it was confirmed that it functions as a non-contact type data transceiver (RF-ID medium) 23. IC chip mounted body (IC card) 2 after confirmation
2 is a non-contact type data transceiver (RF-ID media) 2
3 could be easily detached and reused in the same manner. According to the first aspect of the present invention, there is provided an article provided with an IC chip mounted body or an antenna portion, wherein a conductive pattern having at least a conductive portion for connection is provided on a base material, and the conductive portion for connection is provided. An article in which an IC chip mounted body having an IC chip mounted thereon is directly fixed at a predetermined position and disposed, or a conductive body comprising an antenna conductive part and a connection conductive part located at an end of the antenna conductive part. An article in which an antenna portion made of a pattern is directly fixed and arranged at a predetermined position, wherein the IC chip mounted body or the antenna portion is
An antenna unit that forms RF-ID media by combining with a C-chip mounting body or an IC that forms RF-ID media by combining with the antenna unit
Since the chip mounting body is formed to be detachable, the structure is simple and inexpensive, and for example, the antenna is directly fixed to the article, and the antenna is not connected to the conductive part for connection. The conductive portions for connection of the IC chip mounted body are overlapped so that the respective conductive portions for connection face each other, and the IC chip mounted body and the antenna portion are conductively joined to form an RF-ID medium for use. After use, if the IC chip mounted body is detached after use, the RF-ID media can be integrally peeled off from the article and illegal acts such as sticking the RF-ID media to other articles cannot be performed. Also IC
The chip mounted body and the antenna part can be reused.
Even if the design of the chip mounted body is changed, the IC whose design has been changed
If the chip mounted body can be used in the same manner, a remarkable effect that the antenna part can be reused is exhibited.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram schematically illustrating an antenna unit which is directly fixed and disposed at a predetermined position of an article. FIG. 2 is an explanatory diagram schematically illustrating a state in which an IC chip mounting body is mounted on the antenna unit illustrated in FIG. 1; FIG. 3 is an explanatory view schematically illustrating a state in which an IC chip mounting body is mounted at a predetermined position of the antenna section shown in FIG. FIG. 4 is an explanatory view showing a process of forming a conventional IC label mounting body of an IC label. FIG. 5 is an explanatory diagram showing a process of forming a conventional antenna unit. FIG. 6 is an explanatory view showing a conventional IC label. [Description of Signs] 1 Base material 2 Conductive part for mounting IC chip 3 Conductive part for connection 4 Conductive pattern 5 IC chip 6 Conductive adhesive 7 Base material 8 Antenna conductive part 9 Conductive part for connection 10 Conductive pattern 11 Insulating part 12 Insulating adhesive 20 Article 21 Antenna part 22 IC chip mounting body 23 RF-ID media A1 IC chip mounting body B1 Antenna C1 RF-ID media (IC label)

Claims (1)

Claims: 1. A conductive pattern having at least a conductive part for connection is provided on a base material, and an IC chip mounted body having an IC chip mounted on the conductive part for connection is directly mounted on a predetermined location. The antenna portion made of a conductive pattern composed of an article fixedly disposed on the antenna or a conductive portion for connection located at the end of the antenna conductive portion and the antenna conductive portion was fixed and disposed directly at a predetermined position. An article, wherein the IC chip mounted body or the antenna unit forms an RF-ID medium by combining with the IC chip mounted unit or forms an RF-ID medium by combining with the antenna unit. I
An article provided with an IC chip mounted body or an antenna, wherein the C chip mounted body is formed so as to be detachable.