CN103865271B - 一种纳米杂化材料改性的有机硅导热电子灌封胶的制备方法 - Google Patents
一种纳米杂化材料改性的有机硅导热电子灌封胶的制备方法 Download PDFInfo
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- CN103865271B CN103865271B CN201410103369.5A CN201410103369A CN103865271B CN 103865271 B CN103865271 B CN 103865271B CN 201410103369 A CN201410103369 A CN 201410103369A CN 103865271 B CN103865271 B CN 103865271B
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10155894B2 (en) | 2014-07-07 | 2018-12-18 | Honeywell International Inc. | Thermal interface material with ion scavenger |
Families Citing this family (14)
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JP2017504715A (ja) | 2013-12-05 | 2017-02-09 | ハネウェル・インターナショナル・インコーポレーテッド | 調節されたpHを有するメタンスルホン酸第一スズ溶液 |
CN104017537A (zh) * | 2014-06-26 | 2014-09-03 | 轻工业部南京电光源材料科学研究所 | 一种用于led灯具封装的导热胶及其制备方法 |
ES2886846T3 (es) | 2014-12-05 | 2021-12-21 | Honeywell Int Inc | Materiales de interfaz térmica de alto rendimiento con baja impedancia térmica |
CN106467668B (zh) * | 2015-08-19 | 2021-07-30 | 广东生益科技股份有限公司 | 一种有机硅树脂铝基覆铜板及其制备方法 |
US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
KR102554661B1 (ko) | 2016-03-08 | 2023-07-13 | 허니웰 인터내셔널 인코포레이티드 | 상 변화 물질 |
US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
CN106753208B (zh) * | 2016-11-21 | 2020-01-14 | 北京化工大学 | 一种氧化石墨烯改性的led导热灌封胶及其制备方法 |
CN106832948A (zh) * | 2017-02-26 | 2017-06-13 | 苏州思创源博电子科技有限公司 | 一种氮化硼掺杂含氟硅环氧基聚合物封装材料制备方法 |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
CN114196373A (zh) * | 2021-12-30 | 2022-03-18 | 江西师范大学 | 一种非水凝胶柔性电子封装材料及制备方法和应用 |
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CN102731788A (zh) * | 2012-06-12 | 2012-10-17 | 中科院广州化学有限公司 | 一种有机硅杂化物及其有机硅复合涂料的制备方法 |
CN102993753A (zh) * | 2012-11-23 | 2013-03-27 | 中科院广州化学有限公司 | 一种复合杂化有机硅led封装材料及其制备方法和应用 |
CN102993440A (zh) * | 2011-09-16 | 2013-03-27 | 北京化工大学 | 光固化纳米杂化材料及其合成方法和用途 |
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US6797758B2 (en) * | 2000-04-05 | 2004-09-28 | The Bergquist Company | Morphing fillers and thermal interface materials |
CN101407635B (zh) * | 2008-11-14 | 2011-04-06 | 成都硅宝科技股份有限公司 | 一种加成型导热硅橡胶及其制造方法 |
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CN102993440A (zh) * | 2011-09-16 | 2013-03-27 | 北京化工大学 | 光固化纳米杂化材料及其合成方法和用途 |
CN102731788A (zh) * | 2012-06-12 | 2012-10-17 | 中科院广州化学有限公司 | 一种有机硅杂化物及其有机硅复合涂料的制备方法 |
CN102993753A (zh) * | 2012-11-23 | 2013-03-27 | 中科院广州化学有限公司 | 一种复合杂化有机硅led封装材料及其制备方法和应用 |
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US10155894B2 (en) | 2014-07-07 | 2018-12-18 | Honeywell International Inc. | Thermal interface material with ion scavenger |
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Inventor after: He Jianyun Inventor after: Ding Yumei Inventor after: Yang Weimin Inventor after: He Lichen Inventor after: Wang Qiang Inventor after: Tang Xia Inventor after: Wang Ruoyun Inventor before: He Jianyun Inventor before: He Lichen Inventor before: Wang Qiang Inventor before: Tang Xia Inventor before: Wang Ruoyun |
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