JP2006080367A - Inductance element, radio tag circuit element, tagged tape roll, and manufacturing method of inductance element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inductance element capable of obtaining a sufficiently large inductance value without increasing the size thereof, a radio tag circuit element using it, a tagged tape roll, and a manufacturing method of the inductance element. <P>SOLUTION: A coil (the inductance element) 161-163 comprises at least one loop L having an outward trip 11, and a return trip 12 consisting of a conductive layer pattern R provided on the substrate tape 101. At least one of the outward trip 11 and the return trip 12 is provided in a recess 101A formed in the substrate tape 101. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an inductance element formed on a substrate, a RFID tag circuit element using the inductance element, a tag tape roll, and a method of manufacturing the inductance element.

  Circuit elements formed by arranging IC chips (IC circuits) on a substrate are widely used in various fields. Normally, a capacitor such as a capacitor can be formed inside an IC chip, but an inductor such as a coil cannot be formed. Therefore, an external inductance element is provided on a substrate and connected to the IC chip.

  As an inductance element formed on such a substrate, one in which a conductive layer pattern is formed on a substrate so as to form a spiral shape on the substrate is conventionally known (see, for example, Patent Document 1).

JP 2003-197451 (paragraph numbers 0020 to 0034, FIG. 1)

  However, when the conductive layer pattern is formed on a flat surface as in the above prior art, a large inductance cannot be obtained if the pattern interval in the spiral shape or spiral shape is relatively large (= sparse arrangement). Therefore, in order to increase the inductance, it is necessary to increase the pattern extension by reducing the pattern interval relatively (= dense arrangement). However, if the pattern interval is reduced to some extent, adjacent patterns function as a capacitor. As a result, the inductance decreases. As a result, the inductance cannot be improved sufficiently, and it has been difficult to obtain a sufficiently large inductance without increasing the size.

  An object of the present invention is to provide an inductance element capable of obtaining a sufficiently large inductance value without increasing the size, a radio tag circuit element using the same, a tag tape roll, and a method of manufacturing the inductance element. It is in.

  In order to achieve the above object, a first invention is an inductance element including at least one loop having a forward path portion and a return path portion made of a conductive layer pattern provided on a substrate, the forward path portion and At least one of the return path portions is disposed in a concave portion or a convex portion formed in the substrate.

  In the first invention of the present application, the conductive layer pattern is constituted by a loop, and the forward path part or the return path part of the loop is disposed in the concave part or the convex part of the substrate, so that the forward path part and the return path part adjacent to each loop are formed. Separated in the height direction, the loop surface intersects the substrate surface. By separating the adjacent portions in the height direction in this way, the patterns can be arranged densely while reducing the stray capacitance that the patterns are close to each other and function as a capacitor, and further arranged in the concave or convex portions. As a result, the cross-sectional area of one loop formed by the forward path portion and the return path portion is increased as compared with the case where they are arranged in a plane on the substrate, so that the inductance can be increased. As a result, a sufficiently large inductance value can be obtained without increasing the size of the entire element.

  According to a second invention, in the first invention, a plurality of the loops are provided, and each of the plurality of loops is a recess in which at least one of the forward path part and the return path part is formed in the substrate. Or it has arrange | positioned to the convex part, It is characterized by the above-mentioned.

  In each of the multiple loops, a sufficiently large inductance value can be obtained without increasing the size of the entire element by separating the adjacent portions of the conductive portion in the height direction and further disposing them in the concave or convex portions. Can do.

  According to a third invention, in the first or second invention, one of the forward path part and the return path part is disposed in the recess formed in the substrate, and the other is disposed on the surface of the substrate. It is characterized by being.

  By disposing one of the forward path part and the return path part in the concave part, the position in the height direction can be made lower by the depth of the concave part than the other part arranged on the surface of the substrate. It can be separated in the vertical direction.

  According to a fourth invention, in the first or second invention, one of the forward path part and the return path part is disposed on the convex part formed on the substrate, and the other is disposed on the surface of the substrate. It is provided.

  By disposing one of the forward path part and the return path part on the convex part, the height direction position can be made higher by the convex part height than the other arranged on the surface of the substrate. They can be separated from each other in the height direction.

  According to a fifth invention, in the first or second invention described above, one of the forward path part and the return path part is disposed on the convex portion formed on the substrate, and the other is formed on the substrate. It is characterized by being disposed in the recess.

  By arranging one of the forward path part and the backward path part as a convex part and the other as a concave part, the height direction position of each other can be differentiated by combining the convex part height and the concave part depth. Large separation in the height direction is possible.

  A sixth invention is characterized in that, in any one of the first to fifth inventions, the adjacent forward path part and the return path part are separated from each other also in the surface direction of the substrate through a gap. .

  By separating not only in the height direction but also in the surface direction of the substrate via a gap, the adjacent forward path part and return path part can be reliably separated.

  According to a seventh aspect of the present invention, in any one of the first to fifth aspects of the present invention, the adjacent forward path part and the return path part are the return path side edge position of the forward path part and the forward path side edge of the return path part. The position is substantially the same in the surface direction of the substrate.

  As a result, it is possible to leave the forward path part and the return path part as an integral structure that is not separated in the plane direction, and to perform the separation in the plane direction together when forming a recess in the substrate using a pressing tool or the like. It becomes.

  In an eighth aspect based on the second aspect, in each of the plurality of loops, in each loop, the end of the forward path portion and the start end of the return path portion are connected by a folded portion, and the end of the return path portion in one loop And a forward end portion of the loop adjacent to the one loop is connected by a loop connection portion, and the forward path portion, the turn-back portion, the return path portion, and the loop connection portion are configured in a substantially spiral shape continuous in this order. It is characterized by being.

  The forward path part, the folded part, the return path part, and the loop connection part are continuous in this order as a substantially spiral shape, thereby separating the forward path part and the return path part from each other in the height direction, further increasing the cross-sectional area of the loop, and further patterning Patterns can be densely packed while reducing stray capacitances that are close to each other and function as capacitors.

  According to a ninth invention, in any one of the first to eighth inventions, the concave portion or the convex portion has a substantially arcuate vertical cross-sectional shape.

  By disposing the forward path part or the return path part in the substantially arc-shaped concave part or convex part, it is possible to increase the loop cross-sectional area as compared with the case of extending in a plane on the surface of the substrate.

  A tenth invention is characterized in that, in any one of the first to ninth inventions, the substrate is made of a thermoplastic resin.

  Since the substrate is made of a thermoplastic resin, the concave portion can be easily formed on the substrate by, for example, pressing and pressing a heated pressing tool.

  An eleventh invention is characterized in that, in any one of the first to tenth inventions, the pattern is formed of a metal film containing at least one of copper, gold, silver, aluminum, and nickel. To do.

  By forming a metal film of copper, gold, silver, aluminum, nickel or the like on the substrate, it is possible to configure a loop of the conductive layer pattern including the forward path part and the return path part.

  To achieve the above object, a twelfth aspect of the present invention is an IC circuit unit for storing information, an antenna connected to the IC circuit unit, and a forward path unit and a return path unit comprising a conductive layer pattern provided on the substrate. An RFID tag circuit element for transmitting and receiving information, wherein the inductance element includes at least one of the forward path part and the return path part. It has arrange | positioned in the recessed part or convex part formed in the said base material, It is characterized by the above-mentioned.

  In the twelfth invention of the present application, the forward path portion or the return path portion of the loop provided in the inductance element is disposed in the concave portion or the convex portion of the base material, so that the adjacent forward path portion and the return path portion in each loop are heightened. Separated in the direction, the loop surface intersects the substrate surface. By separating the adjacent portions in the height direction in this way, the patterns can be arranged densely while reducing the stray capacitance that the patterns are close to each other and function as a capacitor, and further arranged in the concave or convex portions. By doing so, the cross-sectional area of one loop formed by the forward path part and the return path part is increased as compared with the case where it is arranged in a plane on the base material, so that the inductance can be increased. As a result, a sufficiently large inductance value can be obtained, and a small inductance element that can be mounted on the RFID circuit element can be realized.

  In a thirteenth aspect based on the twelfth aspect, the inductance element constitutes at least a part of an impedance matching circuit for matching impedance between the antenna side and the IC circuit portion side.

  An impedance matching circuit can be configured and the impedance between the antenna side and the IC circuit unit side can be matched without increasing the size of the RFID tag circuit using a small inductance element capable of obtaining sufficient inductance.

  In a fourteenth aspect based on the twelfth aspect, the inductance element is provided at one end or an intermediate portion of the antenna.

  By providing a small inductance element capable of obtaining a sufficient inductance at one end or an intermediate portion of the antenna, the antenna length can be shortened. As a result, the entire RFID tag circuit element can be reduced in size.

  According to a fifteenth aspect, in the twelfth aspect, the inductance element forms at least a part of a selection circuit (filter, choke coil) for selecting a signal input to the IC circuit unit. To do.

  A selection circuit can be configured using a small inductance element capable of obtaining sufficient inductance, and a signal input to the IC circuit unit can be selected or limited.

  In order to achieve the above object, a sixteenth aspect of the invention is a tag tape roll configured by arranging and winding a plurality of RFID tag circuit elements on a resin base tape, wherein the RFID tag circuit element comprises: An IC circuit unit for storing information, an antenna connected to the IC circuit unit, and at least one loop having a forward path part and a return path part made of a conductive layer pattern provided on the base tape. The inductance element is characterized in that at least one of the forward path part and the return path part is disposed in a concave part or a convex part formed in the base tape.

  In the sixteenth invention of the present application, the forward path portion or the backward path portion of the loop provided in the inductance element provided in the RFID circuit element is disposed in the concave portion or the convex portion of the base tape, so that the forward path adjacent in each loop. The part and the return path part are separated in the height direction. By separating the adjacent parts in the height direction in this way and configuring the loop surface to intersect the base material surface, while reducing the stray capacitance that the patterns are close to each other and function as a capacitor, The patterns can be densely arranged, and further, the loop cross-sectional area can be increased by arranging the patterns in the concave portion or the convex portion as compared with the case of arranging them in a plane. As a result, a plurality of RFID circuit elements each having a sufficiently large inductance value and including a small inductance element can be disposed on the resin base tape.

  To achieve the above object, according to a seventeenth aspect of the present invention, a plurality of loops having a forward path portion and a return path portion made of a conductive layer pattern are formed on a substrate on which an inductance element is mounted, and the forward path portion or the return path of the substrate is formed. By pressing the region where the portion is formed with a pressing tool, a concave portion is formed in the substrate, and the forward path portion or the return path portion is disposed at the bottom thereof, and the forward path portion and the return path portion adjacent in the surface direction of the substrate Are separated in the height direction.

  In the seventeenth invention of the present application, the forward path part or the backward path part of the loop made of the conductive layer pattern formed on the substrate is pressed with a pressing tool, and the forward path part or the backward path part is disposed at the bottom of the concave portion. Adjacent forward and backward paths are separated in the height direction. By separating the adjacent portions in the height direction in this way, the patterns can be arranged densely while reducing the stray capacitance that the patterns are close to each other and function as a capacitor, and further arranged in the concave or convex portions. As a result, the cross-sectional area of one loop formed by the forward path portion and the return path portion is increased as compared with the case where they are arranged in a plane on the substrate, so that the inductance can be increased. As a result, a sufficiently large inductance value can be obtained without increasing the size of the entire element.

  To achieve the above object, according to an eighteenth aspect of the present invention, a plurality of loops having a forward path portion and a return path portion made of a conductive layer pattern are formed on a convex portion formed on a substrate on which an inductance element is mounted. By pressing the area where the forward path part or the return path part is formed with a pressing tool, the convex part is recessed, and the forward path part or the return path part is disposed on the concave bottom, and in the surface direction of the substrate The adjacent forward path part and return path part are separated in the height direction.

  In the eighteenth invention of the present application, the forward path portion or the backward path portion of the loop formed of the conductive layer pattern formed on the convex portion of the substrate is pressed with a pressing tool, and the forward path portion or the backward path portion is disposed on the concave bottom of the convex portion. Thus, the adjacent forward path part and return path part are separated in the height direction in each loop. By separating the adjacent portions in the height direction in this way, the patterns can be arranged densely while reducing the stray capacitance that causes the patterns to be close to each other and function as a capacitor. By disposing on the convex portion, the cross-sectional area of one loop formed by the forward path portion and the return path portion is increased compared with the case where the loop is disposed on the substrate, so that the inductance can be increased. As a result, a sufficiently large inductance value can be obtained without increasing the size of the entire element.

  According to the present invention, a sufficiently large inductance value can be obtained without increasing the size.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a conceptual side view showing the structure of a tag tape roll 102 provided with a RFID circuit element having an inductance element according to the present embodiment.

  In FIG. 1, a tag tape roll 102 is wound around a reel member 102a with a base tape 101 in which a plurality of RFID tag circuit elements To are successively formed in the longitudinal direction successively at predetermined equal intervals. The base material tape 101 functions as a base material or a substrate on which a conductive layer pattern (described later) is formed, and is constituted by, for example, a resin base material (film or the like) of a thermoplastic resin.

  FIG. 2 is a functional block diagram showing a functional configuration of the RFID circuit element To.

  In FIG. 2, the RFID circuit element To includes an antenna 152 that transmits and receives information, and an IC chip 150 that is connected to the antenna 152 and includes an IC circuit unit 151 that stores information.

  In addition to the above, the RFID circuit element To is provided with coils 161, 162, and 163 as inductance elements of the present embodiment. The capacitors 161 to 163 and the capacitor 160 built in the IC chip 150 are connected to the antenna. A known impedance matching circuit (matching unit) 180 for matching the impedance between the 152 side and the IC circuit unit 151 side is configured.

  FIG. 3 is a functional block diagram showing a detailed configuration of the IC circuit unit 151.

  In FIG. 3, an IC circuit unit 151 includes a rectifying unit 153 that rectifies a carrier wave received by an antenna 152, a power source unit 154 that accumulates energy of the carrier wave rectified by the rectifying unit 153, and serves as a driving power source. A clock extraction unit 156 that extracts a clock signal from the carrier wave received by the antenna 152 and supplies the clock signal to the control unit 155; a memory unit 157 that stores a predetermined information signal; and a modulation / demodulation unit 158 connected to the antenna 152; And a control unit 155 for controlling the operation of the entire RFID circuit element To via the rectifying unit 153, the clock extracting unit 156, the modem unit 158, and the like.

  The modem unit 158 demodulates the radio communication signal received by the antenna 152 and modulates and reflects the carrier wave received from the antenna 152 based on the response signal from the control unit 155.

  The control unit 155 interprets the received signal demodulated by the modulation / demodulation unit 158, generates a return signal based on the information signal stored in the memory unit 157, and performs basic control such as returning by the modulation / demodulation unit 158. Execute proper control.

  FIG. 4 is a perspective view showing a detailed structure in the vicinity of the coils 161, 162, 163 and the IC chip 150, and corresponds to an arrow view seen from the direction A in FIG.

  As shown in FIG. 4, the coils 161, 162, and 163 are formed of a base material by a known method such as plating, sputtering, vapor deposition, or printing with a metal film including at least one of copper, gold, silver, aluminum, and nickel, for example. The conductive layer pattern R is formed on the tape 101.

  FIG. 5 is a partially extracted enlarged perspective view showing a detailed structure of the coil 161, which is a main part of the structure shown in FIG.

  In FIG. 5, the coil 161 has a plurality of (in this example, five) loops L1, L2, L3, L4, and L5, and the entire loops L1 to L5 are configured in a substantially spiral shape.

  Each of the loops L1 to L5 includes a forward path portion (forward path electrode) 11, a return path portion (return path electrode) 12, and a turn-back portion 13 that connects the end 11e of the forward path portion 11 and the start end 12s of the return path portion 12. Yes. Among the loops L1 to L5, the loops L1 to L4 except the last loop L5 in this order are the end 12e of each return path section 12 and the start end 11s of the forward path section 11 of the other loops L2 to L5 adjacent thereto. The loop connection part 14 which connects between is provided. The first loop L1 in the above order is provided with the starting point 15 of the entire coil 161, and the last loop L5 in the above order is provided with the end point 16 of the entire coil 161.

  As a result, in the loops L1 to L5, between the start end 11S of the loop L1 and the end 12E of the loop L5, the forward path part 11, the loopback part 13, the return path part 12 of the loop L1, the connection part 14 of the loops L1 and L2, The forward path part 11 of the loop L2, the turn-back part 13, the return path part 12, the connection part 14 of the loops L2 and L3, the forward path part 11 of the loop L3, and so on are continuous in the same order.

  Of the components constituting the loops L1 to L5, the forward path portion 11 of each of the loops L1 to L5 is disposed at the bottom of a substantially arc-shaped recess 101A (groove portion) formed in the base tape 101. All other parts (return path portion 12, turn-back portion 13, connection portion 14, starting point portion 15, end point portion 16) are disposed on the surface of the base tape 101. As a result, the forward path portion 11 has a position in the height direction lower than the return path portion 12 disposed on the surface of the base tape 101 by the height of the recess, and separates them in the height direction.

  At this time, the adjacent forward path portion 11 and return path portion 12 are separated not only in the height direction but also in the surface direction of the base tape 101 (k direction in the figure) via the gap t.

  Next, a procedure for manufacturing the coil 161 having the above configuration will be described with reference to FIGS.

  First, the conductive layer R is formed, for example, on the planar resin film-like base tape 101 by an appropriate known technique (see FIG. 6A).

  Thereafter, the conductive layer R is patterned into a substantially meandering shape by an appropriate known technique (for example, photolithography), and the loops L1 to L5 having the forward path portion 11 and the return path portion 12 on the surface of the base tape 101 are formed. (However, they are on the same plane; see FIG. 6 (b)).

  Then, as shown in FIG. 6C, while the pressing tool (mold) 20 provided with a substantially arc-shaped protrusion 20A corresponding to the base tape recess 101A in a comb-teeth shape is heated, The area where the forward path portion 11 is formed on the surface of the tape 101 is pressed (see FIG. 6C), thereby forming the concave portion 101A in the base tape 101, and the forward path portion 11 being disposed at the bottom thereof. (See FIG. 6 (d)). Instead of heating the pressing tool 20, the base tape 101 (film) side may be heated. As described above, the forward path portion 11 and the backward path portion 12 that are adjacent to each other in the plane direction (k direction in FIG. 5) are separated in the height direction by a simple operation by simply pressing the pressing tool 20 type. The spiral loops L1 to L5 shown in FIG. 5 can be created (see FIG. 6E).

  In addition, when pressing the surface of the base tape 101 with the pressing tool 20 as described above, an inductance measuring means is provided, and the pressing force (or the amount to be dented) is controlled in accordance with the measured value so as to have a predetermined depth. It is preferable to press the pressing tool 20 so as to be. FIG. 7 is an explanatory diagram showing an example of the specific mode. In FIG. 7, in this example, an inductance is measured from a change in antenna input impedance, and an inductance measuring machine 30 (network analyzer or the like: the antenna impedance is measured and the inductance is obtained from the change) is provided. The pressing controller 31 controls the pressing amount of the pressing tool 20 by the pressing device 32 in real time so that the inductance value measured by the inductance measuring machine 30 becomes a predetermined value. If the pressing tool 20 is non-metallic (such as ceramic or thermosetting resin), the impedance may be measured while pressing. By doing in this way, the coils 161-163 as inductance elements which comprise an impedance matching circuit can be formed with high precision. In addition, there is an effect that the variation of the antenna portion can be corrected.

  Although the coil 161 has been described above as an example, the coils 162 and 163 have the same structure and can be manufactured by the same method, thereby obtaining the same effect.

  In the present embodiment configured as described above, the conductive layer pattern R is configured by the loops L1 to L5, and the forward path portion 11 of the loops L1 to L5 is disposed at the bottom of the concave portion 011A of the base tape 101, In each loop L1 to L5, the adjacent forward path portion 11 and return path portion 12 are separated in the height direction, and the loop surface intersects the upper surface (substrate surface) of the base tape 101 (substantially orthogonal in this example). Configure as follows. By separating the adjacent portions in the height direction in this way, the patterns R can be densely arranged while reducing the stray capacitance that the patterns R are close to each other and function as a capacitor (a so-called air-core coil shape is formed). ). Further, by disposing in the recess 101A, the cross-sectional area of one loop L formed by the forward path portion 11 and the return path portion 12 is increased as compared with the case where the pattern R is planarly disposed on the base tape 101. Therefore, the inductance can be increased. As a result, a sufficiently large inductance value can be obtained without increasing the overall size of the coils 161 to 163 as inductance elements, and a small inductance element that can be mounted on the RFID circuit element To is realized. it can. Further, since air is present in the recess 101A, the capacitance between the adjacent conductors (pattern R) can be reduced as compared with the case where there is a material having a high dielectric constant such as resin, and the self-resonance frequency can be increased. (It can operate up to a high frequency).

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit and technical idea of the present invention. Hereinafter, such modifications will be described.

(1) Case of using other concave shape In the above embodiment, the substantially arc-shaped concave portion 100A is formed by the substantially arc-shaped pressing tool 20 (mold), but the coils 161 to 163 are finally formed in a loop shape (substantially spiral). Shape), the cross-sectional shape is not limited to this, and other shapes may be used.

  FIG. 8 is a view showing a modified example having such other concave shape. When the substantially trapezoidal pressing tool 20 ′ shown in FIG. 8A is used, the substantially inverted trapezoidal shape shown in FIG. The recessed portion 100A ′ can be formed and the forward path portion 11 can be disposed at the bottom thereof. If the substantially rectangular pressing tool 20 ″ shown in FIG. 8C is used, the substantially rectangular shape shown in FIG. The recessed portion 100A ″ can be formed and the forward path portion 11 can be disposed at the bottom thereof. If a substantially triangular pressing tool 20 ″ ′ shown in FIG. 8 (e) is used, a substantially inverted triangle shown in FIG. 8 (f) is obtained. A concave portion 100A ″ ′ having a shape can be formed, and the forward path portion 11 can be disposed at the bottom thereof.

  In these modifications, the concave portion itself to be separated from the upper surface of the base tape 101 into the concave portion may have a steep angle, but the electrode portion (the portion indicated by B in each figure) connected to the adjacent spiral is If the angle is not steep, disconnection or the like is less likely to occur, and a stable formation can be achieved.

  Also by these modified examples, the same effect as the above-described embodiment is obtained.

(2) When a part of the conductive layer pattern is recessed after forming the convex portion in the convex portion In the above embodiment, the forward path portion 11 is disposed in the concave portion 101A and the return path portion 12 is disposed on the base tape 101. However, the present invention is not limited to this, and one of the two is disposed on the convex portion provided on the base tape 101 as the substrate, and the other is disposed on the base tape 101 (or the concave portion). It may be arranged.

  FIGS. 9A to 9C are diagrams showing a procedure for manufacturing such a modified example, and are diagrams corresponding to FIGS. 6A to 6E described above in the embodiment. Parts equivalent to those in the above embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified as appropriate.

  First, a substantially arc-shaped (kamaboko-shaped) convex portion 101B is formed in advance on the base tape 101 by an appropriate known method (molding, embossing, adhesion, etc.).

  Next, similarly to the above, the conductive layer R is formed on the convex portion 101B by an appropriate known method, and the shape of the conductive layer R is patterned into a substantially meandering shape. A plurality of loops (L1 to L4 in this example) having the return path portion 12 are formed (however, on the same circular arc surface; see FIG. 9A).

  After that, for example, the above-described pressing tool (mold) 20 ″ (or 20, 20 ′, 20 ″ ′) is used to press the region of the convex portion 101B where the return path portion 12 is formed, thereby cutting the convex portion 101B. A recess 101Ba whose bottom is substantially the same height as the top surface of the base tape 101 is formed, and a return path 12 is disposed at the bottom. The remaining portion that has not been cut forms a substantially arc-shaped strip portion 101Bb (see FIG. 9B). The pressing tool 20 ″ or the like may be heated, or the base tape 101 side may be heated. In this way, the pressing tool 20 ″ or the like is simply pressed and adjacent in the surface direction. The forward path portion 11 and the return path portion 12 that are to be separated in the height direction can form spiral loops L1 to L4. Also by such a modification, the effect similar to the said embodiment is acquired. In this case, there is also an effect that the pressed conductive layer R portion is difficult to be disconnected.

  Further, as shown in FIG. 9C, the return path portion 12 is not substantially flush with the upper surface of the base tape 101, and the return path portion 12 is inserted into a recess 101 </ b> Bc that is recessed further below by using the pressing tool 20. May be arranged. In this case, the height direction positions of the forward path part 11 on the convex part (substantially circular arc strip-shaped part 101Bb) and the return path part 12 of the concave part 101Bc are different by the sum of the height of the convex part 101Bb and the depth of the concave part 101Bc. Therefore, they can be separated largely in the height direction, the cross-sectional area formed by one loop is increased, and a larger inductance value can be obtained.

(3) Other conductive layer pattern shapes For the formation of the conductive layer pattern R, an inductance element was formed by pressing a pressing tool (mold) even if it was not a meandering pattern from the beginning as in the above embodiment. Sometimes, it is sufficient if the adjacent loops L are not short-circuited and the loops L are connected in a spiral shape.

  FIGS. 10A and 10B are diagrams showing a procedure for manufacturing such a modification, and correspond to FIGS. 6A to 6E described above in the embodiment. Parts equivalent to those in the above embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified as appropriate.

First, the conductive layer R ′ is formed on the base tape 101 by an appropriate known method as described above, and then the shape is patterned into a predetermined shape (see FIG. 10A).
Here, as a feature of this modified example, the conductive layer pattern R ′ at this time is such that the portion 11-0 that will later become the forward path portion 11 and the portion 12-0 that will later become the backward path portion are in the surface direction of the base tape 101. It is a one-piece structure that is not separated.

  Then, for example, the portion 11-0 (region where the forward path portion 11 is desired to be formed) on the upper surface of the base tape 101 is pressed with the pressing tool (mold) 20 described above, and thereby the base material is similar to the above embodiment. The upper surface of the tape 101 is recessed to form a recess 101A, and the forward path portion 11 is disposed at the bottom. In this case, the adjacent forward path portion 11 and the return path portion 12 are such that the position of the return path portion 12 side edge portion of the forward path portion 11 and the forward path portion 11 side edge position of the return path portion 12 are substantially the same in the surface direction of the base tape 101. It will be done.

  The pressing tool 20 side may be heated, or the base tape 101 side may be heated. By doing in this way, when forming the recessed part 101A in the base tape 101 with the pressing tool 20, it is possible to perform separation in the surface direction of the forward path part 11 and the return path part 12 together.

  Also by this modification, the same effect as the above-mentioned embodiment is acquired.

(4) When used as an antenna length adjustment coil The above is an example in which the present invention is applied to a coil for an impedance matching circuit (matching circuit) 180 in the RFID circuit element To, but is not limited thereto. Absent. For example, as shown in FIG. 11, the configuration of the shortening coil 170 used for shortening the total length of the antenna 152 in the RFID circuit element To is the configuration of the above embodiment and the modifications (1) to (3). May be applied. In this case, the coil 170 is provided at one end or an intermediate portion of the antenna 152. As a result, the antenna length can be shortened. As a result, the entire RFID circuit element To can be reduced in size.

(5) When used as a choke coil Furthermore, when using a plurality of frequencies in a circuit, it may be used as a so-called choke coil.

  FIG. 12A is a diagram corresponding to FIG. 4 of the above-described embodiment, and FIG. 12B is a diagram corresponding to FIG. 2 of the above-described embodiment, showing an overall schematic circuit diagram of such a modification. . Parts equivalent to those in FIGS. 4 and 2 are denoted by the same reference numerals, and description thereof will be omitted or simplified as appropriate.

  12A and 12B, in this example, the IC circuit portion 151 of the RFID circuit element To has a 13 MHz circuit portion 159L mainly for writing and a 900 MHz circuit portion 159H mainly for reading. Correspondingly, capacitors 183 and 184 for preventing a 13 MHz signal from being introduced into the 900 MHz circuit portion 159H are provided in the IC chip 150. On the 900 MHz circuit portion 159H side, an impedance matching circuit (reference numeral omitted) including the capacitor 160 and the coils 161 and 162 similar to that shown in FIG. 2 is provided.

  As a feature of this modification, choke coils 181 and 182 that prevent a 900 MHz signal from being introduced into the 13 MHz circuit unit 159L are provided, and a selection circuit that selects a signal input to the IC circuit unit 151. Part of. Although the case where the present invention is applied to the coils 161 and 162 has been described above, the described configuration of the present invention may be similarly applied to the choke coils 181 and 182.

  In this case, the same effect as the above embodiment is obtained. In addition, small choke coils 181 and 182 capable of obtaining sufficient inductance can be realized, and a selection circuit can be configured using the choke coils 181 and 182 to select or limit a signal input to the IC circuit unit 151.

(6) Other
(a) In the above description, the case where the coil includes a plurality of loops L has been described as an example. However, the present invention is not limited to this, and the present invention can also be applied to the configuration of only one loop L. Also in this case, since the cross-sectional area of the loop L formed by the forward path portion 11 and the return path portion 12 increases, the same effect that the inductance can be increased is obtained.

  (b) Moreover, it is not restricted to said combination also about which a recessed part and a convex part provide in the outward path part 11 and the return path part 12. FIG. In short, one of the forward path portion 11 and the return path portion 12 is disposed in the concave portion or the convex portion and the other is disposed on the surface of the substrate (substrate), or one is the concave portion and the other is disposed in the convex portion. By doing so, the positions in the height direction may be different from each other and separated in the height direction. Also in this case, since the cross-sectional area of one loop L formed by the forward path portion 11 and the return path portion 12 increases, the same effect that the inductance can be increased is obtained.

  In addition, although not illustrated one by one, the present invention is implemented with various modifications within a range not departing from the gist thereof.

It is a conceptual side view showing the structure of the tag tape roll which provided the RFID circuit element provided with the inductance element by one Embodiment of this invention. It is a functional block diagram showing the functional structure of a wireless tag circuit element. It is a functional block diagram showing the detailed structure of an IC circuit part. FIG. 2 is an arrow view showing a detailed structure in the vicinity of a coil and an IC chip as seen from the direction A in FIG. 1. FIG. 5 is a partially extracted enlarged perspective view showing a detailed structure of a coil that is a main part of the structure shown in FIG. 4. It is a figure explaining the procedure which manufactures a coil. It is explanatory drawing showing an example of the specific aspect which controls a pressing force according to a measured value, and presses a pressing tool so that it may become predetermined depth. It is a figure showing the modification made into another recessed part shape. It is a figure showing the procedure which manufactures such a modification which dentes the part after forming a conductive layer pattern in a convex part. It is a figure showing the procedure which manufactures the modification of another conductive layer pattern shape. It is a schematic circuit diagram showing the modification applied to the coil for antenna full length shortening in a radio | wireless tag circuit element. It is the whole schematic circuit diagram of the modification utilized as a choke coil.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Outward part 12 Return part 13 Folding part 14 Loop connection part 20 Pressing tool 20 'Pressing tool 20 "Pressing tool 20"' Pressing tool 101 Base material tape (board | substrate)
102 Tag tape roll 151 IC circuit part 152 Antenna 161 Coil (inductance element)
162 Coil (inductance element)
163 Coil (inductance element)
170 Coil (inductance element)
181 Coil (inductance element)
182 Coil (inductance element)
101A concave portion 101A 'concave portion 101A "concave portion 101A"' concave portion 101B convex portion 180 impedance matching circuit L1-5 loop R conductive layer pattern R 'conductive layer pattern To RFID circuit element

Claims (18)

An inductance element including at least one loop having a forward path portion and a return path portion made of a conductive layer pattern provided on a substrate,
An inductance element, wherein at least one of the forward path part and the return path part is disposed in a concave portion or a convex portion formed in the substrate. The inductance element according to claim 1, wherein
A plurality of the loops are provided,
Each of the plurality of loops has at least one of the forward path portion and the return path portion disposed in a concave portion or a convex portion formed in the substrate. The inductance element according to claim 1 or 2,
One of the forward path part and the return path part is disposed in the recess formed in the substrate, and the other is disposed on the surface of the substrate. The inductance element according to claim 1 or 2,
One of the forward path portion and the return path portion is disposed on the convex portion formed on the substrate, and the other is disposed on the surface of the substrate. The inductance element according to claim 1 or 2,
One of the forward path part and the return path part is disposed on the convex part formed on the substrate, and the other is disposed on the concave part formed on the substrate. The inductance element according to any one of claims 1 to 5,
The inductance element, wherein the adjacent forward path part and the return path part are separated from each other in the plane direction of the substrate via a gap. The inductance element according to any one of claims 1 to 5,
In the adjacent forward path part and the return path part, the return path side edge position of the forward path part and the forward path side edge position of the return path part substantially coincide with each other in the surface direction of the substrate. Inductance element. The inductance element according to claim 2, wherein
The plurality of loops are:
In each loop, the end of the forward path part and the start end of the return path part are connected by a folded part,
The end of the return path part in one loop and the start end of the forward path part of a loop adjacent to the one loop are connected by a loop connection part,
An inductance element characterized in that the forward path part, the return part, the return path part, and the loop connection part are configured in a substantially spiral shape that is continuous in this order. The inductance element according to any one of claims 1 to 8,
The said recessed part or the said convex part is provided with the substantially circular arc-shaped longitudinal cross-sectional shape, The inductance element characterized by the above-mentioned. The inductance element according to any one of claims 1 to 9,
The inductance element, wherein the substrate is made of a thermoplastic resin. The inductance element according to any one of claims 1 to 10,
The inductance element, wherein the conductive layer pattern is formed of a metal film containing at least one of copper, gold, silver, aluminum, and nickel. An IC circuit unit for storing information, an antenna connected to the IC circuit unit, and an inductance element including at least one loop having a forward path part and a return path part made of a conductive layer pattern provided on the substrate A wireless tag circuit element provided on a base material for transmitting and receiving information,
The RFID tag circuit element, wherein the inductance element has at least one of the forward path part and the return path part disposed in a concave portion or a convex portion formed in the base material. The wireless tag circuit element according to claim 12,
The RFID tag circuit element, wherein the inductance element constitutes at least a part of an impedance matching circuit for matching impedance between the antenna side and the IC circuit unit side. The wireless tag circuit element according to claim 12,
The RFID circuit element according to claim 1, wherein the inductance element is provided at one end or an intermediate portion of the antenna. The wireless tag circuit element according to claim 12,
The RFID tag circuit element, wherein the inductance element constitutes at least a part of a selection circuit for selecting a signal input to the IC circuit unit. A tag tape roll configured by arranging and winding a plurality of RFID circuit elements on a resin base tape,
The RFID circuit element includes at least one IC circuit section for storing information, an antenna connected to the IC circuit section, and an outward path section and a return path section composed of a conductive layer pattern provided on the base tape. An inductance element with a number of loops,
This inductance element is a tag tape roll characterized in that at least one of the forward path portion and the return path portion is disposed in a concave portion or a convex portion formed in the base tape. A plurality of loops having a forward path portion and a return path portion made of a conductive layer pattern are formed on the substrate on which the inductance element is mounted,
By pressing the area where the forward path part or the return path part of the substrate is formed with a pressing tool, a concave portion is formed in the substrate, and the forward path part or the return path part is disposed on the bottom thereof, and the surface of the substrate A method of manufacturing an inductance element, wherein a forward path part and a return path part adjacent in a direction are separated in a height direction. A plurality of loops having a forward path portion and a return path portion made of a conductive layer pattern are formed on the convex portion formed on the substrate on which the inductance element is mounted,
The area where the forward path part or the backward path part is formed in the convex part is pressed with a pressing tool, so that the convex part is recessed and the forward path part or the return path part is disposed on the concave bottom, and the substrate A method of manufacturing an inductance element, comprising separating a forward path part and a return path part adjacent to each other in a height direction.

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