JP6902163B2 - シリコーン無含有熱ゲル - Google Patents

シリコーン無含有熱ゲル Download PDF

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Publication number
JP6902163B2
JP6902163B2 JP2020513513A JP2020513513A JP6902163B2 JP 6902163 B2 JP6902163 B2 JP 6902163B2 JP 2020513513 A JP2020513513 A JP 2020513513A JP 2020513513 A JP2020513513 A JP 2020513513A JP 6902163 B2 JP6902163 B2 JP 6902163B2
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weight
gel
thermal
rpm
amount
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Japanese (ja)
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JP2020532632A (ja
JP2020532632A5 (cg-RX-API-DMAC7.html
Inventor
リーチャン・ヅァン
フイフェン・デューン
ロンウェイ・パン
チー・ヅァン
ヤー・クン・リュー
ハイギャン・カン
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Honeywell International Inc
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Honeywell International Inc
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
    • C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
    • C08G65/2609—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aliphatic hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2642—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds characterised by the catalyst used
    • C08G65/2669—Non-metals or compounds thereof
    • C08G65/2678—Sulfur or compounds thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/03—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in aqueous media
    • C08J3/075—Macromolecular gels
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • General Chemical & Material Sciences (AREA)
JP2020513513A 2017-09-08 2018-08-31 シリコーン無含有熱ゲル Active JP6902163B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762555954P 2017-09-08 2017-09-08
US62/555,954 2017-09-08
US16/105,456 US11041103B2 (en) 2017-09-08 2018-08-20 Silicone-free thermal gel
US16/105,456 2018-08-20
PCT/US2018/049218 WO2019050806A1 (en) 2017-09-08 2018-08-31 THERMAL GEL WITHOUT SILICONE

Publications (3)

Publication Number Publication Date
JP2020532632A JP2020532632A (ja) 2020-11-12
JP2020532632A5 JP2020532632A5 (cg-RX-API-DMAC7.html) 2020-12-24
JP6902163B2 true JP6902163B2 (ja) 2021-07-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020513513A Active JP6902163B2 (ja) 2017-09-08 2018-08-31 シリコーン無含有熱ゲル

Country Status (7)

Country Link
US (1) US11041103B2 (cg-RX-API-DMAC7.html)
EP (1) EP3679087B1 (cg-RX-API-DMAC7.html)
JP (1) JP6902163B2 (cg-RX-API-DMAC7.html)
KR (2) KR102388580B1 (cg-RX-API-DMAC7.html)
CN (1) CN111051392B (cg-RX-API-DMAC7.html)
TW (1) TWI780220B (cg-RX-API-DMAC7.html)
WO (1) WO2019050806A1 (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3426746B1 (en) 2016-03-08 2021-07-14 Honeywell International Inc. Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
CN111050896B (zh) * 2017-08-22 2022-03-11 株式会社Lg化学 用于混合散热材料的方法
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN115279825B (zh) * 2019-12-19 2024-10-11 汉高股份有限及两合公司 含有反应性稀释剂的无硅酮热界面材料
CN111777993B (zh) * 2020-07-14 2022-03-25 深圳陆祥科技股份有限公司 一种无硅导热膏及其制备方法
US20230051813A1 (en) * 2021-08-11 2023-02-16 Ford Global Technologies, Llc Graphene/carbon nanostructure heating element

Family Cites Families (399)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1655133A (en) 1926-11-09 1928-01-03 Charles A Clase Inside micrometer gauge
US2451600A (en) 1945-02-03 1948-10-19 Atlantic Refining Co Tube gauge
US2810203A (en) 1954-08-06 1957-10-22 Sun Oil Co Tube calipering device
GB989845A (en) 1963-05-03 1965-04-22 Polymer Corp Improved butyl rubber-polyolefine blends
US4006530A (en) 1974-04-09 1977-02-08 Schlumberger Technology Corporation Apparatus for measuring the diameter of a well bore
JPS5314131A (en) 1975-05-02 1978-02-08 Nobuyasu Doi Luster tinnlead alloy electroplating method
CH588683A5 (cg-RX-API-DMAC7.html) 1975-07-28 1977-06-15 Concast Ag
US4180498A (en) 1976-07-30 1979-12-25 Ciba-Geigy Corporation Hindered phenyl phosphites
CH630174A5 (de) 1978-04-05 1982-05-28 Hans Meyer Innenmessgeraet.
DE2933870A1 (de) 1979-08-21 1981-03-12 Siemens AG, 1000 Berlin und 8000 München N.n'-bis-salicyloyl-hydrazin als metalldesaktivator.
FR2518738B1 (fr) 1981-12-23 1985-10-18 Flopetrol Etu Fabrications Dispositif pour la mesure de dimensions internes d'un tube, notamment dans un puits et procede de mesure de deplacement applicable a un tel dispositif
IT1157405B (it) 1982-01-15 1987-02-11 Finike Italiana Marposs Comparatore per il controllo delle dimensioni lineari di pezzi meccanici
JPS5967387A (ja) 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
US4565610A (en) 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating lead and lead/tin alloys
US4604424A (en) 1986-01-29 1986-08-05 Dow Corning Corporation Thermally conductive polyorganosiloxane elastomer composition
JPH01500147A (ja) 1986-04-23 1989-01-19 バッテル・ディベロプメント・コーポレーション クロマトグラフ装置と方法
FR2607431B1 (fr) 1986-12-02 1989-03-10 Clextral Procede et installation de montage et demontage des vis d'une machine d'extrusion
US4832781A (en) 1988-01-07 1989-05-23 Varian Associates, Inc. Methods and apparatus for thermal transfer with a semiconductor wafer in vacuum
US4816086A (en) 1988-04-25 1989-03-28 Armstrong World Industries, Inc. Compositions useful in copper oxidation, and a method to prepare copper oxidation solutions
US4910050A (en) 1988-08-04 1990-03-20 Hughes Aircraft Company Method and composition for providing electrostatic discharge protection for spacecraft
JP2611364B2 (ja) 1988-08-26 1997-05-21 上村工業株式会社 無電解錫めっき浴及び無電解錫めっき方法
EP0433816B1 (de) 1989-12-18 1994-04-20 Riedel-De Haen Aktiengesellschaft Verfahren und Vorrichtung zur Herstellung einer Lösung eines Buntmetallsulfonats
JP2745438B2 (ja) 1990-07-13 1998-04-28 株式会社荏原製作所 加熱用伝熱材料及び発熱体とそれを用いた加熱装置
US5403580A (en) 1991-01-22 1995-04-04 Dow Corning Corporation Organosilicon gels and method of making
US5167851A (en) 1991-04-22 1992-12-01 Thermoset Plastics, Inc. Hydrophilic thermally conductive grease
US5084099A (en) 1991-06-17 1992-01-28 Tektronix, Inc. Phase change ink colorants and phase change inks produced therefrom
US5294923A (en) 1992-01-31 1994-03-15 Baker Hughes Incorporated Method and apparatus for relaying downhole data to the surface
JP3256587B2 (ja) 1992-02-21 2002-02-12 株式会社東芝 高熱伝導性放熱体およびその製造方法
JP3175979B2 (ja) 1992-09-14 2001-06-11 株式会社東芝 樹脂封止型半導体装置
US6197859B1 (en) 1993-06-14 2001-03-06 The Bergquist Company Thermally conductive interface pads for electronic devices
EP0661916B1 (en) 1993-07-06 2000-05-17 Kabushiki Kaisha Toshiba Thermal conductivity sheet
US6090484A (en) 1995-05-19 2000-07-18 The Bergquist Company Thermally conductive filled polymer composites for mounting electronic devices and method of application
US5562814A (en) 1995-09-01 1996-10-08 Dale Electronics, Inc. Sludge-limiting tin and/or lead electroplating bath
KR100445310B1 (ko) 1996-01-22 2004-10-15 다우 글로벌 테크놀로지스 인크. 향상된성질을나타내는폴리올레핀탄성중합체혼합물
WO1997041599A1 (en) 1996-04-29 1997-11-06 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5950066A (en) 1996-06-14 1999-09-07 The Bergquist Company Semisolid thermal interface with low flow resistance
US5738936A (en) 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
US5930115A (en) 1996-08-26 1999-07-27 Compaq Computer Corp. Apparatus, method and system for thermal management of a semiconductor device
US5816699A (en) 1997-06-13 1998-10-06 Entek Manufacturing Inc. Twin screw extruder barrel with an easily removable seamless insert having a wear and corrosion resistant lining
JP3662715B2 (ja) 1997-06-16 2005-06-22 アルプス電気株式会社 導電性材料および導電ペーストと電子機器
JP4015722B2 (ja) 1997-06-20 2007-11-28 東レ・ダウコーニング株式会社 熱伝導性ポリマー組成物
US6432497B2 (en) 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
US6096414A (en) 1997-11-25 2000-08-01 Parker-Hannifin Corporation High dielectric strength thermal interface material
FR2775481B1 (fr) 1998-02-27 2003-10-24 Rhodia Chimie Sa Composition silicone adhesive reticulable et utilisation de cette composition pour le collage de substrats divers
JP3948642B2 (ja) 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
US20040069454A1 (en) 1998-11-02 2004-04-15 Bonsignore Patrick V. Composition for enhancing thermal conductivity of a heat transfer medium and method of use thereof
US6432320B1 (en) 1998-11-02 2002-08-13 Patrick Bonsignore Refrigerant and heat transfer fluid additive
JP2000143808A (ja) 1998-11-17 2000-05-26 Fuji Kobunshi Kogyo Kk 熱伝導性・電気絶縁性シリコーンゲル組成物
US6299721B1 (en) 1998-12-14 2001-10-09 Gould Electronics Incl Coatings for improved resin dust resistance
DE69921695T2 (de) 1998-12-15 2005-08-11 Parker-Hannifin Corp., Cleveland Verfahren zum anbringen eines thermischen phasenveränderlichen verbindungsmaterials
US6238596B1 (en) 1999-03-09 2001-05-29 Johnson Matthey Electronics, Inc. Compliant and crosslinkable thermal interface materials
US6165612A (en) 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
US6391442B1 (en) 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
US20070241303A1 (en) 1999-08-31 2007-10-18 General Electric Company Thermally conductive composition and method for preparing the same
US6605238B2 (en) 1999-09-17 2003-08-12 Honeywell International Inc. Compliant and crosslinkable thermal interface materials
US6706219B2 (en) 1999-09-17 2004-03-16 Honeywell International Inc. Interface materials and methods of production and use thereof
US6975944B1 (en) 1999-09-28 2005-12-13 Alpha Mos Method and apparatus for monitoring materials used in electronics
US6496373B1 (en) 1999-11-04 2002-12-17 Amerasia International Technology, Inc. Compressible thermally-conductive interface
US6395811B1 (en) 1999-11-11 2002-05-28 3D Systems, Inc. Phase change solid imaging material
JP2001139818A (ja) 1999-11-12 2001-05-22 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物
US6673434B2 (en) 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US6451422B1 (en) 1999-12-01 2002-09-17 Johnson Matthey, Inc. Thermal interface materials
US6797382B2 (en) * 1999-12-01 2004-09-28 Honeywell International Inc. Thermal interface materials
DE19959262A1 (de) 1999-12-09 2001-06-21 Altoflex S A Leitfähiges pastöses Material und dessen Verwendung
US6940721B2 (en) 2000-02-25 2005-09-06 Richard F. Hill Thermal interface structure for placement between a microelectronic component package and heat sink
US6372997B1 (en) 2000-02-25 2002-04-16 Thermagon, Inc. Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
US7369411B2 (en) 2000-02-25 2008-05-06 Thermagon, Inc. Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink
US7078109B2 (en) 2000-02-25 2006-07-18 Thermagon Inc. Heat spreading thermal interface structure
US6649325B1 (en) 2001-05-25 2003-11-18 The Bergquist Company Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation
US6797758B2 (en) 2000-04-05 2004-09-28 The Bergquist Company Morphing fillers and thermal interface materials
US6984685B2 (en) 2000-04-05 2006-01-10 The Bergquist Company Thermal interface pad utilizing low melting metal with retention matrix
US6339120B1 (en) 2000-04-05 2002-01-15 The Bergquist Company Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
US20030207128A1 (en) 2000-04-10 2003-11-06 Tomoaki Uchiya Thermally conductive sheet
US6400565B1 (en) 2000-04-21 2002-06-04 Dell Products L.P. Thermally conductive interface member
EP1149864A1 (en) 2000-04-28 2001-10-31 STMicroelectronics S.r.l. Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom
US6616999B1 (en) 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad
US6500891B1 (en) 2000-05-19 2002-12-31 Loctite Corporation Low viscosity thermally conductive compositions containing spherical thermally conductive particles
JP2003535465A (ja) 2000-05-31 2003-11-25 ハネウエル・インターナシヨナル・インコーポレーテツド 充填装置
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
GB0014622D0 (en) 2000-06-16 2000-08-09 D C Heat Limited Clothing or footwear with heating element
JP2002003830A (ja) 2000-06-26 2002-01-09 Denki Kagaku Kogyo Kk 高熱伝導性組成物とその用途
US6475962B1 (en) 2000-09-14 2002-11-05 Aos Thermal Compounds, Llc Dry thermal grease
US6610635B2 (en) 2000-09-14 2003-08-26 Aos Thermal Compounds Dry thermal interface material
US20030151030A1 (en) 2000-11-22 2003-08-14 Gurin Michael H. Enhanced conductivity nanocomposites and method of use thereof
US20040206941A1 (en) 2000-11-22 2004-10-21 Gurin Michael H. Composition for enhancing conductivity of a carrier medium and method of use thereof
US6573328B2 (en) 2001-01-03 2003-06-03 Loctite Corporation Low temperature, fast curing silicone compositions
DE60128727T2 (de) 2001-01-22 2008-01-31 PARKER HANNIFIN Corporation, Cleveland Rückstandsfrei ablösbares thermisches verbindungsstück mit phasenübergangsmaterial
US20020187364A1 (en) 2001-03-16 2002-12-12 Shipley Company, L.L.C. Tin plating
US7060747B2 (en) 2001-03-30 2006-06-13 Intel Corporation Chain extension for thermal materials
US6469379B1 (en) 2001-03-30 2002-10-22 Intel Corporation Chain extension for thermal materials
US7608324B2 (en) 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof
JP4237505B2 (ja) 2001-05-30 2009-03-11 ハネウエル・インターナシヨナル・インコーポレーテツド インターフェース材料、ならびにその製造方法および使用方法
US6818301B2 (en) 2001-06-01 2004-11-16 Psiloquest Inc. Thermal management with filled polymeric polishing pads and applications therefor
CN1260399C (zh) 2001-08-31 2006-06-21 罗姆和哈斯电子材料有限责任公司 电解镀锡溶液和用于电镀的方法
US7038009B2 (en) 2001-08-31 2006-05-02 Cool Shield, Inc. Thermally conductive elastomeric pad and method of manufacturing same
FR2831548B1 (fr) 2001-10-31 2004-01-30 Rhodia Chimie Sa Composition silicone adhesive reticulable comprenant comme agent thixotropant un compose a fonction amine cyclique portee par une chaine siloxanique
US20030112603A1 (en) 2001-12-13 2003-06-19 Roesner Arlen L. Thermal interface
US6620515B2 (en) 2001-12-14 2003-09-16 Dow Corning Corporation Thermally conductive phase change materials
KR100479857B1 (ko) 2001-12-28 2005-03-30 제일모직주식회사 반도체 패키지용 실리콘 수지 조성물
US6597575B1 (en) 2002-01-04 2003-07-22 Intel Corporation Electronic packages having good reliability comprising low modulus thermal interface materials
JP3844125B2 (ja) 2002-01-22 2006-11-08 信越化学工業株式会社 放熱部材、その製造方法及びその敷設方法
US6946190B2 (en) 2002-02-06 2005-09-20 Parker-Hannifin Corporation Thermal management materials
AU2002335883A1 (en) 2002-02-06 2003-09-02 Parker Hannifin Corporation Thermal management materials having a phase change dispersion
US6926955B2 (en) 2002-02-08 2005-08-09 Intel Corporation Phase change material containing fusible particles as thermally conductive filler
US7846778B2 (en) 2002-02-08 2010-12-07 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US20030159938A1 (en) 2002-02-15 2003-08-28 George Hradil Electroplating solution containing organic acid complexing agent
US20040149587A1 (en) 2002-02-15 2004-08-05 George Hradil Electroplating solution containing organic acid complexing agent
KR101013189B1 (ko) 2002-03-05 2011-02-10 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 주석 또는 주석 합금 전기도금조 용액에서 산화를 통해주석의 손실을 제한하는 방법
US6913686B2 (en) 2002-12-10 2005-07-05 Advanced Technology Materials, Inc. Methods for analyzing solder plating solutions
US20030171487A1 (en) 2002-03-11 2003-09-11 Tyco Electronics Corporation Curable silicone gum thermal interface material
US6815486B2 (en) 2002-04-12 2004-11-09 Dow Corning Corporation Thermally conductive phase change materials and methods for their preparation and use
US7208191B2 (en) 2002-04-23 2007-04-24 Freedman Philip D Structure with heat dissipating device and method
US20030203181A1 (en) 2002-04-29 2003-10-30 International Business Machines Corporation Interstitial material with enhanced thermal conductance for semiconductor device packaging
US7147367B2 (en) 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
US20030230403A1 (en) 2002-06-14 2003-12-18 Webb Brent J. Conductive thermal interface and compound
US6791839B2 (en) 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
AU2003254046A1 (en) 2002-07-15 2004-02-02 Honeywell International Inc. Thermal interconnect and interface systems, methods of production and uses thereof
JP4016326B2 (ja) 2002-08-02 2007-12-05 石原薬品株式会社 無電解スズメッキ浴
US6657297B1 (en) 2002-08-15 2003-12-02 The Bergquist Company Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
US6761932B2 (en) 2002-08-23 2004-07-13 Basf Corporation Method to improve adhesion of primers to substrates
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US6908682B2 (en) 2002-09-12 2005-06-21 3M Innovative Properties Company Photocured silicone sealant having improved adhesion to plastic
EP1599428A4 (en) 2002-09-25 2007-09-05 Intertech Group Inc FIBER REINFORCED CEMENTITIOUS MATERIAL
US6783692B2 (en) 2002-10-17 2004-08-31 Dow Corning Corporation Heat softening thermally conductive compositions and methods for their preparation
EP1558403A4 (en) 2002-10-21 2006-12-20 Laird Technologies Inc Thermally conductive emi shield
US6956739B2 (en) 2002-10-29 2005-10-18 Parker-Hannifin Corporation High temperature stable thermal interface material
CN1296994C (zh) * 2002-11-14 2007-01-24 清华大学 一种热界面材料及其制造方法
FR2848215B1 (fr) 2002-12-04 2006-08-04 Rhodia Chimie Sa Composition elastomere silicone, adhesive, monocomposante et reticulable par polyaddition
US7326042B2 (en) 2002-12-24 2008-02-05 Bostik Findley, Inc. Apparatus for packaging hot melt adhesives using a mold and carrier
JP4288469B2 (ja) 2003-03-12 2009-07-01 石原薬品株式会社 銅侵食防止用の無電解スズメッキ浴、及び銅侵食防止方法
US6924027B2 (en) 2003-03-31 2005-08-02 Intel Corporation Phase change thermal interface materials including exfoliated clay
US20070164424A1 (en) 2003-04-02 2007-07-19 Nancy Dean Thermal interconnect and interface systems, methods of production and uses thereof
US7013965B2 (en) 2003-04-29 2006-03-21 General Electric Company Organic matrices containing nanomaterials to enhance bulk thermal conductivity
US6901675B2 (en) 2003-05-27 2005-06-07 Bristol Compressors, Inc. System and method for sizing a center bore of a laminated rotor
US7229683B2 (en) 2003-05-30 2007-06-12 3M Innovative Properties Company Thermal interface materials and method of making thermal interface materials
US7744991B2 (en) 2003-05-30 2010-06-29 3M Innovative Properties Company Thermally conducting foam interface materials
TWI251320B (en) 2003-07-04 2006-03-11 Fuji Polymer Ind Thermal conductive composition, a heat-dissipating putty sheet and heat-dissipating structure using the same
JP4337433B2 (ja) 2003-07-08 2009-09-30 パナソニック株式会社 プラズマディスプレイパネルのエージング方法およびエージング装置
KR100981571B1 (ko) 2003-07-26 2010-09-10 삼성전자주식회사 다중 입력 다중 출력 적응 안테나 어레이 방식을 사용하는이동 통신 시스템에서 신호 송수신 시스템 및 방법
US6951182B2 (en) 2003-07-29 2005-10-04 Onweller Arthur E Marine Mooring Line Vermin Shield
US7253523B2 (en) 2003-07-29 2007-08-07 Intel Corporation Reworkable thermal interface material
US6874573B2 (en) 2003-07-31 2005-04-05 National Starch And Chemical Investment Holding Corporation Thermal interface material
US6985690B2 (en) 2003-07-31 2006-01-10 Xerox Corporation Fuser and fixing members containing PEI-PDMS block copolymers
JP2005060822A (ja) 2003-08-08 2005-03-10 Rohm & Haas Electronic Materials Llc 複合基体の電気メッキ
CN1580116A (zh) 2003-08-15 2005-02-16 台盐实业股份有限公司 散热界面材料组成
US20050049350A1 (en) 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
US8039961B2 (en) 2003-08-25 2011-10-18 Samsung Electronics Co., Ltd. Composite carbon nanotube-based structures and methods for removing heat from solid-state devices
US7550097B2 (en) 2003-09-03 2009-06-23 Momentive Performance Materials, Inc. Thermal conductive material utilizing electrically conductive nanoparticles
US20050072334A1 (en) 2003-10-07 2005-04-07 Saint-Gobain Performance Plastics, Inc. Thermal interface material
KR101155940B1 (ko) 2003-11-05 2012-07-05 다우 코닝 코포레이션 열 전도성 그리스, 당해 그리스가 사용되는 방법 및디바이스
JP4219793B2 (ja) 2003-11-25 2009-02-04 信越化学工業株式会社 放熱用シリコーングリース組成物
US7306823B2 (en) 2004-09-18 2007-12-11 Nanosolar, Inc. Coated nanoparticles and quantum dots for solution-based fabrication of photovoltaic cells
US7119143B2 (en) 2004-03-04 2006-10-10 Laird Technologies, Inc. Silicone pads for electronics thermal management
US20050228097A1 (en) 2004-03-30 2005-10-13 General Electric Company Thermally conductive compositions and methods of making thereof
US20080269405A1 (en) 2004-04-01 2008-10-30 Toshihiko Okamoto Single-Component Curable Composition
EP1746135B1 (en) 2004-05-07 2019-05-29 Kaneka Corporation Curable composition
JP4501526B2 (ja) 2004-05-14 2010-07-14 住友化学株式会社 高熱伝導性樹脂組成物
WO2005111146A1 (ja) 2004-05-17 2005-11-24 Techno Polymer Co., Ltd. 熱伝導性樹脂組成物及びその製造方法並びにハウジング
JP4480457B2 (ja) 2004-05-17 2010-06-16 株式会社カネカ 硬化性組成物
JP5005538B2 (ja) 2004-05-20 2012-08-22 モーメンティブ・パフォーマンス・マテリアルズ・インク バルク熱伝導率を増大させるためのナノ材料含有有機マトリックス
US20050287362A1 (en) 2004-06-23 2005-12-29 3M Innovative Properties Company Halogen free tapes & method of making same
WO2006017193A1 (en) 2004-07-13 2006-02-16 Henkel Corporation Novel packaging solution for highly filled phase-change thermal interface material
EP1797155B1 (en) 2004-08-23 2015-10-07 General Electric Company Thermally conductive composition and method for preparing the same
WO2006024610A2 (en) 2004-08-31 2006-03-09 Ciba Specialty Chemicals Holding Inc. Stabilization of organic materials
US20060060980A1 (en) 2004-09-22 2006-03-23 Taiwan Semiconductor Manufacturing Company, Ltd. Ic package having ground ic chip and method of manufacturing same
WO2006049792A1 (en) 2004-10-28 2006-05-11 Dow Corning Corporation Conductive curable compositions
US7328547B2 (en) 2004-10-29 2008-02-12 Bostik, Inc. Process for packaging plastic materials like hot melt adhesives
US20060094809A1 (en) 2004-11-02 2006-05-04 Simone Davide L Electrically and thermally conductive silicone adhesive compositions
EP2546308B1 (en) 2004-11-10 2014-07-16 Kaneka Corporation Curable composition
WO2006065282A1 (en) 2004-12-16 2006-06-22 Dow Corning Corporation Amide-substituted silicones and methods for their preparation and use
JP4954090B2 (ja) 2005-02-01 2012-06-13 ダウ・コーニング・コーポレイション 接着促進添加剤組成物、硬化性被覆組成物、合成繊維材料及び合成繊維材料の被覆方法
US7241707B2 (en) 2005-02-17 2007-07-10 Intel Corporation Layered films formed by controlled phase segregation
CN100543103C (zh) 2005-03-19 2009-09-23 清华大学 热界面材料及其制备方法
US20060228542A1 (en) 2005-04-08 2006-10-12 Saint-Gobain Performance Plastics Corporation Thermal interface material having spheroidal particulate filler
CN100404242C (zh) 2005-04-14 2008-07-23 清华大学 热界面材料及其制造方法
US20060260948A2 (en) 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
JP3878959B2 (ja) 2005-04-28 2007-02-07 メルテックス株式会社 スズめっき液、そのスズめっき液を用いたスズめっき方法及びスズめっき液調整方法
US20070116626A1 (en) 2005-05-11 2007-05-24 Molecular Nanosystems, Inc. Methods for forming carbon nanotube thermal pads
US20060264566A1 (en) 2005-05-19 2006-11-23 Wacker Chemical Corporation HCR room temperature curable rubber composition
CA2609712C (en) 2005-05-26 2015-04-07 Nanocomp Technologies, Inc. Systems and methods for thermal management of electronic components
JP2007002002A (ja) 2005-06-21 2007-01-11 Idemitsu Kosan Co Ltd 伝熱性樹脂組成物
US20070013054A1 (en) 2005-07-12 2007-01-18 Ruchert Brian D Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages
US20070051773A1 (en) 2005-09-02 2007-03-08 Ruchert Brian D Thermal interface materials, methods of preparation thereof and their applications
JP4860229B2 (ja) 2005-10-11 2012-01-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性グリース組成物
EP1839469A2 (en) 2005-11-01 2007-10-03 Techfilm, LLC Thermal interface material with multiple size distribution thermally conductive fillers
JP2007131798A (ja) 2005-11-14 2007-05-31 Kaneka Corp 硬化性組成物
CN1970666A (zh) 2005-11-24 2007-05-30 鸿富锦精密工业（深圳）有限公司 导热胶
CN1978582A (zh) 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 导热膏及使用该导热膏的电子装置
US7465605B2 (en) 2005-12-14 2008-12-16 Intel Corporation In-situ functionalization of carbon nanotubes
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US7964542B2 (en) 2006-01-12 2011-06-21 International Business Machines Corporation Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly
US20070166554A1 (en) 2006-01-18 2007-07-19 Ruchert Brian D Thermal interconnect and interface systems, methods of production and uses thereof
US20070179232A1 (en) 2006-01-30 2007-08-02 National Starch And Chemical Investment Holding Corporation Thermal Interface Material
US7440281B2 (en) 2006-02-01 2008-10-21 Apple Inc. Thermal interface apparatus
US7463496B2 (en) 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US20070219312A1 (en) 2006-03-17 2007-09-20 Jennifer Lynn David Silicone adhesive composition and method for preparing the same
US7955900B2 (en) 2006-03-31 2011-06-07 Intel Corporation Coated thermal interface in integrated circuit die
TWI313695B (en) 2006-04-20 2009-08-21 Taiwan Textile Res Inst Melted-spinning grains containing thermal-stable phase-change polymer and preparation method thereof
US7514485B2 (en) 2006-06-20 2009-04-07 Chemtura Corporation Compatibilizers for composites of PVC and cellulosic materials
JP2008050555A (ja) 2006-07-24 2008-03-06 Sumitomo Chemical Co Ltd 熱伝導性樹脂組成物およびその用途
US20080023665A1 (en) 2006-07-25 2008-01-31 Weiser Martin W Thermal interconnect and interface materials, methods of production and uses thereof
WO2008030690A1 (en) 2006-09-05 2008-03-13 3M Innovative Properties Company Thermally conductive grease
JP2008063412A (ja) 2006-09-06 2008-03-21 Showa Denko Kk 熱伝導性樹脂組成物およびシート
JP5231236B2 (ja) 2006-10-17 2013-07-10 電気化学工業株式会社 グリース
KR100820902B1 (ko) 2006-11-08 2008-04-11 조인셋 주식회사 다층 열 전도성 패드
TWI344196B (en) 2006-11-15 2011-06-21 Ind Tech Res Inst Melting temperature adjustable metal thermal interface materials and use thereof
US7554793B2 (en) 2006-11-16 2009-06-30 Kemet Electronics Corporation Low temperature curable conductive adhesive and capacitors formed thereby
US8431647B2 (en) 2006-12-27 2013-04-30 Bluestar Silicones France Sas Adhesive silicone compositions and adhesive bonding/seaming therewith
CN101627082B (zh) 2007-02-20 2014-06-25 道康宁公司 基于键合氢聚有机硅氧烷的填料处理剂
CN101067030A (zh) 2007-03-30 2007-11-07 广东华南精细化工研究院有限公司 新型聚烯烃高效耐热氧化复合型抗氧剂及其生产工艺和应用
CN101652459A (zh) 2007-04-02 2010-02-17 3M创新有限公司 热脂制品以及方法
US8431655B2 (en) 2007-04-09 2013-04-30 Designer Molecules, Inc. Curatives for epoxy compositions
GB0707176D0 (en) 2007-04-16 2007-05-23 Dow Corning Hydrosilylation curable compositions
US7462294B2 (en) 2007-04-25 2008-12-09 International Business Machines Corporation Enhanced thermal conducting formulations
US7646778B2 (en) 2007-04-27 2010-01-12 Cisco Technology, Inc. Support of C-tagged service interface in an IEEE 802.1ah bridge
WO2008147825A2 (en) 2007-05-22 2008-12-04 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof
US7765811B2 (en) 2007-06-29 2010-08-03 Laird Technologies, Inc. Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduits
FR2919615A1 (fr) 2007-08-02 2009-02-06 Bluestar Silicones France Soc Composition elastomere silicone adhesive
DE102007037435B4 (de) 2007-08-08 2012-03-22 Sgl Carbon Se Schichtstoff
JP5269366B2 (ja) 2007-08-22 2013-08-21 コスモ石油ルブリカンツ株式会社 耐熱型熱伝導性グリース
CN101372614B (zh) 2007-08-24 2011-06-08 清华大学 碳纳米管阵列复合导热片及其制备方法
EP2183312A1 (en) 2007-08-31 2010-05-12 Cabot Corporation Thermal interface materials
JP5535915B2 (ja) 2007-09-12 2014-07-02 スモルテック アーベー ナノ構造体による隣接層の接続および接合
US8586650B2 (en) 2007-09-14 2013-11-19 Henkel US IP LLC Thermally conductive composition
US8112884B2 (en) 2007-10-08 2012-02-14 Honeywell International Inc. Method for providing an efficient thermal transfer through a printed circuit board
US20100304152A1 (en) 2007-10-22 2010-12-02 Flexible Ceramics , Inc. Fire resistant flexible ceramic resin blend and composite products formed therefrom
JP2009102577A (ja) 2007-10-25 2009-05-14 Polymatech Co Ltd 熱伝導性組成物
US20090111925A1 (en) 2007-10-31 2009-04-30 Burnham Kikue S Thermal interface materials, methods of production and uses thereof
US8445102B2 (en) 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
JP5137538B2 (ja) 2007-11-28 2013-02-06 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2009138036A (ja) 2007-12-04 2009-06-25 Momentive Performance Materials Japan Kk 熱伝導性シリコーングリース組成物
US8076773B2 (en) 2007-12-26 2011-12-13 The Bergquist Company Thermal interface with non-tacky surface
JP5176076B2 (ja) 2008-01-16 2013-04-03 日立化成株式会社 感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法
US20090184283A1 (en) 2008-01-18 2009-07-23 Deborah Duen Ling Chung Antioxidants for phase change ability and thermal stability enhancement
US7732829B2 (en) 2008-02-05 2010-06-08 Hymite A/S Optoelectronic device submount
US20090215225A1 (en) 2008-02-24 2009-08-27 Advanced Technology Materials, Inc. Tellurium compounds useful for deposition of tellurium containing materials
JP4656340B2 (ja) 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US20110038124A1 (en) 2008-04-21 2011-02-17 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof
US8632879B2 (en) 2008-04-25 2014-01-21 The University Of Kentucky Research Foundation Lightweight thermal management material for enhancement of through-thickness thermal conductivity
US10358535B2 (en) 2008-04-25 2019-07-23 The University Of Kentucky Research Foundation Thermal interface material
WO2009136508A1 (ja) 2008-05-08 2009-11-12 富士高分子工業株式会社 熱伝導性樹脂組成物
US8115303B2 (en) 2008-05-13 2012-02-14 International Business Machines Corporation Semiconductor package structures having liquid coolers integrated with first level chip package modules
JP5607298B2 (ja) 2008-07-29 2014-10-15 株式会社カネカ 熱伝導材料
CN102112568A (zh) 2008-08-04 2011-06-29 日立化成工业株式会社 胶粘剂组合物、膜状胶粘剂、胶粘片和半导体装置
US8449679B2 (en) 2008-08-15 2013-05-28 Lam Research Corporation Temperature controlled hot edge ring assembly
US8394746B2 (en) 2008-08-22 2013-03-12 Exxonmobil Research And Engineering Company Low sulfur and low metal additive formulations for high performance industrial oils
EP2194165A1 (en) 2008-10-21 2010-06-09 Rohm and Haas Electronic Materials LLC Method for replenishing tin and its alloying metals in electrolyte solutions
JP2010120979A (ja) 2008-11-17 2010-06-03 Taika:Kk 熱伝導性シリコーンゲル硬化物
US20100129648A1 (en) 2008-11-26 2010-05-27 Jun Xu Electronic packaging and heat sink bonding enhancements, methods of production and uses thereof
CN101445627A (zh) 2008-12-11 2009-06-03 上海交通大学 高压直流电缆绝缘材料及其制备方法
US8138239B2 (en) 2008-12-23 2012-03-20 Intel Corporation Polymer thermal interface materials
JP5390202B2 (ja) 2009-01-21 2014-01-15 株式会社カネカ 放熱構造体
US7816785B2 (en) 2009-01-22 2010-10-19 International Business Machines Corporation Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
KR20110123763A (ko) 2009-02-04 2011-11-15 다우 코닝 코포레이션 비-무작위적 공중합체의 제조 방법
CN102341474B (zh) 2009-03-02 2014-09-24 霍尼韦尔国际公司 热界面材料及制造和使用它的方法
EP2406321A1 (en) 2009-03-12 2012-01-18 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
JP5651676B2 (ja) 2009-03-16 2015-01-14 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 熱伝導性グリース、並びに、該グリースを用いる方法及びデバイス
DE102009001722B4 (de) 2009-03-20 2012-04-05 Infineon Technologies Ag Verfahren zum Aufbringen eines Wärmeleitmediums auf eine Wärmeableitfläche
CN102612490B (zh) 2009-04-03 2016-05-18 沃尔贝克材料有限公司 含有石墨烯片和石墨的聚合物组合物
US20100256280A1 (en) 2009-04-07 2010-10-07 Laird Technologies, Inc. Methods of forming resin and filler composite systems
JP2010248277A (ja) 2009-04-10 2010-11-04 Panasonic Corp 熱伝導性樹脂ペーストおよびそれを用いた光ディスク装置
JP5562574B2 (ja) 2009-04-14 2014-07-30 信越化学工業株式会社 熱伝導性接着剤
ES2733913T3 (es) 2009-05-05 2019-12-03 Parker Hannifin Corp Producto de espuma termoconductor
JP5577553B2 (ja) 2009-05-27 2014-08-27 協同油脂株式会社 放熱コンパウンド組成物
US8362607B2 (en) 2009-06-03 2013-01-29 Honeywell International Inc. Integrated circuit package including a thermally and electrically conductive package lid
KR100953679B1 (ko) 2009-06-15 2010-04-20 두성산업 주식회사 방열재 및 그 제조 방법
US8081468B2 (en) 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
CN102804367A (zh) 2009-06-19 2012-11-28 道康宁公司 离聚硅酮热塑性弹性体在电子器件中的用途
US8535787B1 (en) 2009-06-29 2013-09-17 Juniper Networks, Inc. Heat sinks having a thermal interface for cooling electronic devices
CN101942197B (zh) 2009-07-09 2012-06-27 昆山伟翰电子有限公司 导热硅橡胶复合材料及其制作方法
US20120174956A1 (en) 2009-08-06 2012-07-12 Laird Technologies, Inc. Thermoelectric Modules, Thermoelectric Assemblies, and Related Methods
CN102639593B (zh) * 2009-09-18 2014-06-11 普罗赛瑞克斯医药发展公司 可复水逆向热凝胶聚合物
US20130199724A1 (en) 2009-10-09 2013-08-08 Designer Molecules, Inc. Curatives for epoxy compositions
JP5463116B2 (ja) 2009-10-14 2014-04-09 電気化学工業株式会社 熱伝導性材料
US9593209B2 (en) 2009-10-22 2017-03-14 Dow Corning Corporation Process for preparing clustered functional polyorganosiloxanes, and methods for their use
US8223498B2 (en) 2009-11-11 2012-07-17 Juniper Networks, Inc. Thermal interface members for removable electronic devices
TWI370532B (en) 2009-11-12 2012-08-11 Ind Tech Res Inst Chip package structure and method for fabricating the same
JP5318733B2 (ja) 2009-11-26 2013-10-16 コスモ石油ルブリカンツ株式会社 熱伝導性グリース
GB2508320B (en) 2009-12-09 2014-07-23 Intel Corp Polymer thermal interface materials
TWI475103B (zh) 2009-12-15 2015-03-01 財團法人工業技術研究院 散熱結構
JP5638089B2 (ja) * 2009-12-21 2014-12-10 サン−ゴバン パフォーマンス プラスティックス コーポレイション 熱伝導性フォーム材料
KR101023241B1 (ko) 2009-12-28 2011-03-21 제일모직주식회사 반도체용 접착제 조성물 및 이를 이용한 접착 필름
CN101735619B (zh) 2009-12-28 2011-11-09 华南理工大学 一种无卤阻燃导热有机硅电子灌封胶及其制备方法
JP5497458B2 (ja) 2010-01-13 2014-05-21 電気化学工業株式会社 熱伝導性樹脂組成物
JP2011165792A (ja) 2010-02-08 2011-08-25 Teijin Dupont Films Japan Ltd 放熱性二軸延伸フィルム
US9260645B2 (en) 2010-02-23 2016-02-16 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US9771508B2 (en) 2010-02-23 2017-09-26 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US7990711B1 (en) 2010-02-24 2011-08-02 International Business Machines Corporation Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate
WO2011114665A1 (ja) 2010-03-15 2011-09-22 日本化薬株式会社 耐熱用接着剤
US8009429B1 (en) 2010-03-22 2011-08-30 Honeywell International Inc. Electrical component thermal management
US20110265979A1 (en) 2010-04-30 2011-11-03 Sihai Chen Thermal interface materials with good reliability
US8308861B2 (en) 2010-05-13 2012-11-13 E I Du Pont De Nemours And Company Phase change material compositions
US8647752B2 (en) 2010-06-16 2014-02-11 Laird Technologies, Inc. Thermal interface material assemblies, and related methods
CN102134474B (zh) 2010-12-29 2013-10-02 深圳市优宝惠新材料科技有限公司 导热硅脂组合物
US8917510B2 (en) 2011-01-14 2014-12-23 International Business Machines Corporation Reversibly adhesive thermal interface material
US9598575B2 (en) 2011-01-26 2017-03-21 Dow Corning Corporation High temperature stable thermally conductive materials
US8277774B2 (en) 2011-01-27 2012-10-02 Honeywell International Method for the preparation of high purity stannous oxide
JP5749536B2 (ja) 2011-03-28 2015-07-15 電気化学工業株式会社 熱伝導性成形体とその用途
EP2691398B1 (en) 2011-03-30 2016-09-28 InfaCare Pharmaceutical Corporation Methods for synthesizing metal mesoporphyrins
KR101800437B1 (ko) 2011-05-02 2017-11-22 삼성전자주식회사 반도체 패키지
US20120285673A1 (en) 2011-05-11 2012-11-15 Georgia Tech Research Corporation Nanostructured composite polymer thermal/electrical interface material and method for making the same
JP2012241063A (ja) 2011-05-17 2012-12-10 Nitto Denko Corp 半導体装置製造用の接着シート
US20120292005A1 (en) 2011-05-19 2012-11-22 Laird Technologies, Inc. Thermal interface materials and methods for processing the same
EP2743316B1 (en) 2011-08-10 2015-11-04 Adeka Corporation Silicon-containing curable composition and cured product of same
JP5687167B2 (ja) 2011-09-27 2015-03-18 コスモ石油ルブリカンツ株式会社 耐熱型熱伝導性グリース
CN103102689B (zh) 2011-11-15 2015-04-01 佛山市金戈消防材料有限公司 一种高导热有机硅灌封胶组合物及其应用
US20130127069A1 (en) 2011-11-17 2013-05-23 International Business Machines Corporation Matrices for rapid alignment of graphitic structures for stacked chip cooling applications
WO2013074920A1 (en) 2011-11-17 2013-05-23 Reliabulb, Llc Low thermal impedance interface for an led bulb
CN103131138B (zh) 2011-11-23 2016-05-11 合肥杰事杰新材料股份有限公司 一种热塑性聚酯组合物及其制备方法
CN103254647A (zh) 2012-02-20 2013-08-21 深圳德邦界面材料有限公司 一种导热缝隙界面材料及其制备方法
CN104136569A (zh) 2012-03-02 2014-11-05 富士高分子工业株式会社 油灰状传热材料及其制造方法
CN102627943A (zh) 2012-04-11 2012-08-08 北京化工大学常州先进材料研究院 一种湿气/紫外光双固化有机硅胶粘剂
CN102634212B (zh) 2012-04-23 2015-11-25 湖州明朔光电科技有限公司 一种导热硅脂组合物
JP5783128B2 (ja) 2012-04-24 2015-09-24 信越化学工業株式会社 加熱硬化型熱伝導性シリコーングリース組成物
US8937384B2 (en) 2012-04-25 2015-01-20 Qualcomm Incorporated Thermal management of integrated circuits using phase change material and heat spreaders
TWI598385B (zh) 2012-05-10 2017-09-11 國立清華大學 絕緣化熱介面材料
KR101786926B1 (ko) 2012-05-11 2017-10-18 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 그리스 조성물
JP2014003152A (ja) 2012-06-18 2014-01-09 Dow Corning Toray Co Ltd サーマルインターフェース材の形成方法および放熱構造体
CN104428385B (zh) 2012-07-04 2016-05-18 Dic株式会社 热密封剂、使用该热密封剂的层叠体及太阳能电池模块
US8587945B1 (en) 2012-07-27 2013-11-19 Outlast Technologies Llc Systems structures and materials for electronic device cooling
CN104471012B (zh) 2012-07-30 2017-03-29 道康宁公司 导热缩合反应可固化聚有机硅氧烷组合物及该组合物的制备和使用方法
GB201220099D0 (en) 2012-09-19 2012-12-26 Dow Corning Production of blend of polyolefin and organopolysiloxane
JP2014105283A (ja) 2012-11-28 2014-06-09 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
FR3000090A1 (fr) 2012-12-20 2014-06-27 Bluestar Silicones France Procede et compositions utiles pour l'etancheification et l'assemblage de composants d'un groupe moto-propulseur
JP5944306B2 (ja) 2012-12-21 2016-07-05 コスモ石油ルブリカンツ株式会社 高熱伝導性グリース
CN103087389B (zh) 2013-01-31 2015-06-10 合肥工业大学 一种高导热高韧性复合材料及其制备方法
KR102192489B1 (ko) 2013-02-11 2020-12-17 다우 실리콘즈 코포레이션 열 전도성 열 라디칼 경화 실리콘 조성물을 형성하는 원 위치 방법
CN104968750B (zh) 2013-02-11 2017-04-19 道康宁公司 簇合官能化聚有机硅氧烷、形成所述簇合官能化聚有机硅氧烷的工艺及其使用方法
JP5372270B1 (ja) 2013-02-19 2013-12-18 ビッグテクノス株式会社 熱放射性フィルム及び熱放射性粘着テープ
JP6263042B2 (ja) 2013-02-28 2018-01-17 コスモ石油ルブリカンツ株式会社 基油拡散防止性能を有する熱伝導性グリース
CN103102552A (zh) 2013-03-12 2013-05-15 泰山体育产业集团有限公司 一种相变保温聚烯烃泡沫材料及其制备方法
WO2014160067A1 (en) 2013-03-14 2014-10-02 Dow Corning Corporation Thermally curable silicone compositions as temporary bonding adhesives
US9070660B2 (en) 2013-03-15 2015-06-30 Intel Corporation Polymer thermal interface material having enhanced thermal conductivity
CN103214848B (zh) 2013-04-28 2015-07-22 深圳市新亚新材料有限公司 一种用于cpu散热的相变导热硅脂组合物及其制备方法
CN103333447A (zh) 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种相变化热界面材料及其制备方法
US9464879B2 (en) 2013-06-28 2016-10-11 Buhler, Inc. Barrel measuring device
WO2015008330A1 (ja) 2013-07-16 2015-01-22 日立化成株式会社 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
CN103409116B (zh) 2013-07-30 2015-07-22 深圳德邦界面材料有限公司 一种绝缘增强型导热界面材料及其制备方法
CN103436027B (zh) 2013-09-09 2015-10-28 北京化工大学 一种导热电绝缘硅橡胶热界面材料及其制备方法
KR101917164B1 (ko) 2013-10-30 2018-11-09 에스케이이노베이션 주식회사 열전도성 폴리머의 제조방법
US20150125646A1 (en) 2013-11-05 2015-05-07 Espci Innov Self-Healing Thermally Conductive Polymer Materials
WO2015068551A1 (ja) 2013-11-08 2015-05-14 リンテック株式会社 保護膜形成用組成物、保護膜形成用シート、及び保護膜付きチップ
JP2015097134A (ja) 2013-11-15 2015-05-21 日東電工株式会社 回路付サスペンション基板
CN103756631B (zh) 2013-11-28 2015-06-03 常熟市恒信粘胶有限公司 双组份自粘性加成型阻燃导热室温固化有机硅灌封胶
JP2017504715A (ja) 2013-12-05 2017-02-09 ハネウェル・インターナショナル・インコーポレーテッド 調節されたｐＨを有するメタンスルホン酸第一スズ溶液
CN104152103B (zh) 2013-12-23 2016-08-17 郑州中原应用技术研究开发有限公司 一种加成型双组分导热灌封胶及其制备方法
CN103709757A (zh) 2013-12-30 2014-04-09 无锡中石油润滑脂有限责任公司 一种绝缘导热硅脂及其制备方法
CN104449550B (zh) 2013-12-31 2016-08-17 弗洛里光电材料（苏州）有限公司 有机硅组合物及其应用
CN103773322A (zh) 2014-02-08 2014-05-07 中国电子科技集团公司第三十三研究所 一种相变微胶囊导热材料及其制备方法
EP3105300B1 (en) 2014-02-13 2019-08-21 Honeywell International Inc. Compressible thermal interface materials
KR102172821B1 (ko) 2014-03-06 2020-11-02 헨켈 아게 운트 코. 카게아아 단결정 알루미나 충전 다이 부착 페이스트
CN103849356A (zh) 2014-03-20 2014-06-11 中国电子科技集团公司第三十三研究所 一种电气绝缘相变导热材料及其制备方法
CN103865271B (zh) 2014-03-20 2017-04-05 北京化工大学 一种纳米杂化材料改性的有机硅导热电子灌封胶的制备方法
JP6348434B2 (ja) 2014-03-28 2018-06-27 信越化学工業株式会社 シリコーン粘着剤組成物、その製造法及び粘着フィルム
JP2015212318A (ja) 2014-05-01 2015-11-26 信越化学工業株式会社 熱伝導性シリコーン組成物
US20150334871A1 (en) 2014-05-19 2015-11-19 Laird Technologies, Inc. Thermal interface materials with thin film sealants
CN104140678B (zh) 2014-06-29 2017-04-12 惠州市永卓科技有限公司 一种具有自粘性的导热硅脂及其制备方法
CN104098914B (zh) 2014-07-02 2017-09-29 深圳市安品有机硅材料有限公司 有机硅导热界面材料
KR102282332B1 (ko) 2014-07-07 2021-07-27 허니웰 인터내셔날 인코포레이티드 이온 스캐빈저를 갖는 열 계면 재료
CN106605310B (zh) 2014-09-01 2019-11-01 株式会社钟化 汽车用led灯散热器
JP6479167B2 (ja) 2014-09-22 2019-03-06 ダウ グローバル テクノロジーズ エルエルシー 超分岐状オレフィン流体を基とする放熱グリス
CN107078200B (zh) 2014-10-23 2018-12-07 株式会社钟化 Led灯散热器
EP3211041B1 (en) 2014-10-24 2020-02-12 Namics Corporation Conductive composition and electronic component using same
CN104479623B (zh) 2014-12-03 2016-05-18 湖南皓志科技股份有限公司 一种高导热常温固化有机硅灌封胶
KR102470083B1 (ko) 2014-12-05 2022-11-23 허니웰 인터내셔널 인코포레이티드 저열 임피던스를 갖는 고성능 열 계면 재료
CN104513487B (zh) 2014-12-10 2017-05-10 东莞兆舜有机硅科技股份有限公司 一种双组分导热硅凝胶及其用途
CN104497574A (zh) 2014-12-10 2015-04-08 深圳市博恩实业有限公司 多功能有机硅热界面材料
DE112014007281B4 (de) 2014-12-25 2022-07-07 Sekisui Polymatech Co., Ltd. Silikonzusammensetzung
WO2016111139A1 (ja) 2015-01-06 2016-07-14 富士高分子工業株式会社 蓄熱性熱伝導シート
US10431858B2 (en) 2015-02-04 2019-10-01 Global Web Horizons, Llc Systems, structures and materials for electrochemical device thermal management
CN104804705A (zh) 2015-05-06 2015-07-29 成都拓利化工实业有限公司 低释气量加成型无卤阻燃导热有机硅灌封胶及其制备方法
CN104861661A (zh) 2015-05-13 2015-08-26 浙江中天氟硅材料有限公司 一种低密度导热灌封胶及其制备方法
JP6510315B2 (ja) 2015-05-14 2019-05-08 デンカ株式会社 熱伝導性グリース用組成物、熱伝導性グリースおよび放熱部材
CN107708998A (zh) 2015-06-03 2018-02-16 株式会社钟化 金属树脂复合体
JP6323398B2 (ja) 2015-06-10 2018-05-16 信越化学工業株式会社 熱伝導性シリコーンパテ組成物
US10692797B2 (en) 2015-06-30 2020-06-23 Laird Technologies, Inc. Thermal interface materials with low secant modulus of elasticity and high thermal conductivity
CN106467668B (zh) 2015-08-19 2021-07-30 广东生益科技股份有限公司 一种有机硅树脂铝基覆铜板及其制备方法
CN108026375B (zh) 2015-09-09 2021-05-11 株式会社钟化 导热性树脂组合物
CN105111750A (zh) 2015-09-09 2015-12-02 蓝星（成都）新材料有限公司 一种led灌封用有机硅密封胶
CN105349113A (zh) 2015-10-14 2016-02-24 文雪烽 一种导热界面材料
JP6497291B2 (ja) 2015-10-14 2019-04-10 信越化学工業株式会社 絶縁放熱シート
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN105419339A (zh) 2015-12-01 2016-03-23 江苏晶河电子科技有限公司 一种高性能硅基导热凝胶及其制备方法
CN105566920A (zh) 2015-12-24 2016-05-11 平湖阿莱德实业有限公司 低渗油超软导热硅胶组合物及导热硅胶垫片及其制备方法
CN105670555A (zh) 2016-01-22 2016-06-15 何挺 一种高导热型的有机硅灌封胶
EP3426746B1 (en) 2016-03-08 2021-07-14 Honeywell International Inc. Phase change material
CN105925243A (zh) 2016-05-23 2016-09-07 东莞珂洛赫慕电子材料科技有限公司 一种室温固化型高导热柔性硅胶
CN105838322A (zh) 2016-05-26 2016-08-10 张学健 一种新型有机硅灌封胶
US20180030328A1 (en) 2016-07-26 2018-02-01 Honeywell International Inc. Gel-type thermal interface material
CN106221236B (zh) 2016-07-26 2019-09-10 深圳市金无曼工业新材料有限公司 可常温或加温凝胶化制备的双组份导热硅脂及其制备方法
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
PL3839005T3 (pl) 2016-10-12 2023-11-27 Honeywell International Inc. Materiały interfejsu termicznego zawierające środek barwiący
JP7129181B2 (ja) 2017-03-17 2022-09-01 旭化成株式会社 ヘッドマウントディスプレイ用部材
CN107057370A (zh) 2017-05-18 2017-08-18 平湖阿莱德实业有限公司 一种高导热填隙界面材料及其制备方法
US10344194B2 (en) 2017-09-27 2019-07-09 Momentive Performance Materials Inc. Thermal interface composition comprising ionically modified siloxane
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material

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