AU7329200A - Wafer level burn-in and electrical test system and method - Google Patents

Wafer level burn-in and electrical test system and method

Info

Publication number
AU7329200A
AU7329200A AU73292/00A AU7329200A AU7329200A AU 7329200 A AU7329200 A AU 7329200A AU 73292/00 A AU73292/00 A AU 73292/00A AU 7329200 A AU7329200 A AU 7329200A AU 7329200 A AU7329200 A AU 7329200A
Authority
AU
Australia
Prior art keywords
test system
wafer level
electrical test
level burn
burn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU73292/00A
Inventor
John Dinh Hoang
Jerzy Lobacz
Donald Paul Ii Richmond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aehr Test Systems Inc
Original Assignee
Aehr Test Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/353,121 external-priority patent/US6562636B1/en
Priority claimed from US09/353,214 external-priority patent/US6340895B1/en
Application filed by Aehr Test Systems Inc filed Critical Aehr Test Systems Inc
Publication of AU7329200A publication Critical patent/AU7329200A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
AU73292/00A 1999-07-14 2000-07-13 Wafer level burn-in and electrical test system and method Abandoned AU7329200A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/353,121 US6562636B1 (en) 1999-07-14 1999-07-14 Wafer level burn-in and electrical test system and method
US09/353,214 US6340895B1 (en) 1999-07-14 1999-07-14 Wafer-level burn-in and test cartridge
US09353121 1999-07-14
US09353214 1999-07-14
PCT/US2000/019482 WO2001004641A2 (en) 1999-07-14 2000-07-13 Wafer level burn-in and electrical test system and method

Publications (1)

Publication Number Publication Date
AU7329200A true AU7329200A (en) 2001-01-30

Family

ID=26997804

Family Applications (1)

Application Number Title Priority Date Filing Date
AU73292/00A Abandoned AU7329200A (en) 1999-07-14 2000-07-13 Wafer level burn-in and electrical test system and method

Country Status (4)

Country Link
JP (1) JP2003504889A (en)
KR (1) KR100751068B1 (en)
AU (1) AU7329200A (en)
WO (1) WO2001004641A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6815966B1 (en) * 2002-06-27 2004-11-09 Aehr Test Systems System for burn-in testing of electronic devices
EP2273279A1 (en) 2005-04-27 2011-01-12 Aehr Test Systems, Inc. Apparatus for testing electronic devices
KR20060122387A (en) * 2005-05-27 2006-11-30 삼창기업 주식회사 Analog to digtal converter module
WO2008124068A1 (en) * 2007-04-05 2008-10-16 Aehr Test Systems Electronics tester with a signal distribution board and a wafer chuck having different coefficients of thermal expansion
CN101644741B (en) * 2008-08-04 2011-11-09 京元电子股份有限公司 Multi-layer pre-sintering plate structure with power towers
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
KR101215945B1 (en) 2012-07-27 2012-12-27 (주) 에이피 시스템 Smart power and distribution system, and apparatus for testing memory module including the same
TWI836645B (en) 2016-01-08 2024-03-21 美商艾爾測試系統 Tester apparatus and method of testing microelectronic device
CN115210589B (en) * 2020-03-25 2023-07-18 华为技术有限公司 Chip testing device and testing method
KR102386473B1 (en) * 2020-11-05 2022-04-13 광운대학교 산학협력단 Wafer-level test method and apparatus of RF beamforming IC

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5103168A (en) * 1988-10-27 1992-04-07 Grumman Aerospace Corporation Stress testing equipment with an integral cooling plenum
JP3151203B2 (en) * 1988-11-23 2001-04-03 テキサス インスツルメンツ インコーポレイテツド Integrated circuit self-inspection equipment
JP3194040B2 (en) * 1992-04-27 2001-07-30 カシオ計算機株式会社 IC module
US5442282A (en) * 1992-07-02 1995-08-15 Lsi Logic Corporation Testing and exercising individual, unsingulated dies on a wafer
US5654588A (en) * 1993-07-23 1997-08-05 Motorola Inc. Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure
US5385487A (en) * 1993-08-30 1995-01-31 At&T Corp. Apparatus for electrically operating devices in a controlled environment
US5429510A (en) * 1993-12-01 1995-07-04 Aehr Test Systems, Inc. High-density interconnect technique
JP2925964B2 (en) * 1994-04-21 1999-07-28 松下電器産業株式会社 Semiconductor wafer container and method of inspecting semiconductor integrated circuit
US6577148B1 (en) * 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
JPH10163281A (en) * 1996-10-04 1998-06-19 Hitachi Ltd Semiconductor element and its manufacture
JP3364134B2 (en) * 1997-10-20 2003-01-08 松下電器産業株式会社 Wafer cassette
JP3294175B2 (en) * 1997-11-05 2002-06-24 東京エレクトロン株式会社 Wafer storage room for reliability test

Also Published As

Publication number Publication date
JP2003504889A (en) 2003-02-04
KR100751068B1 (en) 2007-08-22
WO2001004641A2 (en) 2001-01-18
WO2001004641A3 (en) 2001-12-06
KR20020036835A (en) 2002-05-16

Similar Documents

Publication Publication Date Title
AU5139900A (en) Liposome-enhanced test device and method
AU4432899A (en) Semiconductor wafer evaluating apparatus and method
AU1121801A (en) Method and apparatus for testing circuits with multiple clocks
EP1045438B8 (en) Probe card for testing semiconductor device, and semiconductor device test method
AU8031198A (en) Method and apparatus for test generation during circuit design
AU4557799A (en) On-chip circuit and method for testing memory devices
AU2000255886A1 (en) Reflex tester and method for measurement
AU3267999A (en) Nqr testing method and apparatus
AU2885999A (en) Method and apparatus for combined stuck-at fault and partial-scanned delay-faultbuilt-in self test
AU1991201A (en) Testing system and method for testing an object
AU1298701A (en) Method and device for diagnosing an inflammatory process
AU1222801A (en) Method and apparatus for testing plumbing installations
AU4388099A (en) Non-contact test method and apparatus
AU2204201A (en) Apparatus for and method of making electrical measurements on an object
HK1040285B (en) Method and apparatus for testing poles
AU2001272733A1 (en) Apparatus and method for electrical testing of electrical circuits
TW406860U (en) Wafer testing system and its probe device
AU5594200A (en) Microsystems integrated testing and characterization system and method
AU2002250528A1 (en) Semiconductor test system and associated methods for wafer level acceptance testing
AU2889299A (en) Formation testing apparatus and method
AU7329200A (en) Wafer level burn-in and electrical test system and method
EP1123639A4 (en) Wafer level burn-in and test thermal chuck and method
AU2001279190A1 (en) System and method for inspecting bumped wafers
TW411060U (en) Burn-in test socket
EP1111398A3 (en) Apparatus and method for inline testing of electrical components

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase