AU2001279190A1 - System and method for inspecting bumped wafers - Google Patents
System and method for inspecting bumped wafersInfo
- Publication number
- AU2001279190A1 AU2001279190A1 AU2001279190A AU7919001A AU2001279190A1 AU 2001279190 A1 AU2001279190 A1 AU 2001279190A1 AU 2001279190 A AU2001279190 A AU 2001279190A AU 7919001 A AU7919001 A AU 7919001A AU 2001279190 A1 AU2001279190 A1 AU 2001279190A1
- Authority
- AU
- Australia
- Prior art keywords
- inspecting
- bumped wafers
- bumped
- wafers
- inspecting bumped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
Landscapes
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Analysis (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/631,509 US6765666B1 (en) | 2000-08-03 | 2000-08-03 | System and method for inspecting bumped wafers |
| US09631509 | 2000-08-03 | ||
| PCT/US2001/024492 WO2002012870A2 (en) | 2000-08-03 | 2001-08-03 | System and method for inspecting bumped wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001279190A1 true AU2001279190A1 (en) | 2002-02-18 |
Family
ID=24531509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001279190A Abandoned AU2001279190A1 (en) | 2000-08-03 | 2001-08-03 | System and method for inspecting bumped wafers |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6765666B1 (en) |
| AU (1) | AU2001279190A1 (en) |
| TW (1) | TW508709B (en) |
| WO (1) | WO2002012870A2 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6765666B1 (en) | 2000-08-03 | 2004-07-20 | Semiconductor Technologies & Instruments, Inc. | System and method for inspecting bumped wafers |
| US7019826B2 (en) * | 2003-03-20 | 2006-03-28 | Agilent Technologies, Inc. | Optical inspection system, apparatus and method for reconstructing three-dimensional images for printed circuit board and electronics manufacturing inspection |
| US7539338B2 (en) * | 2004-06-01 | 2009-05-26 | Panasonic Corporation | Bump inspection apparatus and method for IC component, bump forming method for IC component, and mounting method for IC component |
| JP4530763B2 (en) * | 2004-08-23 | 2010-08-25 | 富士機械製造株式会社 | Part data creation method and part data creation apparatus |
| SG121898A1 (en) * | 2004-10-06 | 2006-05-26 | Generic Power Pte Ltd | System for 2-D and 3-D vision inspection |
| US7551272B2 (en) * | 2005-11-09 | 2009-06-23 | Aceris 3D Inspection Inc. | Method and an apparatus for simultaneous 2D and 3D optical inspection and acquisition of optical inspection data of an object |
| US9052294B2 (en) | 2006-05-31 | 2015-06-09 | The Boeing Company | Method and system for two-dimensional and three-dimensional inspection of a workpiece |
| US8050486B2 (en) * | 2006-05-16 | 2011-11-01 | The Boeing Company | System and method for identifying a feature of a workpiece |
| US7535560B2 (en) * | 2007-02-26 | 2009-05-19 | Aceris 3D Inspection Inc. | Method and system for the inspection of integrated circuit devices having leads |
| US7773220B2 (en) * | 2008-04-02 | 2010-08-10 | International Business Machines Corporation | Method and system for collecting alignment data from coated chips or wafers |
| US8144968B2 (en) * | 2009-01-12 | 2012-03-27 | Aceris 3D Inspection Inc. | Method and apparatus for scanning substrates |
| US8090251B2 (en) * | 2009-10-13 | 2012-01-03 | James Cameron | Frame linked 2D/3D camera system |
| US11538148B2 (en) * | 2020-05-22 | 2022-12-27 | Future Dial, Inc. | Defect detection of a component in an assembly |
| US11551349B2 (en) | 2020-05-22 | 2023-01-10 | Future Dial, Inc. | Defect detection and image comparison of components in an assembly |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5923430A (en) | 1993-06-17 | 1999-07-13 | Ultrapointe Corporation | Method for characterizing defects on semiconductor wafers |
| JPH07183697A (en) | 1993-12-24 | 1995-07-21 | Matsushita Electric Ind Co Ltd | Electronic component mounting apparatus |
| US5956134A (en) | 1997-07-11 | 1999-09-21 | Semiconductor Technologies & Instruments, Inc. | Inspection system and method for leads of semiconductor devices |
| US6606788B1 (en) | 1998-02-27 | 2003-08-19 | Matsushita Electric Industrial Co., Ltd. | Component recognizing method and apparatus |
| JPH11330798A (en) | 1998-05-19 | 1999-11-30 | Fuji Mach Mfg Co Ltd | Method for mounting electric component and system thereof |
| US6577757B1 (en) * | 1999-07-28 | 2003-06-10 | Intelligent Reasoning Systems, Inc. | System and method for dynamic image recognition |
| US6765666B1 (en) | 2000-08-03 | 2004-07-20 | Semiconductor Technologies & Instruments, Inc. | System and method for inspecting bumped wafers |
-
2000
- 2000-08-03 US US09/631,509 patent/US6765666B1/en not_active Expired - Lifetime
-
2001
- 2001-08-03 AU AU2001279190A patent/AU2001279190A1/en not_active Abandoned
- 2001-08-03 TW TW090119032A patent/TW508709B/en not_active IP Right Cessation
- 2001-08-03 WO PCT/US2001/024492 patent/WO2002012870A2/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002012870A2 (en) | 2002-02-14 |
| TW508709B (en) | 2002-11-01 |
| WO2002012870A3 (en) | 2002-05-02 |
| US6765666B1 (en) | 2004-07-20 |
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