JP5635586B2 - デバイスの集積回路を試験するためのシステム及びその使用方法 - Google Patents

デバイスの集積回路を試験するためのシステム及びその使用方法 Download PDF

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JP5635586B2
JP5635586B2 JP2012502262A JP2012502262A JP5635586B2 JP 5635586 B2 JP5635586 B2 JP 5635586B2 JP 2012502262 A JP2012502262 A JP 2012502262A JP 2012502262 A JP2012502262 A JP 2012502262A JP 5635586 B2 JP5635586 B2 JP 5635586B2
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contactor
substrate
distribution board
cartridge
support structure
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JP2012522381A5 (enExample
JP2012522381A (ja
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スコット イー リンゼイ
スコット イー リンゼイ
ジュンジェ イェ
ジュンジェ イェ
ジョヴァーン ジョヴァノヴィック
ジョヴァーン ジョヴァノヴィック
シェーン ピー マラソン
シェーン ピー マラソン
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エイアー テスト システムズ
エイアー テスト システムズ
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
JP2012502262A 2009-03-25 2010-03-25 デバイスの集積回路を試験するためのシステム及びその使用方法 Active JP5635586B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/411,233 US8030957B2 (en) 2009-03-25 2009-03-25 System for testing an integrated circuit of a device and its method of use
US12/411,233 2009-03-25
PCT/US2010/028719 WO2010111526A1 (en) 2009-03-25 2010-03-25 System for testing an integrated circuit of a device and its method of use

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014212000A Division JP6013423B2 (ja) 2009-03-25 2014-10-16 デバイスの集積回路を試験するためのシステム及びその使用方法

Publications (3)

Publication Number Publication Date
JP2012522381A JP2012522381A (ja) 2012-09-20
JP2012522381A5 JP2012522381A5 (enExample) 2013-05-09
JP5635586B2 true JP5635586B2 (ja) 2014-12-03

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Family Applications (4)

Application Number Title Priority Date Filing Date
JP2012502262A Active JP5635586B2 (ja) 2009-03-25 2010-03-25 デバイスの集積回路を試験するためのシステム及びその使用方法
JP2014212000A Active JP6013423B2 (ja) 2009-03-25 2014-10-16 デバイスの集積回路を試験するためのシステム及びその使用方法
JP2016184318A Active JP6239714B2 (ja) 2009-03-25 2016-09-21 デバイスの集積回路を試験するためのシステム及びその使用方法
JP2017211502A Active JP6465947B2 (ja) 2009-03-25 2017-11-01 デバイスの集積回路を試験するためのシステム及びその使用方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2014212000A Active JP6013423B2 (ja) 2009-03-25 2014-10-16 デバイスの集積回路を試験するためのシステム及びその使用方法
JP2016184318A Active JP6239714B2 (ja) 2009-03-25 2016-09-21 デバイスの集積回路を試験するためのシステム及びその使用方法
JP2017211502A Active JP6465947B2 (ja) 2009-03-25 2017-11-01 デバイスの集積回路を試験するためのシステム及びその使用方法

Country Status (5)

Country Link
US (10) US8030957B2 (enExample)
EP (1) EP2411819A1 (enExample)
JP (4) JP5635586B2 (enExample)
SG (5) SG10201801948WA (enExample)
WO (1) WO2010111526A1 (enExample)

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CN107449942B (zh) * 2017-07-26 2021-03-02 王珍珍 一种集成电路板用省力测试设备
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KR102032290B1 (ko) * 2019-03-29 2019-10-15 주식회사 프로이천 핀 보드 조립체
CN109932612B (zh) * 2019-03-29 2022-05-17 山东云则信息技术有限公司 一种移动通讯应用接口测试装置
JP7453891B2 (ja) * 2020-10-06 2024-03-21 日本航空電子工業株式会社 電気部品検査器具
CN120254561A (zh) 2020-10-07 2025-07-04 雅赫测试系统公司 电子测试器
CN112798929B (zh) * 2020-12-29 2024-03-01 中科芯集成电路有限公司 一种基于双叶轮的柔性pcb板批量自动检测装置
JP7633566B2 (ja) * 2021-09-03 2025-02-20 日本電信電話株式会社 半導体モジュール検査装置
CN114132724B (zh) * 2021-11-25 2024-07-19 北京世迈腾科技有限公司 一种在线测试电路板翻板机构及翻转机
CN114035017B (zh) * 2021-11-25 2023-09-29 山东阅芯电子科技有限公司 适用于压接式功率半导体器件的测试装置
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KR102656532B1 (ko) 2022-08-29 2024-04-11 한국기술교육대학교 산학협력단 자동화된 슬롯다이코팅장치 및 그 제어방법
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