KR102062402B1 - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR102062402B1 KR102062402B1 KR1020120136435A KR20120136435A KR102062402B1 KR 102062402 B1 KR102062402 B1 KR 102062402B1 KR 1020120136435 A KR1020120136435 A KR 1020120136435A KR 20120136435 A KR20120136435 A KR 20120136435A KR 102062402 B1 KR102062402 B1 KR 102062402B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- conductive film
- oxide semiconductor
- insulating film
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/405—Orientations of crystalline planes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/471—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having different architectures, e.g. having both top-gate and bottom-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
Landscapes
- Thin Film Transistor (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011263867 | 2011-12-01 | ||
| JPJP-P-2011-263867 | 2011-12-01 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190173017A Division KR102171235B1 (ko) | 2011-12-01 | 2019-12-23 | 반도체 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20130061637A KR20130061637A (ko) | 2013-06-11 |
| KR102062402B1 true KR102062402B1 (ko) | 2020-01-03 |
Family
ID=48523364
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020120136435A Active KR102062402B1 (ko) | 2011-12-01 | 2012-11-28 | 반도체 장치 |
| KR1020190173017A Active KR102171235B1 (ko) | 2011-12-01 | 2019-12-23 | 반도체 장치 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190173017A Active KR102171235B1 (ko) | 2011-12-01 | 2019-12-23 | 반도체 장치 |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US8981367B2 (enExample) |
| JP (2) | JP6222919B2 (enExample) |
| KR (2) | KR102062402B1 (enExample) |
Families Citing this family (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8981367B2 (en) | 2011-12-01 | 2015-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US10002968B2 (en) | 2011-12-14 | 2018-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the same |
| US8907392B2 (en) | 2011-12-22 | 2014-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device including stacked sub memory cells |
| US8704221B2 (en) | 2011-12-23 | 2014-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP6053490B2 (ja) | 2011-12-23 | 2016-12-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US9006024B2 (en) | 2012-04-25 | 2015-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2014045175A (ja) | 2012-08-02 | 2014-03-13 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| KR102222344B1 (ko) | 2013-05-02 | 2021-03-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN105190902B (zh) | 2013-05-09 | 2019-01-29 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
| TWI618058B (zh) | 2013-05-16 | 2018-03-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| US10529740B2 (en) * | 2013-07-25 | 2020-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including semiconductor layer and conductive layer |
| WO2015060133A1 (en) * | 2013-10-22 | 2015-04-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9455349B2 (en) | 2013-10-22 | 2016-09-27 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor thin film transistor with reduced impurity diffusion |
| JP6180908B2 (ja) * | 2013-12-06 | 2017-08-16 | 富士フイルム株式会社 | 金属酸化物半導体膜、薄膜トランジスタ、表示装置、イメージセンサ及びx線センサ |
| JP6506545B2 (ja) | 2013-12-27 | 2019-04-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2015097593A1 (en) * | 2013-12-27 | 2015-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9653611B2 (en) | 2014-03-07 | 2017-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| TWI767772B (zh) | 2014-04-10 | 2022-06-11 | 日商半導體能源研究所股份有限公司 | 記憶體裝置及半導體裝置 |
| CN105097793B (zh) * | 2014-04-22 | 2018-03-16 | 中芯国际集成电路制造(北京)有限公司 | 一种集成电路的设计方法和集成电路 |
| WO2015170220A1 (en) | 2014-05-09 | 2015-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and electronic device |
| TWI595669B (zh) * | 2014-05-19 | 2017-08-11 | 群創光電股份有限公司 | 半導體結構、顯示面板及其控制方法 |
| CN105097805B (zh) * | 2014-05-19 | 2018-04-27 | 群创光电股份有限公司 | 半导体结构及显示面板 |
| US9831238B2 (en) | 2014-05-30 | 2017-11-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including insulating film having opening portion and conductive film in the opening portion |
| DE112014006711B4 (de) * | 2014-05-30 | 2021-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung, Herstellungsverfahren dafür und elektronische Vorrichtung |
| US9455337B2 (en) * | 2014-06-18 | 2016-09-27 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| CN107004722A (zh) | 2014-12-10 | 2017-08-01 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
| TWI732383B (zh) | 2015-02-06 | 2021-07-01 | 日商半導體能源研究所股份有限公司 | 裝置及其製造方法以及電子裝置 |
| US9653613B2 (en) * | 2015-02-27 | 2017-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP6681117B2 (ja) | 2015-03-13 | 2020-04-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR102582523B1 (ko) | 2015-03-19 | 2023-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 전자 기기 |
| JP2016225614A (ja) | 2015-05-26 | 2016-12-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP6583812B2 (ja) * | 2015-06-24 | 2019-10-02 | 国立研究開発法人物質・材料研究機構 | 多層構成の薄膜トランジスタの製造方法 |
| US10985278B2 (en) | 2015-07-21 | 2021-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US9847406B2 (en) | 2015-08-27 | 2017-12-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, storage device, resistor circuit, display device, and electronic device |
| US9741400B2 (en) | 2015-11-05 | 2017-08-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, memory device, electronic device, and method for operating the semiconductor device |
| JP6645160B2 (ja) * | 2015-12-11 | 2020-02-12 | 三菱電機株式会社 | 表示装置用基板およびその製造方法ならびに表示装置およびその製造方法 |
| JP6811084B2 (ja) | 2015-12-18 | 2021-01-13 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2017115214A1 (en) | 2015-12-28 | 2017-07-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
| US9887010B2 (en) | 2016-01-21 | 2018-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, memory device, and driving method thereof |
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| US9905579B2 (en) | 2016-03-18 | 2018-02-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
| JP6668455B2 (ja) | 2016-04-01 | 2020-03-18 | 株式会社半導体エネルギー研究所 | 酸化物半導体膜の作製方法 |
| CN105633101A (zh) * | 2016-04-01 | 2016-06-01 | 京东方科技集团股份有限公司 | Tft阵列基板及其制造方法、显示装置 |
| JP6895794B2 (ja) | 2016-04-27 | 2021-06-30 | 株式会社半導体エネルギー研究所 | 表示装置、表示モジュールおよび電子機器 |
| KR102480052B1 (ko) * | 2016-06-09 | 2022-12-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 트랜지스터 |
| US9847428B1 (en) | 2016-08-08 | 2017-12-19 | United Microelectronics Corp. | Oxide semiconductor device |
| US10475869B2 (en) | 2016-08-23 | 2019-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Display device including display element and transistor |
| US20190273168A1 (en) * | 2016-09-20 | 2019-09-05 | Sharp Kabushiki Kaisha | Semiconductor device and display device |
| US10411003B2 (en) | 2016-10-14 | 2019-09-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR102827790B1 (ko) * | 2016-10-14 | 2025-07-01 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| TW201836020A (zh) | 2017-02-17 | 2018-10-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
| KR101905717B1 (ko) | 2017-03-02 | 2018-11-21 | 포항공과대학교 산학협력단 | 삼차원 적층구조의 듀얼 게이트 박막 트랜지스터 논리 회로 |
| DE112018001295B4 (de) | 2017-03-13 | 2025-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung und Herstellungsverfahren für eine Halbleitervorrichtung |
| US10008614B1 (en) | 2017-03-21 | 2018-06-26 | United Microelectronics Corp. | Dual channel transistor |
| GB2561004B (en) * | 2017-03-31 | 2022-06-01 | Pragmatic Printing Ltd | Electronic structures and their methods of manufacture |
| KR102434199B1 (ko) | 2017-10-13 | 2022-08-19 | 삼성디스플레이 주식회사 | 표시장치 |
| KR102586225B1 (ko) * | 2017-12-28 | 2023-10-06 | 엘지디스플레이 주식회사 | 유기발광 표시 장치 및 이의 제조방법 |
| CN110890428B (zh) | 2018-09-07 | 2023-03-24 | 联华电子股份有限公司 | 氧化物半导体场效晶体管及其形成方法 |
| WO2020157558A1 (ja) | 2019-01-29 | 2020-08-06 | 株式会社半導体エネルギー研究所 | 記憶装置、半導体装置、および、電子機器 |
| CN110581142A (zh) * | 2019-08-23 | 2019-12-17 | 武汉华星光电技术有限公司 | 阵列基板及其制造方法、显示面板 |
| KR102875826B1 (ko) * | 2022-11-09 | 2025-10-24 | 한양대학교 산학협력단 | 적층형 트랜지스터 및 원자증 증착법을 이용한 이의 제조 방법 |
| KR20250136817A (ko) * | 2023-01-19 | 2025-09-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009135350A (ja) * | 2007-12-03 | 2009-06-18 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| US20110127522A1 (en) * | 2009-11-28 | 2011-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US20110281394A1 (en) * | 2010-05-14 | 2011-11-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
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| KR101913111B1 (ko) | 2009-12-18 | 2018-10-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101870119B1 (ko) | 2009-12-25 | 2018-06-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
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- 2012-11-28 JP JP2012259580A patent/JP6222919B2/ja not_active Expired - Fee Related
- 2012-11-28 KR KR1020120136435A patent/KR102062402B1/ko active Active
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2015
- 2015-03-03 US US14/636,611 patent/US9472680B2/en active Active
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2016
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2019
- 2019-12-23 KR KR1020190173017A patent/KR102171235B1/ko active Active
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| JP2009135350A (ja) * | 2007-12-03 | 2009-06-18 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| US20110127522A1 (en) * | 2009-11-28 | 2011-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US20110281394A1 (en) * | 2010-05-14 | 2011-11-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130061637A (ko) | 2013-06-11 |
| US10043833B2 (en) | 2018-08-07 |
| US20130140569A1 (en) | 2013-06-06 |
| US8981367B2 (en) | 2015-03-17 |
| JP2017224870A (ja) | 2017-12-21 |
| JP2013138191A (ja) | 2013-07-11 |
| US20150179806A1 (en) | 2015-06-25 |
| KR20190143443A (ko) | 2019-12-30 |
| US9472680B2 (en) | 2016-10-18 |
| KR102171235B1 (ko) | 2020-10-28 |
| JP6222919B2 (ja) | 2017-11-01 |
| US20170033130A1 (en) | 2017-02-02 |
| JP6377228B2 (ja) | 2018-08-22 |
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