JP2007279782A - Non-contact ic tag having ic chip breakdown prevention structure, connecting element of the non-contact ic tag, and manufacturing method of the non-contact ic tag connecting element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC tag for preventing an IC chip of the non-contact IC tag from being broken by external force applied, and also to provide a manufacturing method of the tag. <P>SOLUTION: A non-contact IC tag 1 having an IC chip breakdown preventing structure includes a dipole antenna 2 formed on one face side of a base film 11 and an IC chip 3 mounted on the antenna 2, and also has a surface protective sheet mounted thereon. Two sheets of strip-like structures 10a, 10b are arranged at intervals, so as to form parallel grooves 9 orthogonal to the length direction of the antenna 2, on both sides of the IC chip 3, and the IC chip 3 is positioned in the grooves 9. The IC tag 1 may be formed as an IC tag connecting element, and the protective sheet may not be necessary. The strip-like structures 10 may be papers or plastic films having uniform thickness of 50 μm to 250 μm. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a non-contact IC tag having an IC chip destruction prevention structure, a non-contact IC tag connecting body, and a method for manufacturing the non-contact IC tag connecting body.
Specifically, a strip-shaped structure for protecting the IC chip is inserted into the non-contact IC tag layer structure having a dipole antenna at intervals so as to form parallel grooves on both sides of the IC chip. The present invention relates to a non-contact IC tag, a non-contact IC tag connecting body, or the like in which the IC chip is hardly subjected to external force by being positioned inside.
Such non-contact IC tags can be used as ordinary IC tags, but in particular, IC tags are susceptible to external forces such as transportation and logistics, product manufacturing process management, construction sites, luggage tags attached to luggage / cases, slips, etc. The present invention relates to a non-contact IC tag that can be suitably used in an environment.

Non-contact type IC tags record and hold information and can exchange information by communicating with external devices in a non-contact manner, so that they can be used as recognition media in transportation and logistics, or for various purposes such as product quality control and inventory management. It has come to be used frequently.
However, when a non-contact type IC tag is used as a physical distribution label, inevitable stress is often applied from the outside during physical distribution. In particular, when the IC chip part receives an impact, it is fatally damaged. Therefore, a structure for protecting the IC chip portion has been conventionally considered. However, there is a problem that a non-contact IC tag cannot be manufactured at a low cost because of a complicated structure.
In particular, a non-contact IC tag having a flat surface (planar surface) has been demanded in the past, and the problem of increasing the manufacturing load for realizing this is significant.

  As an unavoidable structural problem of the non-contact IC tag, there is a problem that the thickness of the IC chip is much larger than that of the base film or the like. Although the IC chip is reduced in size and thinned, recent IC chips also have a planar size within 0.2 mm to 2 mm square and a thickness of 100 μm to 500 μm. Therefore, even if an IC chip is mounted with an antenna pattern formed on the base film surface and the surface protection sheet is covered and flattened, the IC chip portion becomes bulky when the IC tags are stacked.

  This stacked state can be considered as a case where the IC chip is damaged. When using non-contact IC tags, a few to a dozen are often stacked. To make it easier to use, it is normal to align the orientation. Inevitably, the IC chip portions will inevitably overlap in the vertical direction. When a heavy object is placed on the IC tag from the upper surface in the stacked state, any one of the IC chips that are in a vertical positional relationship receives an impact, and the IC chip that is a silicon crystal is destroyed. In this case, a defective IC tag is suspected in an unused state. Another cause is that even when an IC tag attached to a hard adherend collides with another hard object, the protruding IC chip portion is susceptible to impact. The cause of the failure of the IC chip is not only these causes, but it is considered that the thick IC chip 3 is easily damaged when it contacts or collides with a hard structural material such as metal.

On the other hand, in recent years, attention has been focused on non-contact IC tags in the 860 MHz to 960 MHz band belonging to the UHF band, which enables far-distance communication, as well as conventional non-contact IC tags having an electromagnetic induction type planar coil antenna used in the 13.56 MHz band Has been. At high frequencies above the UHF band, it is usual to use a half-wave dipole antenna as the antenna.
When the dipole antenna 2 is formed on a continuous band-shaped base film, the left and right antenna patterns 2R, 2L are arranged in a direction in which the length direction is orthogonal to the flow direction of the band-shaped base film 11, as shown in FIGS. Are formed at regular intervals, and then the IC chip 3 is mounted between the left and right antenna patterns 2R, 2L. The distance (pitch) between the dipole antennas 2 is a short distance of about 25 mm to 50 mm. Therefore, when winding the band-shaped base film 11 with the IC chip 3 mounted thereon, the IC between the upper and lower films of the wound layer is used. The probability that the positions of the chips 3 overlap is increased. When the IC chip 3 that is overlapped between the upper and lower base films 11 receives an external force or only by the winding pressure, one or both of the protruding IC chips 3 are frequently damaged. There is.

  The present invention is intended to solve the above-mentioned problems, but it cannot detect the related prior art in particular. Patent Document 1 relates to a method of manufacturing an IC tag label, but has a problem of realizing a flat (planar) IC tag label. Patent Document 2 and Patent Document 3 are related to the prior application somewhat related to the present application. However, Patent Document 2 is different from the present application in that a protective member provided with a punched hole is inserted only in the peripheral portion of the IC chip. Patent Document 3 describes a non-contact IC tag with a coiled antenna pattern and differs from the present application in that it does not describe a non-contact IC tag with a dipole antenna.

JP 2003-67708 A Japanese Patent Application No. 2005-051036 Japanese Patent Application No. 2005-151967

In a non-contact IC tag having a dipole antenna, the IC chip is often destroyed in the manufacturing process or even after being commercialized.
Therefore, in the present invention, in the configuration of the non-contact IC tag having a dipole antenna, the strip-shaped structures for protecting the IC chip are arranged at intervals so as to form parallel grooves on both sides of the IC chip. The present invention has been completed by studying prevention of destruction of the IC chip.

  A first aspect of the present invention for solving the above problems is an antenna surface of the base film in a non-contact IC tag having a dipole antenna formed on one surface side of the base film and an IC chip attached to the antenna. Then, two strip-shaped structures are arranged on both sides of the IC chip with a gap so as to form a parallel groove perpendicular to the length direction of the antenna, and the IC chip is positioned in the groove. And a non-contact IC tag having an IC chip destruction prevention structure.

  The second of the gist of the present invention for solving the above-mentioned problems is that it has a dipole antenna formed on one surface side of the base film and an IC chip attached to the antenna, and further has a surface protection sheet adhered to the antenna surface. In the non-contact IC tag, between the surface protection sheet and the antenna surface of the base film, two strip-shaped structures are formed on both sides of the IC chip so as to form parallel grooves perpendicular to the length direction of the antenna. The non-contact IC tag having an IC chip destruction prevention structure, wherein the IC chip is positioned in the groove so that the IC chip is positioned in the groove.

  In the non-contact IC tag having the IC chip destruction preventing structure, the strip structure may have an area covering almost the whole area except for the IC chip portion side of the dipole antenna. It can also be a paper or plastic film with a uniform thickness of 250 μm.

  A third of the gist of the present invention for solving the above problems is a non-contact IC tag linking body having a dipole antenna formed at regular intervals on one side of a continuous strip-shaped base film and an IC chip attached to the antenna. Two strip-like structures on both sides of the IC chip are arranged at intervals so as to form a belt-like groove that is perpendicular to the length direction of the antenna and parallel to the belt-like base film. A non-contact IC tag connecting body having an IC chip destruction preventing structure, wherein the non-contact IC tag connecting structure is located in the belt-like groove.

  The fourth of the gist of the present invention for solving the above-mentioned problem is that it has a dipole antenna formed at regular intervals on one surface side of a continuous strip-like base film and an IC chip attached to the antenna, and is further bonded to the antenna surface. In the non-contact IC tag connecting body having the surface protection sheet, two strip-shaped strip structures on the both sides of the IC chip are provided between the surface protection sheet and the antenna surface of the base film. An IC characterized in that an IC chip is positioned in the band-shaped groove, arranged at intervals so as to form a band-shaped groove perpendicular to the direction and parallel to the band-shaped base film. A non-contact IC tag connecting body having a structure for preventing chip destruction.

  In the non-contact IC tag connecting body having the IC chip destruction preventing structure, the strip-shaped strip structure may have an area covering almost the whole area except for the IC chip portion side of the dipole antenna, or the strip-shaped strip. The shaped structure may be paper or a plastic film having a uniform thickness of 50 μm to 250 μm.

  The fifth of the gist of the present invention for solving the above-mentioned problems is a method for producing a non-contact IC tag connecting body having an IC chip destruction preventing structure, and (1) the length of the continuous band-shaped base film on one surface side. A step of forming a dipole antenna whose direction is orthogonal to the length direction of the band-shaped base film at regular intervals, (2) a step of mounting an IC chip on each dipole antenna, and (3) a regular interval And a step of laminating strip-like strip structures on both sides of each IC chip arranged in a row in parallel so that the IC chips are positioned substantially in the center at a predetermined interval. A method of manufacturing a contact IC tag connecting body.

  In the manufacturing method of the non-contact IC tag connecting body having the IC chip destruction preventing structure, the strip-like strip structure can have a width covering almost the whole area except the IC chip portion side of the dipole antenna. The strip-like strip structure may be paper or plastic film having a uniform thickness of 50 μm to 250 μm.

In the non-contact IC tag having the IC chip destruction preventing structure of the present invention, since the strip-shaped structure is inserted so as to form a groove parallel to both sides of the IC chip, the IC chip is located in the groove. Therefore, even if a normal IC tag is handled, the IC chip is hardly damaged like a conventional non-contact IC tag.
In the non-contact IC tag connecting body having the IC chip destruction preventing structure of the present invention, the strip-shaped strip structure is inserted so as to form a strip-shaped groove parallel to both sides of the IC chip. It is located in the belt-like groove and is hardly subjected to external force, and the IC chip can be prevented from being broken even in the manufacturing process of the non-contact IC tag connecting body.
In the manufacturing method of the non-contact IC tag connecting body of the present invention, since the strip-like strip structure is laminated on both sides of the IC chip at intervals, the subsequent processing is performed. In addition, destruction of the IC chip can be prevented.

The present invention relates to a non-contact IC tag having an IC chip destruction prevention structure (hereinafter also referred to as “non-contact IC tag”) and a non-contact IC tag connecting body having an IC chip destruction prevention structure (hereinafter referred to as “non-contact IC tag”). This is also referred to as a “contact IC tag connecting body” and a method for manufacturing a non-contact IC tag connecting body, and will be described below with reference to the drawings.
FIG. 1 is a plan view showing an example of a non-contact IC tag according to the present invention, FIG. 2 is a cross-sectional view thereof, FIG. 3 is another example of the cross-sectional view thereof, and FIG. FIG. 5 is a plan view showing another example of the non-contact IC tag connecting body of the present invention, and FIG. 6 is a diagram for explaining a method for manufacturing the non-contact IC tag connecting body. .

  As shown in FIG. 1, the non-contact IC tag 1 of the present invention has a dipole antenna 2 formed on the surface of a base film 11 and an IC chip 3 mounted between the joint portions 2a and 2b of the left and right antenna patterns 2R and 2L. have. On the both sides of the IC chip 3, strip-shaped structures 10a and 10b having a uniform thickness are arranged, and parallel strip-shaped grooves 9 are formed by the structures 10a and 10b. Since the structures 10a and 10b have a thickness corresponding to the thickness of the IC chip 3 or a thickness that can reduce the protrusion of the IC chip 3, the structure bodies 10a and 10b serve as a protective wall for the IC chip 3. It is possible to mitigate an impact caused by an external force when 3 comes into contact with the IC chip 3 of another non-contact IC tag or collides with another hard object.

The width L of the groove 9 is required to accommodate at least the IC chip 3 and is related to the planar size of the IC chip 3, but in the case of an IC chip having a side of less than 1.0 mm, usually 1.0 mm to 5. A width of about 0 mm is sufficient. This is because, if the width is too wide, the structure does not serve as a protective wall against a pointed object and does not produce an impact mitigating effect.
In the case of FIG. 1, the strip-shaped structures 10a and 10b have a width that covers almost the entire surface of the left and right antenna patterns 2R and 2L, but covers both sides close to the IC chip 3 with a width of several mm to 2 to 3 cm. It may be a thing. This is because even a narrow width can serve as a protective wall.

FIG. 2 is a cross-sectional view of FIG. 1 and shows a cross section taken along line AA of FIG. In the cross-sectional structure of the non-contact IC tag 1 of the present invention, strip-like structures 10a and 10b are disposed and bonded to the surface of the dipole antenna 2 of the base film 11 as shown in FIG.
As the strip-shaped structures 10a and 10b, paper or a plastic film can be used as an example. Adhesive or adhesive is applied to the dipole antenna 2 surface side of the strip-shaped structures 10a and 10b, and is adhered to the dipole antenna 2 surface by the adhesive layer 5 or the like.
The strip-like structures 10a and 10b are complete as a function of preventing destruction if they have the same thickness as the IC chip 3, but even if they are not the same thickness as the IC chip 3, they are 1/10 (10%) of the thickness. Even when it has a thickness of about 1/2 (50%), a sufficient effect can be obtained.

  Even when the strip-like structures 10a and 10b are not equal in thickness to the IC chip, if the base film 11 and the surface protection sheet 4 described later are between the IC chip 3, they are in between. This is because the impact of direct collision between the IC chips 3 can be mitigated. Therefore, if the thickness of the IC chip 3 is 500 μm, a remarkable IC chip destruction preventing effect can be obtained if it has a thickness of about 50 μm to 250 μm, preferably about 100 μm (20%) to 250 μm (50%). However, with the thickness of the current IC chip 3 (about 150 μm), a sufficient effect of preventing the destruction of the IC chip cannot be expected with the thickness of the strip-like structures 10a and 10b less than 15 μm.

FIG. 3 is another example of the cross-sectional view, and shows a cross section taken along line AA of FIG. This non-contact IC tag 1 also has a dipole antenna 2 formed on the surface of the base film 11, and has an IC chip 3 mounted between the joint portions 2a and 2b of the left and right antenna patterns 2R and 2L. On both sides of the IC chip 3, strip-shaped structures 10a and 10b having a uniform thickness are arranged and bonded. A surface protective sheet 4 is further coated on the surfaces of the structures 10a and 10b.
That is, the difference from FIG. 2 is that the surface protection sheet 4 is provided. The strip-shaped structures 10a and 10b have a thickness corresponding to the thickness of the IC chip 3, or have a thickness that can reduce the protrusion of the IC chip 3, and thus serve as a protective wall for the IC chip 3. This is the same as in the case of FIG.

In the case of FIG. 3, the adhesive layer 7 and the release paper 8 are provided on the surface of the base film 11 on the adherend side, but the layer may not be provided. The non-contact IC tag 1 is not limited to a label body, but may be a card-like one that is essentially bonded with a base film 11 and a display body that replaces the surface protection sheet 4. Since this is not used by sticking to an article, the pressure-sensitive adhesive layer 7 is not required.
Those without the pressure-sensitive adhesive layer 7 are also called lami cards and are carried or attached to products or the like. The present invention can be applied to any form of IC tag.

FIG. 4 is a plan view showing an example of the non-contact IC tag connecting body of the present invention.
The non-contact IC tag connecting body 1R refers to a state in which unit non-contact IC tags 1 are continuously connected. The manufacturing process of the non-contact IC tag 1 is inevitably in the form, and is often delivered in that state to users who use it in large quantities.
As shown in FIG. 4, the dipole antenna 2 is formed such that its length direction is orthogonal to the length direction of the strip-shaped base film 11. The interval between the dipole antennas 2 is a constant interval pitch of about 25 mm to 50 mm. Since the total length of the left and right antenna patterns 2R and 2L (length obtained by extending the bent portion) is a half wavelength of the radio wave, the left and right patterns 2R and 2L are usually ¼ wavelength long. The IC chip 3 is mounted on a power feeding unit at an intermediate position between them.

A feature of the non-contact IC tag connecting body 1R of the present invention is the surface of the dipole antenna 2, and two strip-shaped structures 10a and 10b on both sides of the IC chip 3 are arranged in the length direction of the antenna 2. So as to form a band-like groove 9 that is orthogonal to the band-shaped base film 11 and parallel to the length direction of the band-like base film 11, and is adhered and spaced, and the IC chip 3 is positioned in the band-like groove 9. There is in being. In the case of FIG. 4, the strip-like strip structures 10 a and 10 b have an area covering almost the entire area except for the IC chip 3 side of the dipole antenna 2.
In such a case, a sufficient function is also exhibited for protecting the antenna 2 itself. Therefore, the surface protective sheet 4 described above may or may not be present. Although the sectional view is not shown, the structure of the unit of the non-contact IC tag is the same, and the sectional view of FIG. 2 or FIG. 3 is obtained.
However, the non-finished non-contact IC tag connecting body 1R does not include the adhesive layer 8 and the release paper 9. The same applies to the case of FIG. 5 below.

FIG. 5 is a plan view showing another example of the non-contact IC tag connecting body of the present invention.
Also in the case of FIG. 5, two strip-like strip structures 10 a and 10 b on the surface of the dipole antenna 2 on both sides of the IC chip 3 are orthogonal to the length direction of the antenna 2, and the strip-like base film 11 is formed. The IC chip 3 is positioned in the band-shaped groove 9 by being arranged and bonded at intervals so as to form a band-shaped groove 9 parallel to the longitudinal direction of the chip.
However, in the case of FIG. 5, the strip-shaped strip structures 10 a and 10 b are not formed to cover the entire area of the dipole antenna 2, and the end portions of the antenna patterns 2 R and 2 L (on the side opposite to the IC chip 3) The two end portions are exposed. In this case, the cost of the strip structures 10a and 10b can be reduced. The surface protective sheet 4 described above may or may not be present in this case. The perforation line 12 is for separating the unit into the non-contact IC tag 1. Since it may be cut with an automatic cutter during use, it is not always necessary.

Next, the manufacturing method of the non-contact IC tag of this invention is demonstrated.
The non-contact IC tag 1 can be manufactured by adding a step of laminating the strip-shaped structures 10 to a process of a conventional non-contact IC tag manufacturing method. That is, after attaching the IC chip 3 to the dipole antenna 2 of the band-shaped base film 11 and before laminating the surface protective sheet 4, a step of aligning and laminating the strip-like structures 10a and 10b is necessary. Become. Such a process is sufficiently possible even with an existing automated line.
In the manufacturing process of the non-contact IC tag, since the process of forming the dipole antenna 2 on the strip-shaped base film 11 is well known, the strip-shaped structures 10a and 10b, which are the features of the present invention, are inserted and laminated. The process will be described.

FIG. 6 is a diagram for explaining a method of manufacturing a non-contact IC tag linking body.
A dipole antenna 2 is formed on the crimp unit 20 of the IC tag processing machine from the left side, and a band-shaped base film 11 with an IC chip 3 (not shown) mounted thereon is supplied at a constant speed. The strip-shaped strip-like structure films 10a and 10b with two rows of adhesive layers 5 cut to a predetermined width are supplied from above the pressure-bonding unit 20, and the antenna of the strip-shaped base film 11 is provided between the rollers 20a and 20b. Laminated by pressure bonding to the surface.
Thereafter, the surface protective sheet 4 may be further laminated, or a perforation line 12 for separation may be formed. Furthermore, since the pressure-sensitive adhesive layer 7 is provided, the step of laminating the double-sided tape with release paper 8 can be performed inline or offline.

  Thereafter, the strip-shaped base film 11 is wound up by a winding roller. At this time, in the conventional manufacturing process, the IC chip 3 is in the wound state, and the IC chips 3 mounted on the upper and lower base films 11 that have been wound are in contact with each other through the film. It is recognized that it occurs with a considerable probability. In the non-contact IC tag connecting body 1R of the present invention, since the strip-like structures 10a and 10b are used, there is an effect that the impact due to the contact is reduced and the destruction of the IC chip 3 is remarkably reduced.

<Embodiment related to material>
(1) Base film A wide variety of plastic films can be used, and the following single films or composite films thereof can be used.
Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like.

(2) Strip-shaped structure As the material of the strip-shaped structure, high-quality paper, coated paper, craft paper, glassine paper, synthetic paper, latex or melamine resin-impregnated paper base material can be used. In the case of paper that absorbs moisture, the antenna characteristics are affected. Therefore, it is preferable to laminate with a surface protective sheet to prevent moisture absorption or use synthetic paper or resin-impregnated paper. As a plastic film, the simple substance or composite_body | complex of the plastic film for base films mentioned above can be used. Further, a magnetic material sheet may be used if particularly necessary.

(3) Surface protection sheet A wide variety of plastic films and paper substrates can be used. The simple substance or composite_body | complex of the above-mentioned paper base material or the plastic film for base films can be used.

(4) Adhesive, pressure-sensitive adhesive In the present specification, the term adhesive refers to various types such as a solvent type, a polymerization type, an ultraviolet curable type, an emulsion type, and a heat-melt type, and so-called pressure-sensitive adhesive types. Shall be included. In either case, the purpose can be achieved by bonding the two materials.
Further, in the present specification, the term “adhesive” refers to an adhesive that keeps an intermediate tack state indefinitely without a significant increase in viscosity.
Adhesive and adhesive resin compositions include natural rubber, nitrile rubber, epoxy resin, vinyl acetate emulsion, polyester, acrylic, acrylate copolymer, polyvinyl alcohol, phenolic resin, Various materials such as can be used.

As the strip-shaped base film 11 of the non-contact IC tag, a material (120 mm width) obtained by dry laminating a 25 μm-thick aluminum foil on a transparent biaxially stretched polyester film having a thickness of 38 μm is used. Then, a photomask having a dipole antenna pattern was exposed and exposed to light.
After exposure and development, photo-etching was performed to complete a strip-shaped base film 11 having dipole antennas 2 as shown in FIG. One dipole antenna 2 has an outer shape of approximately 20 mm × 90 mm, and the interval pitch between the antennas 2 is 28 mm.

The IC chip 3 having a planar size of 1.0 mm square and a thickness of 152 μm and having spike-like bumps is heated face down on the joint portions 2a and 2b of the left and right antenna patterns 2R and 2L of the band-shaped base film 11. Wearing pressure.
Next, two continuous PET films having a thickness of 100 μm and a width of 45 mm were used as the strip-like strip structures 10a and 10b, and a polyester hot melt adhesive applied thereto was used for the IC tag processing machine. Lamination was performed on the band-shaped base film 11 on which the IC chip 3 was mounted using the crimping unit 20 (see FIG. 6).
The strip-shaped structures 10a and 10b were stuck on both sides of the IC chip 3 so as to form parallel strip-shaped grooves 9 having a width L (see FIG. 1) of 4 mm. The antenna surface of the dipole antenna 2 could be almost completely covered with the strip-like strip structures 10a and 10b.

  Further, a surface protective sheet (PET film) 4 having a thickness of 38 μm was laminated on the strip-like strip structures 10a and 10b via a polyester hot melt adhesive, hot-pressed and then wound. Next, the back surface of the base film 11 is subjected to pressure-sensitive adhesive processing in which a release paper 8 is laminated via a 50 μm pressure-sensitive adhesive layer 7, and finally a separation perforation line 12 is provided as shown in FIG. The IC tag connecting body 1R was completed.

  It was confirmed that the non-contact IC tag connecting body 1R of the above example significantly reduced the destruction of the IC chip in the manufacturing process as compared with the conventional non-contact IC tag connecting body.

It is a top view which shows the example of the non-contact IC tag of this invention. FIG. It is another example of sectional drawing. It is a top view which shows the example of the non-contact IC tag connecting body of this invention. It is a top view which shows the other example of the non-contact IC tag connecting body of this invention. It is a figure explaining the manufacturing method of a non-contact IC tag connecting body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC tag which has IC chip destruction prevention structure, non-contact IC tag 1R Non-contact IC tag connecting body 2 Dipole antenna 3 IC chip 4 Surface protection sheet 5, 6 Adhesive layer 7 Adhesive layer 8 Release paper 9 Groove , Strip-shaped groove 10, 10a, 10b strip-shaped structure, strip-shaped strip-shaped structure 11 base film, strip-shaped base film 12 perforation line

Claims (11)

  In a non-contact IC tag having a dipole antenna formed on one surface side of a base film and an IC chip mounted on the antenna, two strip-shaped structures on the antenna surface of the base film on both sides of the IC chip IC chip destruction prevention structure characterized in that the IC chip is positioned so as to form a parallel groove perpendicular to the length direction of the antenna, and the IC chip is positioned in the groove. Non-contact IC tag having   A non-contact IC tag having a dipole antenna formed on one side of a base film and an IC chip attached to the antenna, and further having a surface protective sheet adhered to the antenna surface. The surface protective sheet and the base film The two strip-shaped structures are arranged on both sides of the IC chip at intervals so as to form parallel grooves perpendicular to the length direction of the antenna. A non-contact IC tag having an IC chip destruction prevention structure, characterized in that the IC chip destruction prevention structure is located inside.   3. The non-contact IC tag having an IC chip destruction preventing structure according to claim 1, wherein the strip-shaped structure has an area covering almost the whole area except for the IC chip portion side of the dipole antenna.   3. The non-contact IC tag having an IC chip destruction preventing structure according to claim 1, wherein the strip structure is a paper or plastic film having a uniform thickness of 50 μm to 250 μm.   A non-contact IC tag linking body having a dipole antenna formed at regular intervals on one surface side of a continuous strip-shaped base film and an IC chip mounted on the antenna, and two strip-shaped strip-shaped structures on both sides of the IC chip Are arranged at intervals so as to form a belt-like groove perpendicular to the length direction of the antenna and parallel to the belt-like base film, and the IC chip is positioned in the belt-like groove. A non-contact IC tag connecting body having an IC chip destruction preventing structure.   In a non-contact IC tag linking body having a dipole antenna formed at regular intervals on one surface side of a continuous strip-shaped base film and an IC chip attached to the antenna, and further having a surface protection sheet adhered to the antenna surface, Between the surface protection sheet and the antenna surface of the base film, two strip-shaped strip structures on both sides of the IC chip are orthogonal to the length direction of the antenna and are parallel to the strip-shaped base film. A non-contact IC tag connecting body having an IC chip destruction preventing structure, wherein the IC chip is disposed so as to form a groove, and the IC chip is positioned in the belt-like groove.   7. A non-contact IC tag having an IC chip destruction preventing structure according to claim 5, wherein the strip-shaped strip structure has an area covering almost the whole area except for the IC chip portion side of the dipole antenna. Articulated body.   7. The non-contact IC tag connector having an IC chip destruction preventing structure according to claim 5, wherein the strip-shaped strip structure is a paper or plastic film having a uniform thickness of 50 μm to 250 μm. . A method of manufacturing a non-contact IC tag linking body having an IC chip destruction prevention structure, wherein (1) the length direction of one continuous belt-like base film is perpendicular to the length of the belt-like base film Forming the dipole antennas at regular intervals, (2) attaching IC chips to the dipole antennas, and (3) forming strips on both sides of the IC chips arranged in a row at regular intervals. Laminating the strip-shaped structure in parallel with a constant interval so that the IC chip is located substantially at the center;
A method for producing a non-contact IC tag connector, comprising:   10. The method of manufacturing a contactless IC tag connecting body according to claim 9, wherein the strip-shaped strip-shaped structure has a width that covers almost the whole area except for the IC chip portion side of the dipole antenna. 10. The method of manufacturing a non-contact IC tag connector according to claim 9, wherein the strip-shaped strip structure is a paper or plastic film having a uniform thickness of 50 μm to 250 μm.

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