JPH04150011A - Composite electronic component - Google Patents

Abstract

PURPOSE:To obtain a composite electronic component which is excellent in its high-frequency characteristic by a method wherein the whole of a support body is constituted of a dielectric. CONSTITUTION:The whole of a support body 1 is constituted of a dielectric such as a porcelain or the like. Then, capacitors 2 to 4 are constituted by utilizing the permittivity of the support body 1. Then, inductors 5, 6 are buried in a coily shape, at the inside of the support body 1 composed of the dielectric, and air-core coils are formed. Thereby, a material whose high-frequency characteristic is excellent can be selected and used as different form a magnetic substance such as a ferrite or the like; the high-frequency characteristic can be enhanced.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a composite electronic component in which a capacitor and an inductor are embedded inside a support, and the high frequency characteristics are improved by constructing the entire support with a dielectric material. This makes it possible to provide superior composite electronic components.

<Prior Art> This type of composite electronic component is used as a component constituting, for example, a trap element, a low-pass filter, a bypass filter, a band-pass filter, an equalizer, or an IFT. Furthermore, in combination with an integrated circuit, it is put into practical use as a highly integrated, high-performance hybrid integrated circuit component. Conventional composite electronic components have a laminated structure in which an inductor layer and a capacitor layer are laminated and integrated, as seen in, for example, Japanese Patent Laid-Open No. 60-244097. The inductor layer is constructed by burying a conductor inside a magnetic material such as ferrite, and the capacitor layer is constructed by burying internal electrodes inside a dielectric material.

<Problems to be Solved by the Invention> As mentioned above, in conventional composite electronic components, the inductor layer was formed by burying a conductor inside a magnetic material such as ferrite. There was a problem in that it was limited by the frequency characteristics of the body. For example, in a typical structure in which the magnetic material is made of ferrite, the limit of the frequency characteristics of the ferrite is around 200 MHz. In the frequency range higher than this, the loss becomes large, so
Filter design was impossible.

Therefore, the i! The problem is to solve the above-mentioned conventional problems and provide a composite electronic component with excellent high frequency characteristics.

Means for Solving the Problems> In order to solve the above problems, the present invention provides a composite electronic component in which a capacitor and an inductor are embedded inside a support, the support being entirely made of a dielectric material. It is characterized by

<Operation> Since the support body in which the capacitor and inductor are buried is entirely composed of a dielectric material, the frequency characteristics are determined by the frequency characteristics of the dielectric material. The dielectric material can be selected from materials with excellent high frequency characteristics, unlike magnetic materials such as ferrite, as seen in dielectric ceramics often used in constituting capacitors. For this reason,
High frequency characteristics are improved.

In the present invention, a capacitor includes a capacitor element or a network thereof, and an inductor includes an inductor element or a network thereof. Further, in addition to capacitors and inductors, it can also be realized as a hybrid integrated circuit component having a resistor and an integrated circuit.

<Example> FIG. 1 is a diagram showing an example of a composite electronic component according to the present invention. In the figure, 1 is a support, 2 to 4 are capacitors, and 5
．． 6 is an inductor, and 7 to 11 are terminal electrodes. The entire support body 1 is made of a dielectric material such as porcelain. The capacitors 2 to 4 are constructed using the dielectric constant of the support 1.

The inductor 5.6 is embedded in a coil shape inside the support 1 made of a dielectric material, and forms an air-core coil. The support 1 is made of a dielectric material, and unlike magnetic materials such as ferrite, a material with excellent high frequency characteristics can be selectively used. Therefore, high frequency characteristics are improved.

FIG. 2 is a perspective view showing an example of the electrode structure of the composite electronic component according to the present invention. In the figure, the same reference numerals as in FIG. 1 indicate the same components. The capacitor 2 has an electrode 21 and an electrode 22 facing each other with a layer of the dielectric 1 interposed therebetween.
It is made up of. The electrode 21 is connected to the terminal electrode 8 by a lead-out part 211, and the electrode 22 is connected to the terminal electrode 7 by a lead-out part 221.

The capacitor 3 is connected to an electric current 8i that is opposed to the capacitor 3 through a layer of the dielectric 1.
31 and an electrode 32, and the capacitor 4 similarly consists of an electrode 41 and an electrode 42. The electrode 32 is connected to the terminal electrode 9 by the lead-out part 321, and the electrode 42 is connected to the lead-out part 421.
are connected to the terminal electrodes 11, respectively. Electrode 3
1 and the electrode 41 are commonly connected to the terminal electrode 8i10.

The inductor 5.6 is formed in a spiral shape with the winding direction reversed and displaced in the direction of the winding axis. Inductor 5
has two starting fis 501 and 502, starting fi 50
1 is connected to the terminal electrode 7, and the starting end 502 is connected to the terminal electrode 9.

Inductor 6 also has two starting ends 601 (not visible in the drawing)
, 602, the starting end 601 is connected to the terminal electrode 8, and the starting end 602 is connected to the terminal electrode 11.

The terminal ends of the inductors 5.6 are commonly connected to the terminal electrode 10.

The capacitors 2 to 4 and the inductor 5.6 are embedded inside the support 1 made of a dielectric material.

That is, the electrodes (21, 22) that constitute the capacitors 2 to 4
~(41, 42) and the spiral conductor constituting the inductor 5.6 are filled with the dielectric 1.

FIG. 3 shows a perspective view of yet another embodiment of the composite electronic component according to the present invention. In the figures, the same reference numerals as in FIGS. 1 and 2 indicate the same components. 12 is an inductor conductor, and 13 and 14 are ground conductors. The inductor conductor 12 has a meandering pattern and is arranged in a plane between the ground conductors 13 and 14. The inductor conductor 12 has -i connected between the terminal electrodes 7-9, the other end connected between the terminal electrodes 8-11, and the intermediate portion connected to the terminal electrode 10.

Therefore, in addition to the inductance due to the inductor conductor 12, distributed capacitance is obtained between the inductor conductor 12 and the ground conductor 13, 14, so that the distributed constant type composite electronic component having the circuit configuration shown in FIG. can get.

Next, a method for manufacturing the composite electronic component having the above structure will be described. Fourth
1 to 16 are diagrams showing the manufacturing process of the composite electronic component according to the present invention shown in FIGS. 1 and 2. In this example, a manufacturing process using a lamination technology known from Japanese Patent Publication No. 57-39521 etc. will be explained, including a high-precision pattern forming technology called photolithography and film formation such as sputtering, vapor deposition, plating, etc. It can also be formed through technology. When using high-precision pattern forming technology using photolithography or film forming technology such as sputtering, vapor deposition, plating, etc., it is possible to realize composite electronic components having more multilayered and finer conductor patterns.

First, as shown in FIG. 4, after printing the dielectric ceramic layer 100, as shown in FIG. A predetermined pattern is formed by a screen printing process. For screen printing of Vi121.31.41, a conductive paste is used, which is a mixture of a conductive component such as lead powder, a binder, and a solvent.

Next, as shown in FIG. 6, a dielectric ceramic layer 101 is printed to cover the electrodes 21, 31, and 41. The dielectric porcelain layer 101 is formed by applying a dielectric porcelain paste, which is a mixture of ferroelectric porcelain powder, a binder, and a solvent, by a screen printing process.

Next, as shown in FIG. 7, after printing the electrodes 22, 32, and 42 of the capacitors 2 to 4 in a predetermined pattern on the surface of the dielectric ceramic layer 101, as shown in FIG.
The dielectric ceramic layer 102 is printed so as to cover the entire electrode 22, 32, 42.

Next, as shown in FIG. 9, conductor patterns 51.61 of inductors 5.6 are printed side by side on the surface of the dielectric ceramic layer 102. The inductor conductors 51.61 are printed to form part of the spiral pattern.

Next, so as to cover about half of the conductor pattern 51.61,
Print dielectric ceramic layers 103, 104. Next, the first
As shown in Figure 1, dielectric ceramic layers 102.103.10
4, a conductor pattern 52.62 of about half a turn is printed so as to be continuous with the end of the conductor pattern 51.61.

Next, as shown in FIG.
A dielectric ceramic layer 105 is printed in the center, leaving approximately half of the outer side of the dielectric ceramic layer 105 intact. Next, as shown in Figure 13,
Continuing with the ends of the conductive patterns 52 and 62,
A substantially half-turn conductor pattern 53, 63 is printed.

The steps shown in FIGS. 10 to 13 are repeated depending on the number of turns required for the inductor 5.6. Then, as shown in FIG. 14, after covering the outside of the conductor patterns 5m and 6m with dielectric ceramic layers 10m+ and 10mx, the 15th
As shown in the figure, the final conductor patterns 5n and 6n are printed, and then the whole is covered with a dielectric ceramic layer Io as shown in FIG.
Complete by covering with n.

17 to 27 are diagrams showing the manufacturing process of the composite electronic component shown in FIG. 3. First, as shown in FIG. 17, after printing the dielectric ceramic layer 100, as shown in FIG.
The electrodes 21, 31, and 41 are formed in a predetermined pattern by a screen printing process.

Next, as shown in FIG. 19, after printing the dielectric ceramic layer 101 so as to cover the electrodes 21, 31, and 41, as shown in FIG. 4 i[22, 32, 42 are printed in a predetermined pattern, and then, as shown in FIG.
2.32.42 so as to cover the entire dielectric ceramic layer 10
Print 2.

Next, as shown in FIG. 22, the ground conductor 13 is printed on the surface of the dielectric ceramic layer 102, and then, as shown in FIG. 23, the dielectric ceramic layer 103 is printed to cover the ground conductor 13.
print.

Next, as shown in FIG. 24, after printing the meandering conductive pattern 12 on the surface of the dielectric ceramic layer 103, as shown in FIG. print. After this, as shown in FIG. 26, the ground conductor 14 is printed on the surface of the dielectric ceramic layer 104, and then, as shown in FIG.
5 to cover the ground conductor 14.

<Effects of the Invention> As described above, the composite electronic component according to the present invention is a composite electronic component that has a support and a capacitor and an inductor embedded inside the support, and the support has a structure in which the entire support is Since it is made of dielectric material, it is possible to provide composite electronic components with excellent high frequency characteristics.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the configuration of a composite electronic component according to the present invention.
2 is a perspective view showing one embodiment of the composite electronic component according to the present invention, FIG. 3 is a perspective view showing another embodiment of the composite electronic component according to the present invention, and FIGS. A diagram showing an example of the manufacturing process of the composite electronic component shown in the figure, 'fS17-2
FIG. 27 is a diagram showing an example of the manufacturing process of the composite electronic component shown in FIG. 27; 1...Support 2.3.4...Capacitor 5.6,...Inductor Fig. 1 Fig. 2 Fig. 3 Fig. 4 Fig. 5 Fig. 6 Fig. 7 Fig. 8 Fig. 9 Figure 10 Figure 11 Figure 12! 05 Figure 13 Figure 14 Figure 15 Figure 16 Figure 17 Figure 18 Figure 19 Figure 20 Figure 21 Figure 22 Figure 23 Figure 24 Figure 25 Figure 26 Figure 27

Claims (1)

[Claims] (1) An electronic component in which a capacitor and an inductor are embedded inside a support, wherein the support is entirely made of a dielectric material.