JP7431582B2 - 光ビームを使用して材料を処理するための方法およびシステム - Google Patents
光ビームを使用して材料を処理するための方法およびシステム Download PDFInfo
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- JP7431582B2 JP7431582B2 JP2019565416A JP2019565416A JP7431582B2 JP 7431582 B2 JP7431582 B2 JP 7431582B2 JP 2019565416 A JP2019565416 A JP 2019565416A JP 2019565416 A JP2019565416 A JP 2019565416A JP 7431582 B2 JP7431582 B2 JP 7431582B2
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Images
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Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Nonlinear Science (AREA)
- Automation & Control Theory (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
- Laser Beam Processing (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Light Guides In General And Applications Therefor (AREA)
Description
[0001] 本願は、2016年9月29日に出願された米国仮特許出願第62/401,650の優先権を主張して2017年5月26日に出願された国際出願PCT/US2017/034848号の一部継続出願である。本願は、2016年9月29日に出願された米国仮特許出願第62/401,650号の優先権を主張して2017年5月26日に出願された米国特許出願第15/607,411号の一部継続出願である。本願は、2016年9月29日に出願された米国仮特許出願第62/401,650号の優先権を主張して2017年5月26日に出願された米国特許出願第15/607,410号の一部継続出願である。本願は、2016年9月29日に出願された米国仮特許出願第62/401,650号の優先権を主張して2017年5月26日に出願された米国特許出願第15/607,399号の一部継続出願である。以上の出願をここで引用したことにより、これら全ての開示内容全体が本願にも含まれるものとする。
[0002] 本明細書において開示する主題は、一般的には、光ビームを使用して材料を処理する方法およびシステムに関する。また、本明細書において開示する主題は、光ビームを使用して、ファイバ結合レーザ(例えば、ダイオード・レーザ、ファイバ・レーザ、イットリウム・アルミニウム・ガーネット(「YAG」)レーザ)またはダイオード・レーザ(例えば、ファイバ結合ダイオード・レーザ、自由空間ダイオード・レーザ)のようなレーザ・ビームを使用して、材料を処理する方法およびシステムに関する。
[0060] 本明細書において使用する場合の単語および用語の定義
[0061] 本明細書において開示するのは、先に説明した従来の方法のコスト、複雑さ、光損失、またはその他の欠点を減らすことができ、可変ビーム特性(VBC)を有するレーザ・ビームを供給するように動作可能なファイバを提供するように構成された方法、システム、および機器である。このVBCファイバは、広範囲におよぶ多様な光ビーム特性を変化させるように構成される。このようなビーム特性は、VBCファイバを使用して制御することができ、つまり、ユーザが広く多様なレーザ処理用途の個々の要件に適するように、種々のビーム特性を調整する(tune)ことを可能にする。例えば、ビーム径、ビーム発散分布、BPP、強度分布、M2係数、NA、光強度、パワー密度、半径方向ビーム位置、放射輝度、スポット・サイズ等、またはこれらの任意の組み合わせを調整するために、VBCファイバを使用することができる。
[00133] 光ビームを使用して材料を処理する機器は、例えば、図1にしたがって光ビーム102の1つ以上のビーム特性を制御するために、第1長のファイバ104および第2長のファイバ108、ならびに摂動デバイス110とを含む、VBCファイバ100を備えることができる。光ビームを使用して材料を処理するためのこのような機器は、例えば、図2にしたがって光ビーム202の1つ以上のビーム特性を制御するために、第1長のファイバ204および第2長のファイバ208と、摂動デバイス210とを含む、VBCファイバ200を備えることができる。
[00142] 図29は、光ビームを使用して材料を処理する方法の第1例を示す。光ビームを使用して材料を処理する方法は、第1RIPを有する第1長のファイバ内に光ビームを発射するステップと、光ビームを第1長のファイバから、第2RIPと1つ以上の閉じ込め領域とを有する第2長のファイバ内に結合するステップと、第1長のファイバにおいて、第2長のファイバにおいて、または第1および第2長のファイバにおいて光ビームの1つ以上のビーム特性を修正するステップと、および/または第2長のファイバから、光ビームの1つ以上のビーム特性が修正された出力ビームを生成するステップとを含む。第1RIPは第2RIPと異なってもよい。1つ以上のビーム特性を修正するステップは、1つ以上のビーム特性を第1状態(例えば、BPP=0.637mm-mrad)から第2状態(例えば、BPP=1.27mm-mrad)に変化させるステップを含むことができる。第1状態は第2状態と異なってもよい。
[00162] 図31は、光ビームを使用して材料を処理する機器の第1例を示す。図31に示す材料処理は、例えば、ろう付けまたは溶接とすることができる。ある例では、蝋付けまたは溶接プロセスに関与する材料は、同様のまたは異なる金属合金、ポリマー(例えば、熱可塑性樹脂)、あるいは複合材料を含むことができる。
Claims (16)
- 光ビーム、並びに第1屈折率分布(RIP)を有する第1長のファイバおよび前記第1RIPとは異なる第2RIPを有する第2長のファイバを使用して材料を処理する方法であって、
前記第1RIPを有する前記第1長のファイバ内に前記光ビームを発射するステップと、
前記第1長のファイバと前記第2長のファイバとを機能的かつ直接結合するファイバ-結合界面を介して、前記第1長のファイバから、前記第2RIPであって、複数の閉じ込め領域を規定する前記第2RIPを有する第2長のファイバ内に前記光ビームを結合するステップと、
摂動に基づいて第1状態から前記第1状態とは異なる第2状態に変化可能である1つ以上のビーム特性を、1つ以上の材料を蝋付けする、被覆する、焼き付ける、加熱処理する、または溶接する、あるいはこれらの任意の組み合わせの内1つ以上である材料処理構成に基づいて、前記第1状態から前記第2状態に変化させるために、前記第1長のファイバを摂動することによって、前記第1長のファイバ内において、前記光ビームの前記1つ以上のビーム特性を修正するステップと、
前記第2長のファイバの出力にて、前記1つ以上のビーム特性が修正された出力ビームを生成するステップであって、該1つ以上のビーム特性が修正された前記出力ビームを生成するステップは、前記第2長のファイバの前記複数の閉じ込め領域の少なくとも1つ内に、前記光ビームの前記修正された1つ以上のビーム特性を閉じ込めるステップを有する、ステップと、
を含む、方法。 - 請求項1記載の方法であって、更に、
前記材料処理構成のために、前記出力ビームを使用するステップを含む、方法。 - 請求項1記載の方法において、前記1つ以上のビーム特性を修正するステップが、更に、1つ以上のセンサからのプロセス内フィードバックに基づいて、1つ以上の材料の処理中に、前記1つ以上のビーム特性を調節するステップを含む、方法。
- 請求項1記載の方法において、前記1つ以上のビーム特性を修正するステップが、更に、1つ以上のセンサからのフィードバックに基づいて、1つ以上の材料を処理する工程間において、前記1つ以上のビーム特性を調節するステップを含む、方法。
- 請求項1記載の方法において、前記1つ以上のビーム特性を修正するステップが、更に、前記1つ以上のビーム特性を前記第1状態から前記第2状態に変化させるために、摂動デバイスを1つ以上の離散刻みずつ調節するステップを含む、方法。
- 請求項1記載の方法において、前記1つ以上のビーム特性を修正するステップが、更に、前記1つ以上のビーム特性を前記第1状態から前記第2状態に変化させるために、摂動デバイスを連続的に調節するステップを含む、方法。
- 請求項1記載の方法において、前記出力ビームのビーム形状が非対称である、方法。
- 請求項1記載の方法であって、更に、
前記材料処理中に、1つ以上の材料に沿った前記出力ビームの進行方向を第1方向から第2方向に変更するステップを含み、
前記第1方向が前記第2方向と異なる、方法。 - 請求項8記載の方法において、前記第2方向が前記第1方向に対して逆である、方法。
- 請求項1記載の方法において、前記修正するステップは、前記光ビームに対して横方向の変位を与えるステップを含む、方法。
- 請求項1記載の方法において、前記第1長のファイバは、入力ファイバから前記光ビームを受け取る入力を含む、方法。
- 請求項1記載の方法において、前記ファイバ-結合界面は屈折率整合材を含む、方法。
- 請求項1記載の方法において、前記ファイバ-結合界面はスプライスを含む、方法。
- 請求項1記載の方法において、前記第1長のファイバからの前記光ビームのビーム特性を前記第2長のファイバにおいて実質的に維持する、方法。
- 請求項1記載の方法において、前記第1状態は第1ビーム・パラメータ積(BPP)に対応し、前記第2状態は前記第1BPPとは異なる第2BPPに対応する、方法。
- 請求項1記載の方法において、前記第1状態は第1スポット形状に対応し、前記第2状態は前記第1スポット形状とは異なる第2スポット形状に対応する、方法。
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