JP2000222540A - Non-contact type semiconductor tag - Google Patents
Non-contact type semiconductor tagInfo
- Publication number
- JP2000222540A JP2000222540A JP11026410A JP2641099A JP2000222540A JP 2000222540 A JP2000222540 A JP 2000222540A JP 11026410 A JP11026410 A JP 11026410A JP 2641099 A JP2641099 A JP 2641099A JP 2000222540 A JP2000222540 A JP 2000222540A
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- semiconductor
- contact type
- type semiconductor
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は非接触型半導体タグ
に関しさらに詳細には本体に球形の半導体を用いた半導
体タグに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type semiconductor tag, and more particularly, to a semiconductor tag using a spherical semiconductor as a main body.
【0002】[0002]
【従来の技術】物流、交通など多方面に用いられている
タグ(荷札)を電子化し、さらに非接触でこれを読み取
ることにより業務の合理化を図る提案が多くなされてい
る。これらの応用ではICカードの技術を応用し、高周
波キャリアを用いたタグが用いられている。2. Description of the Related Art Many proposals have been made to digitize tags (tags) used in various fields such as distribution and transportation, and to read them out in a non-contact manner to streamline operations. In these applications, a tag using a high frequency carrier is used by applying the technology of an IC card.
【0003】しかしながら物流制御などでは使い捨てな
どの要請からコストに対する要求は厳しく、通常の半導
体を用い、またICカード類似の実装方法を用いてはそ
の実現が困難である。However, in distribution control and the like, the demand for cost is severe due to the requirement of disposable and the like, and it is difficult to realize this using a normal semiconductor and a mounting method similar to an IC card.
【0004】一方、最近、球形の半導体を用いて半導体
のコストを大幅に低減する方式が提案されている。半導
体タグでは回路規模も大きくなく、直径1mmのシリコン
球の表面に十分に収容できる規模であって、この面では
球形半導体はタグの応用に適していると考えられる。On the other hand, recently, there has been proposed a method of using a spherical semiconductor to greatly reduce the cost of the semiconductor. The circuit size of the semiconductor tag is not large and can be sufficiently accommodated on the surface of a silicon sphere having a diameter of 1 mm. In this respect, the spherical semiconductor is considered to be suitable for tag applications.
【0005】しかしながら球形半導体はたとえば1mmの
厚さがあり、立体であるから、従来のICカードの工法
であるプリント基板実装はなじみにくい。However, since the spherical semiconductor has a thickness of, for example, 1 mm and is three-dimensional, it is difficult to mount a printed circuit board, which is a conventional IC card construction method.
【0006】本発明はこの点に関し、球形半導体を用
い、安価で実用的な半導体タグを提供しようとするもの
である。[0006] In this regard, the present invention seeks to provide an inexpensive and practical semiconductor tag using a spherical semiconductor.
【0007】[0007]
【発明が解決しようとする課題】通常の半導体を用い、
またICカード類似の実装方法を用いた従来の半導体タ
グではコストの切り下げに限界がある。SUMMARY OF THE INVENTION An ordinary semiconductor is used.
In addition, the conventional semiconductor tag using a mounting method similar to an IC card has a limit in reducing the cost.
【0008】一方、最近、球形の半導体を用いる方式は
タグの応用に適していると考えられるが、球形半導体が
立体であり、従来のICカードの工法であるプリント基
板実装とはなじみにくいという問題がある。On the other hand, recently, a method using a spherical semiconductor is considered to be suitable for application to a tag. However, the problem is that the spherical semiconductor is three-dimensional and is not easily compatible with a conventional printed circuit board mounting method of an IC card. There is.
【0009】本発明は、かかる点に鑑みてなされたもの
であり、その目的は球形半導体に適した高周波アンテナ
の構造を提供し、安価で実用的な非接触型半導体タグを
提供することである。The present invention has been made in view of the above points, and an object of the present invention is to provide a structure of a high-frequency antenna suitable for a spherical semiconductor, and to provide an inexpensive and practical non-contact type semiconductor tag. .
【0010】[0010]
【課題を解決するための手段】本発明に従えば、球形半
導体を用いた非接触型半導体タグにおいて、高周波の送
受を行うために使用するアンテナをダイポール型とし、
また必要によりアンテナが半導体本体の支持体を兼ねる
ように構成し、部品の簡単化と組み立ての簡単化を図っ
たことを特徴とする非接触型半導体タグが提供される。According to the present invention, in a non-contact type semiconductor tag using a spherical semiconductor, an antenna used for transmitting and receiving a high frequency is a dipole type,
Also, a non-contact type semiconductor tag is provided in which the antenna is configured to also serve as a support for the semiconductor body as required, and simplification of parts and simplification of assembly are achieved.
【0011】[0011]
【発明の実施の形態】以下、本発明に従う非接触型半導
体タグの実施形態について説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a non-contact type semiconductor tag according to the present invention will be described.
【0012】(実施例1)図1はアンテナに単純ダイポ
ールを採用した本発明に従う非接触型半導体タグの実施
例である。100は直径が1mmの球形半導体の本体であ
り、球面に多重に半導体回路が形成されている。その回
路には不揮発性メモリおよび情報の送受回路、受信電力
から動作電源を作り出すための電源回路が含まれ、さら
にアンテナと回路間のインピーダンス整合を取るための
コイルが内蔵されている。101は整合コイルであり、
アンテナの左右素子に対応して2個設けられている。(Embodiment 1) FIG. 1 shows an embodiment of a non-contact type semiconductor tag according to the present invention employing a simple dipole as an antenna. Reference numeral 100 denotes a spherical semiconductor main body having a diameter of 1 mm, and multiple semiconductor circuits are formed on a spherical surface. The circuit includes a non-volatile memory, an information transmission / reception circuit, a power supply circuit for generating an operation power supply from received power, and a coil for impedance matching between the antenna and the circuit. 101 is a matching coil,
Two are provided corresponding to the left and right elements of the antenna.
【0013】201、202はアンテナ素子の一片であ
り半田付け203により、本体の球体に機械的に取り付
けられている。Reference numerals 201 and 202 denote antenna elements which are mechanically attached to the sphere of the main body by soldering 203.
【0014】素子の動作キャリア周波数は2.45GHz
であり、単純ダイポールとして必要な全長(201、2
02の長さの和)は61mmとなる。もしこれが長すぎる
ときは整合コイル101の巻数を増して装荷インダクタ
ンスを増やすことにより、全長を実用上半減することが
可能である。これにより全長が約30mmで太さが最大1
mm程度の実用的なタグを実現することが出来る。The operating carrier frequency of the element is 2.45 GHz.
And the total length required for a simple dipole (201, 2,
02 is 61 mm). If this is too long, the total length can be reduced by half by increasing the number of turns of the matching coil 101 to increase the loading inductance. As a result, the overall length is about 30 mm and the thickness is up to 1
A practical tag of about mm can be realized.
【0015】半導体は球体のためある程度の機械強度が
確保されるので、この形でも実用に耐えるが、さらに樹
脂コーテングにより補強および保護を施すことも出来
る。Since a semiconductor has a certain mechanical strength due to its spherical shape, it can withstand practical use in this form, but can be reinforced and protected by a resin coating.
【0016】(実施例2)図2はアンテナに折り返し型
ダイポールを採用した本発明に従う非接触型半導体タグ
の実施例である。アンテナ素子は折り返し型であり、全
長は半波長であり、2.45GHzキャリアの場合約60m
mである。整合コイル101は平面巻きの形式を用いて
いる。この折返しアンテナの形式ではアンテナ素子が1
個の連続した機械部品であって取り扱いが容易であり、
かつ球体接続部の位置決めが容易な特徴がある。またア
ンテナのインピーダンスは約300Ωと高く、半導体回
路と整合しやすい特徴がある。(Embodiment 2) FIG. 2 shows an embodiment of a non-contact type semiconductor tag according to the present invention employing a folded dipole as an antenna. The antenna element is a folded type, has a total length of half a wavelength, and is about 60 m for a 2.45 GHz carrier.
m. The matching coil 101 uses a planar winding type. In this folded antenna type, the antenna element is 1
It is a series of mechanical parts that are easy to handle,
In addition, there is a feature that the positioning of the spherical connecting portion is easy. In addition, the antenna has a high impedance of about 300Ω and is easily matched with a semiconductor circuit.
【0017】(実施例3)図3はT型整合を採用した型
のダイポールアンテナを採用した本発明に従う非接触型
半導体タグの実施例である。アンテナ素子の全長は半波
長であり、2.45GHzキャリアの場合は約60mmであ
る。アンテナの本体201は切れ目のない一本の金属棒
である。(Embodiment 3) FIG. 3 shows an embodiment of a non-contact type semiconductor tag according to the present invention employing a dipole antenna of a type employing T-type matching. The total length of the antenna element is a half wavelength, and is about 60 mm for a 2.45 GHz carrier. The main body 201 of the antenna is a single continuous metal rod.
【0018】整合部204、205はアンテナ本体の中
央部に取り付けられその全長は100分の12波長であ
って、2.45GHzキャリアの場合は約15mmである。
この場合素子204、205は7mmで短いため、球体の
取り付け部は実施形態2に比べて機械的に安定であり、
取り扱いが容易という特徴が得られる。アンテナのイン
ピーダンスは約600Ωで半導体回路との整合も容易で
ある。The matching portions 204 and 205 are attached to the central portion of the antenna main body, and have a total length of 12/100 wavelengths, which is about 15 mm for a 2.45 GHz carrier.
In this case, since the elements 204 and 205 are 7 mm and short, the mounting portion of the sphere is mechanically more stable than in the second embodiment,
The feature of easy handling is obtained. The impedance of the antenna is about 600Ω, and matching with the semiconductor circuit is easy.
【0019】(実施例4)以上の実施形態では本体の球
体とそれに接するアンテナ素子は中心を共有する構造と
して説明したが、実施例2、3の場合は、素子の組み立
て時の球体素子の挿入に問題が生じる場合がある。図4
は実施例3におけるアンテナ素子と球体の接合面の他の
構造を示す。この例では球体の半分がアンテナ素子に接
するように構成される。この構造によれば球体を挿入す
るさいアンテナ素子が邪魔にならず、アンテナ素子を変
形することなしに単純な平行移動で組み立て動作が完了
するという利点がある。(Embodiment 4) In the above embodiments, the sphere of the main body and the antenna element in contact with it have been described as having a structure sharing the center. Can cause problems. FIG.
Shows another structure of the joint surface between the antenna element and the sphere in the third embodiment. In this example, half of the sphere is configured to be in contact with the antenna element. According to this structure, there is an advantage that the antenna element does not become an obstacle when the sphere is inserted, and the assembling operation can be completed by simple translation without deforming the antenna element.
【0020】以上、本発明の非接触型半導体タグの実施
形態について具体的に説明してきたが、本発明は上記実
施形態に限定されるものではない。例えば、アンテナの
構造がダイポールに反射器や導波器をつけた八木アンテ
ナ形式にも同様に適用できる。Although the embodiments of the non-contact type semiconductor tag of the present invention have been specifically described above, the present invention is not limited to the above embodiments. For example, the invention can be similarly applied to a Yagi antenna type in which a reflector or a director is attached to a dipole.
【0021】また上記実施形態では棒状のアンテナ構造
で説明したが、スリットアンテナなどの面構造のアンテ
ナでも同様の効果がある。In the above embodiment, the rod-shaped antenna structure has been described. However, a similar effect can be obtained with a planar antenna such as a slit antenna.
【0022】[0022]
【発明の効果】以上説明してきたように、本発明に従え
ば、球形半導体を用いて非接触型半導体タグを構成し、
高周波の送受を行うために使用するアンテナをダイポー
ル型に構成し、部品の簡単化と組み立ての簡単化を図っ
た非接触型半導体タグが提供される。これにより球形半
導体の特徴を発揮でき、安価で実用的な非接触型半導体
タグを提供することができる。As described above, according to the present invention, a non-contact type semiconductor tag is formed by using a spherical semiconductor,
A non-contact type semiconductor tag is provided in which an antenna used for transmitting and receiving high-frequency waves is configured as a dipole type, and parts are simplified and assembly is simplified. As a result, the characteristics of a spherical semiconductor can be exhibited, and an inexpensive and practical non-contact type semiconductor tag can be provided.
【0023】また本発明によれば使用するアンテナをア
ンテナが半導体本体の支持体を兼ねるように構成するこ
とも出来、部品の簡単化と組み立ての簡単化を図ること
が出来る。Further, according to the present invention, the antenna to be used can be configured so that the antenna also serves as a support for the semiconductor body, so that simplification of parts and simplification of assembly can be achieved.
【図1】アンテナに単純ダイポールを採用した非接触型
半導体タグの実施例を示す説明図である。FIG. 1 is an explanatory diagram showing an embodiment of a non-contact type semiconductor tag employing a simple dipole as an antenna.
【図2】アンテナに折り返しダイポールを採用した非接
触型半導体タグの実施例を示す説明図である。FIG. 2 is an explanatory diagram showing an embodiment of a non-contact type semiconductor tag employing a folded dipole as an antenna.
【図3】T型整合を採用したダイポールアンテナを採用
した非接触型半導体タグの実施例を示す説明図である。FIG. 3 is an explanatory diagram showing an embodiment of a non-contact type semiconductor tag employing a dipole antenna employing T-type matching;
【図4】アンテナ素子と球体の接合面の他の構造であ
る。FIG. 4 shows another structure of the joint surface between the antenna element and the sphere.
100 球形半導体 101 球形半導体面に構成された整合コイル 201 アンテナ素子 202 アンテナ素子 203 アンテナと球形半導体の溶接部 204 T整合部の一片 205 T整合部の他の一片 REFERENCE SIGNS LIST 100 spherical semiconductor 101 matching coil formed on spherical semiconductor surface 201 antenna element 202 antenna element 203 welding part of antenna and spherical semiconductor 204 one piece of T matching part 205 another piece of T matching part
Claims (6)
部のリーダライタと非接触で交信する半導体タグにおい
て、本体の半導体は一個の球体であり、高周波の送受を
行うアンテナはダイポール型であることを特徴とする非
接触型半導体タグ。In a semiconductor tag for communicating information in an internal memory with an external reader / writer in a non-contact manner using a high frequency, a semiconductor of a main body is a single sphere, and an antenna for transmitting / receiving a high frequency is a dipole type. Non-contact type semiconductor tag characterized by the above-mentioned.
載しアンテナの長さを短縮したことを特徴とする請求項
1記載の非接触型半導体タグ。2. The non-contact type semiconductor tag according to claim 1, wherein a matching circuit with the antenna is mounted on the main body semiconductor to reduce the length of the antenna.
本体球の両端にアンテナ素子を取り付けてなることを特
徴とする請求項1記載の非接触型半導体タグ。3. The antenna is a simple dipole type,
2. The non-contact type semiconductor tag according to claim 1, wherein antenna elements are attached to both ends of the main body sphere.
り、アンテナの突き合わせ部分に本体の球体を配置した
ことを特徴とする請求項1記載の非接触型半導体タグ。4. The non-contact type semiconductor tag according to claim 1, wherein the antenna is of a folded dipole type, and a sphere of a main body is arranged at a butt portion of the antenna.
あり、整合部の中間に球体の本体を配置したことを特徴
とする請求項1記載の非接触型半導体タグ。5. The non-contact type semiconductor tag according to claim 1, wherein a central portion of the antenna main body is made of a continuous metal, and a spherical main body is arranged in the middle of the matching portion.
の変形なしに球体を受容できる形状としたことを特徴と
する請求項1記載の非接触型半導体タグ。6. The non-contact type semiconductor tag according to claim 1, wherein a connecting portion between the antenna and the spherical semiconductor has a shape capable of receiving a sphere without deformation of the connecting portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11026410A JP2000222540A (en) | 1999-02-03 | 1999-02-03 | Non-contact type semiconductor tag |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11026410A JP2000222540A (en) | 1999-02-03 | 1999-02-03 | Non-contact type semiconductor tag |
Publications (1)
Publication Number | Publication Date |
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JP2000222540A true JP2000222540A (en) | 2000-08-11 |
Family
ID=12192792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP11026410A Withdrawn JP2000222540A (en) | 1999-02-03 | 1999-02-03 | Non-contact type semiconductor tag |
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