JP4106673B2 - Antenna device using coil unit, printed circuit board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an antenna device and a printed circuit board using a coil unit that can be used particularly suitably for a small communication device, a non-contact type IC card, and the like.
[0002]
[Prior art]
A non-contact type IC card incorporates a coiled antenna that matches the operating frequency.
[0003]
The conventional antenna is formed in a two-dimensional spiral along the outer periphery of the IC card, and can supply power for operation to the IC card and transmit / receive a carrier wave for information transmission.
[0004]
[Problems to be solved by the invention]
According to such a conventional technique, since the coil is simply formed in two dimensions, there is a problem that it is difficult to realize a high inductance with a small pattern size and circuit design is often difficult.
[0005]
Therefore, in view of the problems of the prior art, an object of the present invention is to easily realize a necessary high inductance with a minimum pattern size by forming a coil on each of a plurality of substrates to be laminated. An object of the present invention is to provide an antenna device and a printed circuit board using a coil unit.
[0006]
[Means for Solving the Problems]
The configuration of the first invention according to this application for achieving the above object (referring to the invention according to claim 1, the same applies hereinafter) is formed by arranging a plurality of coil units on a substrate, and each coil unit is laminated. The coils to be formed on each of the plurality of substrates are connected in series so that the direction of magnetic field generation is the same direction, and the coil unit is connected to the electronic module with one of the main elements as the main element, and all the other are connected to the electronic module. The gist is to make the sub-element not to be connected.
[0008]
The configuration of the second invention (referring to the invention according to claim 3, hereinafter the same) includes a plurality of coil units, an IC module that can be connected to each coil unit and can be expanded to the number of coil units, and each coil unit. The gist of the present invention is to include a coupling coil coupled to the communication circuit of the electronic module and a board on which the coil unit, the IC module, and the coupling coil are mounted.
[0009]
In addition, each coil unit can connect in series the coil formed in each of the several base material to laminate | stack so that the generation | occurrence | production direction of a magnetic field may become the same direction.
[0010]
In the first and second inventions, the substrate may be formed of a base material.
[0011]
[Action]
According to the configuration of the first invention, the coils of each coil unit are formed on each of the base materials to be laminated, and are connected in series so that the magnetic field generation direction is the same direction. Therefore, each coil interlaces with the magnetic flux from the coil on the other base material on each base material, and as a whole, the required high inductance can be easily realized. The coil unit can be suitably used as a highly sensitive coiled antenna, and can also be used as a general inductance element, transformer element, or the like. However, the base material here means any insulating plate, insulating film, insulating sheet or the like including a printed circuit board, and the material of the base material is ceramics or any plastic resin including an epoxy resin. Mica, glass, etc. can be used. On the other hand, a coil can be formed with respect to a base material by methods, such as printing, an etching, and vapor deposition, by the arbitrary conductive materials containing a metal.
[0012]
By forming the coil in a two-dimensional spiral shape, the forming process can be simplified, and the entire manufacturing cost can be reduced.
[0013]
When a protective material is provided on a coil that is exposed to the outside, the protective material mechanically protects the coil and can effectively prevent a coil disconnection accident, oxidation, insulation deterioration, and the like.
[0014]
Further, by arranging a plurality of coil units on a substrate and using one as a main element, all the others can be used as sub-elements. That is, the main element operates as a radiator element, and the sub-element operates as a director element or a reflector element, so that a high-performance array antenna can be formed as a whole.
[0015]
According to the configuration of the second invention, each coil unit can operate as an antenna of the IC module by being connected to the IC module. Therefore, the IC module can supply power for operation by an external radio wave or an AC magnetic field via the coil unit, and can transmit and receive data to and from an external device. No separate wiring is required for each IC module.
[0016]
In the first and second inventions, the substrate may be formed of a base material of the coil unit or may be formed of an insulating material different from the base material of the coil unit. According to the former, the substrate can be formed simultaneously with the formation of the coil unit, and the entire manufacturing process can be remarkably simplified.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0018]
The coil unit 10 includes a plurality of base materials 11, 11... To be stacked and coils 12, 12... Formed on the base materials 11, 11.
[0019]
The base materials 11, 11... Are each formed of an appropriate insulating material. An IC module 15 including a communication circuit, a microprocessor, a writable nonvolatile memory, and the like is mounted on the upper surface of the uppermost base material 11, and lines 15 a and 15 b to be drawn out from the IC module 15 are formed. The coils 12, 12... Are formed on the lower surface of each base material 11 in a two-dimensional spiral shape.
[0020]
The uppermost coil 12 has an outer peripheral end connected to one line 15a via a connection point 11a of the uppermost base material 11, and is formed counterclockwise from the outer peripheral end. The inner peripheral end is connected to the inner peripheral end of the intermediate layer coil 12 via the connection point 11b. Further, the intermediate layer coil 12 is formed counterclockwise from the inner peripheral end, and the outer peripheral end is connected to the outer peripheral end of the lowermost layer coil 12 through the connection point 11 c of the lowermost layer base material 11. Further, the lowermost layer coil 12 is formed counterclockwise from the outer peripheral end, and the connection point 11d of the lowermost layer base material 11, the connection point 11e of the intermediate layer base material 11, and the connection point of the uppermost layer base material 11 The inner peripheral end is connected to the other line 15b through 11f. Each connection point 11i (i = a, b...) Is formed so as to penetrate each base material 11 up and down.
[0021]
Therefore, the coils 12, 12... Formed on the lower surface of each base material 11 are connected in series by the current from the IC module 15 so that the magnetic field generation direction is the same direction. The formation area of each coil 12, the number of turns, and the number of stacked base materials 11, 11... Can be arbitrarily set according to the required inductance of the coil unit 10. The winding direction and connection form of each coil 12 may be any form other than that shown in the drawing as long as the magnetic field generation direction from each coil 12 is the same direction.
[0022]
A protective material 13 is provided on the lowermost coil 12 exposed to the outside (two-dot chain line in FIG. 2). The protective material 13 can mechanically protect the lowermost coil 12. However, the coils 12, 12... May be formed on the upper surface of each base material 11, and the protective material 13 at this time is provided on the uppermost coil 12 exposed to the outside. The protective material 13 may be formed of another base material 11.
[0023]
Such a coil unit 10 can be compactly incorporated into a small communication device, an IC card or the like and used as an antenna for transmission and reception. In the coil unit 10, the coils 12, 12... Operate as an integrated coil, resonate with external radio waves together with a capacitor (not shown), and can supply operating power to the IC module 15. Further, the IC module 15 can realize a necessary data exchange function with an external communication device via the coil unit 10.
[0024]
In the above description, the external radio wave applied to the coil unit 10 may be replaced with an appropriate AC magnetic field. Further, instead of mounting the IC module 15 on the substrate 11, the connection points 11a and 11f may be drawn out and connected to an external electronic module. The coil unit 10 can be widely used as a general inductance element, transformer element, etc., in addition to being used as a transmission / reception antenna.
[0025]
[Other embodiments]
The coil units 10 shown in FIGS. 1 and 2 may be arranged on a substrate 21 to form an antenna device (FIG. 3).
[0026]
On the upper surface of the substrate 21, a plurality of coil units 10, 10... Are mounted in a predetermined arrangement. Each of the coil units 10, 10... Has one of the main elements and all the other sub-elements. The coil unit 10 as the main element is drawn to the outside of the substrate 21 through a variable capacitance type capacitor C1 at one end, and the capacitors C10 are combined with the coil units 10, 10. Yes. Therefore, the coil unit 10 as the main element operates as a radiator element, and the coil units 10, 10... As the sub elements operate as a director element or a reflector element, thereby forming an array antenna as a whole. .
[0027]
In FIG. 3, an electronic module connected to the coil unit 10 as a main element may be mounted on the substrate 21 in accordance with FIG. 1.
[0028]
The coil units 10, 10... Mounted on the substrate 21 can be connected to the IC module 35 (FIG. 4), respectively, and may form an integrated printed circuit board as a whole.
[0029]
An electronic module 30 including an arithmetic unit 31 and a communication circuit 32 is mounted on the substrate 21. The arithmetic unit 31 is bidirectionally connected to the communication circuit 32, and a coupling coil 33 formed on the substrate 21 is connected to the communication circuit 32 via a capacitor C3. The arithmetic unit 31 and the communication circuit 32 are supplied with power by the battery B. Each IC module 35 includes a writable nonvolatile memory 35 a and a communication circuit 35 b and is connected to the coil unit 10.
[0030]
Therefore, the arithmetic unit 31 supplies power for operation to each IC module 35 via the communication circuit 32, the coupling coil 33, the coil units 10, 10... An exchange function can be realized. This is because the coupling coil 33 is electromagnetically or magnetically coupled to each coil unit 10, and the arithmetic unit 31 can communicate with each IC module 35 individually via a radio wave or an alternating magnetic field. .
[0031]
The IC module 35 can be easily connected to each coil unit 10, and therefore, the substrate 21 can be easily added with the IC module 35 as necessary (two-dot chain line in FIG. 4). That is, by providing the necessary number of coil units 10, 10... In advance, the substrate 21 can arbitrarily add IC modules 35, 35. However, an arbitrary number of coil units 10, 10... Can be mounted on the substrate 21 irrespective of FIG.
[0032]
3 and 4, the coil units 10, 10... May be formed by a common base material 11, 11... And the substrate 21 may be formed integrally with the coil units 10, 10. That is, the substrate 21 can be formed by the common base materials 11, 11. In FIG. 4, all or a part of the arithmetic unit 31, the communication circuit 32, and the capacitor C <b> 3 may be disposed outside the substrate 21.
[0033]
Further, the substrate 21 in FIG. 1, the substrate 21 in FIG. 3, and FIG. 4 can further increase the inductance of each coil unit 10 by means of mixing and embedding a high magnetic material such as ferrite. Can do.
[0034]
【The invention's effect】
As described above, in the coil units of the first and second inventions according to this application, coils are formed on each of a plurality of base materials to be laminated, and the coils are connected in series so that the magnetic field generation direction is the same direction. By connecting, it can be operated as an integral coil as a whole, so that the required high inductance can be easily realized with a minimum pattern size.
[0035]
Therefore, according to the first and second inventions, by using such a coil unit, an antenna device as a high-performance array antenna or a printed circuit board that does not require individual wiring for each IC module is formed. can do.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a coil unit. FIG. 2 is an enlarged cross-sectional view corresponding to the line XX in FIG. 1. FIG. 3 is a plan view of a use state showing another embodiment (1).
FIG. 4 is a plan view of a use state showing another embodiment (2).
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Coil unit 11 ... Base material 12 ... Coil 13 ... Protective material 21 ... Board | substrate 35 ... IC module

Claims (5)

The multiple coil units will be arranged on a substrate, wherein each coil unit are connected in series coils forming each of the plurality of substrates to be laminated as the generating direction of the magnetic field is in the same direction, the coil unit, an antenna apparatus characterized by either connected to the electronic module as a main element, the secondary element is not connected to any other electronic module. The substrate antenna device according to claim 1, wherein the formed by the substrate. A plurality of coil units , an IC module that can be connected to each of the coil units and can be expanded up to the number of the coil units, a coupling coil that is coupled to each coil unit and is connected to a communication circuit of an electronic module, and the coil A printed circuit board comprising a unit, an IC module, and a board on which a coupling coil is mounted . 4. The printed circuit board according to claim 3, wherein each of the coil units is connected in series with a coil formed on each of a plurality of base materials to be laminated so that a magnetic field is generated in the same direction. The printed circuit board according to claim 4 , wherein the substrate is formed of the base material.

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