JP2006285709A - Non-contact ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC tag for making a good non-contact communication without communication interference and preventing an IC chip from being damaged even when attached to a metal body. <P>SOLUTION: The non contact IC tag 1 is structured in such a way that the IC chip 3 with memory capable of reading information without contact and a planar antenna coil 2 connected to it are formed on a base film 11, laminates a magnetic sheet 10 over the antenna coil plane (or the opposite side plane) on the base film 11 via an adhesive layer and a base material over the magnetic sheet 10 via the adhesive layer. It has an opening 103 enough to house the IC chip 3 on the magnetic sheet 10 and places the IC chip 3 in the opening. The magnetic sheet 10 is used so that communication interference due to the metal body is alleviated and damage of the IC chip is prevented. The surface base material can be placed on the base film and adhered on an adherend. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a non-contact IC tag. Specifically, the present invention relates to a non-contact IC tag having a structure for preventing damage to an IC chip and a structure for suppressing communication inhibition by metal of the IC tag.
The non-contact IC tag of the present invention is used as a normal non-contact IC tag, and can be suitably used by suppressing communication hindrance particularly when it is attached to an object made of a metal material or a metal container. . Further, the present invention relates to an IC tag considering an IC chip damage prevention structure.
The technical field of the present invention relates to the manufacture and use of contactless IC tags, and the main fields of use are fields such as transportation, distribution, inventory management, and factory process management.

Non-contact type IC tags record and hold information and can exchange information by communicating with external devices in a non-contact manner, so that they can be used as recognition media in transportation and logistics, or for various purposes such as product quality control and inventory management. It has come to be used frequently.
However, when a non-contact type IC tag is mounted close to a conductive member, such as an object made of a metal material or a metal container, the inside of the object behind the metal is generated by an alternating magnetic field generated by an electromagnetic wave for IC tag transmission / reception. An eddy current is generated. This eddy current generates a magnetic flux that repels the transmission / reception magnetic flux, which attenuates the transmission / reception magnetic flux, making transmission and reception often difficult.
Therefore, when a non-contact IC tag is attached to a member made of a conductive material such as metal, a magnetic material is disposed between the non-contact IC tag and the conductive member, and a magnetic flux for transmission / reception is passed through the magnetic body, whereby the magnetic flux is applied to the metal. There is known a method of suppressing the generation of eddy current by entering. The non-contact IC tag of the present invention also uses this principle.

  On the other hand, as another problem of the non-contact IC tag, when the non-contact IC tag is used as a physical distribution label, inevitable stress is often applied from the outside during the physical distribution. In particular, when the IC chip part receives an impact, it is fatally damaged. Thus, a structure for protecting the IC chip portion has been conventionally considered. However, there is a problem that the structure becomes complicated and a non-contact IC tag cannot be manufactured at a low cost.

  The non-contact IC tag has a problem that the thickness of the IC chip is much larger than the thickness of the substrate or the like due to its structure. Although the IC chip is reduced in size and thinned, recent IC chips also have a planar size within 0.2 mm to 2 mm square and a thickness of 100 μm to 500 μm. Therefore, even when an antenna coil is formed on the base material (base film) surface, an IC chip is mounted, and the protective member is covered and flattened, when the IC tag label is stacked, the IC chip portion becomes bulky.

This stacked state can be considered as a case where the IC chip is damaged. When non-contact IC tag labels are used, several to dozens are often stacked. To make it easier to use, it is normal to align the labels. Inevitably, the IC chip portions will inevitably overlap in the vertical direction. In this state, when a heavy object is placed on the label from the upper surface, any one of the IC chips that are in a vertical positional relationship receives an impact, and the IC chip that is a silicon crystal is destroyed. In this case, a defective label is suspected in an unused state.
Another cause is that even when an IC tag attached to a hard adherend collides with another hard object, the protruding IC chip portion is most susceptible to impact. The cause of the failure of the IC chip is not only these causes, but it is considered that the thick IC chip 3 is easily damaged when it contacts or collides with a hard structural material such as metal.

For reference, an embodiment of an actual contactless IC tag is illustrated in FIG. A general non-contact IC tag 1 has an antenna coil 2 formed on the surface of a base film 11 and IC chips 3 are mounted on both ends 2a and 2b of the antenna coil 2 in the form of a wire coil.
In FIG. 6, the metal foil laminated on the transparent base film 11 is photo-etched to form the antenna coil 2, and is a view seen from the side to be attached to the adherend.
One end of the antenna coil 2 is connected to a conduction circuit 7 passing through the back surface of the base film 11 by using a caulking tool or the like so as to communicate with both ends 2 a and 2 b of the antenna coil connected to the IC chip 3. The pads of the IC chip 3 are connected to both end portions 2a and 2b by a conductive adhesive or the like. Although not shown, a thickness adjustment pattern may be provided around the IC chip 3, but the metal foil for antenna has a thickness of about 20 μm to 35 μm and does not correspond to the thickness of the IC chip 3.

As a prior art of a non-contact IC tag for the purpose of suppressing communication inhibition by metal, there are Patent Document 1 and Patent Document 2. However, Patent Document 1 is different from the present application regarding the structure in which the magnetic core member is housed in the antenna coil. Patent Document 2 describes that a magnetic sheet is used for a non-contact IC tag to be attached to a metal or the like, but still does not describe the configuration of the present application regarding “a size opening for accommodating an IC chip”. .
On the other hand, there is Patent Document 3 as a prior art that has a problem of flattening a non-contact IC tag. However, the IC chip portion is locally pressed and flattened, and this also has a configuration different from that of the present application. I have to. In addition, although patent document 4 exists as a prior application of this application, it does not cope with the communication obstruction by a metal.

JP 2001-56847 A JP 2003-85501 A JP 2003-67708 A Japanese Patent Application No. 2005-051036

In the prior art, a method of individually taking measures against the structure for protecting the IC chip and the structure for suppressing the communication hindrance due to the metal is adopted, but no measures are taken to solve both at the same time.
Therefore, in the present invention, by using a magnetic material sheet for the non-contact IC tag, non-contact communication characteristics on the metal body are improved, and the IC chip is accommodated in an opening provided in the magnetic material sheet. The present invention has been completed by researching solutions to both the flattening of the contact IC tag and the protection of the IC chip from the impact received from other objects.

  The first of the gist of the present invention for solving the above problems is that a non-contact readable IC chip with memory and a planar antenna coil connected thereto are formed on a base film, and the antenna coil of the base film In a non-contact IC tag having a structure in which a magnetic material sheet is laminated on the surface via an adhesive layer and a surface base material is laminated on the magnetic material sheet surface via an adhesive layer, the IC chip is attached to the magnetic material sheet. The non-contact IC tag is characterized in that an opening having a size for accommodating the IC chip is provided, and an IC chip is positioned in the opening.

  The second of the gist of the present invention for solving the above-mentioned problems is that a non-contact readable IC chip with memory and a planar antenna coil connected thereto are formed on a base film, and the antenna coil of the base film In a non-contact IC tag having a structure in which a magnetic material sheet is laminated on the surface via an adhesive layer, and a surface base material is laminated on the surface opposite to the antenna coil surface of the base film via an adhesive layer, The contactless IC tag is characterized in that an opening having a size for accommodating the IC chip is provided in the magnetic material sheet, and the IC chip is positioned in the opening.

  A third aspect of the present invention that solves the above problems is that a non-contact readable IC chip with a memory and a planar antenna coil connected thereto are formed on a base film, and the antenna coil of the base film In a non-contact IC tag having a structure in which a magnetic material sheet is laminated on the surface opposite to the surface via an adhesive layer, and a surface base material is laminated on the antenna coil surface of the base film via an adhesive layer, The contactless IC tag is characterized in that an opening having a size for accommodating the IC chip is provided in the magnetic material sheet, and the IC chip is positioned in the opening.

  The fourth of the gist of the present invention for solving the above problems is that a non-contact readable IC chip with memory and a planar antenna coil connected thereto are formed on a base film, and the antenna coil of the base film In a non-contact IC tag having a structure in which a magnetic material sheet is laminated on the surface opposite to the surface via an adhesive layer, and a surface base material is laminated on the magnetic material sheet via an adhesive layer, the magnetic material The contactless IC tag is characterized in that an opening having a size for accommodating the IC chip is provided in the sheet, and the IC chip is positioned in the opening.

In the above, the magnetic material sheet has a thickness equal to or greater than the thickness of the IC chip, and the magnetic material sheet is large enough to cover the entire surface of the antenna coil. preferable. The magnetic material sheet has a circular opening having a diameter of 1.5 mm to 5.0 mm, or a rectangular opening having a side of 1.5 mm to 5.0 mm on one side, and the IC chip is positioned in the opening. Is preferable from the effect of preventing destruction of the IC chip.
Further, if the difference between the thickness of the magnetic material sheet and the thickness of the IC chip is within 0.05 mm, it is preferable that the non-contact IC tag can be flattened. If the adhesive layer and release paper are provided on the base film surface in the first and fourth embodiments, and the magnetic material sheet surface in the second and third embodiments, the contactless IC tag is attached. Convenient when sticking to the body.

Since the non-contact IC tag of the present invention employs a magnetic material sheet that surrounds the IC chip, even if it is attached to an object made of a metal material or a metal container, communication is less likely to occur.
Since the non-contact IC tag of the present invention employs a mounting method that takes into consideration the prevention of breakage of the IC chip, even if a conventional non-contact IC tag is used, the IC tag is less likely to fail.
In the non-contact IC tag of the present invention, since the magnetic material sheet is inserted except for the IC chip portion, the IC chip portion does not protrude from the base material and is flat as a whole, and has excellent appearance and surface printability. A contact IC tag can be realized.

The present invention relates to a non-contact IC tag having an IC chip breakage prevention structure and a communication inhibition suppression structure. The present invention will be described below with reference to the drawings.
FIG. 1 is a schematic plan view showing an example of a non-contact IC tag according to the present invention, FIG. 2 is a sectional view of the first embodiment, FIG. 3 is a sectional view of the second embodiment, and FIG. FIG. 5 is a sectional view of the third embodiment, and FIG. 5 is a sectional view of the fourth embodiment.

In the non-contact IC tag 1 of the present invention, an antenna coil 2 is formed on a base film 11 as shown in FIG. 1, and an IC chip 3 is mounted on both ends 2a and 2b of the antenna coil. A magnetic material sheet 10 is inserted so as to surround the periphery of the IC chip 3. The magnetic material sheet 10 has an opening 103 for accommodating the IC chip 3, and the IC chip 3 is accommodated in the opening 103. Communication interruption occurring when the IC chip 3 is attached to a metal object or metal container by inserting the magnetic material sheet 10 can be suppressed.
Further, since the IC chip 3 is accommodated in the opening 103 provided in the magnetic material sheet 10, when the IC chip 3 comes into contact with the IC chip 3 of another IC tag or collides with another hard object. Impact or stress can be mitigated.

  The size of the opening 103 needs to be a size that surrounds (contains) the IC chip 3, and is related to the planar size of the IC chip 3, but in the case of an IC chip having a side of less than 1 mm, a circular opening Then, even in the case of a square opening having a diameter of about 1.5 mm to 5.0 mm, one side is preferably about 1.5 mm to 5.0 mm. This is because, if the hole is too large, the effect of cushioning against a sharp object is not produced. The opening 103 is not limited to a circle and a rectangle, but may be a rectangle or an ellipse. Moreover, the keyhole shape which one side opened may be sufficient. In short, any shape that surrounds the IC chip 3 as a whole is acceptable. The magnetic material sheet 10 itself needs to have a size that covers at least the entire antenna coil, and the shape thereof is approximately matched to the outer shape of the antenna. Therefore, the magnetic material sheet 10 has a rectangular shape or a circular shape according to the shape of the antenna coil.

  The cross-sectional structure of the first embodiment of the non-contact IC tag 1 of the present invention is such that a magnetic material sheet 10 is laminated on the antenna coil 2 surface side of the base film 11 via an adhesive layer 5b as shown in FIG. Yes. The surface base material 4 is further laminated on the other surface of the magnetic material sheet 10 via an adhesive layer 5a. The surface base material 4 performs the protective action of the non-contact IC tag 1. For convenience of illustration, the adhesive layer 5b and the base film 11 are illustrated as having a gap, but in actuality, the base film 11 or the antenna coil 2 is in close contact.

The surface of the base film 11 on the adherend side has an adhesive layer 6. The pressure-sensitive adhesive layer 6 is a case where the pressure-sensitive adhesive layer 6 is applied in advance to a release paper 8 having a release surface, which is generally called a separator paper, and this is applied to the base film 11 of the IC tag 1. There are many. Such a label body is also called an IC tag label.
The IC tag is not limited to a label body, but there is also a card-like one in which a base film and a display body that substitutes for the surface substrate are inherently bonded. Since this thing is not what is stuck and used, it does not have the adhesive layer 6. Although such a thing is also called a Rami card, the present invention can be applied to any form of IC tag.
In the first embodiment, when the magnetic material sheet 10 is not positioned between the metal object as the adherend and the antenna coil 2 when the adhesive material 6 is attached to the adherend, the magnetic material sheet is not located. Since the antenna coil 2 and the antenna 10 are in close contact with each other, an effect of alleviating communication inhibition is produced.

  The cross-sectional structure of the second embodiment of the non-contact IC tag 1 of the present invention is that the antenna coil 2 is formed on the base film 11 as shown in FIG. 3, and the IC chip 3 is mounted on both ends 2a and 2b of the antenna coil. A magnetic material sheet 10 is laminated on the antenna coil 2 surface side of the base film 11 via an adhesive layer 5b. The first embodiment is a difference in which the surfaces of the surface base material 4, the pressure-sensitive adhesive layer 6 and the release paper 8 are opposite to each other. That is, in 2nd Embodiment, the surface base material 4 is laminated | stacked through the adhesive bond layer 5a on the surface on the opposite side to the antenna coil 2 of the base film 11, and the surface used as the adherend side of the magnetic material sheet 10 is provided on the surface. It has an adhesive layer 6 and release paper 8.

  The thickness of the magnetic material sheet 10 is preferably about 50 μm to 1000 μm, and if the thickness is equal to or greater than that of the IC chip 3, the unevenness of the IC chip is particularly preferable. Since the thickness of the current IC chip is about 100 μm to 500 μm, the IC tag can be flattened at the same thickness or more, and at the same time, a remarkable IC chip destruction preventing effect can be achieved. Even if the magnetic material sheet 10 does not have a thickness equal to or greater than that of the IC chip 3, if the difference from the thickness of the IC chip 3 is within 0.05 mm, the non-contact IC tag can be flattened. Preferably, the appearance can be improved and the printability by a printer or the like can be improved.

The cross-sectional structure of the third embodiment of the non-contact IC tag 1 of the present invention has a magnetic material sheet 10 on the surface opposite to the antenna coil 2 surface of the base film 11 via an adhesive layer 5b as shown in FIG. Are stacked. The first embodiment is different from the magnetic material sheet 10 on the opposite side.
Although the adhesive layer 5a is illustrated apart from the surface of the antenna coil 2, in reality, the two are in close contact with each other.

The cross-sectional structure of the fourth embodiment of the non-contact IC tag 1 of the present invention is the magnetic material sheet 10 on the surface opposite to the antenna coil 2 surface of the base film 11 through the adhesive layer 5b as shown in FIG. Are stacked. The second embodiment is different from the magnetic material sheet 10 on the opposite side.
Although the pressure-sensitive adhesive layer 6 is illustrated apart from the surface of the antenna coil 2, the adhesive layer 6 is actually in close contact with each other.

  In the third embodiment of FIG. 4, the IC chip 3 is not illustrated so as to be accommodated in the opening 103, but the thickness direction is enlarged for convenience of illustration of the schematic diagram. Actually, for the width (diameter or side length) of 1.5 mm to 5.0 mm of the opening 103, the thickness of the base film 11 and the thickness of the adhesive layer 5b are only a few μm. 11 and the adhesive layer 5b can be understood to be bent into (insert) into the opening 103. The same applies to the fourth embodiment of FIG. Therefore, in both the third and fourth embodiments, the IC chip 3 is positioned in the opening 103, and the magnetic material sheet 10 absorbs the thickness of the IC chip 3 to flatten the IC tag or break the IC chip. In addition to producing a prevention effect, a communication inhibition mitigating effect is also produced.

In the manufacture of the non-contact IC tag 1 of the present invention, since the magnetic material sheet 10 has a considerable thickness, in the case of mass production, the magnetic material sheet is used as the multi-faced sheet of the antenna sheet in the same manner as the magnetic card or IC card. 10. It is considered appropriate to temporarily stack the surface base material 4 and then manufacture by a press laminating process, but in order to easily manufacture a small amount, it can be manufactured as follows.
First, the antenna coil 2 is manufactured on the base film 11 by a process such as photoetching or printing. Next, the IC chip 3 is joined to the antenna coil 2. Adhesive processing or an adhesive sheet is applied to the surface of the antenna coil 2 on the magnetic material sheet 10 provided with the opening 103, and the positions of the IC chip 3 and the opening 103 are aligned and bonded. The surface base material 4 is laminated on the side opposite to the antenna coil 2 surface side of the magnetic material sheet 10, and the release paper 8 is attached to the surface of the base film 11 on the adherend side by adhesion.

  The above is the manufacturing method in the case of Embodiment 1, but in the case of Embodiment 2, it can be similarly manufactured by laminating the surface base material 4 on the base film 11 side. It is obvious to those skilled in the art that the surface of the base film 11 on the side of the IC chip 3 and the surface of the magnetic material sheet 0 can be the same in the case of the third and fourth embodiments as well.

<Embodiment related to material>
(1) Magnetic material sheet A magnetic material sheet refers to a sheet-like magnetic body having a high magnetic permeability. Usually, ferrite is used. Consisting of a single ferrite, b. A composite of ferrite and plastic, c. A composite material of ferrite, metal and plastic, d. There are ferrite and metal compounds, composites of plastics, etc.
As the ferrite, ferrite powder or flakes are used. As the plastic, a thermoplastic plastic with good processability can be used, or a thermosetting plastic with good heat resistance can be used. As the metal powder, carbonyl iron powder, atomized powder such as iron-permalloy, reduced iron powder, and the like are used. In addition to molding using plastic, a sintered body or compact of metal powder and ferrite powder may be used. Amorphous magnetic sheets are also known as new materials.

(2) Base film A wide variety of plastic films can be used, and the following single films or composite films thereof can be used.
Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like.

(3) Surface base material A wide variety of plastic films and paper base materials can be used. As the plastic film, those listed above can be used, and as the paper substrate, the following can be used. When performing printer printing on the surface, paper substrates such as fine paper and coated paper are particularly preferable.
Fine paper, coated paper, kraft paper, glassine paper, synthetic paper, latex and melamine impregnated paper.

(4) Adhesive, pressure-sensitive adhesive In the present specification, the term adhesive refers to various types such as a solvent type, a polymerization type, an ultraviolet curable type, an emulsion type, and a heat-melt type, and so-called pressure-sensitive adhesive types. Shall be included. In either case, the purpose can be achieved by bonding the two materials.
Further, in the present specification, the term “adhesive” refers to an adhesive that keeps an intermediate tack state indefinitely without a significant increase in viscosity.
Various resin compositions such as natural rubber, nitrile rubber, epoxy resin, vinyl acetate emulsion, acrylic, acrylate copolymer, polyvinyl alcohol, phenol resin, etc. Material can be used.

Hereinafter, actual embodiments will be described using examples.
As the magnetic material sheet 10, a magnetic material sheet ("(trade name) IRL02" manufactured by TDK Corporation) 10 made of a ferrite material and having a thickness of 50 m was used. The size of the magnetic material sheet 10 is the same size as the base film 11 of the non-contact IC tag 1 (54 mm × 86 mm), a circular opening 103 having a diameter of 4 mm is punched at the IC chip mounting position, and an adhesive (acrylic) is applied to one surface. An acid ester copolymer system) was applied to a thickness of 16 μm.

  As a base film 11 of the IC tag, a base material obtained by dry laminating a 25 μm thick aluminum foil on a transparent biaxially stretched polyester film having a thickness of 38 μm is used. Exposed and exposed. After exposure and development, photoetching was performed to complete an inlet base film having the antenna coil 2 as shown in FIG. The antenna coil 2 has an outer shape of approximately 45 mm × 76 mm.

  An IC chip 3 having a planar size of 1.0 mm square and a thickness of 150 μm was attached to both ends 2a and 2b of the inlet base film 11 with heat pressure applied in a face-down state. Next, after the magnetic material sheet 10 prepared in advance is bonded so that the IC chip 3 is positioned at the center of the circular opening 103 (see FIGS. 1 and 2), the thickness is 40 μm via a polyester hot melt adhesive. The non-contact IC tag 1 was completed by laminating the surface base material (coated paper) 11 on the magnetic material sheet 10 side and hot pressing. Finally, the back surface of the base film 11 was subjected to pressure-sensitive adhesive processing in which the release paper 8 was laminated through the 32 μm pressure-sensitive adhesive layer 6 and cut into a size of 54 mm × 86 mm to complete a non-contact IC tag label with release paper.

The same magnetic material sheet 10, base film 11 and IC chip 3 as in Example 1 are used, and the IC chip 3 is face-down on the antenna coil both ends 2a and 2b of the inlet base film 11 on which the antenna coil 2 is formed. Attach with heat pressure.
Next, the same magnetic material sheet 10 as in Example 1 was used, and the magnetic material sheet 10 was bonded under the same conditions so that the IC chip 3 was positioned at the center of the circular opening (diameter 3 mm) 103.
Next, a non-contact IC tag 1 was completed by laminating a surface base material (coated paper) 4 having a thickness of 40 μm on the base film 11 side through a polyester-based hot melt adhesive and hot pressing.
Finally, the back surface of the magnetic material sheet 10 was subjected to adhesive processing in which the release paper 8 was laminated through the 32 μm adhesive layer 6 and cut into a size of 54 mm × 86 mm to complete a non-contact IC tag label with release paper. .

  The use test of the non-contact IC tag 1 of Example 1 and Example 2 and the conventional non-contact IC tag using no magnetic material sheet was performed under the same conditions. Even when the non-contact IC tag 1 was attached to a metal container (printing ink can), it was possible to communicate with the reader / writer without any trouble. However, the conventional non-contact IC tag 1 was attached to a metal container (printing ink can). When worn, reading was impossible. Moreover, it was recognized that the non-contact IC tag 1 of each Example markedly reduces the problems caused by breakage of the IC chip in the practical process.

It is a schematic plan view which shows the example of the non-contact IC tag of this invention. It is sectional drawing of the 1st Embodiment. It is sectional drawing of the 2nd Embodiment. It is sectional drawing of the same 3rd embodiment. It is sectional drawing of the same 4th embodiment. It is a figure which shows embodiment of a non-contact IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC tag 2 Antenna coil 3 IC chip 4 Surface base material 5,5a, 5b Adhesive layer 6 Adhesive layer 7 Conductive circuit 8 Release paper 10 Magnetic material sheet 11 Base film

Claims (10)

An IC chip with a memory capable of reading information in a non-contact manner and a planar antenna coil connected thereto are formed on a base film, and a magnetic material sheet is laminated on the antenna coil surface of the base film via an adhesive layer. Further, in a non-contact IC tag having a structure in which a surface base material is laminated on the surface of the magnetic material sheet via an adhesive layer, an opening having a size for accommodating the IC chip is provided in the magnetic material sheet, and an IC is provided in the opening. A non-contact IC tag in which a chip is positioned. An IC chip with a memory capable of reading information in a non-contact manner and a planar antenna coil connected thereto are formed on a base film, and a magnetic material sheet is laminated on the antenna coil surface of the base film via an adhesive layer. Further, in a non-contact IC tag having a structure in which a surface base material is laminated on the surface opposite to the antenna coil surface of the base film via an adhesive layer, an opening having a size for accommodating the IC chip in the magnetic material sheet A non-contact IC tag, wherein an IC chip is positioned in the opening. An IC chip with a memory capable of reading information in a non-contact manner and a planar antenna coil connected thereto are formed on a base film, and an adhesive layer is provided on the surface opposite to the antenna coil surface of the base film. In a non-contact IC tag having a structure in which a magnetic material sheet is laminated and a surface base material is laminated on an antenna coil surface of the base film via an adhesive layer, an opening having a size for accommodating the IC chip in the magnetic material sheet A non-contact IC tag, wherein an IC chip is positioned in the opening. An IC chip with a memory capable of reading information in a non-contact manner and a planar antenna coil connected thereto are formed on a base film, and an adhesive layer is provided on the surface opposite to the antenna coil surface of the base film. In a non-contact IC tag having a structure in which a magnetic material sheet is laminated and a surface base material is laminated on the magnetic material sheet via an adhesive layer, an opening having a size for accommodating the IC chip is provided in the magnetic material sheet, A non-contact IC tag, wherein an IC chip is positioned in the opening. The non-contact IC tag according to any one of claims 1 to 4, wherein the magnetic material sheet has a thickness equal to or greater than a thickness of the IC chip. The contactless IC tag according to any one of claims 1 to 4, wherein the magnetic material sheet is sized to cover the entire surface of the antenna coil. The magnetic material sheet has a circular opening having a diameter of 1.5 mm to 5.0 mm or a rectangular opening having a side of 1.5 mm to 5.0 mm, and an IC chip is located in the opening. The non-contact IC tag according to any one of claims 1 to 4. The contactless IC tag according to any one of claims 1 to 4, wherein a difference between the thickness of the magnetic material sheet and the thickness of the IC chip is within 0.05 mm. 5. The non-contact IC tag according to claim 1, further comprising release paper on the surface of the base film through an adhesive layer. 4. The non-contact IC tag according to claim 2, further comprising release paper on the magnetic material sheet surface through an adhesive layer.

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