MY124410A - Burn-in test socket. - Google Patents
Burn-in test socket.Info
- Publication number
- MY124410A MY124410A MYPI99001225A MYPI9901225A MY124410A MY 124410 A MY124410 A MY 124410A MY PI99001225 A MYPI99001225 A MY PI99001225A MY PI9901225 A MYPI9901225 A MY PI9901225A MY 124410 A MY124410 A MY 124410A
- Authority
- MY
- Malaysia
- Prior art keywords
- housing
- socket
- limit position
- circuit package
- burn
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A SOCKET (1) FOR BURN-IN TESTING OF AN INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICAL LEADS. THE SOCKET INCLUDES AN OUTER SOCKET HOUSING AND AN INNER SOCKET HOUSING (4)SLIDABLY MOVEABLE RELATIVE TO THE OUTER HOUSING BETWEEN AN UPPER LIMIT POSITION AND A LOWER LIMIT POSITION, THE INNER FOR SUPPORTING THE INREGRATED CIRCUIT PACKAGE THEREON AND HAVING A PLURALITY OF TERMINAL-RECEIVING CAVITIES(7) THEREIN. TYHE SOCKET FURTHER INCLUDES A PLURALITY OF TERMINALS (12) DISPOSED IN THE TERMINAL-RECIEVING OF SAID INNER HOUSING (4) FOR CONTACTING THE LEADS OF THE INTEGRATED CIRCUIT PACKAGE, A CAM MECHANISM (27) FOR RAISING AND LOWERING THE INNER HOUSING BETWEEN THE UPPER LIMIT POSITION AND LOWER LIMIT POSITION RELATIVE TO THE OUTER HOUSING, AND A LATCH MECHANISM (34) FOR HOLDING AND RELEASING THE INTEGRATED CIRCIUT PACKAGE RELATIVE TI THE INNER HOUSING. (FIG. 1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10105894A JP3020030B2 (en) | 1998-04-01 | 1998-04-01 | Burn-in socket |
Publications (1)
Publication Number | Publication Date |
---|---|
MY124410A true MY124410A (en) | 2006-06-30 |
Family
ID=14419623
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI99001225A MY124410A (en) | 1998-04-01 | 1999-03-31 | Burn-in test socket. |
MYPI99001233A MY123246A (en) | 1998-04-01 | 1999-03-31 | Test socket lattice |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI99001233A MY123246A (en) | 1998-04-01 | 1999-03-31 | Test socket lattice |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP3020030B2 (en) |
KR (2) | KR100581240B1 (en) |
CN (2) | CN1178066C (en) |
MY (2) | MY124410A (en) |
TW (2) | TW411060U (en) |
WO (2) | WO1999050677A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6267603B1 (en) | 1998-04-01 | 2001-07-31 | Molex Incorporated | Burn-in test socket |
US6283780B1 (en) | 1998-04-01 | 2001-09-04 | Molex Incorporated | Test socket lattice |
JP2002164135A (en) * | 2000-11-26 | 2002-06-07 | Isao Kimoto | Socket |
JP3789789B2 (en) * | 2001-08-31 | 2006-06-28 | 株式会社エンプラス | Socket for electrical parts |
JP4368132B2 (en) * | 2003-04-25 | 2009-11-18 | 株式会社エンプラス | Socket for electrical parts |
KR100898409B1 (en) | 2007-07-05 | 2009-05-21 | 주식회사 오킨스전자 | Burn-in socket for lead-frame type chip package |
KR101090303B1 (en) * | 2009-06-12 | 2011-12-07 | (주)브이알인사이트 | Bank structure of FPGA board for a semiconductor design verification |
JP5836112B2 (en) * | 2011-12-28 | 2015-12-24 | 株式会社エンプラス | Socket for electrical parts |
US8888503B2 (en) * | 2011-12-28 | 2014-11-18 | Enplas Corporation | Socket for electric parts |
KR101485779B1 (en) * | 2013-06-28 | 2015-01-26 | 황동원 | Socket device for testing an IC |
KR101931623B1 (en) * | 2016-12-20 | 2018-12-21 | 주식회사 오킨스전자 | Soket comprising locker for fixing latch |
CN109342773A (en) * | 2018-08-17 | 2019-02-15 | 北方电子研究院安徽有限公司 | A kind of Can aging board clamp |
WO2020157921A1 (en) * | 2019-01-31 | 2020-08-06 | 山一電機株式会社 | Socket for inspection |
KR102606908B1 (en) * | 2020-12-23 | 2023-11-24 | (주)마이크로컨텍솔루션 | Test socket |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3245747B2 (en) * | 1991-09-18 | 2002-01-15 | 日本テキサス・インスツルメンツ株式会社 | socket |
JPH0677467B2 (en) * | 1992-12-25 | 1994-09-28 | 山一電機株式会社 | IC socket |
JP3259109B2 (en) * | 1993-02-08 | 2002-02-25 | 日本テキサス・インスツルメンツ株式会社 | socket |
JP2667633B2 (en) * | 1994-02-24 | 1997-10-27 | 山一電機株式会社 | IC holding device in IC socket |
JPH0888063A (en) * | 1994-09-16 | 1996-04-02 | Yamaichi Electron Co Ltd | Contact structure of ic socket |
JPH09162332A (en) * | 1995-12-13 | 1997-06-20 | Toshiba Chem Corp | Ic test socket for bga |
JP3714642B2 (en) * | 1996-07-30 | 2005-11-09 | 株式会社エンプラス | Electrical connection device |
-
1998
- 1998-04-01 JP JP10105894A patent/JP3020030B2/en not_active Expired - Fee Related
-
1999
- 1999-03-31 MY MYPI99001225A patent/MY124410A/en unknown
- 1999-03-31 WO PCT/US1999/007079 patent/WO1999050677A1/en active IP Right Grant
- 1999-03-31 CN CNB998006726A patent/CN1178066C/en not_active Expired - Fee Related
- 1999-03-31 KR KR1019997011193A patent/KR100581240B1/en not_active IP Right Cessation
- 1999-03-31 CN CNB998006718A patent/CN1178065C/en not_active Expired - Fee Related
- 1999-03-31 WO PCT/US1999/007078 patent/WO1999050676A1/en active IP Right Grant
- 1999-03-31 KR KR1019997011192A patent/KR100581237B1/en not_active IP Right Cessation
- 1999-03-31 MY MYPI99001233A patent/MY123246A/en unknown
- 1999-05-12 TW TW088204940U patent/TW411060U/en not_active IP Right Cessation
- 1999-05-12 TW TW088204939U patent/TW399814U/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1178066C (en) | 2004-12-01 |
TW411060U (en) | 2000-11-01 |
JPH11297443A (en) | 1999-10-29 |
CN1266491A (en) | 2000-09-13 |
WO1999050676A1 (en) | 1999-10-07 |
CN1266492A (en) | 2000-09-13 |
KR20010013206A (en) | 2001-02-26 |
TW399814U (en) | 2000-07-21 |
KR100581237B1 (en) | 2006-05-22 |
MY123246A (en) | 2006-05-31 |
WO1999050677A1 (en) | 1999-10-07 |
JP3020030B2 (en) | 2000-03-15 |
KR20010013205A (en) | 2001-02-26 |
KR100581240B1 (en) | 2006-05-22 |
CN1178065C (en) | 2004-12-01 |
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