JP2003288560A - Interposer and inlet sheet with antistatic function - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an interposer and an inlet sheet with an antistatic characteristic lasting for a long period of time without impeding communication owing to static electricity occurring during handling or in a manufacturing process nor deteriorating nor breaking an IC chip in the worst case. <P>SOLUTION: The interposer having an IC chip and a connection terminal part formed on a base material surface or the inlet sheet having an antenna circuit equipped with the IC chip, on a base material surface is characterized in that an antistatic layer is formed on at least one surface side of the base material surface. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an interposer and an inlet sheet having an antistatic function, and more particularly to an interposer and an inlet sheet having an electrostatic breakdown preventing property that lasts for a long period of time.

[0002]

2. Description of the Related Art A structure in which an antenna circuit is divided into an interposer and an antenna holder according to FIGS. 8 to 10, the interposer and the antenna holder are formed in advance, and an antenna circuit is formed using these. explain.

FIG. 8 shows a process of forming an interposer. First, a base material 1 having a predetermined size is prepared so as to cover a terminal portion of an antenna holder, which will be described later (a). A pair of conductive patterns 4 in which the chip mounting conductive portion 2 and the connection terminal portion 3 are continuous are provided (b). After that, the IC chip 5 is mounted so as to straddle the conductive portion 2 for mounting the IC chip to form the interposer A (c), and at least the conductive connection portion 3 on which the IC chip 5 is mounted (scheduled joining portion). An adhesive is applied on the above to form the adhesive portion 6 (d).

FIG. 9 shows a process of forming the other antenna holder B. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion are provided on the surface of the base material 7. A conductive pattern 10 including a connection terminal portion 9 (a portion to be joined), which is a terminal portion, is provided at an end portion of 8 (b), and thereby the antenna holder B is formed.
The connection terminal portion 9 is provided so as to correspond to the connection terminal portion 3 of the interposer A. Reference numeral 11 is an insulating portion.

Then, the interposer A and the antenna holder B are superposed so that the connection terminal portions 3 and 9 face each other via the adhesive portion 6, and the connection terminal portions 3 and 9 are connected to each other with the adhesive portion 6. By connecting the interposer A and the antenna holder B with each other by adhering them through the electric circuit and connecting the interposer A and the antenna holder B with each other, the electric circuit shown in FIG. RF-ID (Radio Frequency) such as thin information transmission / reception type recording media capable of recording and erasing data
IDentification) media C] is obtained.

FIG. 11 is an explanatory view for explaining an inlet sheet group and a plurality of inlet sheets, which are manufactured in the manufacturing process of the inlet sheet and are connected in series. In FIG. 11, 12 is a base material made of an insulating material such as paper or plastic, 13 is a figure formed by a method such as screen printing using conductive ink on a predetermined portion of the surface of the base material 12 and curing and drying. An antenna circuit having a pattern shown, 14 is an insulating portion formed by a method of printing with an insulating ink, followed by curing and drying,
Reference numeral 5 denotes an IC chip mounted on the antenna circuit 13 located at the chip mounting portion. It is also possible to seal the IC chip 5 by coating the mounted IC chip 5 with a thermosetting insulating ink made of a polymer member such as a phenol resin or a polyester resin by the potting method and then curing the ink. Then, the antenna circuit 13, the insulating portion 14,
Each IC circuit 15 is formed including the IC chip 5 and the like.

The inlet sheet set E shown in FIG. 11 is formed by connecting a plurality of IC circuits 15 in which an antenna circuit 13 having an IC chip 5 is formed on a surface of a base material 12, and each IC circuit 15 is The inlet sheet D is formed by being cut into individual rectangular sheets including this. These are used for RF-ID media used for information recording media such as non-contact type IC cards, tags, labels, etc., which can record and erase data by transmitting and receiving data in a non-contact state. To be done.

[0008]

The interposer and the inlet sheet formed in this manner interfere with communication due to static electricity generated during handling or during the manufacturing process, or the IC chip is deteriorated or destroyed in some cases. Sometimes caused the inconvenience.

The object of the present invention is to solve the problems of the prior art, to prevent static electricity generated during handling or in the manufacturing process, etc., from interfering with communication, and from deteriorating or destroying the IC chip. An object of the present invention is to provide an interposer and an inlet sheet having a puncture prevention property.

[0010]

In order to solve the above problems, an interposer having an antistatic function according to claim 1 of the present invention is an interposer in which an IC chip and a connection terminal portion are formed on a base material surface. An antistatic layer is formed on at least one surface side of the substrate surface.

An interposer having an antistatic function according to a second aspect of the present invention is an interposer in which an IC chip and a connection terminal portion are formed on a surface of a base material, and the base material contains an antistatic agent. Characterize.

An inlet sheet having an antistatic function according to a third aspect of the present invention is an inlet sheet having an antenna circuit having an IC chip formed on a substrate surface,
An antistatic layer is formed on at least one surface side of the substrate surface.

An inlet sheet having an antistatic function according to a fourth aspect of the present invention is an inlet sheet having an antenna circuit having an IC chip formed on a substrate surface,
An antistatic agent is blended in the base material.

The interposer having an antistatic function of the present invention is an interposer in which an IC chip and a connection terminal portion are formed on a surface of a base material, and an antistatic layer is formed on at least one surface side of the base material. Alternatively, since the base material is blended with an antistatic agent, communication may be hindered by static electricity generated during handling of an interposer or an RF-ID medium prepared using the interposer or during a manufacturing process, and in some cases, IC It has the property of preventing electrostatic breakdown, which will last for a long period of time without deterioration or destruction of the chip.

The inlet sheet having an antistatic function of the present invention is an inlet sheet in which an antenna circuit having an IC chip is formed on a base material surface, and an antistatic layer is formed on at least one surface side of the base material surface. Or because the base material is blended with an antistatic agent, static electricity generated during handling of the inlet sheet or during the manufacturing process may interfere with communication, or in some cases, the IC chip may deteriorate or be destroyed. It has a long-lasting antistatic property.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is an illustration showing a process of forming the interposer of the present invention. A base material 1 having a predetermined size is prepared so as to extend over the terminal portion of the antenna holder shown in FIG. 2, and resin is provided on at least one surface side of the base material 1 (on the upper surface side of the base material 1 in the present embodiment). The antistatic layer 16 is formed by using an epoxy thermosetting resin type ink in which 2% by mass of graphite powder is blended with respect to the component (a). And the antistatic layer 16
A pair of conductive patterns 4 in which the IC chip mounting conductive portion 2 and the connection terminal portion 3 are continuous are provided on the above (b). Then, the IC chip mounting conductive portion 2 is laid so as to straddle the I
The C chip 5 is mounted to form the interposer A (C), and the adhesive is applied onto at least the conductive connection portion 3 (the portion to be joined) on which the IC chip 5 is mounted to form the adhesive portion 6. (D).

FIG. 2 shows a process of forming the other antenna holder B, in which a base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion are provided on the surface of the base material 7. A conductive pattern 10 including a connection terminal portion 9 (a portion to be joined), which is a terminal portion, is provided at an end portion of 8 (b), and thereby the antenna holder B is formed.
The connection terminal portion 9 is provided so as to correspond to the connection terminal portion 3 of the interposer A of the present invention. Reference numeral 11 is an insulating portion.

Then, the interposer A and the antenna holder B of the present invention are superposed so that the respective connection terminal portions 3 and 9 face each other via the adhesive portion 6, and the connection terminal portions 3 and 9 are bonded to each other by an adhesive agent. The RF-ID medium C shown in FIG. 3 is obtained by bonding the interposer A and the antenna holder B of the present invention by adhering through the portion 6 and achieving electrical conduction.

In the above embodiment, an example in which the antistatic layer 16 is formed on the upper surface side of the substrate 1 has been shown, but in the present invention, the antistatic layer 16 is formed on the lower surface side of the substrate 1. Alternatively, the antistatic layer 16 may be formed on both the upper surface side and the lower surface side of the base material 1, and in either case, the antistatic layer 16 has an excellent electrostatic breakdown preventing property that lasts for a long period of time.

FIG. 4 is an explanatory view for explaining an inlet sheet set of a plurality of inlet sheets, which is manufactured in the manufacturing process of the inlet sheet of the present invention, and the inlet sheet of the present invention. In FIG. 4, 12
Is a base material made of an insulating material such as paper or plastic, 16
Is formed on at least one surface side of the base material 12 (on the upper surface side of the base material 12 in this embodiment) by using an epoxy thermosetting resin type ink in which 2% by mass of graphite powder is mixed with the resin component. The antistatic layer 13 is a predetermined portion of the surface of the antistatic layer 16,
An antenna circuit having a pattern shown in the figure formed by a method such as screen-printing using conductive ink and curing and drying. Reference numeral 14 denotes an insulating portion formed by a method such as printing using insulating ink and then curing and drying. 5 is I mounted on the antenna circuit 13 located at the chip mounting portion.
A C chip is shown. After the mounted IC chip 5 is coated with thermosetting insulating ink made of a polymer member such as phenol resin or polyester resin by the potting method,
The IC chip 5 can be sealed by curing. Then, including the antenna circuit 13, the insulating portion 14, the IC chip 5, etc., I of each inlet sheet D1
The C circuit 15 is formed. The inlet sheet D1
In order to protect the antenna circuit 13 and the like on the surface on which the IC circuit 15 is formed and on the back surface of the base material 12, a cover sheet (overcoat layer) not shown can be formed.

The inlet sheet set E1 shown in FIG. 4 comprises a plurality of IC circuits 15 in which an antenna circuit 13 having an IC chip 5 is formed on the surface of a base material 12, and each IC circuit 15 comprises: The inlet sheet D1 of the present invention is formed by being cut into individual rectangular sheets including this. These are used for RF-ID media used for information recording media such as non-contact type IC cards, tags, labels, etc., which can record and erase data by transmitting and receiving data in a non-contact state. To be done.

In the above embodiment, an example in which the antistatic layer 16 is formed on the upper surface side of the base material 12 has been shown, but in the present invention, the antistatic layer 16 is formed on the lower surface side of the base material 12. Alternatively, the antistatic layer 16 may be formed on both the upper surface side and the lower surface side of the base material 12, and in either case, the antistatic layer 16 has an excellent antistatic property that lasts for a long time.

Regarding the inlet sheet D1 of the present invention,
A 30 μm thick PET film (polyethylene terephthalate film, surface specific resistance 1
0 ¹⁰ Ωcm, manufactured by Toray Industries, Inc., 100X21) to form the antistatic layer 16, and an antistatic layer 16 having a thickness of 10 μm, in which 2% by mass of graphite powder is mixed with the resin, which is an epoxy thermosetting material. Of the case where the antistatic layer 16 is formed by using the conductive resin type ink and the case where the antistatic layer 16 is not formed
A test was conducted in which a static voltage of 20 KV or 30 KV was applied to the antenna circuit 13 with the C chip 5 interposed. As a result of the test, when the antistatic layer 16 is not formed,
Of the tested inlet sheets, 0.1% of the inlet sheets were defective due to the IC chip 5 being destroyed.
When the antistatic layer 16 is formed, the IC chip 5
Was not destroyed and the number of defective inlets was 0.

In the above embodiment, the example in which the conductive pattern 4 and the antenna circuit 13 are formed after the antistatic layer 16 is formed on the upper surface side of the base material 12 is shown, but the present invention is not limited to this. After forming the conductive pattern 4 and the antenna circuit 13, the antistatic layer 16 may be formed, or a combination thereof.

5 to 7 are cross-sectional explanatory views schematically showing cross sections of other inlet sheets of the present invention. Figure 5
It is sectional explanatory drawing which shows the cross section of the other inlet sheet D2 of this invention typically. Inlet sheet D2 of the present invention
The antistatic layer 16 is formed on the lower surface side of the substrate 12. FIG. 6 is a cross-sectional explanatory view schematically showing the cross section of another inlet sheet D3 of the present invention. In the inlet sheet D3 of the present invention, the antistatic layer 16 is formed on both the upper surface side and the lower surface side of the base material 12. FIG. 7 is a cross-sectional explanatory view schematically showing the cross section of another inlet sheet D4 of the present invention. The base material 12 of the inlet sheet D4 of the present invention contains an antistatic agent 17.

The material of the base material of the interposer or inlet sheet used in the present invention is a woven fabric, a non-woven fabric, a mat, a paper or a combination thereof made of an inorganic or organic fiber such as glass fiber, alumina fiber, polyester fiber or polyamide fiber. Or a composite substrate formed by impregnating these with resin varnish, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, an ethylene / vinyl alcohol copolymer group Material, polyvinyl alcohol resin base material,
Plastic substrate such as polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin substrate, polyether sulfone resin substrate Alternatively, it can be selected from known ones such as those subjected to surface treatment such as corona discharge treatment, plasma treatment, ultraviolet ray irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment.

The conductive pattern, the antenna circuit, the insulating portion, etc., which form the IC circuit of the present invention, can be formed by known methods. For example, conductive patterns and antenna circuits are formed by printing conductive ink by screen printing or inkjet printing to dry and immobilize it, attaching coated or uncoated metal wires,
Examples include etching, dispersion, metal foil attachment, direct metal vapor deposition, metal vapor deposition film transfer, and conductive polymer layer formation. Examples of the formation of the insulating portion include a method of printing insulating ink by screen printing or inkjet printing to dry and fix the insulating ink, and attachment of an insulating film.

The mounting of IC chips includes wire bonding (WB) and anisotropic conductive film (AC).
F), conductive paste (ACP), insulating resin (NCP),
The connection can be made by a known method such as using an insulating film (NCF) or a cream solder ball. If necessary, the connection portion may be protected and reinforced with a known underfill material or potting material.

Vehicle materials for the conductive ink and the insulating ink used in the present invention include those which are cured by a thermoplastic resin or a thermosetting resin, ultraviolet rays, an electron beam or the like,
Examples thereof include natural rubber, synthetic rubber, and combinations thereof. Examples of the conductive ink include those obtained by mixing these vehicle materials with conductive powder such as silver powder and aluminum powder to impart conductivity. These conductive inks and insulating inks are in the form of a solution type dissolved in a solution, an aqueous emulsion type, a hot melt type that solidifies by cooling after heating, melting, and coating,
After applying liquid oligomer or monomer, etc., heat or ultraviolet rays,
Some of them can be cured by irradiation with radiation such as an electron beam, but both can be used.

As the vehicle material of the ink used for forming the antistatic layer in the present invention, the above-mentioned vehicle material can be used, but it is preferable to use the following thermosetting or radiation curable resin. Specifically, for example, acrylate compounds, methacrylate compounds, propenyl compounds, allyl compounds, vinyl compounds,
Acetylene compounds, unsaturated polyesters, epoxy poly (meth) acrylates, poly (meth) acrylate polyurethanes, polyester polyols poly (meth)
Acrylates, polyether polyol poly (meth)
Examples thereof include thermosetting or radiation-curable curable resins such as acrylates, phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, styrene, α-alkylstyrene, and other epoxy compounds. You may use these in mixture of 2 or more types.

If necessary, liquid polybutene, mineral oil, liquid polyisobutylene, liquid polyacrylic ester, tackifier, rosin and rosin derivative, polyterpene resin, terpene phenol resin, petroleum resin and the like can be added. If necessary, it can be diluted with an organic solvent.

In the present invention, an epoxy compound having two or more epoxy groups in one molecule and being cured into a resin can be preferably used. Specific examples of the epoxy compound used in the present invention include, for example, bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, tetrabromobisphenol A type epoxy compounds, phenol novolac type epoxy compounds, cresol novolac type epoxy compounds, glycidyl ester type epoxy compounds. Examples thereof include compounds, alicyclic epoxy compounds, hydantoin type epoxy compounds, and the like, and mixtures of two or more of these.

In the present invention, a reactive diluent may be added to the epoxy compound. As the reactive diluent, an epoxy compound having one or more epoxy groups in one molecule and having a relatively low viscosity at room temperature can be preferably used. Depending on the purpose, other polymerizable functionalities other than the epoxy group can be used. Group, for example, alkenyl group such as vinyl group and allyl group, (meth)
It may have an unsaturated carboxylic acid group such as acryloyl group.

As the curing agent used in the present invention, a phenol resin, an acid anhydride, an amine compound or the like can be used. Examples of the phenol resin include, but are not limited to, phenol novolac resin, cresol novolac resin, naphthol modified phenol resin, dicyclopentadiene modified phenol resin, and paraxylene modified phenol resin. The compounding ratio of the epoxy compound and the phenol resin as the curing agent is such that O in the phenol resin is equivalent to 1 equivalent of epoxy group in the epoxy compound.
H equivalent is preferably 0.3 to 1.5 equivalent,
0.5 to 1.2 equivalents are more preferable.

Examples of acid anhydrides include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhymic acid anhydride and dodecenylsuccinic anhydride. It is illustrated. The mixing ratio of the epoxy compound and the acid anhydride is preferably such that the acid anhydride equivalent is 0.6 to 1.0 per 1 equivalent of the epoxy group in the epoxy compound.

Examples of the amine compound include, but are not limited to, modified polyamines such as aliphatic polyamines, aromatic amines, polyaminoamides, polyaminoimides, polyaminoesters and polyaminoureas. Tertiary amine-based, imidazole-based, hydrazide-based, dicyandiamide-based, and melamine-based compounds can also be used. The mixing ratio of the epoxy compound and the amine compound is preferably such that the amine equivalent is 0.6 to 1.0 per 1 equivalent of the epoxy group in the epoxy compound.

The vehicle material used for forming the antistatic layer in the present invention may optionally contain a flexibility-imparting agent. Specific examples of the flexibility-imparting agent include polyester flexibility-imparting agents, acrylic flexibility-imparting agents, urethane flexibility-imparting agents, polyvinyl acetate flexibility-imparting agents, and heat. Examples include plastic elastomer-based flexibility imparting agents, natural rubber-based flexibility imparting agents, synthetic rubber-based flexibility imparting agents, and mixtures of two or more of these. Any of these can be used, but among these, polyester polyol, polyvinyl alkyl ether, and a mixture of two or more thereof can be preferably used because of their large effects.

The blending amount of the flexibility-imparting agent to the vehicle material used for forming the antistatic layer in the present invention can impart flexibility and flexibility, depending on the kind of the flexibility-imparting agent. It is not particularly limited as long as it is within the range, but it is preferably set within the range of 30 to 70 mass% with respect to the entire resin content. If it is less than 30% by mass, flexibility and flexibility may not be imparted, and conversely, if it exceeds 70% by mass, the adhesive strength may decrease.

The ink used for forming the antistatic layer in the present invention is prepared by blending the vehicle material with an antistatic agent. The antistatic agent used in the present invention is an antistatic layer formed on the surface of a substrate by printing using an antistatic layer-forming ink mixed with an antistatic agent from the communication interference due to static electricity or deterioration or destruction of IC chips. There is no particular limitation as long as it can protect the interposer or inlet sheet of the present invention, and it may be an organic antistatic agent, an inorganic antistatic agent, or a mixture thereof.

As the inorganic antistatic agent, specifically,
Examples thereof include carbon black, graphite powder, carbon fiber, metal powder, metal fiber, molten salt and semiconductor.

As the organic antistatic agent, specifically,
For example, nitrogen-containing compounds such as long-chain amines, amides and quaternary ammonium salts, esters of fatty acids and their derivatives, sulfonic acids and alkyl aromatic sulfonates, polyoxyethylene derivatives, polyglycols and their derivatives, polyhydric alcohols. And its derivatives, phosphoric acid derivatives, cationic surfactants, anionic surfactants, amphoteric surfactants, non-ion-on surfactants and the like.

The blending amount of the antistatic agent depends on the kind of the antistatic agent, but the larger the amount is, the better the electrostatic protection is, but if it is too much, the insulating property is impaired. Therefore, the upper limit is not impaired. It is preferable that the lower limit value is a value at which the antistatic layer formed on the surface of the base material can protect the interposer and the inlet sheet of the present invention from communication interference due to static electricity and deterioration or destruction of the IC chip. In the case of graphite powder, it is preferable to mix it in an amount of, for example, about 2 to 3% by mass based on the entire resin content in consideration of economy.

In the present invention, the antistatic layer-forming ink may further contain a filler if necessary.
The filler may be inorganic fine particles such as silica, alumina, calcium carbonate, titanium oxide and carbon black, organic fine particles such as various polymer powders, or a mixture of two or more kinds of them.

In the present invention, the ink for forming an antistatic layer is formed on the surface of a substrate by using letterpress printing, intaglio printing such as gravure printing, lithographic printing such as offset printing, screen printing, inkjet printing and other commonly used printing methods. The antistatic layer can be formed on the entire surface or on a predetermined portion of the base material by simply printing and drying it as necessary, or by irradiating with radiation such as electron beam or ultraviolet ray to cure it to form an antistatic layer.

In the present invention, a base material in which an antistatic agent is mixed with the base material itself of the interposer or the inlet sheet can be used. In the present invention, the antistatic agent used by blending with the base material itself can be used in an appropriate amount by combining one kind or two or more kinds selected from the above antistatic agents. The blending amount of the antistatic agent depends on the type of the antistatic agent, but the larger the amount is, the better the electrostatic protection is, but if it is too large, the insulating property of the base material itself is impaired. It is a value that does not exist, and the lower limit value is preferably a value that can protect the interposer and the inlet sheet of the present invention from communication interference due to static electricity and deterioration or destruction of the IC chip. The interposer and the inlet sheet of the present invention using a base material in which an antistatic agent is blended in the base material itself have excellent antistatic damage characteristics that last for a long period of time. The method of adding the antistatic agent to the base material itself is not particularly limited, and a method of adding and mixing the antistatic agent to paper pulp at the time of papermaking, coating or spraying on paper, fiber, woven fabric, non-woven fabric, mat, or spraying. A known method such as a method of impregnating an antistatic agent by dipping or the like, a method of melting and kneading a plastic with an antistatic agent, and the like can be used.

The above description of the embodiments is for explaining the present invention and does not limit the invention described in the claims or reduce the scope thereof. Further, the configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims.

[0047]

The interposer having an antistatic function according to claim 1 of the present invention is an interposer in which an IC chip and a connection terminal portion are formed on a base material surface, and at least one surface side of the base material surface is antistatic. Since the layers are formed, the interposer or R created by using the interposer
The static electricity generated during the handling of the F-ID medium or during the manufacturing process does not hinder communication, and in some cases, the IC chip is not deteriorated or destroyed, and has a characteristic of preventing electrostatic breakdown that lasts for a long time. Produce an effect.

An interposer having an antistatic function according to claim 2 of the present invention is an interposer in which an IC chip and a connection terminal portion are formed on a surface of a base material, and the base material contains an antistatic agent. Static electricity that occurs during handling of the interposer or the RF-ID medium created using the interposer or during the manufacturing process does not hinder communication, and in some cases, the IC chip is not degraded or destroyed, and it is a long-lasting static memory. It has a remarkable effect of having an electric breakdown preventing property.

An inlet sheet having an antistatic function according to a third aspect of the present invention is an inlet sheet having an antenna circuit having an IC chip formed on a substrate surface,
Since the antistatic layer is formed on at least one side of the substrate surface, static electricity generated during handling of the inlet sheet or in the manufacturing process may hinder communication, or in some cases, the IC chip may be deteriorated or destroyed. It has a remarkable effect that it has the property of preventing electrostatic breakdown that lasts for a long time.

An inlet sheet having an antistatic function according to a fourth aspect of the present invention is an inlet sheet having an antenna circuit having an IC chip formed on a substrate surface,
Since the base material is blended with an antistatic agent, the static electricity generated during handling of the inlet sheet or in the manufacturing process does not hinder communication, and in some cases, does not cause deterioration or destruction of the IC chip, which results in long-term use. It has a remarkable effect of having a permanent electrostatic breakdown preventing property.

[Brief description of drawings]

1A to 1D are explanatory views showing a process of forming an interposer of the present invention.

2A to 2B are explanatory views showing a process of forming an antenna holder.

FIG. 3 is a non-contact type IC using the interposer of the present invention.
It is explanatory drawing explaining a medium.

FIG. 4 is an explanatory diagram illustrating an inlet sheet of the present invention.

FIG. 5 is a cross-sectional explanatory view illustrating a cross section of another inlet sheet of the present invention.

FIG. 6 is a cross-sectional explanatory diagram illustrating a cross section of another inlet sheet of the present invention.

FIG. 7 is a cross-sectional explanatory view illustrating a cross section of another inlet sheet of the present invention.

8A to 8D are explanatory views showing a process of forming a conventional interposer.

9A to 9B are explanatory views showing a process of forming an antenna holder.

FIG. 10 is an explanatory diagram illustrating a conventional non-contact type IC medium.

FIG. 11 is an explanatory diagram illustrating a conventional inlet sheet.

[Explanation of symbols]

1, 7, 12 base material 2 IC chip mounting conductive part 3, 9 Connection terminal part 4 Conductive pattern 5 IC chip 6 Adhesive part 8 Antenna conductive part 10 Conductive pattern 11, 14 Insulation part 13 Antenna circuit 15 IC circuit 16 Antistatic layer 17 Antistatic agent A interposer B Antenna holder C RF-ID media D, D1, D2, D3, D4 inlet sheet

Claims (4)

[Claims] 1. An interposer having an IC chip and a connection terminal portion formed on a base material surface, wherein an antistatic layer is formed on at least one surface side of the base material surface, which has an antistatic function. Interposer. 2. An interposer having an IC chip and a connection terminal portion formed on a surface of a base material, wherein the base material is blended with an antistatic agent, which has an antistatic function. 3. An antistatic function comprising: an inlet sheet having an antenna circuit having an IC chip formed on a base material surface, wherein an antistatic layer is formed on at least one surface side of the base material surface. An inlet sheet having. 4. An inlet sheet having an antistatic function, wherein an antistatic agent is blended in the base material in an inlet sheet having an antenna circuit provided with an IC chip on a base material surface.