JP2003085520A - Manufacturing method for ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for an IC card of a simple structure suitable for small lot manufacturing. SOLUTION: The manufacturing method of an IC card is characterized by that a data carrier including an IC chip and a pair of antennas, and supplied information and power from a radio wave by an electrostatic coupling system is laminated on an antenna sheet provided with a pair of conductive antenna regions capable of respectively and electrically connecting to the pair of antennas on another sheet to obtain a data sheet, and an adhesive sheet is attached on a surface with the data carrier of the data sheet.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an IC card, and more particularly to a method for manufacturing an IC card which has a simple structure and is suitable for manufacturing a small amount.

[0002]

2. Description of the Related Art A conventional IC card is a resin such as polyethylene terephthalate, polypropylene, polyethylene or the like having a thickness of 20 to 100 .mu.m and an insulating sheet having a coil made of a wire such as silver or copper attached thereto. Was manufactured by connecting various IC chips to a coil-shaped antenna obtained by etching in a coil shape and hot-pressing a polyethylene terephthalate film on both surfaces of the coil-shaped antenna using a sheet-shaped adhesive. However, although such an IC card is suitable for mass production, it is not suitable for small-lot production.

On the other hand, as a data carrier of the electrostatic coupling system, developed by Motorola Co., Ltd.
No. 8 publication and the like. A reader / writer device for reading and writing data on an IC chip by the electrostatic coupling method is already on the market (Dainippon Printing Co., Ltd.) and is disclosed in Japanese Patent Laid-Open No. 8-153170. In addition, in principle, JP-A-59-60
In Japanese Patent No. 783, "I perform information exchange by electrostatic coupling method I
C card "is disclosed.

[0004]

SUMMARY OF THE INVENTION The present invention relates to a method of manufacturing an IC card adopting an electrostatic coupling method.

[0005]

According to the present invention, (1) a data carrier 1 having an IC chip 2 and a pair of antennas 5 and to which information and electric power are supplied from radio waves by an electrostatic coupling method.
Is laminated on an antenna sheet 10 having a pair of conductive antenna regions 8 that can be electrically connected to the pair of antennas on another sheet 9 to obtain a data sheet 11, and a data carrier of the data sheet 11 is obtained. 1 is a method for manufacturing an IC card, which is characterized in that an adhesive sheet 12 is attached to the surface having 1. The present invention is (2) the method for manufacturing an IC card according to (1), wherein the conductive antenna region 8 is formed by a printer using conductive ink.

The present invention is the method for producing an IC card according to (1) or (2), wherein (3) the pressure-sensitive adhesive sheet 12 is a pressure-sensitive adhesive sheet having at least a recording layer 16, a support 17, and a pressure-sensitive adhesive layer 18. . According to the present invention, (4) fixed information is printed 21 in advance on the recording layer 16 of the pressure-sensitive adhesive sheet 12, and after being attached to the data sheet 11, individual information is printed (printed) 22 on the recording layer 16 by a printer (3). It is a manufacturing method of the described IC card.

The present invention is (5) the method for manufacturing an IC card according to any one of (1) to (4), wherein the sheet 9 is the printed matter 26 and the conductive antenna region 8 is formed on one surface thereof.

According to the present invention, (6) the sheet 9 has the recording layer 28 on the surface not having the conductive antenna region 8 (1) to
The method for manufacturing an IC card according to any one of (4).
According to the present invention, (7) the fixed information is printed 32 on the recording layer 28 of the sheet 9 in advance, the conductive antenna region 8 is formed on the back surface, the data carrier 1 is laminated, and the adhesive sheet 12 is attached, and then the recording is performed. A method of manufacturing an IC card according to (6), wherein individual information is printed 33 on the layer 28 by a printer.

The present invention is (8) the method for manufacturing an IC card according to any one of (1) to (4), wherein the adhesive sheet 35 is attached to the surface of the sheet 9 that does not have the conductive antenna region 8. is there. In the present invention, (9) the adhesive sheet 35 is used as the recording layer 4.
2. The method for manufacturing an IC card according to (8), which is a pressure-sensitive adhesive sheet having at least the support 43 and the pressure-sensitive adhesive layer 44. The present invention includes (10) the recording layer 42 of the adhesive sheet 35.
In the method of manufacturing an IC card according to (9), fixed information is printed 46 in advance on the data sheet 11 and attached to the data sheet 11, and then individual information is printed (printed) 47 on the recording layer 42 by a printer.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION In the first aspect of the present invention, a data carrier 1 having an IC chip 2 and a pair of antennas 5 and to which information and electric power are supplied from radio waves by an electrostatic coupling system is attached to a separate sheet 9. Antenna sheet 1 in which a pair of conductive antenna regions 8 that can be electrically connected to the pair of antennas are provided
A method for manufacturing an IC card is characterized in that the data sheet 11 is obtained by stacking the data sheets on the sheet No. 0, and the adhesive sheet 12 is attached to the surface of the data sheet having the data carrier.

The data carrier 1 has an IC chip 2 and a pair of antennas 5, has a structure as shown in FIGS. 1 and 2, and is also called an interposer. For example, a pair of antennas 5 may be provided on the support 6, and the terminals 3 of the IC chip 2 and the antennas 5 may be joined with an anisotropic conductive paste (ACP) 4. A conductive adhesive 7 may be formed on both antennas 5.

The antenna sheet 10 is formed by forming a pair of conductive antenna regions 8 on the sheet 9 and has a structure shown in FIG. 3, for example. The conductive antenna region 8 may be formed by printing and printing with a printing machine, a printer or the like using conductive ink. As the sheet 9, papers, paperboards, synthetic papers, films, non-woven fabrics, and laminates thereof can be used. However, a conductive support such as a metal foil or a metal vapor-deposited paper is not preferable because it is electrically connected between the pair of antennas.

The data carrier 1 shown in FIGS. 1 and 2 and the antenna sheet 10 shown in FIG. 3 are connected to the antenna 5 of the data carrier 1 and the conductive antenna region 8 as shown in FIGS. Are laminated so that they can be electrically connected to each other to form the data sheet 11. 4 and 5, the terminal 3 of the data carrier 1 and the anisotropic conductive paste 4 are not shown. A conductive adhesive 7 may be used to bond the stacked data carriers 1.

The adhesive sheet 12 is attached to protect the data carrier 1 and the conductive antenna area 8 formed on the data sheet 11. The pressure-sensitive adhesive sheet 12 has a layer structure as shown in FIG. 6 and has at least the support 13 and the pressure-sensitive adhesive layer 14, and a known pressure-sensitive adhesive sheet such as a pressure-sensitive adhesive label, a pressure-sensitive adhesive label, or a pressure-sensitive adhesive tape can be used.

As the support 13 of the adhesive sheet, paper,
Synthetic papers, films, non-woven fabrics, and laminates thereof can be used. However, a conductive support such as a metal foil or a metal vapor-deposited paper is not preferable because it is electrically connected between the pair of antennas. When the surface to which the data sheet 11 is attached is visible after being attached, a transparent or translucent support such as a transparent film or glassine paper may be used. On the other hand, it is preferable to use an opaque support in order to make the attaching surface invisible.

The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 14 includes
A known adhesive such as an acrylic type, a rubber type, a vinyl ether type, a urethane type or the like may be applied and dried in the form of a solvent type, an aqueous emulsion type, a hot melt type, a liquid curing type, or the like. As the pressure-sensitive adhesive, it is preferable to use a pressure-sensitive adhesive having an adhesive strength such that the data sheet 11 and the pressure-sensitive adhesive sheet 12 are not separated by hand.

The pressure-sensitive adhesive layer 14 may be formed to a thickness of 5 to 50 μm, preferably 7 to 30 μm. If necessary, the pressure-sensitive adhesive may contain auxiliary agents such as a tackifier, a cross-linking agent, a pigment, an ultraviolet absorber and a rust preventive. The method of forming the pressure-sensitive adhesive is not limited at all, for example, comma coater, reverse coater, gravure coater, reverse gravure coater, kiss coater, knife coater, bar coater,
A coating machine such as a lip coater or a printing machine may be used to directly apply the adhesive sheet to the support 13 or transfer the release sheet to the support 13.

In the first invention, as shown in FIG. 7, the IC card 15 can be obtained by attaching the adhesive sheet 12 to the surface of the data sheet 11 having the data carrier 1. It can be manufactured by a simple operation without using a conventional heat press device, and is suitable for manufacturing a small-scale IC card. The method for attaching the pressure-sensitive adhesive sheet is not particularly limited as long as it is a means for laminating the pressure-sensitive adhesive layer 14 of the pressure-sensitive adhesive sheet 12 on the surface of the data sheet 11 having the data carrier 1 and applying pressure,
For example, a labeler may be used. Alternatively, the pressure-sensitive adhesive sheets may be manually stacked and attached by finger pressure.

It is also possible to form a plurality of data sheets on one sheet, attach an adhesive sheet, and then cut the sheet into a predetermined size. Alternatively, the data sheet may be formed as a belt-shaped continuous sheet, and a continuous adhesive sheet may be superposed and attached, and then cut into a predetermined size.

Further, when the support 13 and the sheet 9 of the adhesive sheet are made of paper, it is a preferable form because even if the discarded card is mixed with the used paper raw material, it can be processed in the used paper recycling process. The mixed IC chip and the conductive antenna region 8 can be easily separated. In this case, as the pressure-sensitive adhesive, it is preferable to use a publicly-known pressure-sensitive adhesive having excellent recyclability, which is disclosed in JP-A-8-218040.

In addition, it is preferable that the support 13 and the sheet 9 of the pressure-sensitive adhesive sheet are water-impermeable sheets such as synthetic papers and films because the IC card has excellent water resistance and durability.

Further, a tint block printing is performed on the sheet 9, a hidden printing is performed with an ink containing a fluorescent dye, a fluorescent pigment, etc., a hologram or a thread is interposed, and the like.
It is preferable to stick the pressure-sensitive adhesive sheet 12 on it, since the function of preventing falsification is imparted.

A second aspect of the present invention is the method for manufacturing an IC card as described above, wherein the conductive antenna region 8 is formed by a printer using conductive ink.

When printing an antenna with a printer, unlike printing which is produced in large quantities, the antenna can be formed when the card is issued. Furthermore, since the ID number that can individually identify the chip can be printed as it is, or can be encrypted or coded like a bar code, etc., and can be printed with the antenna, in the event of IC chip damage or the like. It's very convenient. Furthermore, on the printer side, IC
It is also possible to automate the printing of the information as described above by inputting the information with the reading / writing device of the chip.

Of course, other visual recognition information and individual information can be printed if necessary. For example, personal information such as the name of the user of the card can be printed. Further, the antenna can be a design antenna. For example, like the antenna sheet 10 shown in FIGS. 8 to 12, there are a tree-like pattern, a hierographic pattern, a humanoid pattern, a butterfly wing pattern, etc., but of course the invention is not limited thereto. It is essential that the pair of antennas are independently formed without contacting each other, and it is preferable to form the pair of antennas in the largest possible area of the card surface because the communication distance with the reader / writer is extended.

As the printer, known methods such as a thermal transfer recording method and an inkjet recording method can be used, but the thermal transfer recording method is preferable in view of the ease of preparing the conductive ink and the printing speed of the antenna.

As this thermal transfer recording system, a thermal transfer ribbon is prepared by providing a heat-fusible conductive layer having conductivity on a heat-resistant substrate such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate). Then, by using a transfer device having a heating head such as a thermal head, the conductive layer is heated so that the conductive layer is opposed to the sheet surface on which the antenna is formed, and the antenna region may be transferred and formed on the sheet by the conductive heat-fusible transfer ink. .

More specifically, the thickness of the heat resistant substrate used as the thermal transfer ribbon is generally 2 μm to 10 μm.
It is preferably m. If the substrate is thinner than this, the ribbon is likely to be damaged during heating by a thermal head or the like, and if it is thicker than this, the amount of applied energy required for transfer is large and not practical.

The conductive heat-fusible transfer ink is mainly composed of
It is composed of a conductive substance and a heat-fusible substance.
It is composed of the following materials. Conductive substance: Carbon black (preferably conductive carbon black such as Ketjen black), graphite, conductive metals such as gold and silver, and conductive compounds such as oxides of indium and tin.

Thermofusible substance: melting point 40 ° C to 150 ° C
Waxes such as paraffin wax and carnauba wax, vinyl resin such as ethylene vinyl acetate copolymer, acrylic resin such as ethylene ethyl acrylate, coumarone resin such as coumarone indene resin, petroleum resin, phenolic resin, maleic acid resin, Polyamide resin, cellulose resin, epoxy resin, ketone resin and the like can be mentioned, and they can be appropriately selected and used, but among them, waxes are preferably used.

The proportion of these materials in the thermal transfer layer is such that the conductive substance is 1 to 60% by mass and the heat fusible substance is 40%.
˜99% by mass. More preferably, the conductive material is 2
5 to 45% by mass, and the heat-fusible substance is 55 to 75% by mass.

The conductivity of the conductive layer formed by the printer is defined by its surface resistivity. This surface resistivity is generally assumed to be a rectangular parallelepiped, and the length of opposite sides to which the electrodes are applied is W [mm].
When the distance between the sides is L [mm] and the measured resistance between the electrodes is R [Ω], the surface resistivity ρS = R × W ÷ L
It is represented by. In the present invention, the surface resistivity of the conductive layer is preferably 1Ω / □ to 10000Ω / □ in order to obtain sufficient communication characteristics. In the case of the thermal transfer recording method, it is difficult to lower the surface resistivity of the constituent material of the heat-fusible ink, and if the surface resistivity is higher than this, it may be difficult to develop a sufficient communication distance.

When the heat-fusible transfer ink is provided on the heat transfer ribbon, if the thickness of the ink layer is too small, sufficient communication characteristics cannot be obtained, and if the ink layer is too thick, the heat transfer is performed. With the applied energy supplied to the thermal head, the ink layer is not completely transferred to the transferred substrate, so-called transfer failure occurs. Therefore, the thickness of the transfer ink layer is preferably 0.1 μm to 100 μm, and is preferably set to 0.5 μm to 20 μm in order to sufficiently exhibit the function as an antenna.
Further, in addition to transferring the thermal transfer ink layer to the transferred substrate by printing once, it is also possible to perform a printing method of so-called multiple printing in which the thermal transfer ink layer is partially transferred in several times.

In order to facilitate peeling of the transfer layer during thermal transfer, it is preferable to provide an anchor layer between the substrate such as PET and the conductive thermal transfer layer in the thermal transfer ribbon. This anchor layer is mainly composed of a heat-fusible substance with the above-mentioned conductive substance, but when heated by a heating head, for example, the melting point is set lower than that of the conductive transfer layer, or Alternatively, the melting point is similar to that of the conductive transfer layer, but the melt viscosity is low, so that it is necessary to make the characteristics such that peeling can be easily performed during heating and melting. For example, when the melting points are made different, the ink is designed so that the melting point of the anchor layer is 10 ° C. or more, preferably 20 ° C. or more lower than the melting point of the conductive thermal transfer layer. When making a difference in melt viscosity, it is preferable to design so that the amount of the wax component of the anchor layer is larger than that of the conductive transfer layer. In order to secure the communication distance, it is necessary to add a conductive substance also to the anchor layer for the purpose of lowering the surface resistance of the antenna when peeling occurs inside the anchor layer during transfer or at the interface of the base material. It is preferable. This anchor layer is
In order to sufficiently transfer the conductive transfer layer, it is preferable to set the thickness of the anchor layer to 0.1 μm to 10 μm so that it can be melted by a part of energy applied to the thermal head.

The thermal transfer layer is not limited to a conductive transfer layer or a layer structure in which an anchor layer is further added. For example, when the surface roughness of the transferred substrate is large, the transferability is enhanced, It is possible to provide at least one overcoat layer in order to enhance the adhesiveness to the transfer-receiving substrate. In this case, it is preferable to add a conductive agent also to the overcoat layer in order to improve the communication characteristics of the electrostatic antenna. Further, the use of EVA (ethylene vinyl acetate copolymer) for the thermal transfer layer including the anchor coat layer and the overcoat layer improves the adhesiveness of the IC chip mounting body 1 to the conductive adhesive material, which will be described later. preferable. In particular,
It is more preferable to use it for the anchor coat layer.

In order to provide a conductive layer including such a conductive thermal transfer layer and an anchor layer on a substrate, the above materials are dissolved, mixed, dispersed in a solvent or heated and melted in a liquid state. A method of coating the base material with a coating machine such as a gravure coater, a bar coater, or a roll coater is generally used. The coater used when the ink is melted and applied is called a hot melt coater. Such ink coating with a coater allows continuous coating of a roll-shaped substrate, mass production, and low manufacturing cost.

In order to apply the ink with a coater or the like, it is necessary to make the ink into a liquid state. This is a state in which the constituent materials of the transfer layer are dissolved, mixed, dispersed or heated and melted in a solvent, an attritor, a ball mill, a sand mill, It is prepared by mixing or kneading with a roll mill or the like. At this time, a powdery material such as conductive carbon black is finely pulverized and dispersed to a predetermined particle size. In the present invention, the workability at the time of coating the ink layer, the addition of auxiliary agents and additives necessary for ensuring the uniformity of the conductive layer is not limited,
For example, a surfactant or the like may be added to improve dispersibility during ink preparation. The average particle size of the powder material in the final ink is preferably 50 μm or less, preferably 20 μm or less in order to make the surface of the ink layer after coating uniform. It is also possible to add an antifoaming agent for eliminating bubbles generated during coating.

The roll coated with the transfer layer or the like is cut into a suitable size for use in a thermal transfer printer, and cut into a required length with a slitter or the like to be subdivided. Eventually, this small roll will be printed by thermal transfer,
At this time, it is preferable to use a thermal transfer printer which can usually print in an arbitrary shape and can print an ID number or the like. This thermal transfer printer is a device that superimposes a thermal transfer ribbon and a substrate to be transferred, supplies current to a thermal head, raises the temperature of the head element to the melting point of the transfer layer or higher, and transfers the transfer layer to the substrate layer. . At this time, the amount of heat flowing from the thermal head into the thermal transfer ribbon is partly scattered other than the melting of the transfer layer due to unevenness of the substrate. Therefore, it is necessary to give extra energy to be applied to the thermal head, and the temperature of the thermal head may greatly exceed the melting temperature of the transfer layer. At that time, the phenomenon of so-called sticking may occur in which the substrate surface of the thermal transfer ribbon tends to be softened or melted and stick to the thermal head. When this occurs, the transfer pattern may be unclear, or, in severe cases, the film may be broken and torn off. In order to prevent such troubles, a heat resistant layer may be provided on the side of the thermal transfer ribbon that contacts the thermal head. This heat-resistant layer is provided by coating a substrate with a material such as silicone resin, epoxy resin, melamine resin, phenol resin, fluororesin, polyimide resin, or nitrocellulose.

In the present invention, in order to produce the same pattern in a large amount, in addition to the use of the thermal transfer printer described above, a mold having a certain pattern is heated and pressed against the thermal transfer ribbon so that the transferred substrate is electrically conductive. A so-called hot stamping method of transferring the heat transfer layer may be adopted. When the transfer method is used, at least a part of the antenna is made of graphite, carbon black, at least one conductive material selected from conductive metals and conductive compounds, and wax formed on the support. Since it is composed of a conductive layer containing water, it is more excellent in water resistance than an antenna layer formed by inkjet printing using a water-soluble ink. In the inkjet method, it is generally necessary to provide an absorbing layer for absorbing ink, but the antenna of the present invention can be formed on plain paper itself.

The second aspect of the invention is preferable because the conductive antenna region 8 is formed by the printer, so that antennas of various shapes can be manufactured from a single sheet according to the customer's request. Further, when the antenna with design or personal information is printed, the adhesive sheet is preferably a transparent support.

The third aspect of the present invention is characterized in that, in the above IC card manufacturing method, the adhesive sheet 12 is a recording adhesive sheet 19 having at least a recording layer 16, a support 17, and an adhesive layer 18. is there. For example, the pressure-sensitive adhesive sheet has a layer structure as shown in FIG. 13, but an undercoat layer (not shown) is provided between the support 17 and the recording layer 16, or a plurality of recording layers are laminated (not shown). Recording layer 1
6, an overcoat layer (not shown) is formed, or a barrier layer (not shown) is provided between the support 17 and the adhesive layer 18.
It is possible to adopt a known constitution of a pressure-sensitive adhesive sheet for recording.

As the recording layer 16, known recording layers of various recording systems can be used. For example, a heat-sensitive recording layer of a heat-sensitive recording system, a heat transfer image-receiving layer of a heat transfer recording system, an ink receiving layer of an ink jet recording system, a color forming layer of a pressure-sensitive copying system, etc. can be exemplified, and various commercially available pressure-sensitive adhesive sheets for recording are used. You can also

The recording layer 16 is preferable because it can display card information or individual information. Further, a transparent protective film may be further laminated to protect the recording surface after recording.

As the heat-sensitive recording method, known recording layers such as leuco type, diazo type and chelate type can be appropriately used, and recording layers capable of developing a plurality of colors can also be used. An irreversible color thermosensitive recording layer can also be used. In the case of the heat-sensitive recording method, it is preferable to form a protective layer on the recording layer. Among them, the protective layer cured by ionizing radiation (electron beam, ultraviolet ray, etc.) is preferable because it is particularly excellent in water resistance and durability. Since heat is applied during recording in the heat-sensitive recording method, it is advisable to suppress the amount of heat or use the heat-sensitive recording sheet as a display sheet, and after displaying, laminate on the surface of the heat-shrinkable substrate. In particular, JP-A-9-58134 and JP-A-9-2777.
It is preferable to employ a heat-sensitive heat-sensitive recording layer proposed in Japanese Patent Laid-Open No. 14 and Japanese Patent Application Laid-Open No. 10-86528.

As the thermal transfer recording method, known methods such as melt thermal transfer and sublimation thermal transfer can be appropriately selected and used, and an image receiving layer suitable for each of them can be adopted. In the case of this method, the contact pressure of the thermal head at the portion attached to the IC chip is higher than that at other portions, so that the recorded image is easily distorted only in that portion. Therefore, it is preferable to record by excluding the portion attached to the IC chip or to attach the previously recorded one.

The ink jet recording method is a preferable recording method because printing can be performed in a non-contact state by the printer, and printing can be performed without being influenced by surface irregularities due to a data carrier such as an IC chip. As the ink, known inks such as aqueous type, solvent type pigment type, dye type and the like can be appropriately selected. It is also possible to form a known recording layer adapted to the ink. The preferable inkjet recording method will be further described below.

As the ink receiving layer, a known receiving layer of an ink jet recording sheet can be used. Generally, an ink receiving layer (a) containing an inorganic pigment as a main component
And the ink receiving layer (b) mainly containing a water-soluble polymer.

(A) In the case of the ink receiving layer containing an inorganic pigment as a main component, examples of the inorganic pigment include zeolite, light calcium carbonate, heavy calcium carbonate, magnesium carbonate, kaolin, talc, calcium sulfate, barium sulfate, Titanium oxide, zinc oxide, zinc sulfide, zinc carbonate, satin white, aluminum silicate, diatomaceous earth, calcined clay, calcium silicate, magnesium silicate, colloidal silica, amorphous silica, aluminum hydroxide, colloidal alumina, alumina, Inorganic pigments such as hydrated alumina that are used as coating agents for general coated paper can be mentioned. As more preferable inorganic pigments, colloidal silica, amorphous silica, aluminum hydroxide,
Alumina and alumina hydrate can be mentioned. These may be used alone or in combination of two or more. Among them, as the particle size of the inorganic pigment, the particle size of the inorganic pigment is preferably about 500 nm or less in order to maintain the transparency of the ink receiving layer and to improve the resolution of the printed image.

In the ink receiving layer containing an inorganic pigment as a main component, an adhesive is used together with the inorganic pigment in order to stably fix the ink on the surface of the support. Examples of the adhesive include starch derivatives such as oxidized starch and etherified starch, cellulose derivatives such as carboxymethyl cellulose and hydroxyethyl cellulose, casein, gelatin, soybean protein, fully saponified polyvinyl alcohol, partially saponified polyvinyl alcohol, polyvinylpyrrolidone, and silicon modified. Water-based adhesive such as polyvinyl alcohol, acetoacetyl group-modified polyvinyl alcohol, styrene-maleic anhydride copolymer salt, styrene-butadiene latex, acrylic latex, polyester polyurethane latex, vinyl acetate latex, or polymethylmethacrylate. , Polyurethane resin, unsaturated polyester resin, vinyl chloride-vinyl acetate copolymer, polyvinyl butyral, alkyd resin, etc. And the like. These may be used alone or in admixture of two or more. These adhesives are used in the range of about 1 to 80 parts by mass, preferably about 5 to 50 parts by mass, relative to 100 parts by mass of the inorganic pigment.

A cationic resin may be added to the ink receiving layer for the purpose of improving the water resistance of the print recording area. Examples of the cationic resin that can be used in the ink receiving layer include polydiallylamine hydrochloride, diallylamine hydrochloride-acrylamide copolymer, diallylamine hydrochloride-sulfur dioxide copolymer, polydiallyldimethylammonium chloride, diallyldimethylammonium chloride- Acrylamide copolymer, diallyldimethylammonium chloride-sulfur dioxide copolymer,
Polyallylamine hydrochloride, allylamine hydrochloride-diallylamine hydrochloride copolymer, N-vinylacrylic amidine hydrochloride-acrylamide copolymer, epichlorohydrin-dialkylamine addition polymer, polyamide polyamine epichlorohydrin polymer, dicyandiamide -Formalin polycondensate, dicyandiamide-polyethyleneamine polycondensate, polyethyleneimine hydrochloride, poly (meth) acryloyloxyalkyltrialkylammonium chloride, poly (meth) acryloyloxyalkyltrialkylammonium chloride-acrylamide copolymer, poly ( (Meth) acrylamidoalkyltrialkylammonium chloride, poly (meth) acrylamidoalkyltrialkylammonium chloride-acrylamide copolymer Body, and the like. These may be used alone or in admixture of two or more.

The content of the cationic resin is 10% by weight of the inorganic pigment.
1 to 50 parts by weight, preferably 5 to 30 parts by weight
It is adjusted in the range of parts by mass. If the blending amount is small, it is difficult to obtain the effects of improving the print water resistance and the print density, and if the blending amount is large, the print density is lowered or the image bleeding easily occurs.
It should be noted that, when the recorded matter is quickly attached to an adherend after recording with an inkjet printer and the support and the adherend are made of a material such as plastic films or resin plates that does not allow water to pass through. Since the structure has excellent water resistance, it is not always necessary to add a cationic resin to the ink receiving layer. When the inorganic pigment has an anionic surface such as colloidal silica and amorphous silica, and the dye in the liquid ink is anionic, a cationic resin is blended in addition to the inorganic pigment and the adhesive. It is preferable to form the ink receiving layer. When the surface of the pigment is, for example, an alumina hydrate having a cationic property, it is not necessary to mix the cationic resin in the ink receiving layer.

Further, in the ink receiving layer, a pigment dispersant,
Thickener, cross-linking agent, fluidity modifier, defoaming agent, foam suppressor, release agent, foaming agent, penetrant, coloring dye, coloring pigment, fluorescent whitening agent, preservative, anti-bacterial agent, water resistance. Agents, light stabilizers such as HALS, ultraviolet absorbers and the like can be added as appropriate.

(B) In the case of the ink receiving layer containing a water-soluble polymer as a main component, examples of the water-soluble polymer include cellulose derivatives such as carboxymethyl cellulose and hydroxyethyl cellulose, casein, gelatin, partially saponified polyvinyl alcohol. , Polyvinylpyrrolidone, silicon modified polyvinyl alcohol, acetoacetyl group modified polyvinyl alcohol and the like. These may be used alone or in admixture of two or more. Even in the case of this ink receiving layer, as in the case of the ink receiving layer containing an inorganic pigment as a main component, a cationic resin, a thickener, a cross-linking agent, a fluidity modifier, a defoaming agent and a depressant are contained in the ink receiving layer. Foam,
A penetrating agent, a fluorescent whitening agent, an antiseptic agent, an antifungal agent, a light stabilizer such as HALS, an ultraviolet absorber and the like can be added as appropriate. Further, a small amount of an inorganic pigment such as colloidal silica, amorphous silica, aluminum hydroxide, alumina, and alumina hydrate may be added to such an extent that it does not cause any trouble. It is preferable that the ink receiving layer is formed by blending a cationic resin.

The ink receiving layer is formed by coating the ink receiving layer coating liquid with a bar coater, blade coater, air knife coater, roll coater, gravure coater, die coater, curtain coater, spray coater, cast coater, screen printing or the like. Then, it is formed by coating and drying on at least one surface of the support so that the coating amount after drying is about ² to 50 g / m ² . By the way, if the coating amount is less than 2 g / m ² , the recording image quality deteriorates, and
Even if it is more than 0 g / m ² , the effect of the recorded image is not particularly improved, which is uneconomical. A preferable coating amount is 5 to 30 g / m
It is about ² .

A third aspect of the invention is an IC card 20 having a structure as shown in FIG. 14, which can record on a recording layer by a printer instead of printing, so that individual IC cards having different display information can be manufactured. it can. In addition, a protective film (not shown) may be attached on the recording layer to protect the recording. It is also possible to form not only a recording layer for recording with a printer but also a magnetic recording layer (not shown). In this case, the information possessed by the IC chip and the information possessed by the magnetic recording layer serve as a highly functional IC card that prevents falsification.

The fourth aspect of the present invention is the same as the third aspect of the present invention, in which fixed information is printed 21 on the recording layer 16 of the adhesive sheet 12 in advance and the fixed information is attached to the data sheet 11, and then the recording layer 1 is formed.
6 to print individual information on the printer 6 (I)
It is a method of manufacturing a C card. IC card 23 obtained
Has a layer structure such as the card shown in FIG.

In the third aspect of the invention, when the recording sheet having the recording layer 16 is used as the adhesive sheet 12, individual IC cards having different display information can be manufactured. However, all the display information can be printed by the printer. Not something to record,
It is characterized in that common display information is previously formed on the recording layer surface of the adhesive sheet 12 before pasting by a printing machine, and individual information is printed on the recording layer 16 after pasting by a printer. By manufacturing in this order, the manufacturing speed of the IC card becomes faster, which is preferable.

A fifth aspect of the present invention is the method for manufacturing an IC card according to any one of the first to fourth aspects, wherein the sheet 9 is the printed matter 26 and the conductive antenna region 8 is formed on one side thereof. The obtained IC card 27 has a layer structure of a card as shown in FIG. 16, for example.

Printed matter 26 already printed as sheet 9
Is a feature. For example, the function of the IC card can be added to printed materials such as postcards, business cards, existing cards, admission tickets, and slips.

A sixth aspect of the present invention is the method for producing an IC card according to any one of the first to fourth aspects, wherein the sheet 9 has the recording layer 28 on the surface that does not have the conductive antenna region 8.
The obtained IC card 31 has a layer structure of a card as shown in FIG. 17, for example. As the recording layer 28, similarly to the third invention, recording layers of various known recording systems can be used.
For example, a thermal recording layer of a thermal recording system, a thermal transfer image receiving layer of a thermal transfer recording system, an ink receiving layer of an inkjet recording system, a color forming layer of a pressure sensitive copying system, etc. can be exemplified, and various commercially available recording sheets can be used. it can.

The recording layer 28 is preferable because it can display card information or individual information. In particular, the recording by the inkjet recording method is preferable because the printer can perform the printing in a non-contact state, and the printing can be performed without being affected by the unevenness of the surface due to the data carrier such as an IC chip.
Further, a transparent protective film may be further laminated to protect the recording surface after recording. In the case of the inkjet recording method, in order to prevent excess ink from penetrating or unintended water from penetrating and reaching the IC chip, a resin or the like is formed on the surface of the sheet 9 on which the conductive antenna region 8 is formed. It is preferable to provide a barrier layer or use a water-impermeable support 8 as a support for the sheet.

According to the sixth aspect of the invention, not the printing but the recording on the recording layer 28 can be performed by the printer, so that individual IC cards having different display information can be manufactured. In addition, a protective film may be attached on the recording layer to protect the recording.

In a seventh aspect of the present invention according to the sixth aspect, fixed information is printed 32 on the recording layer 28 of the sheet 9 in advance, the conductive antenna region 8 is formed on the back surface, and the data carrier 1 is laminated. This is a method of manufacturing an IC card in which individual information is printed (printed) 33 on the recording layer 28 by a printer after the adhesive sheet 12 is attached. IC card 34 obtained
Has a layer structure as shown in FIG. 18, for example.

In the seventh invention, when a recording sheet having the recording layer 28 is used as the sheet 9, it is possible to manufacture individual IC cards having different display information, but all the display information is recorded by the printer. Instead, common display information is formed in advance on the recording layer surface of the sheet 9 by a printing machine, and individual information is printed on the recording layer 28 after being attached by a printer. By manufacturing in this order, the manufacturing speed of the IC card becomes faster.

An eighth aspect of the present invention is the method for producing an IC card according to any one of the first to fourth aspects, wherein the adhesive sheet 35 is attached to the surface of the sheet 9 that does not have the conductive antenna region 8. The sticking to the sheet 9 may be performed before and after the sticking of the adhesive sheet 11 on the other surface. IC to be obtained
The cards 38, 39, 40 have a layered structure as shown in FIGS. 19, 20, and 21, for example.

Information, decoration, etc. are applied to the adhesive sheet 35 by a printing machine, a printer or the like, and the sheet 9 is attached. For example,
This is a manufacturing method suitable for a case where the sheet 9 does not look good as a card, or when the information on the surface of the sheet 9 needs to be updated, or when the customer wants to select a card design. Further, in the configuration of FIGS. 19 and 20, when both the supports of the adhesive sheet 35 and the adhesive sheet 12 are water-impermeable sheets such as synthetic papers and films, the IC card has excellent water resistance and durability. Therefore, it is a preferable form. When the support of the adhesive sheet 12, the support of the adhesive sheet 35, and the sheet 9 are made of paper, it is a preferable mode because even if the discarded card is mixed with the used paper raw material, it can be processed in the used paper recycling process. . In addition, mixed IC
The chips can be easily separated.

A ninth aspect of the present invention is the IC according to the eighth aspect, wherein the adhesive sheet 35 is an adhesive sheet 41 having at least a recording layer 42, a support 43 and an adhesive layer 44.
It is a method of manufacturing a card. The obtained IC card 45 is
For example, the layer structure is as shown in FIG. As the recording layer 42, similarly to the third invention, recording layers of various known recording systems can be used. For example, a heat-sensitive recording layer of a heat-sensitive recording system, a heat transfer image-receiving layer of a heat transfer recording system, an ink receiving layer of an ink jet recording system, a color forming layer of a pressure-sensitive copying system, etc. can be exemplified, and various commercially available pressure-sensitive adhesive sheets for recording are used. You can also

The recording layer 42 is preferable because it can display card information or individual information. In particular, the recording by the inkjet recording method is preferable because the printer can perform the printing in a non-contact state, and the printing can be performed without being affected by the unevenness of the surface due to the data carrier such as an IC chip.
Further, a transparent protective film may be further laminated to protect the recording surface after recording. The ninth invention is
Since it is possible to record on the recording layer 42 by a printer instead of printing,
It is possible to manufacture individual IC cards having different display information. In addition, a protective film may be attached on the recording layer to protect the recording.

The tenth aspect of the present invention is the same as the ninth aspect of the present invention, in which fixed information is printed 46 on the recording layer 42 of the adhesive sheet 35 in advance, and the fixed information is attached to the data sheet 11.
2 to print individual information on the printer 2 (I)
It is a method of manufacturing a C card. Obtained IC card 48
Has a layer structure as shown in FIG. 23, for example.

In the ninth invention, when the recording sheet having the recording layer 42 is used as the adhesive sheet 35, individual IC cards having different display information can be manufactured. The display information common to the adhesive sheet 4 is not recorded by the printer but common display information is previously recorded.
It is characterized in that it is formed on the recording layer surface of No. 5 by a printing machine, and individual information is printed by the printer on the recording layer 42 after pasting. By manufacturing in this order, the manufacturing speed of the IC card becomes faster.

In the present invention, the above method inventions can be combined. For example, a configuration as shown in FIG. 24 in which recording adhesive sheets are laminated on both sides is also possible.

[0072]

INDUSTRIAL APPLICABILITY The method of the present invention can be manufactured by a simple operation without using a conventional heat press device, and is suitable for manufacturing a small-scale IC card.

[Brief description of drawings]

FIG. 1 is a plan view illustrating an electrostatic coupling type data carrier used in the present invention.

FIG. 2 is a diagram for explaining a cross section taken along the line AA of FIG.

FIG. 3 is a plan view illustrating an antenna sheet on which a conductive antenna used in the present invention is formed.

FIG. 4 is a plan view illustrating a data sheet in which the data carrier of FIG. 1 is attached to the antenna sheet of FIG.

5 is a diagram for explaining a cross section taken along line BB of FIG. 4. FIG. The details of the data carrier 1 are not shown.

FIG. 6 is a cross-sectional view illustrating an adhesive sheet used in the present invention.

FIG. 7 is a sectional view illustrating an example of an IC card obtained by the first method of the invention.

FIG. 8 is a plan view of an antenna sheet illustrating an example of the shape of a conductive antenna used in the present invention.

FIG. 9 is a plan view of an antenna sheet illustrating an example of the shape of a conductive antenna used in the present invention.

FIG. 10 is a plan view of an antenna sheet illustrating an example of the shape of a conductive antenna used in the present invention.

FIG. 11 is a plan view of an antenna sheet illustrating an example of the shape of a conductive antenna used in the present invention.

FIG. 12 is a plan view of an antenna sheet illustrating an example of the shape of a conductive antenna used in the present invention.

FIG. 13 is a cross-sectional view illustrating an adhesive sheet used in the present invention.

FIG. 14 is a cross-sectional view illustrating an example of an IC card obtained by the third invention method.

FIG. 15 is a sectional view illustrating an example of an IC card obtained by the fourth invention method.

FIG. 16 is a cross-sectional view illustrating an example of an IC card obtained by the fifth invention method.

FIG. 17 is a cross-sectional view illustrating an example of an IC card obtained by the method of the sixth invention.

FIG. 18 is a sectional view illustrating an example of an IC card obtained by the seventh method of the invention.

FIG. 19 is a sectional view illustrating an example of an IC card obtained by an eighth invention method.

FIG. 20 is a cross-sectional view illustrating an example of an IC card obtained by the eighth invention method.

FIG. 21 is a cross-sectional view illustrating an example of an IC card obtained by the method of the eighth invention.

FIG. 22 is a cross-sectional view illustrating an example of an IC card obtained by the method of the ninth invention.

FIG. 23 is a cross-sectional view illustrating an example of an IC card obtained by the method of the tenth invention.

FIG. 24 is a cross-sectional view illustrating an example of an IC card obtained by the method of the present invention.

[Explanation of symbols]

1: Data carrier 2: IC chip 3: IC chip terminals 4: Anisotropic conductive paste (APC) 5: Antenna 6: Support 7: Conductive adhesive 8: Conductive antenna area 9: Sheet 10: Antenna sheet 11: Data sheet 12: Adhesive sheet 13: Adhesive sheet support 14: Adhesive layer 15: IC card 16: recording layer 17: Adhesive sheet support 18: Adhesive layer 19: Adhesive sheet for recording 20: IC card 21: Printing department 22: Recording section 23: IC card 24: Sheet 25: Printing department 26: Printed matter 27: IC card 28: Recording layer 29: Sheet 30: Recording sheet 31: IC card 32: Printing department 33: Recording unit 34: IC card 35: Adhesive sheet 36: Adhesive layer 37: Support for adhesive sheet 38, 39, 40: IC card 41: Adhesive sheet for recording 42: recording layer 43: Adhesive sheet support 44: Adhesive layer 45: IC card 46: Printing department 47: Recording section 48,49: IC card

Continued front page    F-term (reference) 2C005 MA19 MB06 NA10 PA18 PA21                 5B035 AA04 BB09 CA01 CA23                 5J045 AB06 BA01 DA09 EA07 EA13                       LA01 MA07 NA00                 5J046 AA09 AA19 AB13 PA07

Claims (10)

[Claims] 1. A data carrier having an IC chip and a pair of antennas, to which information and electric power are supplied from radio waves by an electrostatic coupling method, can be electrically connected to a separate sheet with the pair of antennas. A method for manufacturing an IC card, comprising: laminating an antenna sheet provided with a pair of conductive antenna regions to obtain a data sheet, and attaching an adhesive sheet to a surface of the data sheet having a data carrier. 2. The method of manufacturing an IC card according to claim 1, wherein the conductive antenna region is formed by a printer using conductive ink. 3. The pressure-sensitive adhesive sheet is a pressure-sensitive adhesive sheet having at least a recording layer, a support and a pressure-sensitive adhesive layer.
A method for manufacturing the described IC card. 4. The method of manufacturing an IC card according to claim 3, wherein fixed information is printed in advance on the recording layer of the pressure-sensitive adhesive sheet, the individual information is printed on the recording layer by a printer after the fixed information is attached to the data sheet. 5. The method of manufacturing an IC card according to claim 1, wherein the sheet is a printed matter, and a conductive antenna region is formed on one surface of the sheet. 6. The method of manufacturing an IC card according to claim 1, wherein the sheet has a recording layer on a surface having no conductive antenna region. 7. Fixed information is printed in advance on the recording layer of the sheet, a conductive antenna region is formed on the back surface, a data carrier is laminated, an adhesive sheet is attached, and then individual information is printed on the recording layer by a printer. 7. The method for manufacturing an IC card according to claim 6, wherein. 8. The method of manufacturing an IC card according to claim 1, wherein an adhesive sheet is attached to a surface of the sheet having no conductive antenna region. 9. The pressure-sensitive adhesive sheet according to claim 8, which is a pressure-sensitive adhesive sheet having at least a recording layer, a support and a pressure-sensitive adhesive layer.
C card manufacturing method. 10. The method of manufacturing an IC card according to claim 9, wherein the fixed information is printed in advance on the recording layer of the pressure-sensitive adhesive sheet, the information is attached to the data sheet, and the individual information is printed by the printer on the recording layer.