JP2009017284A - Antenna device - Google Patents

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JP2009017284A
JP2009017284A JP2007177381A JP2007177381A JP2009017284A JP 2009017284 A JP2009017284 A JP 2009017284A JP 2007177381 A JP2007177381 A JP 2007177381A JP 2007177381 A JP2007177381 A JP 2007177381A JP 2009017284 A JP2009017284 A JP 2009017284A
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conductor
antenna device
present
circuit board
antenna
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Kazutaka Iwase
和尊 岩瀬
Kunio Imai
邦夫 今井
Shusuke Suzuki
秀典 鈴木
Takaaki Koike
貴章 小池
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Panasonic Corp
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Panasonic Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an antenna device which is suitably made compact, is capable of expanding a communication distance and is also suitable for high-speed communication. <P>SOLUTION: The antenna device includes a first conductor 12, a power feeding section 13 connected to the first conductor 12, and a second conductor 14 at least a part of which is disposed away from a connection part of the first conductor 12 with the power feeding section 13 a distance such that the second conductor 14 can be capacitively coupled to the first conductor 12, wherein the first conductor 12 and the second conductor 14 are disposed in parallel while facing each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、アンテナ装置に係り、特に高速通信と通信距離の拡大を図ることができるアンテナ装置に関する。   The present invention relates to an antenna device, and more particularly to an antenna device that can achieve high-speed communication and expansion of a communication distance.

近年、各種機器には様々なアンテナ装置が開発され使用されている。このようなアンテナ装置としては、例えば特許文献1に記載のものが知られている。   In recent years, various antenna devices have been developed and used for various devices. As such an antenna device, for example, an antenna device described in Patent Document 1 is known.

このアンテナ装置101は、図7(A)に示すように、基板101上に形成されたループアンテナを構成するループ導体102と、同一基板101上に形成され一方の先端部分がループ導体102に給電接合点Qで接続する平衡不平衡変成器(バラン)103と、高周波電源104とを有している。
特許第3334079号公報
As shown in FIG. 7A, the antenna device 101 is formed on the same substrate 101 with a loop conductor 102 constituting a loop antenna formed on the substrate 101, and one tip portion feeds the loop conductor 102. A balanced / unbalanced transformer (balun) 103 connected at the junction point Q and a high-frequency power source 104 are provided.
Japanese Patent No. 3334079

しかしながら、このアンテナ装置101にあっては、図7(B)に示すように、機器に内蔵されるこのアンテナに、高周波電源104からの高周波電流を同軸ケーブル201などで給電するためには、整合を取る必要がある。そこで、前述した平衡不平衡変成器(バラン)103が必要であるので、小型化の点からまたコストの面からも、都合のよいものではなかった。   However, in this antenna device 101, as shown in FIG. 7B, in order to feed a high-frequency current from a high-frequency power source 104 to the antenna built in the equipment with a coaxial cable 201 or the like, matching is performed. Need to take. Therefore, the above-described balanced / unbalanced transformer (balun) 103 is necessary, which is not convenient from the viewpoint of miniaturization and cost.

本発明は、上記事情に鑑みてなされたもので、小型化に好適であって、通信距離を拡大させることができるとともに高速通信にも適したアンテナ装置を提供することを目的とする。   The present invention has been made in view of the above circumstances, and an object thereof is to provide an antenna device that is suitable for miniaturization, can increase the communication distance, and is also suitable for high-speed communication.

本発明のアンテナ装置は、第1の導体と、前記第1の導体に接続された給電部と、少なくとも一部が、前記第1の導体における前記給電部との接続箇所から容量結合可能な距離に離間して配設された第2の導体と、を備えるものである。   The antenna device according to the present invention includes a first conductor, a power supply unit connected to the first conductor, and a distance at least a part of which can be capacitively coupled from a connection point of the first conductor with the power supply unit. And a second conductor spaced apart from each other.

また、前記第1の導体と前記第2の導体は平行に配設するのが好ましい。   The first conductor and the second conductor are preferably arranged in parallel.

また、前記第2の導体は、前記少なくとも一部が前記第1の導体に対向して配設するのが好ましい。   Moreover, it is preferable that the at least part of the second conductor is disposed to face the first conductor.

また、前記第1の導体は、当該第1の導体を構成する第3の導体と第4の導体が交差するようにしてもよい。   Further, the first conductor may be configured such that the third conductor and the fourth conductor constituting the first conductor intersect each other.

また、前記第2の導体は、当該第1の導体を構成する第5の導体と第6の導体が交差するのが好ましい。   Moreover, it is preferable that the 5th conductor and 6th conductor which comprise the said 1st conductor cross | intersect the said 2nd conductor.

また、前記第1の導体、前記第2の導体及び前記給電部は、回路基板の同一面に形成されるようにしてもよい。   In addition, the first conductor, the second conductor, and the power feeding unit may be formed on the same surface of the circuit board.

また、前記第1の導体前記給電部は、回路基板の同一面に形成され、前記第2の導体は、前記回路基板に隣接して配設されるようにしてもよい。   The first conductor may be formed on the same surface of the circuit board, and the second conductor may be disposed adjacent to the circuit board.

また、前記第1の導体及び前記給電部は、回路基板の第1の面に形成され、前記第2の導体は、前記回路基板の第2の面に形成されるようにしてもよい。   The first conductor and the power feeding unit may be formed on a first surface of a circuit board, and the second conductor may be formed on a second surface of the circuit board.

従って、本発明によれば、第1の導体と、第1の導体に接続された給電部と、少なくとも一部が、第1の導体における給電部との接続箇所から容量結合可能な距離に離間して配設された第2の導体とを備えており、バランが不要であるため小型化に好適であって、通信距離を拡大させることができるとともに高速通信にも適したアンテナ装置を提供できる。   Therefore, according to the present invention, the first conductor, the power feeding portion connected to the first conductor, and at least a part thereof are separated from the connection portion of the first conductor with the power feeding portion by a distance capable of capacitive coupling. Therefore, it is suitable for miniaturization because it does not require a balun, and it is possible to provide an antenna device that can increase the communication distance and is also suitable for high-speed communication. .

以下、本発明の実施形態について、添付図面を参照しながら詳細に説明する。
(第1の実施形態)
図1及び図2は、本発明の第1の実施形態に係るRFIDタグのアンテナ部分を構成するアンテナ装置10を示すものであり、このアンテナ装置10は、基板を構成するプリント基板11と、このプリント基板11の一面(以下、表面11Aとよぶ)に取り付けた給電素子を構成する第1の導体12と、プリント基板11の同一面である表面11Aに設けた高周波電源からなる給電部13と、プリント基板11の反対面(以下、裏面11Bとよぶ)に設けた無給電素子を構成する第2の導体14と、GNDである地板15とを備えている。
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
(First embodiment)
1 and 2 show an antenna device 10 constituting an antenna part of an RFID tag according to a first embodiment of the present invention. The antenna device 10 includes a printed board 11 constituting a substrate, A first conductor 12 constituting a power feeding element attached to one surface of the printed circuit board 11 (hereinafter referred to as a surface 11A), a power feeding unit 13 comprising a high frequency power source provided on the surface 11A which is the same surface of the printed circuit board 11, A second conductor 14 constituting a parasitic element provided on the opposite surface (hereinafter referred to as back surface 11B) of the printed circuit board 11 and a ground plate 15 as GND are provided.

プリント基板11は、本実施形態の場合、縦(Y方向)の長さGyが55mm、横(X方向)の長さGxが85mmであって、厚さは0.8mmを有する。また、このプリント基板11には、例えば、ガラス繊維を編んだ布にエポキシ樹脂を含浸させた板であるガラスエポキシ基板をベース基材として用いており、誘電率(ε)が4.3〜4.7のものを使用している。 In the case of this embodiment, the printed board 11 has a longitudinal (Y direction) length Gy of 55 mm, a lateral (X direction) length Gx of 85 mm, and a thickness of 0.8 mm. The printed board 11 uses, for example, a glass epoxy board, which is a board in which a glass fiber knitted cloth is impregnated with an epoxy resin, as a base substrate, and has a dielectric constant (ε r ) of 4.3 to 3. 4.7 is used.

第1の導体12は、X,Y方向に折れ曲がるL字形に形成したものであって、互いに交差する第3の導体(以下、「X導体部121」とよぶ)と第4の導体(以下、「Y導体部122」とよぶ)で構成されているとともに、マイクロストリップ線路123を介して給電部13と接続されており、全長が約80mm前後となっている。即ち、この第1の導体12は、本実施形態のRFIDで使用する周波数帯がUHFの950MHzでその中心波長(λ。)315mmに対して、約1/4程度に設定されている。なお、第1の導体12及び後述する第2の導体14は、外縁部がプリント基板11の縁部からの距離Dが5mmのところに位置するように設置してあるとともに、内縁部が地板15の外縁部からの距離Eが6mmのところに位置するように配置してある。   The first conductor 12 is formed in an L shape that bends in the X and Y directions. The first conductor 12 intersects with each other (hereinafter referred to as “X conductor portion 121”) and the fourth conductor (hereinafter referred to as “X conductor portion 121”). And is connected to the power feeding unit 13 via the microstrip line 123, and has a total length of about 80 mm. That is, the first conductor 12 has a frequency band used in the RFID of the present embodiment of UHF of 950 MHz and is set to about ¼ with respect to its center wavelength (λ) of 315 mm. The first conductor 12 and the second conductor 14 to be described later are installed so that the outer edge portion is located at a distance D of 5 mm from the edge portion of the printed circuit board 11, and the inner edge portion is the ground plane 15. It arrange | positions so that the distance E from the outer edge part may be located in the place of 6 mm.

このうち、X導体部121は、一端部121Aがマイクロストリップ線路123との接続箇所となっている。本実施形態のX導体部121は、長さL1xが38mm、幅W1xが5mmの大きさであって、プリント基板11の表面11AにおいてX方向に沿って形成した銅板(又は銅箔)などからなる。 Among these, the X conductor portion 121 has a one end 121 </ b> A serving as a connection portion with the microstrip line 123. The X conductor portion 121 of the present embodiment has a length L 1x of 38 mm and a width W 1x of 5 mm, and a copper plate (or copper foil) formed along the X direction on the surface 11A of the printed board 11 or the like. Consists of.

Y導体部122は、X導体部121の一端部121Aとは反対側である他端部に一端部が接続されている。本実施形態のY導体部122は、長さL1yが46mm、幅W1yが5mmの大きさであって、プリント基板11の表面11AにおいてY方向に沿って形成した、同じく銅板(又は銅箔)などからなる。 One end portion of the Y conductor portion 122 is connected to the other end portion of the X conductor portion 121 opposite to the one end portion 121A. The Y conductor portion 122 of the present embodiment has a length L 1y of 46 mm and a width W 1y of 5 mm, and is a copper plate (or copper foil) formed along the Y direction on the surface 11A of the printed board 11. ) Etc.

マイクロストリップ線路123は、X導体部121と電気的に接続させるため、X導体部121と一体で銅板(又は銅箔)などから形成されたものがプリント基板11の表面11AにおいてY方向に沿って形成されている。なお、本実施形態のマイクロストリップ線路123は、長さCが6mm、幅Cが1.5mmに形成されている。 Since the microstrip line 123 is electrically connected to the X conductor 121, the microstrip line 123 that is integrally formed with the X conductor 121 and made of a copper plate (or copper foil) or the like along the Y direction on the surface 11 </ b> A of the printed board 11. Is formed. Incidentally, the microstrip line 123 of the present embodiment, the length C y is 6 mm, the width C x is formed in 1.5 mm.

第1の導体12は、互いに直交する状態に交差させたX導体部121及びY導体部122で構成することで、2方向の偏波を効率よく送信または受信することができる。即ち、重力の作用する方向に対してプリント基板11が起立するような配置(例えば、図1において、−Y方向を重力加速度の方向となるように起立)状態にすれば、図示外のRFIDタグリーダから放射される所定波長帯の電波に対して、水平偏波をX導体部121で垂直偏波をY導体部122で、それぞれ効率的に捉えることができる。その結果、RFIDタグリーダへ効率的に応答を送信することができる。   The first conductor 12 is configured by the X conductor portion 121 and the Y conductor portion 122 that intersect with each other so as to be orthogonal to each other, so that polarized waves in two directions can be efficiently transmitted or received. That is, when the printed circuit board 11 is arranged to stand up with respect to the direction in which gravity acts (for example, in FIG. 1, the -Y direction is set up to be the direction of gravity acceleration), an RFID tag reader (not shown) is shown. Can be efficiently captured by the X conductor portion 121 and the vertical polarization by the Y conductor portion 122, respectively. As a result, a response can be efficiently transmitted to the RFID tag reader.

第2の導体14は、X,Y方向に沿って略L字形に形成したものであって、互いに交差する第5の導体(以下、「X導体部141」とよぶ)と第6の導体(以下、「Y導体部142」とよぶ)で構成されているとともに、プリント基板11を介して第1の導体12(特に、X導体部121)と容量結合可能な距離に離間して配設されている。なお、第2の導体14も、本実施形態のRFIDで使用する波長(λ。)315mmに対して、約1/4程度の長さに形成されている。   The second conductor 14 is formed in a substantially L shape along the X and Y directions. The second conductor 14 intersects with each other with a fifth conductor (hereinafter referred to as “X conductor portion 141”) and a sixth conductor ( (Hereinafter referred to as “Y conductor portion 142”), and is disposed at a distance capable of capacitive coupling with the first conductor 12 (particularly, the X conductor portion 121) via the printed circuit board 11. ing. The second conductor 14 is also formed to have a length of about ¼ with respect to the wavelength (λ) 315 mm used in the RFID of the present embodiment.

このうち、X導体部141は、一端部寄りの定点141Aがマイクロストリップ線路123と高周波的に接続される箇所となっている。本実施形態のX導体部141は、長さL2xが45mm、幅W2xが5mmの大きさであって、プリント基板11の裏面11BにおいてX方向に沿って形成した銅板(又は銅箔)などからなる。なお、このX導体部141は、プリント基板11を挟んで第1の導体12のX導体部121と一部重合して容量結合するようになっており、本実施形態では、その容量結合部分Aを構成する重合領域Bがおよそ8mm形成されている。 Among these, the X conductor portion 141 is a place where a fixed point 141A near one end is connected to the microstrip line 123 in high frequency. The X conductor portion 141 of the present embodiment has a length L 2x of 45 mm and a width W 2x of 5 mm, and is a copper plate (or copper foil) formed along the X direction on the back surface 11B of the printed circuit board 11. Consists of. The X conductor portion 141 is partially overlapped and capacitively coupled with the X conductor portion 121 of the first conductor 12 with the printed circuit board 11 interposed therebetween. In the present embodiment, the capacitive coupling portion A The superposition | polymerization area | region B which comprises is formed about 8 mm.

Y導体部142は、X導体部141の一端部とは反対の他端部に一端部が接続されている。本実施形態のY導体部122は、長さL2yが46mm、幅W2yが5mmの大きさであって、プリント基板11の裏面11BにおいてY方向に沿って形成した、X導体部141と同じ銅板(又は銅箔)などからなる。 One end of the Y conductor 142 is connected to the other end opposite to the one end of the X conductor 141. The Y conductor portion 122 of the present embodiment has a length L 2y of 46 mm and a width W 2y of 5 mm, and is the same as the X conductor portion 141 formed along the Y direction on the back surface 11B of the printed board 11. It consists of a copper plate (or copper foil).

本発明では、容量結合部分Aを構成する重合部Bにより、第1の導体12のX導体部121と第2の導体14のX導体部141との物理的な位置のずれ(換言すれば、プリント基板11を介在させた重複)を形成することで双方のX導体間121、141間での誘導電流に位相のずれを発生させ、これによってバランの代替手段を構成させるものである。このため、重合領域Bは、電気的には容量結合部分Aを構成するものであって、本実施形態では、周波数(f)がUHF帯の950MHzを使用しているので、使用する波長帯(中心波長λ。;315mm)の約1/40程度に設定されており、前述した約8mm程度に設定している。   In the present invention, due to the overlapping portion B constituting the capacitive coupling portion A, the physical position shift between the X conductor portion 121 of the first conductor 12 and the X conductor portion 141 of the second conductor 14 (in other words, A phase shift occurs in the induced current between the two X conductors 121 and 141 by forming the overlap with the printed board 11 interposed therebetween, thereby constituting an alternative means of the balun. For this reason, the superposition | polymerization area | region B electrically comprises the capacitive coupling part A, Since the frequency (f) uses 950 MHz of UHF band in this embodiment, the wavelength band ( Is set to about 1/40 of the center wavelength λ (315 mm), and is set to about 8 mm.

次に、第1の導体12のX導体部121と第2の導体14のX導体部141との容量結合について説明する。   Next, capacitive coupling between the X conductor portion 121 of the first conductor 12 and the X conductor portion 141 of the second conductor 14 will be described.

図3は、本実施形態のアンテナ装置10の等価回路を示すものであり、これに基づいて双方のX導体部121,141間の静電容量値を理論的に算出する。
双方のX導体部121,141間には平行平板コンデンサが形成されているものとすると、平行平板コンデンサの容量Cは、一般に、次式から算出することができる。
C=ε・ε・S/d・・・(1)
但し、ε;空気の誘電率(=8.85×10−12)[F/m]、
ε;プリント基板(ガラスエポキシ基板)の誘電率[F/m]、
S;平板の面積(重合領域=(15×10−3)・(5×10−3))[m]、
d;平板間の距離(プリント基板の厚さ=0.8×10−3)[m]。
FIG. 3 shows an equivalent circuit of the antenna device 10 of the present embodiment, and based on this, the capacitance value between both the X conductor portions 121 and 141 is theoretically calculated.
Assuming that a parallel plate capacitor is formed between the X conductor portions 121 and 141, the capacitance C of the parallel plate capacitor can be generally calculated from the following equation.
C = ε r · ε 0 · S / d (1)
However, ε 0 ; dielectric constant of air (= 8.85 × 10 −12 ) [F / m],
ε r ; dielectric constant [F / m] of printed circuit board (glass epoxy board),
S: Area of flat plate (polymerization region = (15 × 10 −3 ) · (5 × 10 −3 )) [m 2 ],
d: Distance between flat plates (thickness of printed circuit board = 0.8 × 10 −3 ) [m].

ここで、ガラスエポキシ基板の誘電率εは材質厚さその他の各種パラメータに依存するので一意に決定するのが難しい。従って、本実施形態では、次のような範囲、ε=4.3〜4.7[F/m]で定義すると、X導体部121,141間の静電容量の値は、(1)式から、C=3.6〜3.9[pF]となる。 Here, the dielectric constant ε r of the glass epoxy substrate is difficult to determine uniquely because it depends on the material thickness and other various parameters. Therefore, in the present embodiment, when defined in the following range, ε r = 4.3 to 4.7 [F / m], the capacitance value between the X conductor portions 121 and 141 is (1) From the equation, C = 3.6 to 3.9 [pF].

一方、実測では、第1の導体12のX導体部121と第2の導体14のX導体部141との静電容量Cが、C=2〜5[pF]であることが確認されている。これにより、上述の理論値は、実測値と近似的に十分に一致する範囲内のものであることから、本発明のアンテナ装置10について、この等価回路(モデル)が理論的に正しいことの裏づけが得られる。従って、本実施形態のアンテナ装置10によれば、プリント基板11の同一面上に第1の導体12及び第2の導体14を設置し、かつ、これらの間を5[pF]程度のコンデンサで接続させたものと同程度に、アンテナ特性を得ることができるわけである(但し、通信用の周波数帯として950MHzのものを使用)。   On the other hand, in the actual measurement, it has been confirmed that the capacitance C between the X conductor portion 121 of the first conductor 12 and the X conductor portion 141 of the second conductor 14 is C = 2 to 5 [pF]. . As a result, the above-described theoretical value is within a range that approximately agrees with the actually measured value, and therefore, for the antenna device 10 of the present invention, it is proved that this equivalent circuit (model) is theoretically correct. Is obtained. Therefore, according to the antenna device 10 of the present embodiment, the first conductor 12 and the second conductor 14 are installed on the same surface of the printed circuit board 11, and a capacitor of about 5 [pF] is provided between them. The antenna characteristic can be obtained to the same extent as that of the connected one (however, a frequency band for communication of 950 MHz is used).

なお、両面側の地板15は、互いに図示外のスルーホールで接続されている。   Note that the base plates 15 on both sides are connected to each other through through holes not shown.

従って、本実施形態によれば、無給電素子を構成する第2の導体14のX導体部141を、給電素子を構成する第1の導体12のマイクロストリップ線路123の近傍の重合部Bでプリント基板11を介して重ね合わせることで、バランを必要とせずにアンテナ装置10側と図示外の回路側との整合を取ることができる。この結果、プリント基板11での実装容積がそのバランの分だけ削減でき、アンテナ装置10の小型化を図ることができるので、デザインの自由が高まるとともに、製造コストの削減が可能になる。   Therefore, according to the present embodiment, the X conductor portion 141 of the second conductor 14 constituting the parasitic element is printed by the overlapping portion B in the vicinity of the microstrip line 123 of the first conductor 12 constituting the feeder element. By superimposing via the substrate 11, the antenna device 10 side and the circuit side (not shown) can be matched without the need for a balun. As a result, the mounting volume on the printed circuit board 11 can be reduced by the amount of the balun, and the antenna device 10 can be reduced in size. Thus, design freedom increases and manufacturing cost can be reduced.

さらに、通信距離は、一般に、波長及び帯域幅や基板誘電率で通信距離が変動するほかに、容量結合となる重合部Bがあるとでも通信距離が増大し、延いては放射利得が向上するとともに、バランが不要なのでリアクタンス成分がなくなる分、高速通信も可能となる。換言すれば、RFIDの負荷変調(アンテナに到来した電波が反射して再び放出される量、または/及び位相を制御することで送信回路に代える)方式では、バランがある場合よりもバランがない方がスイッチ特性が良好なので、スイッチの高速応答性、つまり高速通信が実現可能になる。   Furthermore, the communication distance generally varies depending on the wavelength, bandwidth and substrate dielectric constant, and the communication distance increases even if there is a superposition part B that becomes capacitive coupling, and the radiation gain is improved. At the same time, since no balun is required, there is no reactance component, so high-speed communication is possible. In other words, RFID load modulation (the amount of radio waves arriving at the antenna is reflected and emitted again, or / and is replaced with a transmission circuit by controlling the phase) has less balun than when there is a balun. Since the switch characteristics are better, high-speed response of the switch, that is, high-speed communication can be realized.

また、双方のX導体部121、141は、前述したように、誘電体であるプリント基板15を介して容量結合させているので、誘電率による波長の短縮(誘電体の実効誘電率の二乗に反比例した波長短縮)のため、無給電素子である第2の導体14の電気長を短縮させることも可能となり、さらにアンテナ装置10の小型化を図ることができる。   Further, as described above, since both the X conductor portions 121 and 141 are capacitively coupled via the printed circuit board 15 which is a dielectric, the wavelength is shortened by the dielectric constant (the square of the effective dielectric constant of the dielectric). Therefore, the electrical length of the second conductor 14 which is a parasitic element can be shortened, and the antenna device 10 can be further downsized.

しかも、本実施形態では、それぞれ、第1の導体12及び第2の導体14のX導体部121,141とY導体部122,142とが90度の角度で交差しているので、水平偏波と垂直偏波との2種類の偏波状態の電波を確実に捉えることができるようになり、通信範囲が拡大する。即ち、本発明に係る発明者が行ったシミュレーションによれば、中心周波数が1GHzに対して、通信特性として良好なVSWR2以下を200MHz確保することができたことが確認されている。これは、従来のものに比べて、20%程度の広帯域化を実現できたことになる。   In addition, in this embodiment, the X conductor portions 121 and 141 and the Y conductor portions 122 and 142 of the first conductor 12 and the second conductor 14 intersect at an angle of 90 degrees, respectively. Thus, radio waves in two types of polarization states, ie, vertical polarization, can be reliably captured, and the communication range is expanded. That is, according to the simulation performed by the inventor according to the present invention, it has been confirmed that 200 MHz having a good VSWR 2 or less as a communication characteristic can be secured for a center frequency of 1 GHz. This means that a broadband of about 20% can be realized compared to the conventional one.

さらに、従来のようなループアンテナを使用せずに済むので、アンテナ装置10のケーシング、延いてはこのアンテナ装置10を組み込んだRFIDタグ本体の筐体(ケース)の特に薄型化を図ることもできるようになる。   Furthermore, since it is not necessary to use a loop antenna as in the prior art, the casing of the antenna device 10 and thus the casing (case) of the RFID tag main body incorporating the antenna device 10 can be particularly thinned. It becomes like this.

(第2の実施形態)
次に、本発明の第2の実施形態について説明する。なお、本実施形態において、第1の実施形態と同一部分には同一符号を付して重複説明を避ける。
図4は、本発明の第2の実施形態に係るRFIDタグのアンテナ部分を構成するアンテナ装置20を示すものであり、このアンテナ装置20では、第1の実施形態とは異なり、第1の導体21及び第2の導体22が、プリント基板11の同一面(この場合、表面11A)上で、かつ、互いに平行で、しかも互いに対向した状態に配設されている。また、このアンテナ装置20では、第1の導体21の方が第2の導体22よりも幅広で、ストレートな形状を呈している。
(Second Embodiment)
Next, a second embodiment of the present invention will be described. In the present embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals to avoid redundant description.
FIG. 4 shows an antenna device 20 constituting an antenna part of an RFID tag according to the second embodiment of the present invention. In this antenna device 20, unlike the first embodiment, a first conductor is shown. 21 and the second conductor 22 are arranged on the same surface of the printed board 11 (in this case, the surface 11A), parallel to each other, and facing each other. In the antenna device 20, the first conductor 21 is wider than the second conductor 22 and has a straight shape.

第1の導体21は、X方向の長さL1xが70mm、Y方向の長さであるL1yが20mmの大きさであって、プリント基板11の表面11AにおいてX,Y方向に沿って略L字形に形成した銅板(又は銅箔)などからなる。 The first conductor 21 has a length L 1x in the X direction of 70 mm and a length L 1y in the Y direction of 20 mm, and is substantially along the X and Y directions on the surface 11A of the printed board 11. It consists of a copper plate (or copper foil) formed in an L shape.

第2の導体22は、X,Y方向に沿って略L字形に形成したもので、X方向(X導体部221)の長さL2x及びY方向(Y導体部222)の長さであるL2yがいずれも46mmの大きさであって、プリント基板11の表面11Aに形成した銅板(又は銅箔)などからなる。なお、容量結合部分Aを構成する重合部Bの長さは、9mmである。 The second conductor 22 is formed in an approximately L shape along the X and Y directions, and has a length L 2x in the X direction (X conductor portion 221) and a length in the Y direction (Y conductor portion 222). Each of L 2y has a size of 46 mm, and is made of a copper plate (or copper foil) formed on the surface 11A of the printed circuit board 11 or the like. In addition, the length of the superposition | polymerization part B which comprises the capacitive coupling part A is 9 mm.

従って、本実施形態によれば、導体の長さは通信周波数に対応するが、本実施形態の第1の導体21及び第2の導体22では、第1の実施形態の第1の導体12及び第2の導体14の長さ(第1の導体12及び第2の導体14それぞれにおける、幅の中間点を結ぶ線分の長さ。)である157mmと同じ長さとなっているので、通信周波数もほぼ同じである。   Therefore, according to the present embodiment, the length of the conductor corresponds to the communication frequency, but in the first conductor 21 and the second conductor 22 of the present embodiment, the first conductor 12 of the first embodiment and Since it is the same length as 157 mm which is the length of the second conductor 14 (the length of the line connecting the intermediate points of the widths of the first conductor 12 and the second conductor 14 respectively), the communication frequency Is almost the same.

(第3の実施形態)
次に、本発明の第3の実施形態について説明する。なお、本実施形態において、第1の実施形態と同一部分には同一符号を付して重複説明を避ける。
(Third embodiment)
Next, a third embodiment of the present invention will be described. In the present embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals to avoid redundant description.

図5は、本発明の第3の実施形態に係るRFIDタグのアンテナ部分を構成するアンテナ装置30を示すものであり、このアンテナ装置30は、第1の実施形態とは異なり、第2の導体32がRFIDタグ本体の筐体(ケース)5の外面に貼り付けてある。なお、この筐体5は、内部に、プリント基板11と、第1の導体31と、高周波電源13と、地板15とを備えている。   FIG. 5 shows an antenna device 30 constituting an antenna portion of an RFID tag according to the third embodiment of the present invention. This antenna device 30 is different from the first embodiment in that it is a second conductor. 32 is attached to the outer surface of the casing (case) 5 of the RFID tag main body. The housing 5 includes a printed circuit board 11, a first conductor 31, a high frequency power supply 13, and a ground plane 15 inside.

第1の導体31は、第1の実施形態のものよりも若干大きい、X方向(X導体部311)の長さL1xが37mm、Y方向(Y導体部312)の長さL1yが50mmの大きさであって、プリント基板11の表面11AにおいてX,Y方向に沿って形成した銅板(又は銅箔)などからなる。また、この第1の導体31は、X導体部311と地板15との間の距離Exが5mm、Y導体部312と地板15との間の距離Eyが7mmとなっており、第1の実施形態とは若干距離が異なる。 The first conductor 31 is slightly larger than that of the first embodiment, the length L 1x in the X direction (X conductor portion 311) is 37 mm, and the length L 1y in the Y direction (Y conductor portion 312) is 50 mm. And a copper plate (or copper foil) formed along the X and Y directions on the surface 11A of the printed board 11. The first conductor 31 has a distance Ex of 5 mm between the X conductor portion 311 and the ground plane 15 and a distance Ey between the Y conductor portion 312 and the ground plane 15 of 7 mm. The distance is slightly different from the form.

第2の導体32は、X,Y方向に沿って略L字形に形成したもので、第1の実施形態のものよりも若干大きい、X方向(X導体部321)の長さL2xが46mm、Y方向(Y導体部322)の長さL2yが52mmの大きさであって、銅板(又は銅箔)などからなるものが筐体5の外側面の所定位置に貼り付けてある。また、この第2の導体31は、第1の導体31との間で、容量結合部分Aを構成する長さ9mmの重合部Bを有している。 The second conductor 32 is formed in an approximately L shape along the X and Y directions, and is slightly larger than that of the first embodiment, and the length L 2x in the X direction (X conductor portion 321) is 46 mm. The length L 2y in the Y direction (Y conductor portion 322) is 52 mm, and a copper plate (or copper foil) or the like is attached to a predetermined position on the outer surface of the housing 5. In addition, the second conductor 31 has a 9 mm-long overlapping portion B that forms a capacitive coupling portion A with the first conductor 31.

筐体5は、この内外にある第1の導体31及び第2の導体32の間での容量結合を確保できるような材料、例えば厚さtが1mm程度に薄い適宜の樹脂材料で形成されている。また、この容量結合を確実にするため、第1の導体31は、外縁部が筐体5の内面から1mm離間して、換言すれば1mmの隙間(d)を介して近接・配置されている。   The housing 5 is formed of a material that can ensure capacitive coupling between the first conductor 31 and the second conductor 32 inside and outside, for example, an appropriate resin material having a thickness t as thin as about 1 mm. Yes. In addition, in order to ensure this capacitive coupling, the first conductor 31 is disposed at an outer edge portion 1 mm away from the inner surface of the housing 5, in other words, close to and disposed via a 1 mm gap (d). .

従って、本実施形態によれば、第2の導体32がRFIDタグ本体の筐体(ケース)5の外面に貼り付けてあるので、第1、第2の実施形態のアンテナ装置10、20に比べて、さらなる小型化、または、製品の組立て後でも外側の素子を動かすことができるため製品時の調整が容易になる、といった効果が得られる。   Therefore, according to the present embodiment, since the second conductor 32 is attached to the outer surface of the casing (case) 5 of the RFID tag main body, compared with the antenna devices 10 and 20 of the first and second embodiments. As a result, the size can be further reduced, or the outer element can be moved even after the product is assembled, so that it is easy to adjust the product.

なお、本実施形態においても、第1の導体31及び第2の導体32は、第1の実施形態の第1の導体12及び第2の導体14の長さより若干大きく、また、誘電率による波長の短縮が若干少なくなっているが、素子の配置と長さを適切に設定することによって、通信周波数はほぼ同じに設定できる。また、本実施形態によれば、本実施形態の第1の導体31及び第2の導体32では、第1の実施形態の第1の導体12及び第2の導体14の面積とほぼ同じ面積を有するので、同様の利得も得られる。   Also in this embodiment, the first conductor 31 and the second conductor 32 are slightly larger than the lengths of the first conductor 12 and the second conductor 14 of the first embodiment, and the wavelength depending on the dielectric constant. The communication frequency can be set substantially the same by appropriately setting the arrangement and length of the elements. Further, according to the present embodiment, the first conductor 31 and the second conductor 32 of the present embodiment have substantially the same area as the areas of the first conductor 12 and the second conductor 14 of the first embodiment. Therefore, the same gain can be obtained.

(第4の実施形態)
次に、本発明の第4の実施形態について説明する。なお、本実施形態において、第1〜第3の実施形態と同一部分には同一符号を付して重複説明を避ける。
(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described. In the present embodiment, the same parts as those in the first to third embodiments are denoted by the same reference numerals to avoid redundant description.

図6は、本発明の第4の実施形態に係るRFIDタグのアンテナ部分を構成するアンテナ装置40を示すものであり、このアンテナ装置40は、第3の実施形態とは異なり、第2の導体42が、アンテナ装置40を収容させたRFIDタグ本体の筐体(ケース)6の内面に貼り付けてある。なお、この筐体6は、内部に、プリント基板11と、第1の導体41と、高周波電源13と、地板15とを備えている。   FIG. 6 shows an antenna device 40 constituting an antenna part of an RFID tag according to the fourth embodiment of the present invention. This antenna device 40 is different from the third embodiment in that it is a second conductor. 42 is attached to the inner surface of the housing (case) 6 of the RFID tag main body in which the antenna device 40 is accommodated. The housing 6 includes a printed board 11, a first conductor 41, a high frequency power supply 13, and a ground plane 15 inside.

第1の導体41は、第3の実施形態の第1の導体31と同一の形状であって、かつ、同一寸法に形成されており、第1〜第3の実施形態と同様、プリント基板11の一面(この場合は、上面11A)に形成されている。また、この第1の導体41は、第3の実施形態の場合と同様、X導体部411と地板15との間の距離Exが5mm、Y導体部412と地板15との間の距離Eyが7mmとなっており、第1の実施形態とは若干距離が異なる。   The first conductor 41 has the same shape as the first conductor 31 of the third embodiment and is formed with the same dimensions, and the printed circuit board 11 as in the first to third embodiments. Is formed on one surface (in this case, the upper surface 11A). In addition, the first conductor 41 has a distance Ex between the X conductor portion 411 and the ground plane 15 of 5 mm and a distance Ey between the Y conductor portion 412 and the ground plane 15 as in the case of the third embodiment. The distance is 7 mm, which is slightly different from the first embodiment.

また、第2の導体42も、第3の実施形態の第2の導体32と同一の形状であって、かつ、同一寸法に形成されているが、前述したように、プリント基板11ではなく、RFIDタグ本体の筐体(ケース)6の内面に貼り付けてある。   Also, the second conductor 42 has the same shape and the same size as the second conductor 32 of the third embodiment, but as described above, instead of the printed circuit board 11, It is affixed to the inner surface of the casing (case) 6 of the RFID tag main body.

また、第1の導体41と第2の導体42の間には、容量結合部分Aを構成する長さ8mmの重合部Bを有している。   Moreover, between the 1st conductor 41 and the 2nd conductor 42, it has the overlap part B of 8 mm in length which comprises the capacitive coupling part A. As shown in FIG.

筐体(ケース)6は、電磁シールド作用が発生することのない非導電性及び非磁性の材料で形成されており、本実施形態では適宜の樹脂材料で形成されている。   The housing (case) 6 is formed of a non-conductive and non-magnetic material that does not generate an electromagnetic shielding action, and is formed of an appropriate resin material in the present embodiment.

従って、本実施形態によれば、第2の導体42がRFIDタグ本体の筐体(ケース)6の内面に貼り付けてあるので、第1、第2の実施形態のアンテナ装置10、20に比べて、基板を小型にできるので製造コストを抑えることができるといった効果が得られる。   Therefore, according to the present embodiment, since the second conductor 42 is attached to the inner surface of the casing (case) 6 of the RFID tag main body, compared with the antenna devices 10 and 20 of the first and second embodiments. Thus, since the substrate can be made small, an effect that the manufacturing cost can be suppressed is obtained.

なお、本実施形態においても、第1の導体41及び第2の導体42は、第1の実施形態の第1の導体12及び第2の導体14の長さとほぼ同じ長さとなっているので、各部位の配置や形状の工夫によって、通信周波数はほぼ同じに設定できる。また、本実施形態によれば、本実施形態の第1の導体41及び第2の導体42は、第1の実施形態の第1の導体12及び第2の導体14の面積とほぼ同じ面積を有するので、同様の利得も得られる。   Also in the present embodiment, the first conductor 41 and the second conductor 42 have substantially the same length as the lengths of the first conductor 12 and the second conductor 14 of the first embodiment. The communication frequency can be set substantially the same by devising the arrangement and shape of each part. Further, according to the present embodiment, the first conductor 41 and the second conductor 42 of the present embodiment have substantially the same area as the areas of the first conductor 12 and the second conductor 14 of the first embodiment. Therefore, the same gain can be obtained.

なお、本発明は上述した実施形態に何ら限定されるものではなく、その要旨を逸脱しない範囲において種々の形態で実施し得るものである。即ち、例えば、給電部に非接触な第2の導体は、基板以外の場所に設置する構成であってもよく、またRFIDタグ本体の筐体(ケース)6内外のどこに置いてもよい。さらに、第1、第2の導体は、基板に取り付けた銅板、金属棒、細めの板、広めの面、又は各種の適宜形状が適用できる。また、この第1、第2の導体は、筐体の内面に貼る、外面に貼る、筐体に貼らないで置くだけ、外部の機器や部品と共用、さらには内蔵のほかの部品と共用するといった各種の対応が可能である。さらに、人体を素子として扱うような構成としてもよい。また、給電側の素子、つまり第1の導体は、図4に示すように、各種の形状、例えば、棒、板、面などに適宜に変更することができる。   The present invention is not limited to the embodiment described above, and can be implemented in various forms without departing from the gist of the present invention. That is, for example, the second conductor that is not in contact with the power feeding unit may be installed in a place other than the substrate, or may be placed anywhere inside or outside the housing (case) 6 of the RFID tag main body. Further, the first and second conductors can be applied to a copper plate, a metal rod, a thin plate, a wide surface, or various appropriate shapes attached to the substrate. In addition, the first and second conductors can be attached to the inner surface of the housing, attached to the outer surface, simply placed on the housing without being attached, and shared with external equipment and components, and also shared with other internal components. Various correspondences are possible. Furthermore, it is good also as a structure which handles a human body as an element. Further, as shown in FIG. 4, the power supply side element, that is, the first conductor can be appropriately changed to various shapes such as a bar, a plate, and a surface.

以上のように、本発明によれば、バランを必要としなくて済むので、小型化に好適であって、通信距離を拡大させることができるとともに高速通信も可能であり、RFIDタグリーダとの組み合わせで使用するICタグ(例えば、物流部門の荷札用などとして商品に取り付けて使用する)やICカードなどに適用するのに好適である。   As described above, according to the present invention, it is not necessary to use a balun. Therefore, the present invention is suitable for downsizing, can increase the communication distance and can perform high-speed communication, and can be combined with an RFID tag reader. It is suitable for application to an IC tag to be used (for example, attached to a product as a tag for a logistics department, etc.) or an IC card.

本発明の第1の実施形態に係るアンテナ装置をプリント基板の一面から見たときの状態を示す構成図である。It is a block diagram which shows a state when the antenna apparatus which concerns on the 1st Embodiment of this invention is seen from one surface of a printed circuit board. そのアンテナ装置をプリント基板の反対面から見たときの状態を示す構成図The block diagram which shows the state when the antenna device is seen from the opposite surface of the printed circuit board そのアンテナ装置の等価回路を示す説明図である。It is explanatory drawing which shows the equivalent circuit of the antenna device. 本発明の第2の実施形態に係るアンテナ装置を示すものであり、(A)はその構成図、(B)はその各要素の大きさを示す説明図である。The antenna apparatus which concerns on the 2nd Embodiment of this invention is shown, (A) is the block diagram, (B) is explanatory drawing which shows the magnitude | size of each element. 本発明の第3の実施形態に係るアンテナ装置を示すものであり、(A)はその構成図、(B)はその各要素の大きさを示す説明図である。The antenna apparatus which concerns on the 3rd Embodiment of this invention is shown, (A) is the block diagram, (B) is explanatory drawing which shows the magnitude | size of each element. 本発明の第4の実施形態に係るアンテナ装置を示すものであり、(A)はその構成図、(B)はその各要素の大きさを示す説明図The antenna apparatus which concerns on the 4th Embodiment of this invention is shown, (A) is the block diagram, (B) is explanatory drawing which shows the magnitude | size of each element. (A)は従来のアンテナ装置を示す構成図、(B)はその原理を示す説明図である。(A) is a block diagram which shows the conventional antenna apparatus, (B) is explanatory drawing which shows the principle.

符号の説明Explanation of symbols

10、20、30、40 アンテナ装置
11 プリント基板(基板)
11A 表面
11B 裏面
12、21、31、41 第1の導体(給電素子)
121 X導体部(第3の導体)
122 Y導体部(第4の導体)
123 マイクロストリップ線路
13 給電部
14、22、32、42 第2の導体(無給電素子)
141 X導体部(第5の導体)
142 Y導体部(第6の導体)
15 地板(GND)
A 容量結合部分
B 重合部
5、6 RFIDタグ本体の筐体(ケース)
10, 20, 30, 40 Antenna device 11 Printed circuit board (board)
11A Front surface 11B Back surface 12, 21, 31, 41 First conductor (feeding element)
121 X conductor (third conductor)
122 Y conductor (fourth conductor)
123 Microstrip line 13 Feed section 14, 22, 32, 42 Second conductor (parasitic element)
141 X conductor (fifth conductor)
142 Y conductor (sixth conductor)
15 Ground plate (GND)
A Capacitance coupling part B Superposition part 5, 6 Case (case) of RFID tag main body

Claims (8)

第1の導体と、
前記第1の導体に接続された給電部と、
少なくとも一部が、前記第1の導体における前記給電部との接続箇所から容量結合可能な距離に離間して配設された第2の導体と、
を備えるアンテナ装置。
A first conductor;
A power supply connected to the first conductor;
At least a portion of the second conductor disposed at a distance capable of capacitive coupling from a connection portion of the first conductor with the power feeding unit;
An antenna device comprising:
請求項1記載のアンテナ装置であって、
前記第1の導体と前記第2の導体は平行に配設される、
アンテナ装置。
The antenna device according to claim 1,
The first conductor and the second conductor are arranged in parallel;
Antenna device.
請求項2記載のアンテナ装置であって、
前記第2の導体は、前記少なくとも一部が前記第1の導体に対向して配設される、
アンテナ装置。
The antenna device according to claim 2, wherein
The second conductor is disposed so that at least a part of the second conductor faces the first conductor;
Antenna device.
請求項1から3のいずれか一項に記載のアンテナ装置であって、
前記第1の導体は、当該第1の導体を構成する第3の導体と第4の導体が交差する、
アンテナ装置。
The antenna device according to any one of claims 1 to 3,
In the first conductor, the third conductor and the fourth conductor constituting the first conductor intersect.
Antenna device.
請求項1から4のいずれか一項に記載のアンテナ装置であって、
前記第2の導体は、当該第1の導体を構成する第5の導体と第6の導体が交差する、
アンテナ装置。
The antenna device according to any one of claims 1 to 4,
In the second conductor, the fifth conductor and the sixth conductor constituting the first conductor intersect with each other.
Antenna device.
請求項1から5のいずれか一項に記載のアンテナ装置であって、
前記第1の導体、前記第2の導体及び前記給電部は、回路基板の同一面に形成される、
アンテナ装置。
The antenna device according to any one of claims 1 to 5,
The first conductor, the second conductor, and the power feeding unit are formed on the same surface of the circuit board.
Antenna device.
請求項1から5のいずれか一項に記載のアンテナ装置であって、
前記第1の導体前記給電部は、回路基板の同一面に形成され、前記第2の導体は、前記回路基板に隣接して配設される、
アンテナ装置。
The antenna device according to any one of claims 1 to 5,
The first conductor is formed on the same surface of the circuit board, and the second conductor is disposed adjacent to the circuit board;
Antenna device.
請求項1から5のいずれか一項に記載のアンテナ装置であって、
前記第1の導体及び前記給電部は、回路基板の第1の面に形成され、前記第2の導体は、前記回路基板の第2の面に形成される、
アンテナ装置。
The antenna device according to any one of claims 1 to 5,
The first conductor and the power feeding unit are formed on a first surface of a circuit board, and the second conductor is formed on a second surface of the circuit board.
Antenna device.
JP2007177381A 2007-07-05 2007-07-05 Antenna device Withdrawn JP2009017284A (en)

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