JP2004334268A - Paper slip ic tag, book/magazine with it, and book with it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a paper slip IC tag attachable to a book/magazine without using any dedicated labeler or the like and a book/magazine with the paper slip IC tag. <P>SOLUTION: In this paper slip IC tag 1 formed of a paperboard type paper slip as a base material and used for the book/magazine, a recess groove 4 or an aperture with a dimension allowing insertion of an IC chip is formed in a paper slip 1b, and an IC chip 2 attached into the recess groove and an antenna pattern 3 printed on the paper slip are connected to each other. On one side paper slip 1b of the paperboard type paper slip folded double, an IC tag is formed, while in the other side paper slip 1c, the recess groove or the aperture for storing the IC chip may be formed in the opposite position of the IC chip. In the book/magazine with the paper slip IC tag, the paper slip IC tag is inserted/stuck between a signature and an endpaper, into a front/back cover, or between the front/back cover and the endpaper and the like in bookbinding. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a paper IC tag and a book / magazine provided with the paper IC tag.
More specifically, the present invention relates to an IC tag used for a book / magazine, an IC tag using a paper piece in a form easy to handle in a bookbinding process or the like, and a book / magazine using the paper piece IC tag.
Therefore, the field of application of the present invention relates to the field of bookbinding and processing of IC tags used for books and magazines and books and magazines.
[0002]
[Prior art]
Non-contact IC tags (sometimes called “wireless tags”, “RF-ID tags”, “RF-ID elements”, “non-contact data carriers”, etc.) are used for logistics management, product quality indication, or theft prevention. It has been widely used for the purpose.
It has been studied to attach non-contact IC tags to books and magazines and use them for logistics management, book search purposes, sales and return management, and anti-theft purposes.
However, even if it can be understood that attaching a non-contact IC tag to a book or a magazine is suitable for these purposes, it is possible for a large number of publications that are actually issued in large numbers to be produced on a profitable basis without reducing productivity. It is difficult to attach.
[0003]
In order to attach a non-contact IC tag to a book or magazine, a dedicated automatic labeling device is provided at a predetermined position in a part that becomes a spine or a front or back cover and a facing side in a bookbinding process before attaching a cover. It is conceivable that the IC tag is continuously attached to each book. However, the bookbinding process of books and magazines is often performed by small and medium-sized companies, and the introduction of a dedicated labeling device imposes a new facility burden.
In addition, the sales volume of books and magazines undergoes large seasonal fluctuations throughout the year, and providing equipment that can handle busy periods is a great risk even for small and medium-sized companies.
If an IC tag is attached, the sales volume does not necessarily increase, and it is inevitable to pay attention to new equipment burdens in the case where various information media, in particular, paper media are on the decline due to the emergence of electronic media.
[0004]
Therefore, it is necessary to consider attaching an IC tag to existing existing equipment, but as a method to make it possible, an IC tag with an IC tag formed on a piece of paper equal to or smaller than the body page size is used. It could be a piece of paper.
In this case, it is possible to perform collation in a normal bookbinding process as if the number of pasted points increased by one.
Further, it is necessary to consider that the IC tag-attached paper piece for facilitating the work should be made as flat as possible by absorbing the thickness of the IC chip. This is because, when an IC chip having a thickness of about 500 μm protrudes from the paper surface, the stacked state of the paper pieces becomes unstable, and the workability of the operation of stacking many paper sheets is reduced.
When examining an IC tag made of such a paper material and a bookbinding method, the following prior arts exist.
[0005]
Patent Literature 1 relates to a method of attaching an RFID tag to a top binding, in which a core ball is formed with a concave groove capable of accommodating the RFID tag, and an RFID tag is attached in the concave groove to form a core ball with an RFID tag. It is described that the core ball with the RFID tag is attached to a cloth material to form a cover with the RFID tag, and the book with the RFID tag is wrapped around the contents of the book to produce a bookbinding.
However, in this case, the use of the RFID tag or the core ball increases the cost, and the area of the RFID tag is limited, so that there is a problem that a large communication distance cannot be secured.
[0006]
Patent Literatures 2 and 3 propose that a non-contact IC tag is attached between the inner surface of the cover and the facing, etc. However, a feeder or the like for supplying a label is required, and conventional equipment can be used. It is considered difficult to implement.
[0007]
[Patent Document 1] JP-A-2003-11544
[Patent Document 2] Japanese Patent Application No. 2003-039831
[Patent Document 3] Japanese Patent Application No. 2003-039872
[0008]
[Problems to be solved by the invention]
In view of the above, the present invention has studied the form of a low-cost paper IC tag that can be bound only with conventional equipment that handles paper chips and signatures and books and magazines to which the paper IC tag is attached, and completed the present invention. It has been reached.
[0009]
[Means for Solving the Problems]
The first aspect of the present invention to solve the above problems is an IC tag for a book or magazine using a paperboard-shaped paper piece as a base material, which has a concave groove large enough to fit an IC chip into the paper piece. A paper chip IC tag, wherein the IC chip mounted in the through hole is connected to an antenna pattern printed on a paper chip.
[0010]
A second aspect of the present invention for solving the above-mentioned problems is an IC tag for a book or magazine using a paperboard-shaped paper piece as a base material, which has a through-hole large enough to fit an IC chip into the paper piece. A paper chip IC tag, wherein the IC chip mounted in the through hole is connected to an antenna pattern printed on a paper chip.
[0011]
A third aspect of the present invention to solve the above-mentioned problem is an IC tag for books and magazines using a folded paperboard-shaped paper piece as a base material, and an IC chip is attached to one folded paper piece on one side. A paper chip IC tag in which a concave groove large enough to be fitted is formed, and an IC chip mounted in the concave groove is connected to an antenna pattern printed on a paper sheet.
[0012]
A fourth aspect of the present invention for solving the above-mentioned problem is an IC tag for a book or a magazine using a folded paperboard-shaped paper piece as a base material, and an IC chip is attached to one folded paper sheet on one side. A paper chip IC tag, wherein a through hole having a size that can be fitted is formed, and an IC chip mounted in the through hole is connected to an antenna pattern printed on a paper chip.
[0013]
A fifth aspect of the present invention for solving the above problems is an IC tag for a book or a magazine using a folded paperboard-shaped paper piece as a base material, wherein an antenna pattern is formed on one folded paper piece. A paper chip, wherein an IC tag to which an IC chip is connected is formed by printing, and a concave groove having a size of the IC chip is formed at a position facing the IC chip on the other paper sheet when the paper chip is folded in half. IC tag.
[0014]
A sixth aspect of the present invention for solving the above-mentioned problem is an IC tag for a book or a magazine using a folded paperboard-shaped paper piece as a base material, wherein an antenna pattern is provided on one folded paper piece. A sheet of paper, wherein an IC tag to which an IC chip is connected is formed by printing, and a through hole of the size of the IC chip is formed at a position facing the IC chip on the other side of the sheet when the sheet is folded in half. IC tag.
[0015]
Seventh of the gist of the present invention for solving the above problem is that a paper IC tag according to any one of claims 1 to 10 is inserted or pasted between a signature and a facing back, Or a book / magazine with a paper chip IC tag, which is inserted or pasted between the front cover or back cover and the facing back and bound flat or completely.
[0016]
Eighth of the gist of the present invention for solving the above-mentioned problem is to insert or stick the paper piece IC tag according to any one of claims 1 to 10 between any signatures. And a book / magazine with a paper chip IC tag characterized by being flat-bound or perfect-bound.
[0017]
A ninth aspect of the present invention for solving the above-mentioned problem is to insert or stick the paper piece IC tag according to any one of claims 1 to 10 between a signature and a facing back, Alternatively, there is provided a book with a paper chip IC tag, wherein the book is inserted and pasted between the front cover or the back cover and the facing back to perform bookbinding.
[0018]
A tenth aspect of the present invention for solving the above-mentioned problem is to insert or stick the paper piece IC tag according to any one of claims 1 to 10 between any signatures. And a book with an IC tag.
[0019]
An eleventh aspect of the present invention for solving the above-mentioned problem is to insert or paste the paper chip IC tag according to claims 1 to 10 between a signature and a facing, or to insert a paper cover or back cover and a facing back. A book / magazine with a paper chip IC tag characterized by being inserted or pasted in between and saddle-stitched.
[0020]
According to a twelfth aspect of the present invention for solving the above-mentioned problems, the paper chip IC tag according to claim 3 or 4 can be inserted between any one of the signatures, between the signature and the facing back, or a cover or back cover. And a saddle-stitched book or magazine with an IC tag inserted between any one of the following locations.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a paper chip IC tag and a book / magazine with the paper chip IC tag of the present invention will be described with reference to the drawings and the like.
FIGS. 1, 2, 3, 4, 5, and 6 are diagrams showing various embodiments of the paper chip IC tag of the present invention, FIG. 7 is a diagram showing an IC chip with extension terminals, and FIG. FIG. 9 is a diagram showing a connection portion between the antenna coil and the IC chip, and FIG. 9 is a diagram showing another mounting method of the IC chip. FIGS. 10, 11, 12, 13, 14, and 15 are diagrams showing various examples of books / magazines with a paper chip IC tag or books.
[0022]
FIG. 1 is a view showing a first embodiment of a paper chip IC tag of the present invention. FIG. 1 (A) is a plan view, and FIG. 1 (B) is a cross-sectional view taken along line AA of FIG. 1 (A). is there.
As shown in FIG. 1A, the paper chip IC tag 1 forms a concave groove 4 large enough to fit the IC chip 2 in a rectangular paper chip 1b, and prints the antenna pattern 3 around the concave groove 4. The concave groove 4 may be formed after the printing of the antenna pattern 3.
The IC chip 2 is mounted in the groove 4 so that the IC chip 2 and the antenna pattern 3 are electrically connected.
Since the concave groove 4 is provided to absorb the thickness of the IC chip 2 within the thickness of the paper piece, the concave groove is formed so as to have a plane shape and a depth capable of fitting at least a part of the thickness of the IC chip 2. I do.
[0023]
Usually, since the IC chip 2 has a thickness of about 200 μm to 500 μm, the concave groove 3 also needs to have a corresponding depth, and the paper piece itself is made of paperboard or cardboard having a thickness capable of forming the concave groove. preferable. However, even if it is not enough to accommodate the entire thickness of the IC chip 2, if the IC chip 2 can accommodate a part of the thickness, the IC chip will protrude less from the paper chip, and the stacking state when the paper chips are stacked is stable. Can be done.
In the case of generally used coated paper, the thickness is about 110 μm at 110 kg / 46 size, and the thickness of the high quality paper is about 130 μm at 110 kg / 46 size. Even with such a thickness, a concave groove having a depth of about half of the thickness can be formed by pressing the embossment, so that a predetermined effect can be obtained. However, the paper may be slightly restored or returned due to pressing.
In addition, cardboard, coated cardboard, chip cardboard, and the like can be used as the paper substrate.
[0024]
The planar shape of the IC chip 2 is a rectangular shape, often about 5 mm × 5 mm or less and 1 mm × 1 mm or more, but a form easily connected to an antenna pattern has been developed. That is, the conventional semiconductor element has minute pads on the surface of the chip and requires precise work for connection with a circuit by wire bonding or the like. However, as an IC chip for an IC tag, FIG. As described above, an IC chip 2w having terminals w1 and w2 extended in a wing shape from the pads p1 and p2 has been developed.
The paper chip IC tag of the present invention is not limited to the use of such an IC chip 2w. However, any IC chip having an extended terminal can be connected to the antenna pattern 3 using a conductive adhesive or the like. IC tags can be easily manufactured.
[0025]
The antenna pattern to be printed on the paperboard-like paper piece is formed by silk screen printing or the like using conductive ink. Since the embossing amount of the silk printing is about 100 to 300 μm, this embossing amount also has an effect of absorbing the thickness of the IC chip.
As the antenna pattern, an inductive coupling type coil-shaped pattern or an electrostatic coupling type patch type pattern is used. In the case of the inductive coupling type, 13.56 MHz (based on ISO15693) is often used, and in the case of the patch type, the frequency of 2.45 GHz is often used.
In order to avoid the influence of moisture absorption of the paper base material, it is preferable to provide a moisture-proof coating as an insulation treatment before printing the antenna pattern.
[0026]
In the case of a coil-shaped pattern, it is necessary to mount an IC chip between both ends of the coil, so that both ends of the coil need to be arranged at close positions.
To this end, a jumping circuit process is performed in which one end of the coil is disposed near the other terminal through the upper or lower side of the coil via an insulating coating, as indicated by a circle C in FIG. 1A. Required.
After the antenna pattern 3 is printed, the concave groove 4 can be formed into a concave groove by pressing and embossing the both ends of the antenna pattern. In that case, the IC chip 2 and the antenna pattern can be connected at the bottom of the concave groove.
[0027]
FIG. 2 is a view showing a second embodiment of a paper chip IC tag according to the present invention, wherein FIG. 2 (A) is a plan view, and FIG. 2 (B) is a sectional view taken along line AA of FIG. 2 (A). is there.
As shown in FIG. 2A, in the second embodiment of the paper chip IC tag 1, a through hole 5 large enough to fit the IC chip 2 in a rectangular paper chip 1b is formed, and an antenna pattern is formed around the through hole 5. 3 is printed and connected to the IC chip 2. In addition, a through-hole means the hole which penetrated the paper piece 1b.
In the case of the second embodiment, since the back surface of the IC chip 2 is not supported by a piece of paper, in order to prevent the IC chip from dropping, the size of the through hole 5 is punched out according to the size of the IC chip 2, Preferably, the side of the hole supports the IC chip.
Alternatively, after connecting the IC chip to the antenna pattern 2, the periphery may be filled with resin and fixed.
[0028]
FIG. 3 is a diagram showing a third embodiment of the paper IC tag of the present invention.
In the third embodiment, a concave groove 4 large enough to fit an IC chip is formed in one side paper piece 1b of the folded paperboard-like paper pieces 1b and 1c, and printing is performed on the IC chip and the paper chip mounted in the concave groove. The antenna pattern is connected to the antenna pattern 3 described above.
The arrow on the lower side of FIG. 3 indicates that the folding line 6 is folded in a valley and the sheet 1c is superimposed on the antenna pattern 3. The same applies to the following drawings.
In the case of using a two-fold paper piece as in the third embodiment, it can be used in either a flat state where the paper piece is not bent or a two-fold state.
[0029]
FIG. 4 is a diagram showing a paper chip IC tag according to a fourth embodiment of the present invention.
The fourth embodiment is the same as the third embodiment except that the through-hole 5 is formed in the one-side paper piece 1b obtained by folding the paper pieces 1b and 1c in two, and the IC chip 2 is mounted in the through-hole. There is a difference. The sheet 1d is not essential for using the folding line 7 for saddle stitching when bonding the sheet 1b and the sheet 1c.
The third embodiment and the fourth embodiment can be used by folding in two at the folding line 6 and bonding the surfaces. By folding in two, the IC tag can be made invisible, and disconnection of the antenna can be prevented.
[0030]
In both the third embodiment and the fourth embodiment, the groove 4 or the through hole 5 may be formed in the other folded paper piece 1b. It is not necessary that the groove be a groove and a hole is a hole. The hole may be a groove and a hole may be a groove. However, if any one of the holes is a through hole, it is convenient to confirm the position of the IC chip 2.
In these cases, since the concave groove 4 or the through hole 5 is formed on both sides, it is easy to accommodate the thickness of the IC chip when the IC chip is used by folding it in two.
The paper chip IC tags of the third embodiment and the fourth embodiment can be suitably used when saddle stitching the fold line 6 is used. The same applies to the case where the paper pieces 1b and 1c are glued together and saddle stitched at the folding line 7 portion. However, in the case of saddle stitching at the folding line 6, there is no point in providing a concave groove or a through hole in the other sheet 1c.
[0031]
FIG. 5 is a view showing a paper chip IC tag according to a fifth embodiment of the present invention.
In the fifth embodiment, the antenna pattern 3 is printed on one side of the two-folded paperboard-shaped paper piece 1b to form a paper-sheet IC tag to which an IC chip is connected, and the other-side paper sheet 1c via the folding line 6 is provided. A concave groove 4 for accommodating the thickness of the IC chip is formed at a position facing the IC chip on the side of the paper piece on which the IC tag is formed.
FIG. 6 is a diagram showing a sixth embodiment of a paper IC tag according to the present invention.
The sixth embodiment is the same as the fifth embodiment, except that a through-hole 5 is formed at the position where the IC chip of the other side of the paper sheet 1c faces the IC chip when the paper sheet is folded in half, to accommodate the thickness of the IC chip. It is characterized by the following.
[0032]
In both the fifth embodiment and the sixth embodiment, the one-sided paper piece 1b serving as the paper-sheet IC tag 1 has neither a concave groove nor a through-hole, and therefore does not differ from a normal paper-sheet IC tag.
Therefore, in principle, either the fifth embodiment or the sixth embodiment should be used by folding it in two, or if necessary, by bonding the paper pieces 1b and 1c.
In these embodiments, when the paper chip 1c is folded into two so that the IC chip 2 and the antenna pattern are inside the paper chip 1b, the concave groove or through hole of the paper chip 1c absorbs the thickness of the IC chip 2. There are advantages to Further, by folding in two, the IC tag can be made invisible similarly to the third and fourth embodiments, and disconnection of the antenna can be prevented.
[0033]
In the third to sixth embodiments, the paper piece on the other side of the two-folded paper piece can be wider than one side. In FIG. 4, the sheet 1c + 1d side is wider than the sheet 1c side in FIG. 6, but the sheet 1b side may be wider. The reason why the wide portion is provided is that when a sheet IC tag is fed by a bookbinding machine, only a single portion is clamped to facilitate feeding when a double sheet is strong. One sheet part can be a binding part.
[0034]
FIG. 7 is a diagram illustrating an IC chip with extension terminals, and FIG. 8 is a diagram illustrating a connection portion between the IC chip and an antenna coil.
As shown in FIG. 7, the IC chip 2w with extension terminals is provided with extension terminals w1 and w2 made of a conductive member connected to the pads p1 and p2 of the IC chip 2w.
When connecting the IC chip 2w and the antenna pattern 3, it is possible to apply a conductive adhesive to the extended terminal surface and connect to the end of the antenna pattern.
[0035]
FIG. 8A shows a case where the IC chip 2 is mounted in the concave groove 4, and the extension terminals w <b> 1 and w <b> 2 and the terminals of the antenna pattern 3 are bonded with a conductive adhesive 8.
FIG. 8B shows a case in which the connection is made to the IC chip 2 in the concave groove 4, and the extension terminals w 1, w 2 and the antenna pattern 3 are adhered by the conductive adhesive 8 on the bottom surface of the concave groove 4. I have.
In the case of FIG. 8B, as described above, after printing the antenna pattern, embossing is performed including both ends thereof, and connection with the IC chip is performed in the concave groove. In this case, connection is easy even without the extension terminals w1 and w2. In particular, if an anisotropic conductive adhesive is used, a short circuit will not occur if both terminals of the antenna are separated.
Although not shown, the case of the through hole 5 is the same as that of FIG.
[0036]
FIG. 9 is a diagram showing another mounting method of the IC chip 2 and the antenna.
First, as shown in FIG. 9A, the line width between both terminals 3a and 3b of the antenna coil 3 is reduced so that the distance between the terminals 3a and 3b becomes approximately the width of the concave groove so that the terminals 3a and 3b are close to each other. An antenna pattern is formed.
Next, as shown in FIG. 9B, a concave groove 4 is formed by embossing between the narrowed terminals 3a and 3b. At this time, if the surface of the embossing die on the side orthogonal to the coil wire is formed as a gentle slope with respect to the bottom surface of the concave groove, it is possible to prevent the coil wire from being broken due to pressing during embossing.
[0037]
FIG. 9C is a cross-sectional view taken along line AA in FIG. 9B after the IC chip 2 is mounted. After the concave groove 4 is formed, if the IC chip 2 is loaded and fixed with the conductive adhesive tape 8t, the pad p1 and the terminal 3a are connected, and the pad p2 and the terminal 3b are connected to form an antenna circuit. Instead of using the conductive adhesive tape 8t, an IC chip with extension terminals may be used.
This mounting method has an advantage that it is not necessary to form a jumping circuit in the antenna coil.
[0038]
Next, a book / magazine with a paper IC tag will be described.
The production of a book / magazine with a paper piece IC tag according to the present invention can be performed in the following steps: (1) flat binding, (2) perfect binding, (3) saddle binding, and (4) top binding.
(1) In the case of flat binding, it can be inserted between arbitrary signatures to perform flat binding, or after collating the signature, insert or paste a paper chip IC tag between the facing and the signature. If the cover is attached after the binding and flat binding, a flat binding book having a sheet IC tag between the facing and the signature is obtained. Also, if a sheet IC tag is inserted or pasted on the outer surface of the facing and bound flat, and then attached to the cover, a flat bound book having the sheet IC tag between the front or back cover and the facing can be obtained. If the front cover or the back cover and the facing are attached to each other, the sheet IC tag can be hidden.
[0039]
(2) The same applies to the case of perfect binding, which can be inserted between arbitrary signatures to perform perfect binding, or after collation, a paper IC tag is inserted between the facing and the signature. By pasting, perfect binding and pasting on the cover, a perfect binding having a paper IC tag between the facing and the signature can be obtained. Also, if a sheet IC tag is inserted or stuck to the outer surface of the facing and perfect-bound, and the front cover is adhered to the front cover, a perfect binding book having a sheet IC tag between the front or back cover and the facing can be obtained. Can be
In these cases, the book is a book in which the paper chip IC tag is stuck or bound at the beginning and end of the book, and has the paper chip IC tag in the inside of the book, which is fastened by the small edge glue.
[0040]
FIG. 10 shows a book / magazine in which the paper IC tag 1 is stuck or bound (inserted) between any signatures. In this case, in addition to perfect binding, flat binding, top binding, or saddle binding is also possible.
In this specification, inserting a sheet IC tag means binding and binding without using an adhesive, and attaching means attaching with an adhesive.
[0041]
If there is a paper IC tag between the signatures, it is particularly easy to notice. Therefore, it is preferable to print an advertisement or the like on the paper IC tag. Printing on the IC tag surface can be performed before printing the antenna pattern or simultaneously with printing the antenna pattern.
FIG. 11 shows an example of a perfect binding book having the sheet IC tag 1 between the cover 14 and the facing 16. This shows a state in which a part of the facing 16 is broken. Since the look and the front cover or the back cover are adhered to each other, it is possible to conceal the presence of the IC chip 1 without giving the purchaser anxiety or discomfort.
[0042]
(3) The same applies to saddle stitching. In the case of saddle stitching, the signatures are sequentially supplied onto the gathering chain in a state where the signatures are opened, and are collated. The paper IC tag 1 can be inserted between any signatures. Alternatively, it is also possible to attach a sheet IC tag between the facing and the signature or on the outer surface of the facing and then saddle stitch the book.
When inserting between signatures with saddle stitching, the signatures are opened and overlapped, so that a sheet IC tag having a folding line is used.
FIG. 12 shows an example of the book / magazine 10 on the outer surface of the facing 16 and the saddle stitched by inserting or sticking the sheet IC tag 1 between the cover 14 and the cover.
FIG. 13 shows an example of a book / magazine 10 in which a paper IC tag 1 is inserted between arbitrary signatures and saddle-stitched.
[0043]
(4) In the case of top binding, the signature is overwound and the back glue is solidified, followed by finish cutting. Then, the covers, such as cloth pasting, are pasted together using an automatic cover pasting machine.
After pasting the cover, there are cases where rounding, shaping, and grooving are performed.
Also in the case of top binding, bookbinding can be performed by inserting or attaching a sheet IC tag between the facing and the signature or on the outer surface of the facing, and then pasting the cover.
FIG. 14 shows a book in which the paper IC tag 1 is inserted or pasted between the top binding return 16 and the main body page 13.
FIG. 15 shows a booklet in which a sheet IC tag 1 is pasted between a facing 16 of a top binding and a cover 14 so that the sheet IC tag 1 is sandwiched between the facing and the front or back cover in the cover wrapping process. An example is shown.
[0044]
【Example】
Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1, 2, 3, 8, 9, 9, 11, 12, and 15. FIG.
(Example 1)
<Production of paper IC tag>
A 410 µm thick maricoat paper (310 g / m ² ) Was used to produce a paper IC tag of the third embodiment (FIG. 3).
A coil-shaped antenna pattern is formed on one side of the two-fold paper sheet 1b of the base material (the size of one IC tag paper sheet; the size of 200 mm x 150 mm folded in two at the center folding line). Silk screen printing was performed using a screen ink ("CHV series" manufactured by Jujo Chemical Co., Ltd.).
[0045]
The outer shape of the antenna coil was a rectangular shape of 45 mm × 75 mm.
The line width of the coil was about 1 mm, the distance between the lines was 0.5 mm, and printing was performed so that the coil was wound five times. The ink volume was about 150 μm.
The distance between both ends of the antenna coil 3 is set to about 0.8 mm, and the tip of 3 mm × 3 mm is pressed with a square embossed die so that the part becomes the center, and the concave groove having a depth of 250 μm is formed. 4 was formed.
After the embossing, both ends of the antenna coil are located on the bottom surface of the concave groove 4 as shown in FIG.
[0046]
An anisotropic conductive adhesive is applied to the pad surface of the IC chip 2 having a non-contact communication function having an outer shape of 2.0 × 2.0 mm and a thickness of 400 μm in the concave groove 4 so that each pad is connected to both ends of the antenna coil. It was mounted and fixed so as to be located in the part.
In this state, writing was performed on the paper IC tag 1 and the non-contact communication function was tested.
[0047]
<Manufacture of books and magazines with paper IC tags>
Offset printing was performed using "Canary" (40.5 kg / 765 x 1076 mm) on the main body paper, and "King-O" (60 kg / 765 x 1085 mm) on 128 pages of B5 size (four 32 signature pages) and front picture paper. ) To print by rotary offset to prepare 24 pages of B5 size (3 pages of 8 signatures).
After collation, the bundle thickness became about 10 mm.
Separately, a top coat paper (88 kg / 765 × 1100 mm) was used as a cover paper, and one page of four B5-size signatures was subjected to offset rotary printing.
In the saddle stitching process, the prepared sheet IC tag 1 is inserted (straddled along the folding line 6) on the outer surface (return surface) of the final signature and on the front cover side. Stapled and cut. The facing surface and the inner surface of the cover were adhered so that the IC tag 1 could not be seen.
As a result, a magazine 10 with a paper IC tag as shown in FIG. 12 was obtained.
[0048]
(Example 2)
<Production of paper IC tag>
A high quality paper (110 g / 46 size) having a thickness of 130 μm was used as a base material for a paper chip IC tag to produce a paper chip IC tag of the second embodiment (FIG. 2).
A coil-shaped antenna pattern was silk-screen printed on a sheet 1b of the substrate (size of the sheet; 100 mm x 150 mm) using a conductive silk screen ink ("CHV series" manufactured by Jujo Chemical Co., Ltd.).
[0049]
The outer shape of the antenna coil was a rectangular shape of 45 mm × 75 mm.
The line width of the coil was about 1 mm, the distance between the lines was 0.5 mm, and printing was performed so that the coil was wound five times. The ink volume was about 230 μm.
The gap between both ends of the antenna coil 3 was set to about 2.0 mm, and the through hole 5 was formed by punching out 2 mm × 2 mm so that the center of the portion was the center.
[0050]
An IC chip 2w with an extended terminal having a non-contact communication function and having an outer shape of 2.0 × 2.0 mm and a thickness of 400 μm was fitted into the through hole 5. A conductive adhesive was applied to both terminals w1 and w2 of the IC chip 2w, and mounted and fixed so that each terminal was located on both ends of the antenna coil.
In this state, writing was performed on the paper IC tag 1 and the non-contact communication function was tested. As a result, it was confirmed that reading and writing could be performed well.
[0051]
<Manufacture of books and magazines with paper IC tags>
The body paper was printed by offset rotary printing using “Cream Kinmari” (70 kg / 788 × 1096 mm) to prepare 216 pages of B5 size (13 pages of signatures + 13 pages of 8 pages + 1 page). The text thickness after collation was about 11 mm.
Separately, the front cover was prepared by attaching a cover cloth (T-thin cloth) to a chip ball No. 28.
In the bookbinding process, the previously prepared piece of paper IC tag 1 is attached to the inner surface of the cover, and then a step of attaching the cover to the main body page is performed, and the return face and the inner surface of the cover are adhered to make the piece of paper IC tag 1 invisible. I did it. As a result, a book 10 with a paper IC tag as shown in FIG. 15 was obtained. The book thickness was about 16 mm.
[0052]
(Example 3)
<Production of paper IC tag>
A 410 µm thick maricoat paper (310 g / m ² ) Was used to produce the paper IC tag of the first embodiment (FIG. 1).
A coil-shaped antenna pattern was silk-screen printed on the substrate (size of paper piece; 100 mm × 150 mm size) paper piece 1b using conductive silk screen ink (“CHV series” manufactured by Jujo Chemical Co., Ltd.).
The ink volume of the coil wire was set to about 150 μm.
[0053]
The outer shape of the antenna coil was a rectangular shape of 45 mm × 75 mm, the line width of the coil was about 1.0 mm, the distance between the lines was 0.5 mm, and the coil was wound five times. However, the portion where the IC chip 2 is mounted is a thin wire having a width of about 0.4 mm so that the connection terminals 3a and 3b at both ends of the coil approach the antenna bundle (FIG. 9A).
A concave groove 4 having a depth of 250 μm was formed by pressing between the two connection terminals 3a and 3b of the antenna coil to a size of 3 mm × 3 mm by an embossing die.
After embossing, as shown in FIG. 9B, the antenna coil 3 is located on the bottom surface of the concave groove.
[0054]
An IC chip 2 having a non-contact communication function having an outer shape of 2.0 × 2.0 mm and a thickness of 400 μm is fitted into the concave groove 4, and a conductive adhesive tape 8t is provided between the pads p1 and p2 and the connection terminals 3a and 3b. (FIG. 9 (C)).
In this state, writing was performed on the paper IC tag 1 and the non-contact communication function was tested. As a result, it was confirmed that reading and writing could be performed well.
[0055]
<Manufacture of books and magazines with paper IC tags>
The body paper was printed by rotary offset printing using “Kohoku Olahu” (42.0 kg / 1076 × 765 mm) to prepare 192 B5 size pages (32 pages of signatures, 6 units). After collation, the bundle thickness became about 15 mm.
Separately, four pages of a B5 signature sheet were offset web-fed printing using “Kata Cream Coat” (12.5 kg / 640 × 940 mm) as a cover sheet.
In the collating process, the prepared sheet IC tag 1 is pasted on the outer surface (return surface) of the final signature and on the cover side, and then the return surface and the inner surface of the cover are adhered to the sheet IC tag. 1 was made invisible. After perfect binding, the cover was attached and cut.
As a result, a magazine 10 with a paper IC tag as shown in FIG. 11 was obtained.
[0056]
As described above, the embodiments of the present invention have been described. However, various modified embodiments are possible without departing from the concept of the present invention, and are not out of the scope of the present invention.
For example, in the present invention, the cover is a concept including the back cover. In addition, even if a paper IC tag is pasted into the Kannon fold of a single Kannon cover (the front end of the cover is folded over to the body side), the paper IC tag is pasted between the cover and the return Has not changed. The same applies to the case where the Kannon portion is pasted on the cover.
Further, the same applies to books and magazines in which a four-page opening picture is a book-bound signature and a sheet of paper IC tag is stuck on the inside.
[0057]
【The invention's effect】
As described in detail above, according to the present invention, the following effects can be obtained.
Since the paper chip IC tag of the present invention can be bound only with conventional equipment that handles paper chips and signatures, it is possible to reduce the new equipment burden associated with attaching non-contact IC tags to books and magazines.
Further, since the paper chip IC tag of the present invention is formed with a concave groove or a through hole for absorbing the thickness of the IC chip, the stacked state of the paper chip IC tags does not become unstable, and the work efficiency can be improved. .
In the book / magazine with the paper chip IC tag of the present invention, since the base material of the IC tag is made only of the paper chip, the recycling and disposal of paper resources, disposal processing, and the like become easier as compared with the case where the film base material is used. .
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a first embodiment of a paper IC tag.
FIG. 2 is a diagram showing a second embodiment of a paper IC tag.
FIG. 3 is a diagram illustrating a third embodiment of a paper IC tag.
FIG. 4 is a view showing a fourth embodiment of a paper IC tag.
FIG. 5 is a diagram illustrating a paper sheet IC tag according to a fifth embodiment;
FIG. 6 is a view showing a sixth embodiment of a paper IC tag.
FIG. 7 is a diagram showing an IC chip with extension terminals.
FIG. 8 is a diagram showing a connection portion between an antenna coil and an IC chip.
FIG. 9 is a diagram showing another mounting method of the IC chip.
FIG. 10 shows a book / magazine bound in a sheet by inserting a paper chip IC tag between signatures.
FIG. 11 shows an example of a perfect binding book having a paper chip IC tag between a cover and a return.
FIG. 12 shows an example of a book / magazine in which a paper chip IC tag is inserted or pasted between a cover and an outer surface of a facing.
FIG. 13 shows an example of a book / magazine having a paper IC tag between arbitrary signatures.
FIG. 14 shows an example of a book in which a paper IC tag is inserted or pasted between a body page and a return.
FIG. 15 shows a book in which a paper IC tag is pasted between a facing and a cover.
[Explanation of symbols]
1 Paper chip IC tag
2,2w IC chip
3 Antenna pattern
3a, 3b antenna pattern connection terminals
4 groove
5 Through-hole
6,7 folding line
8 Conductive adhesive
8t conductive adhesive tape
9 binding needles
10 Book / Magazine with IC tag
11 signatures
13 Text page
14 Cover
15 back cover
16 Look back

Claims (16)

An IC tag for a book or magazine using a paperboard-shaped paper chip as a base material, wherein the paper chip is formed with a concave groove large enough to fit an IC chip, and the IC chip mounted in the concave groove and an antenna printed on the paper chip. A paper chip IC tag which is connected to a pattern. An IC tag for a book or a magazine using a paperboard-shaped paper piece as a base material, wherein a through-hole having a size large enough to fit an IC chip into the paper piece is formed, and the IC chip mounted in the through-hole and an antenna printed on the paper piece. A paper chip IC tag which is connected to a pattern. An IC tag for a book or magazine using a folded paperboard-shaped paper piece as a base material, wherein a concave groove large enough to fit an IC chip is formed in one folded paper sheet. A paper chip IC tag, wherein the mounted IC chip is connected to an antenna pattern printed on the paper chip. An IC tag for a book or a magazine using a folded paperboard-shaped paper piece as a base material, wherein a through-hole large enough to fit an IC chip is formed in one-side folded paper piece. A paper chip IC tag, wherein the mounted IC chip is connected to an antenna pattern printed on the paper chip. 4. A groove or a through hole having a size of an IC chip is formed at a position on the other side of the folded sheet of paperboard facing the IC chip when the sheet is folded in half. Item 6. A paper chip IC tag according to Item 4. An IC tag for a book or a magazine using a folded paperboard-shaped paper piece as a base material, an antenna pattern is printed on a folded half-side paper piece to form an IC tag to which an IC chip is connected. A paper chip IC tag, wherein a concave groove having a size of an IC chip is formed at a position facing the IC chip on the other-side paper sheet when folded in half. An IC tag for a book or a magazine using a folded paperboard-shaped paper piece as a base material, an antenna pattern is printed on a folded half-side paper piece to form an IC tag to which an IC chip is connected. A paper chip IC tag, wherein a through hole having a size of an IC chip is formed at a position on the other side of the paper sheet facing the IC chip when folded in half. 8. The paper sheet IC tag according to claim 3, wherein one side of the folded paperboard-like paper sheet is wider than the other paper sheet. 9. The paper chip IC according to claim 3, wherein the folded paperboard paper sheet is bent with the IC chip inside, and the faces of the facing paper sheets are adhered to each other. tag. The antenna pattern is a coil-shaped inductive coupling type pattern, and connection terminals at both ends of the coil are provided close to both sides of the coil wire bundle, and a wire bundle between the coil connection terminals is pressed to form a concave groove. The paper chip IC tag according to claim 1 or 3, wherein an IC chip is mounted therein. The paper chip IC tag according to any one of claims 1 to 10 is inserted or pasted between a signature and a facing, or inserted or pasted between a front cover or a back cover and a facing. A book or magazine with a paper chip IC tag characterized by flat binding or perfect binding. A paper chip IC tag, characterized in that the paper chip IC tag according to any one of claims 1 to 10 is inserted or pasted between any of the signatures and is flat-bound or wireless-bound. Books and magazines. The paper chip IC tag according to any one of claims 1 to 10 is inserted or pasted between a signature and a facing, or inserted or pasted between a front cover or a back cover and a facing. A book with a paper chip IC tag, which is top-bound. A book with a paper chip IC tag, wherein the paper chip IC tag according to any one of claims 1 to 10 is inserted or pasted between any of the signatures and book-bound. The paper chip IC tag according to any one of claims 1 to 10 is inserted or pasted between a signature and a facing, or inserted or pasted between a front cover or a back cover and a facing and saddle stitched. Books / magazines with paper chip IC tags. The sheet IC tag according to claim 3 or 4 is inserted into any of the sections between the signatures, between the signature and the facing, or between the front cover or back cover and the facing, and saddle-stitched. A book / magazine with a paper chip IC tag.

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