TW411060U - Burn-in test socket - Google Patents

Burn-in test socket

Info

Publication number
TW411060U
TW411060U TW088204940U TW88204940U TW411060U TW 411060 U TW411060 U TW 411060U TW 088204940 U TW088204940 U TW 088204940U TW 88204940 U TW88204940 U TW 88204940U TW 411060 U TW411060 U TW 411060U
Authority
TW
Taiwan
Prior art keywords
burn
test socket
socket
test
Prior art date
Application number
TW088204940U
Other languages
Chinese (zh)
Inventor
Akira Kaneshige
Tomohiro Nakano
Isamu Yamamoto
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of TW411060U publication Critical patent/TW411060U/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW088204940U 1998-04-01 1999-05-12 Burn-in test socket TW411060U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10105894A JP3020030B2 (en) 1998-04-01 1998-04-01 Burn-in socket

Publications (1)

Publication Number Publication Date
TW411060U true TW411060U (en) 2000-11-01

Family

ID=14419623

Family Applications (2)

Application Number Title Priority Date Filing Date
TW088204940U TW411060U (en) 1998-04-01 1999-05-12 Burn-in test socket
TW088204939U TW399814U (en) 1998-04-01 1999-05-12 Test socket lattice

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW088204939U TW399814U (en) 1998-04-01 1999-05-12 Test socket lattice

Country Status (6)

Country Link
JP (1) JP3020030B2 (en)
KR (2) KR100581237B1 (en)
CN (2) CN1178065C (en)
MY (2) MY123246A (en)
TW (2) TW411060U (en)
WO (2) WO1999050676A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6267603B1 (en) 1998-04-01 2001-07-31 Molex Incorporated Burn-in test socket
US6283780B1 (en) 1998-04-01 2001-09-04 Molex Incorporated Test socket lattice
JP2002164135A (en) * 2000-11-26 2002-06-07 Isao Kimoto Socket
JP3789789B2 (en) * 2001-08-31 2006-06-28 株式会社エンプラス Socket for electrical parts
JP4368132B2 (en) 2003-04-25 2009-11-18 株式会社エンプラス Socket for electrical parts
KR100898409B1 (en) 2007-07-05 2009-05-21 주식회사 오킨스전자 Burn-in socket for lead-frame type chip package
KR101090303B1 (en) * 2009-06-12 2011-12-07 (주)브이알인사이트 Bank structure of FPGA board for a semiconductor design verification
US8888503B2 (en) * 2011-12-28 2014-11-18 Enplas Corporation Socket for electric parts
JP5836112B2 (en) * 2011-12-28 2015-12-24 株式会社エンプラス Socket for electrical parts
KR101485779B1 (en) 2013-06-28 2015-01-26 황동원 Socket device for testing an IC
KR101931623B1 (en) * 2016-12-20 2018-12-21 주식회사 오킨스전자 Soket comprising locker for fixing latch
CN109342773A (en) * 2018-08-17 2019-02-15 北方电子研究院安徽有限公司 A kind of Can aging board clamp
WO2020157921A1 (en) * 2019-01-31 2020-08-06 山一電機株式会社 Socket for inspection
KR102606908B1 (en) * 2020-12-23 2023-11-24 (주)마이크로컨텍솔루션 Test socket

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245747B2 (en) * 1991-09-18 2002-01-15 日本テキサス・インスツルメンツ株式会社 socket
JPH0677467B2 (en) * 1992-12-25 1994-09-28 山一電機株式会社 IC socket
JP3259109B2 (en) * 1993-02-08 2002-02-25 日本テキサス・インスツルメンツ株式会社 socket
JP2667633B2 (en) * 1994-02-24 1997-10-27 山一電機株式会社 IC holding device in IC socket
JPH0888063A (en) * 1994-09-16 1996-04-02 Yamaichi Electron Co Ltd Contact structure of ic socket
JPH09162332A (en) * 1995-12-13 1997-06-20 Toshiba Chem Corp Ic test socket for bga
JP3714642B2 (en) * 1996-07-30 2005-11-09 株式会社エンプラス Electrical connection device

Also Published As

Publication number Publication date
WO1999050677A1 (en) 1999-10-07
TW399814U (en) 2000-07-21
KR100581240B1 (en) 2006-05-22
KR100581237B1 (en) 2006-05-22
CN1178066C (en) 2004-12-01
JP3020030B2 (en) 2000-03-15
MY123246A (en) 2006-05-31
CN1266492A (en) 2000-09-13
CN1178065C (en) 2004-12-01
CN1266491A (en) 2000-09-13
KR20010013205A (en) 2001-02-26
WO1999050676A1 (en) 1999-10-07
JPH11297443A (en) 1999-10-29
KR20010013206A (en) 2001-02-26
MY124410A (en) 2006-06-30

Similar Documents

Publication Publication Date Title
SG81959A1 (en) Testing ic socket
SG81987A1 (en) Integrated circuit test socket
GB0012407D0 (en) Test socket
SG83791A1 (en) Probe socket for strip testing
TW411060U (en) Burn-in test socket
GB9811795D0 (en) Test apparatus
SG72735A1 (en) Test handler
EP1144237A4 (en) Multi-steer testing apparatus
GB9802091D0 (en) Device scan testing
GB2345146B (en) Stress testing apparatus
GB9820289D0 (en) Testing arrangement
SG97766A1 (en) Burn-in testing device
GB9809337D0 (en) BNC test connector
GB2342723B (en) Electrical test apparatus
GB2337606B (en) Test rig
SG94342A1 (en) Burn-in board
PL332672A1 (en) Testing probe
GB2337871B (en) Test connector
PL107887U1 (en) Vidion test chart
TW358549U (en) Tester for testing integrted circuit
GB9822553D0 (en) Test instrument
GB2368944B (en) Test device
GB9802584D0 (en) Seven pin towing socket tester
GB9810189D0 (en) Testing equipment
GB9817982D0 (en) Testing equipment

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model