JP4541246B2 - Non-contact IC module - Google Patents

Description

  The present invention relates to a non-contact IC module including a non-contact communication body having an IC chip and an antenna arranged on one surface of the IC chip.

  In recent years, non-contact IC modules that can receive information from the outside using electromagnetic waves as a medium and transmit information to the outside, such as information recording media for RFID (Radio Frequency IDentification) applications such as non-contact IC cards, etc. Widely used in general.

  A non-contact IC label or a non-contact IC card, which is an example of a product mounted with a non-contact IC module, includes a non-contact communication body having an IC chip and an antenna electrically connected to the IC chip. When this antenna receives an electromagnetic wave from the information reading / writing device, an electromotive force is generated in the antenna by a resonance action. The IC chip is activated by this electromotive force, information in the IC chip is converted into a signal, and this signal is transmitted from the antenna. A signal transmitted from the antenna is received by the antenna of the information reading / writing device, sent to the data processing device via the controller, and data processing such as signal identification is performed.

  On the other hand, recently, for example, in order to prevent forgery of banknotes, securities, and vouchers, ribbon-like strips called threads are inserted when manufacturing sheet materials such as paper forming these banknotes and securities. The sheet material manufactured by is known. As one of the methods of using the non-contact IC module described above, by applying the non-contact IC module to such a thread, the forgery prevention effect by the thread is further enhanced, and the thread itself has an information transmission / reception function. A thread is known (Patent Document 1).

The anti-counterfeit thread described in Patent Document 1 has a limited electromotive force because the area of the antenna is limited only by the on-chip antenna formed on the IC chip, and the communication distance becomes very short. For this reason, an external antenna (a booster antenna) that is electrically connected in contact with the IC chip is provided, and a device for expanding the range in which communication is possible is incorporated.
JP 2004-139405 A

  However, in the anti-counterfeit thread described in Patent Document 1 described above, the IC chip is joined to one end of the external antenna with a conductive adhesive, so that the contact joint that functions as an electrical contact is mechanical. The strength is extremely weak. Therefore, especially when the anti-counterfeit thread is rolled into a flexible sheet material such as paper, the electrical contact between the IC chip and the external antenna is caused by the bending of the sheet material during the rolling process or the subsequent use process. There is a possibility that the external antenna may not function due to local or wide contact.

  It is also possible to eliminate the electrical contact and place the IC chip and the external antenna in a non-contact manner. However, since the thread has a very high aspect ratio, the shape of the external antenna that can be mounted is limited. Therefore, it is difficult to arrange the external antenna so that it can function effectively.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a non-contact IC module in which the function of a booster antenna is not hindered when bending or deformation occurs.

In order to achieve the above object, according to the present invention, a non-contact communication body having an IC chip and a first antenna disposed on one surface of the IC chip and circulated in a square shape, and a second antenna for a booster And a substrate on which the first antenna is placed , wherein the second antenna is connected to the first region having a narrow width in the longitudinal direction and to both ends of the first region. A second region and a third region having a width wider than the region, and the first region of the second antenna has a concave portion at a central portion in a longitudinal direction of the second antenna, and the non-inverted region is formed inside the concave portion. A contact communicator is disposed, and the recess is formed to be adjacent to and substantially parallel to the three sides of the IC chip, and the remaining one side of the IC chip is an open portion. Non-contact IC module There is provided.
In addition, according to the present invention, a non-contact communication body having an IC chip and a first antenna arranged on one surface of the IC chip and circulated in a square shape, a second antenna for a booster, and the second antenna are mounted. The second antenna has a meander-line-shaped first region and both ends of the first region in the longitudinal direction, and is wider than the first region. The second antenna comprises a wide rectangular second region and a third region, and the first region of the second antenna has a recess on three sides of a portion of the antenna at a central portion in the longitudinal direction of the second antenna, The non-contact communication body is disposed inside a recess, and the recess is adjacent to and substantially parallel to the three sides of the IC chip, and the remaining one side is an open portion with respect to the IC chip. It was characterized by Non-contact IC module is provided that.
According to such a non-contact IC module, an electrical connection can be made in a non-contact manner by an induced current between at least one side of the second antenna and at least one side of the first antenna formed on one surface of the IC chip. become. Therefore, the contactless IC module of the present invention does not require the contact-type joint provided between the second antenna and the IC chip. For example, even if it is used for a thread, a contactless electronic card, etc., it is disconnected. Therefore, the second antenna can perform highly reliable communication without losing its function.

This ensures that it is possible to increase the current density in the first region, while extending the transmission and reception distance, it is possible to send and receive secure and reliable signals.

This ensures, without changing the shape of the second antenna itself, since it is possible to increase the portion where the second antenna and the first antenna faces substantially parallel, to increase the current density, reliable and secure Signals can be sent and received.

  The first antenna and the second antenna may be arranged separately on one surface of the substrate. As a result, since only one surface side needs to be processed at the time of manufacturing, the manufacturing process can be simplified and the manufacturing cost can be suppressed and reduced.

  The first antenna and the second antenna may be arranged apart from each other in the thickness direction of the substrate. As a result, the first antenna and the second antenna can be laid out in a hierarchy corresponding to the size of the IC chip. Therefore, the optimal design of the communication capability of the first antenna by the second antenna can be achieved.

  The substrate includes a first part having a storage part for containing the IC chip, a third part arranged to face the first part, and disposed between the first part and the third part. It is sufficient that the second part is provided with a function of bonding the two. Accordingly, the interface can be set at an arbitrary depth of the substrate, and the first antenna and the second antenna can be set at arbitrary depths with respect to the interface. The optimum design of the communication capability of the first antenna can be achieved.

  The second antenna may be formed on a first portion constituting the substrate, and one surface of the second antenna and one surface of the first antenna may be substantially on the same plane. Thereby, since both can be provided in the state which becomes the nearest, it becomes possible to raise current density most. Therefore, it is possible to obtain a non-contact IC module capable of transmitting and receiving signals with high reliability while extending the transmission / reception distance.

  The radiation characteristic of the second antenna may be controlled by the depth of the recess. By expanding the depth of the recess, the current density is increased, and reliable and reliable signal transmission / reception is possible.

  The non-contact IC module is particularly preferably used as a thread. The thread is used for the purpose of preventing counterfeiting by being mixed in or mixed with paper, but a non-contact IC module can be used as a thread on which an IC chip is mounted.

  The first part may be made of paper, and the third part may be made of a film. With such a configuration, the side surface and the bottom surface of the IC chip are supported by the fiber ends of the paper. In addition, the strength of the entire non-contact IC module is increased by the film. Therefore, for example, even if it is used for a thread or a non-contact type electronic card, there is no possibility of causing an electrical failure such as disconnection, and it is excellent in strength and enables highly reliable communication.

  According to such a configuration, since at least one side of the booster antenna and at least one side of the on-chip antenna formed on one surface of the IC chip are provided in a non-contact and substantially parallel, conventionally, the antenna and the IC chip The contact-type joint portion provided between the two is not necessary, and electrical failure such as disconnection does not occur, so that the reliability can be improved. Further, since the booster antenna and the IC chip are provided in a non-contact manner, it is very efficient when the IC chip and the antenna are peeled off from the substrate or the like, such as collecting the IC chip. Furthermore, since the recess is provided in the first region of the booster antenna, the radiation characteristics can be improved and the radiation characteristics can be adjusted without changing the shape of the booster antenna itself.

  According to the non-contact IC module of the present invention, since the booster antenna is provided, the contact-type joint portion conventionally provided between the antenna and the IC chip becomes unnecessary, and an electrical failure such as disconnection occurs. Therefore, reliability can be improved. Further, since the booster antenna and the IC chip are provided in a non-contact manner, it is very efficient when the IC chip and the antenna are peeled off from the substrate or the like, such as collecting the IC chip. Furthermore, since the recess is provided in the booster antenna, the radiation characteristic can be improved and the radiation characteristic can be adjusted without changing the shape of the booster antenna itself. And, when the non-contact communication body is an on-chip antenna type, the communication distance can be greatly improved as compared to the conventional case. Is possible.

  Hereinafter, a non-contact IC module embodying the present invention will be described in detail.

  FIG. 1 is a schematic plan view showing an embodiment of a non-contact IC module according to the present invention. FIG. 2 is a perspective view of the non-contact IC module when cut along line AA in FIG. 1 and 2, reference numeral 10 is a non-contact IC module, 11 is a substrate, 12 is a non-contact communication body, 13 is an IC chip, 14 is an on-chip antenna (first antenna), and 15 is a booster antenna (second antenna). ) And 16 represent the recesses, respectively.

  The non-contact IC module 10 is schematically configured from a substrate 11, a non-contact communication body 12, and a booster antenna (second antenna) 15.

  In the non-contact IC module 10, the non-contact communication body 12 and the booster antenna 15 are provided on one surface 11 a of the substrate 11. In addition, a recess 16 is provided at the center in the longitudinal direction of the booster antenna 15 so as to be recessed perpendicularly to the longitudinal direction of the booster antenna 15 with the outer edge of the long side of the booster antenna 15 as a base end. And in the recessed part 16, the non-contact communication body 12 is distribute | arranged with the booster antenna 15 non-contact.

  The non-contact communication body 12 includes an IC chip 13 and an on-chip antenna (first antenna) 14 provided on the IC chip 13 and electrically connected to the IC chip 13. The on-chip antenna 14 is made of a conductor that is circulated in a square shape on one surface of the IC chip 13.

  The booster antenna (second antenna) 15 has a shape capable of receiving a half wavelength of an ultra-high frequency band <UHF> and a microwave band radio wave frequency (300 MHz to 30 GHz) that can be used for a non-contact IC module such as a non-contact IC card. As shown, it is provided on one surface 11 a of the substrate 11. In this embodiment, the booster antenna 15 has a pole shape. Further, the length L1 of the booster antenna 15 in the longitudinal direction L is half of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> or microwave band that can be used for a non-contact IC module such as a non-contact IC card. The length corresponds to the wavelength.

  In the longitudinal direction L, the booster antenna (second antenna) 15 includes a first region 15a having a narrow width, a second region 15b having a width wider than the first region 15a, and a second region 15b having a width wider than the first region 15a. It consists of a third region 15c. The 1st-3rd area | regions 15a-15c of such a booster antenna 15 should just be formed integrally from conductive foil.

  The recess 16 formed in the first region 15a of the booster antenna 15 is provided at a place where the current distribution in the booster antenna 15 is highest. Incidentally, a pole-shaped antenna such as the booster antenna 15 has a current distribution as shown in FIG. 3 in the longitudinal direction. That is, the pole-shaped booster antenna 15 has the highest current distribution at the center in the longitudinal direction.

  Moreover, it is preferable that the recessed part 16 formed in the 1st area | region 15a is formed in the substantially the same shape as the non-contact communication body 12 distribute | arranged to this inside. Furthermore, although the non-contact communication body 12 and the recessed part 16 are provided in non-contact, the recessed part 16 is formed so that the clearance gap between both may become as small as possible, and the clearance gap between both may become as small as possible. Thus, it is preferable to arrange the non-contact communication body 12 in the recess 16.

  The on-chip antenna (first antenna) 14 of the non-contact communication body 12 is arranged so that at least one side thereof is non-contact and substantially parallel to at least one side of the booster antenna (second antenna) 15. Even if the recess 16 is not particularly formed in the first region 15a, an on-chip antenna (first antenna) is provided for at least one side of the first region 15a that is narrower than the second region 15b and the third region 15c. It is sufficient that one side of 14 is parallel.

  Furthermore, it is preferable that the depth L2 of the recess 16 (depth with the outer edge of the long side of the booster antenna 15 as a base end) L2 is as large as possible. As the depth L2 of the recess 16 is increased, the depth L3 of the first region 15a with respect to the second region 15b and the third region 15c is narrowed. Thereby, the current density of the 1st field 15a increases. As a result, it is possible to increase the strength of the magnetic field generated in the region where the non-contact communication body 12 is disposed in the recess 16. Therefore, by adjusting the depth L2 of the recess 16, the radiation characteristics (radiation current, directivity) of the booster antenna 15 can be controlled.

  The board | substrate 11 should just be comprised from 3 layers of the 2nd part 18 which adhere | attaches the 1st part 17 and the 3rd part 19, and this 1st part 17 and the said 3rd part 19, for example. The first portion 17 is formed with a rectangular storage portion 17a that forms an extension in the depth direction of the recess 16 formed in the first region 15a of the booster antenna 15. Such a storage portion 17 a forms a space for storing the non-contact communication body 12 together with the concave portion 16 of the booster antenna 15. Note that the storage portion 17 a may be formed in a cutout shape in which one side is opened at the side portion of the substrate 11 in addition to the rectangular shape at the center of the substrate 11.

  The first part 17 is preferably formed from paper. Besides this, for example, a woven fabric, a nonwoven fabric, a mat, paper or the like made of inorganic fibers such as glass fiber and alumina fiber, or a combination thereof, polyester fiber Further, it may be a woven fabric, nonwoven fabric, mat, paper or the like made of organic fibers such as polyamide fibers, or a combination thereof, or a composite base material formed by impregnating them with a resin varnish.

  The third part 19 is preferably formed of a film, for example, a resin film. Besides this, for example, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, ethylene -Vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer system Plastic base materials such as resin base materials and polyethersulfone-based resin base materials, or mat processing, corona discharge processing, plasma processing, ultraviolet irradiation processing, electron beam irradiation processing, flame plasma processing, ozone processing, or various types of these. Select from known materials such as those with surface treatment such as adhesion treatment Used Te. Among these, an electrically insulating film or sheet made of polyethylene naphthalate, polyethylene terephthalate, or polyimide is preferably used.

  The second part 18 that joins the first part 17 and the third part 19 and forms an adhesive layer for fixing the non-contact communication body 12 by the concave part 16 and the storage part 17a is a hot melt adhesive or a thermosetting adhesive. A moisture curable adhesive, a two-component mixed curable adhesive, a photocurable adhesive, a pressure-sensitive adhesive, and the like are preferably used.

  The IC chip 13 constituting the non-contact communication body 12 is not particularly limited, and information can be transmitted in a non-contact state via an on-chip antenna 14 formed on one surface of the IC chip 13 constituting the non-contact communication body 12. Any device that can be used for RFID media such as a non-contact type IC tag, a non-contact type IC label, or a non-contact type IC card can be used as long as it can be written and read.

  The on-chip antenna (first antenna) 14 constituting the non-contact communication body 12 is formed by screen printing on a surface of the IC chip 13 in a square shape using polymer type conductive ink. Various forming methods such as those obtained by etching a conductive foil, electroplating, electrostatic plating, or metal vapor deposition can be employed.

  As the polymer type conductive ink in the present invention, for example, conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are mixed in the resin composition. The thing which was done is mentioned.

  When a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the on-chip antenna 14 at 200 ° C. or less, for example, about 100 to 150 ° C. A path through which electricity of the coating film forming the on-chip antenna 14 flows is formed when the conductive fine particles forming the coating film contact each other, and the resistance value of the coating film is on the order of 10 to 5 Ω · cm.

  Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.

  The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photo-curing polymer type conductive ink include, for example, a thermoplastic resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester polyol and isocyanate) and 60 fine conductive particles. Preferred are those containing 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combination type (however, the thermoplastic type is 50% by mass or more). Used.

  When the on-chip antenna 14 is further required to have bending resistance, a flexibility-imparting agent can be added to the polymer-type conductive ink. Examples of the flexibility imparting agent include a polyester flexibility imparting agent, an acrylic flexibility imparting agent, a urethane flexibility imparting agent, a polyvinyl acetate flexibility imparting agent, and a thermoplastic elastomer flexibility. Include a property-imparting agent, a natural rubber-based flexibility imparting agent, a synthetic rubber-based flexibility imparting agent, and a mixture of two or more thereof.

  On the other hand, examples of the conductive foil forming the on-chip antenna 14 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.

  The booster antenna 15 is formed on one surface 11a of the substrate 11, for example, one surface of the first portion 17 by screen printing in a predetermined pattern using polymer type conductive ink, or a conductive foil. Is formed by etching. When the first portion 17 is formed of paper, toner fixing using a conductive toner can be preferably used. The booster antenna 15 may be formed such that at least one side of the first region 15a is non-contact and substantially parallel to at least one side of the on-chip antenna 14 of the non-contact communication body 12, and preferably the first region 15a. A recess 16 may be formed on the surface. The booster antenna 15 may be formed by integrally forming the first region 15a, the second region 15b, and the third region 15c, but may be formed separately and electrically connected.

  Next, the operation of the non-contact IC module 10 will be described. In the non-contact IC module 10, when the booster antenna 15 receives a radio wave from an information reading / writing device (not shown), an alternating current flows along the longitudinal direction L of the booster antenna 15. Due to the alternating current flowing through the booster antenna 15, a magnetic field having a central axis in the direction in which the alternating current flows is generated around the booster antenna 15.

An induced electromotive force is generated in the on-chip antenna 14 formed on one surface of the IC chip 13 constituting the non-contact communication body 12 by a magnetic field generated around the booster antenna 15, and the IC chip is generated by the induced electromotive force. 13 is activated, information in the IC chip 13 is converted into a signal, and this signal is transmitted from the on-chip antenna 14.
A signal transmitted from the on-chip antenna 14 is transmitted via the booster antenna 15, received by the antenna of the information reading / writing device, sent to the data processing device via the controller, and data processing such as identification is performed. Done.

  As described above, in the non-contact IC module 10 of this embodiment, at least one side of the on-chip antenna 14 is arranged substantially in parallel with at least one side of the first region 15a of the booster antenna 15 in a non-contact manner. Therefore, even if the booster antenna 15 and the on-chip antenna 14 are not in contact with each other, electrical connection is maintained between them by electromagnetic induction. In particular, the first region 15a of the booster antenna 15 that is substantially parallel to at least one side of the on-chip antenna 14 is formed so that its width is narrower than the second region 15b and the third region 15c. The current density of the first region 15a is increased, and electrical conduction by electromagnetic induction is efficiently maintained between the on-chip antenna 14 and the communication characteristics (communication distance) of the non-contact communication body 12 can be improved. it can. As a result, it is possible to apply to an application in which a non-contact communication body that has conventionally been equipped with only an on-chip antenna cannot be applied.

  In addition, by adjusting the depth L2 of the recess 16, the radiation characteristics (radiation current, directivity) of the booster antenna 15 can be controlled, so that a non-contact IC module having desired communication characteristics can be easily obtained. it can. By forming the recess 16 so that its width increases in the depth direction, it is possible to further optimally control the radiation characteristics (radiation current, directivity).

  As described above, the recess 16 is formed in the first region 15a of the booster antenna 15 and has the highest current distribution. Therefore, the on-chip antenna of the non-contact communication body 12 is formed in the region where the magnetic field strength of the booster antenna 15 is the highest. 14, even if the booster antenna 15 and the non-contact communication body 12 are electrically non-contact, it is possible to use the same electromagnetic induction as that in which both are connected. The communication characteristics (communication distance) of the contact communication body 12 can be improved.

  Such a non-contact IC module 10 can be used as a thread that is inserted into paper or the like that constitutes bills, cash vouchers, or the like. For example, as shown in FIG. 4, the non-contact IC module 10 is sandwiched between the paper 31 so as to be sandwiched as an IC thread on which an IC is mounted. Alternatively, as shown in FIG. The IC module 10 may be bent and punched so that a part of the IC module 10 is exposed to the surface of the paper 31.

  When the non-contact IC module 10 is used as a thread in such a manner as to form paper such as banknotes or vouchers, the non-contact IC module 10 may be bent or subjected to great pressure during the distribution process or use. However, as described above, the booster antenna 15 and the non-contact communication body 12 are made electrically non-contact, and the electrical connection is maintained between the booster antenna 15 and the on-chip antenna 14 by electromagnetic induction. Therefore, there is no fear of disconnection of the electrical contact between the booster antenna 15 and the non-contact communication body 12 due to the stress that the electrical contact between the booster antenna and the non-contact communication body is removed due to stress.

  Next, a method for manufacturing the non-contact IC module 10 having the above-described configuration will be described. In manufacturing the non-contact IC module 10 of the present invention, first, a film 41 constituting the third portion 19 is prepared as shown in FIG. Then, an adhesive layer 42 forming the second portion 18 is formed on one surface of the film 41 by coating or the like (see FIG. 7). As shown in FIG. 8, on the adhesive layer 42, the paper 43 forming the first portion 17 is attached, and the substrate 11 on which the film 41 and the paper 43 are attached via the adhesive layer 42 is formed. The

  Next, as shown in FIG. 9, a conductor layer 44 such as a conductive foil constituting the booster antenna 15 is formed on one surface of the substrate 11, that is, one surface of the paper 43 forming the first portion 17. The conductor layer 44 is formed by, for example, printing the conductor layer 44 so that the openings 44a are formed by a screen printing method. Thereby, the conductor layer 44 in which the opening 44a is formed in advance is formed. In addition, before sticking the paper 43 which comprises the 1st part 17 to the adhesive material layer 42, the conductor layer 44 is previously formed in one surface of the paper 43, and the paper 43 in which such the conductor layer 44 was formed is used as the adhesive material layer. A procedure of attaching to 42 may be adopted.

  Subsequently, as shown in FIG. 10, at the position where the opening 44 a of the conductor layer 44 is formed, the first portion 17 is removed with the same size as the opening 44 a, and the second portion 18 is removed from the conductor layer 44. An opening 45 reaching the upper surface of the adhesive layer 42 to be formed is formed. Note that the opening 45 of the first portion 17 may be formed in a size smaller than the opening 44 a of the conductor layer 44. Such an opening 45 may be formed by, for example, a method using a laser beam or a method in which a predetermined mask pattern is formed and then etched.

  By forming such an opening 45, the conductor layer 44 is formed in the shape of the booster antenna 15 including the second region 15b, the third region 15c, and the first region 15a narrower than the second region 15b. At the same time, a recess 16 is formed in the first region 15a. Further, the paper 43 forming the first portion 17 under the conductor layer 44 forms a storage portion 17 a for storing the non-contact communication body 12 by the opening 45.

  After the opening 45 is formed, the module substrate 46 corresponding to each non-contact IC module 10 is cut along the broken line C in FIG. 10 (see FIG. 11).

  Then, as shown in FIG. 12, when the non-contact communication body 12 is inserted from the opening 45 of the module substrate 46, the non-contact communication body 12 is fixed by the adhesive layer 42 exposed at the bottom of the opening 45. The IC module 10 is completed. The non-contact communication body 12 may be disposed at the center of the module substrate 46 or may be disposed on the side portion of the module substrate 46. In the case where the non-contact communication body 12 is arranged in the center portion of the module substrate 46, the storage portion 17a may be formed as a recess having a rectangular opening in the center portion of the first portion 17. Further, when the non-contact communication body 12 is disposed on the side portion of the module substrate 46, the storage portion 17 a may be formed in a notch shape in which one side is open on the side portion of the first portion 17. Further, when the non-contact communication body 12 is inserted, the on-chip antenna 14 and the booster antenna 15 formed on one surface of the IC chip 13 constituting the non-contact communication body 12 are positioned on substantially the same plane. Is preferred.

  Next, the second manufacturing method of the non-contact IC module 10 described above will be described. In addition, the same number is attached | subjected to the member similar to the manufacturing method mentioned above. In the second manufacturing method of the non-contact IC module 10, first, as shown in FIG. 13, an adhesive layer 42 forming the second portion 18 is formed on one surface of the film 41 forming the third portion 19 by coating or the like. Further, the paper 43 constituting the first portion 17 is attached on the adhesive layer 42 to form the substrate 11 on which the film 41 and the paper 43 are attached via the adhesive layer 42.

  Next, as shown in FIG. 14, a conductor layer 44 such as a conductive foil constituting the booster antenna 15 is formed on one surface of the substrate 11, that is, one surface of the paper 43 constituting the first portion 17. For example, the conductor layer 44 may be formed by applying a paste containing a conductor or attaching a metal thin film.

  Subsequently, as shown in FIG. 15, an opening 45 reaching from the predetermined position of the conductor layer 44 to the upper surface of the adhesive layer 42 forming the second portion 18 is formed. Such an opening 45 may be formed by, for example, a method using a laser beam or a method in which a predetermined mask pattern is formed and then etched.

  By forming such an opening 45, the conductor layer 44 is formed in the shape of the booster antenna 15 including the second region 15b, the third region 15c, and the first region 15a narrower than the second region 15b. At the same time, a recess 16 is formed in the first region 15a. Further, the paper 43 forming the first portion 17 under the conductor layer 44 forms a storage portion 17 a for storing the non-contact communication body 12 by the opening 45.

  After the formation of the opening 45, the module substrate 46 corresponding to each non-contact IC module 10 is cut along the broken line C in FIG. 15, and finally the non-contact communication body 12 from the opening 45 of the module substrate 46. Is inserted, the non-contact communication body 12 is fixed by the adhesive layer 42 exposed at the bottom of the opening 45, and the non-contact IC module 10 is completed (see FIG. 16). Also in this manufacturing method, the non-contact communication body 12 may be disposed at the central portion of the module substrate 46 or may be disposed at the side portion of the module substrate 46.

  In the above-described two manufacturing methods, for example, after forming the opening 45 in at least the first portion 17 by laser light, the module substrate 46 corresponding to each non-contact IC module 10 is cut. In addition to this, it may be manufactured by a procedure of forming an opening at least in the first part after first cutting into individual module substrates, and the order of each step in the manufacturing method is not limited. .

  In the above-described embodiment, the non-contact IC module 10 in which the non-contact communication body 12 and the booster antenna 15 are provided on the one surface 11a of the substrate 11 is illustrated. However, the non-contact IC module of the present invention is not limited thereto. It is not limited. In the non-contact IC module of the present invention, a thin substrate is used, the surface of the substrate opposite to the surface where the booster antenna is disposed, and the position facing the recess of the booster antenna A non-contact communication body may be arranged. Even in the non-contact IC module having such a configuration, the same effect as the above-described embodiment can be obtained.

  Moreover, in this embodiment, although the pole-shaped antenna was illustrated as the booster antenna (2nd antenna) 15, the non-contact IC module of this invention is not limited to this. In the non-contact IC module of the present invention, the length of the booster antenna in the longitudinal direction is a half-wavelength of a radio wave frequency (300 MHz to 30 GHz) of an ultra-high frequency band <UHF> or a microwave band that can be used for the non-contact IC module. The shape of the booster antenna may be any as long as the concave portion is provided at the highest current distribution in the booster antenna.

  In the non-contact IC module of the present invention, the booster antenna (second antenna) may have, for example, a shape as shown in FIG. 17 or a shape as shown in FIG.

  The booster antenna 20 shown in FIG. 17 has a bow shape, and a recess 21 is provided at the center in the longitudinal direction. As shown in FIG. 18, the booster antenna 20 has a current distribution such that the current distribution becomes the highest in the central portion in the longitudinal direction, that is, in the region where the recess 21 is provided.

  Further, the booster antenna 22 shown in FIG. 19 has a shape in which two trapezoids having different shapes are connected to each other, and a recess 23 is provided in a region closer to the end than the central portion in the longitudinal direction. As shown in FIG. 20, the booster antenna 22 has a current distribution such that the current distribution is highest in a region closer to the end than the center, that is, a region where the recess 23 is provided.

  In addition, as a shape of the booster antenna (second antenna), for example, as illustrated in FIG. 21, the first region 41 a of the booster antenna (second antenna) 41 is not a recess, The one side of the on-chip antenna (first antenna) 43 formed on one surface of the IC chip 42 is non-contact and substantially parallel, and the second region 41b and the third region 41c of the booster antenna 41 are the first ones. The shape may be wider than the one region 41a.

  In addition, for example, as shown in FIG. 22, a first area 45a having a shape called a meander line, and a rectangular second area 45b and a third area 45c connected to the first area 45a of the meander line are included. It may be a booster antenna (second antenna) 45 having a shape. In such a booster antenna (second antenna) 45, the IC chip 46 is arranged in a form in which the on-chip antenna (first antenna) 47 is surrounded by one of the recesses forming the meander line.

  Further, for example, as shown in FIG. 23, a booster antenna (second antenna) 48 having a shape in which the second region 48b and the third region 48c are formed asymmetrically and the first region 48a is formed by meander lines. There may be. In such an embodiment, the IC chip 51 on which the on-chip antenna (first antenna) 49 is formed may be arranged closer to the third region 48 c side than the center of the substrate 50.

  In the non-contact IC module of the present invention, various forms can be adopted for the formation position of the booster antenna (second antenna) in the thickness direction of the substrate. For example, in the non-contact IC module 61 shown in FIG. 24, a booster antenna (second antenna) 66 is formed between the first part 63 and the third part 65 of the substrate 62. The booster antenna (second antenna) 66 is formed on the one surface (lower surface) side of the first portion 63 made of, for example, paper, and has a shape facing the third portion 65 via the second portion 64 that is an adhesive layer. It is made. The on-chip antenna (first antenna) is formed on the second portion 64 side of the IC chip 68, and the on-chip antenna (first antenna) and the booster antenna (second antenna) 66 are substantially flush with each other.

  Further, for example, in the non-contact IC module 71 shown in FIG. 25, the booster antenna (second antenna) 76 is formed on the one surface (upper surface) side of the third portion 73 formed of, for example, a film and is an adhesive layer. A shape facing the first part 75 through the two parts 74 is formed. Moreover, it is distribute | arranged to the 1st part 75 side of IC chip 78 in which the on-chip antenna (1st antenna) was formed. Also in this embodiment, the on-chip antenna (first antenna) is formed on the second portion 74 side of the IC chip 78, and the on-chip antenna (first antenna) and the booster antenna (second antenna) 76 are facing each other. The plane is substantially the same.

  In the non-contact IC module 81 shown in FIG. 26, the booster antenna (second antenna) 86 is formed on one surface (outer surface) side of the third portion 83 formed of, for example, a film. The on-chip antenna (first antenna) is formed on the second portion 84 side of the IC chip 88, and the on-chip antenna (first antenna) and the booster antenna (second antenna) 86 are separated from each other in the thickness direction. Has been.

  The non-contact IC module of the present invention can be applied not only to logistics or book management, but also to threads used for preventing counterfeiting of banknotes, securities, and vouchers.

1 is a schematic plan view showing an embodiment of a non-contact IC module according to the present invention. FIG. 2 is a cutaway perspective view of the non-contact IC module of FIG. 1. It is a graph which shows the electric current distribution of the antenna for boosters. It is sectional drawing which shows the example of application as a thread | sled of a non-contact IC module. It is sectional drawing which shows the example of application as a thread | sled of a non-contact IC module. It is a perspective view which shows 1 process of the manufacturing method of a non-contact IC module. It is a perspective view which shows 1 process of the manufacturing method of a non-contact IC module. It is a perspective view which shows 1 process of the manufacturing method of a non-contact IC module. It is a perspective view which shows 1 process of the manufacturing method of a non-contact IC module. It is a perspective view which shows 1 process of the manufacturing method of a non-contact IC module. It is a perspective view which shows 1 process of the manufacturing method of a non-contact IC module. It is a perspective view which shows 1 process of the manufacturing method of a non-contact IC module. It is a perspective view which shows 1 process of the 2nd manufacturing method of a non-contact IC module. It is a perspective view which shows 1 process of the 2nd manufacturing method of a non-contact IC module. It is a perspective view which shows 1 process of the 2nd manufacturing method of a non-contact IC module. It is a perspective view which shows 1 process of the 2nd manufacturing method of a non-contact IC module. It is a schematic plan view which shows the other example of the antenna for boosters. It is a graph which shows the electric current distribution of the antenna for boosters. It is a schematic plan view which shows the other example of the antenna for boosters. It is a graph which shows the electric current distribution of the antenna for boosters. It is a schematic plan view which shows the other example of the antenna for boosters. It is a schematic plan view which shows the other example of the antenna for boosters. It is a schematic plan view which shows the other example of the antenna for boosters. It is a perspective view which shows the other structural example of a non-contact IC module. It is a perspective view which shows the other structural example of a non-contact IC module. It is a perspective view which shows the other structural example of a non-contact IC module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Non-contact IC module, 11 ... Board | substrate, 12 ... Non-contact communication body, 13 ... IC chip, 14 ... On-chip antenna (1st antenna), 15, 20, 22, ..Booster antenna (second antenna), 15a ... first region, 15b ... second region, 15c ... third region, 16, 21, 23 ... concave, 17 ... first Part, 17a ... storage part, 18 ... second part, 19 ... third part.

Claims (9)

Non-contact IC comprising an IC chip and a non-contact communication body having a first antenna that is arranged on one surface of the IC chip and circulates in a square shape, a second antenna for a booster, and a substrate on which the second antenna is placed. A module ,
The second antenna includes a first region having a narrow width in the longitudinal direction, and a second region and a third region having a width wider than that of the first region.
The first area of the second antenna has a recess at the center in the longitudinal direction of the second antenna, the non-contact communication body is disposed inside the recess, and the recess has three sides of the IC chip. A non-contact IC module , which is adjacent to and substantially parallel to the IC chip, and is formed so that the remaining one side is an open portion with respect to the IC chip . Non-contact IC comprising an IC chip and a non-contact communication body having a first antenna that is arranged on one surface of the IC chip and circulates in a square shape, a second antenna for a booster, and a substrate on which the second antenna is placed. A module,
The second antenna includes, in the longitudinal direction, a first region having a meander line shape, and a rectangular second region and a third region that are connected to both ends of the first region and are wider than the first region. ,
The first region of the second antenna has a concave portion on three sides of the antenna at a central portion in the longitudinal direction of the second antenna, and the non-contact communication body is disposed inside the concave portion, The non-contact IC module, wherein the recess is formed so as to be adjacent to the three sides of the IC chip substantially parallel to each other and the remaining one side to be an open portion with respect to the IC chip. 3. The contactless IC module according to claim 1, wherein the first antenna and the second antenna are spaced apart from each other on one surface of the substrate. 3. The contactless IC module according to claim 1, wherein the first antenna and the second antenna are arranged apart from each other in a thickness direction of the substrate. The substrate includes a first part having a storage part for containing the IC chip, a third part arranged to face the first part, and disposed between the first part and the third part. It is, non-contact IC module according to any one of claims 1 to 3, characterized in that it consists of second part having a function of bonding the two. The said 2nd antenna is formed on the 1st part which comprises the said board | substrate, The 1st surface of the said 2nd antenna and the 1st surface of the said 1st antenna have comprised the substantially same plane, The Claim 5 characterized by the above-mentioned. The non-contact IC module described. Contactless IC module according to claim 1 or 2, wherein the depth of the recess, the radiation characteristics of the booster antenna is characterized by comprising a controlled. The contactless IC module, the contactless IC module according to any one of claims 1 to 7, characterized by being used as a thread. 6. The non-contact IC module according to claim 5 , wherein the first part is made of paper, and the third part is made of a film.

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