TW344876B - Carrier having interchangeable substrate used for testing of semiconductor dies - Google Patents

Carrier having interchangeable substrate used for testing of semiconductor dies

Info

Publication number
TW344876B
TW344876B TW084105914A TW84105914A TW344876B TW 344876 B TW344876 B TW 344876B TW 084105914 A TW084105914 A TW 084105914A TW 84105914 A TW84105914 A TW 84105914A TW 344876 B TW344876 B TW 344876B
Authority
TW
Taiwan
Prior art keywords
substrate
die
base
testing
contacts
Prior art date
Application number
TW084105914A
Other languages
Chinese (zh)
Inventor
G Wood Alan
M Farnworth Warren
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/124,899 external-priority patent/US5495179A/en
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Application granted granted Critical
Publication of TW344876B publication Critical patent/TW344876B/en

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Apparatus for testing a discrete bare semiconductor die, comprising: a) a substrate for providing an electrical connection between the die and test circuitry; b) the substrate including a plurality of contacts in electrical communication with circuit traces, the contacts adapted to establish electrical communication with contact locations on the die; c) a base for retaining the die and substrate; d) a latching mechanism attached to the base for securing the substrate to the base, the latching mechanism including terminal contacts adapted to contact the substrate and establish an electrical connection between the circuit traces on the substrate and the test circuitry; and e) clamp means attached to the base for biasing the die and substrate together and forcing the contacts on the substrate against the contact locations on the die with a predetermined force.
TW084105914A 1993-09-21 1995-06-10 Carrier having interchangeable substrate used for testing of semiconductor dies TW344876B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/124,899 US5495179A (en) 1991-06-04 1993-09-21 Carrier having interchangeable substrate used for testing of semiconductor dies

Publications (1)

Publication Number Publication Date
TW344876B true TW344876B (en) 1998-11-11

Family

ID=22417338

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105914A TW344876B (en) 1993-09-21 1995-06-10 Carrier having interchangeable substrate used for testing of semiconductor dies

Country Status (2)

Country Link
JP (1) JP2716663B2 (en)
TW (1) TW344876B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7746088B2 (en) 2005-04-29 2010-06-29 Applied Materials, Inc. In-line electron beam test system
US7786742B2 (en) 2006-05-31 2010-08-31 Applied Materials, Inc. Prober for electronic device testing on large area substrates
US7847566B2 (en) 2004-02-12 2010-12-07 Applied Materials, Inc. Configurable prober for TFT LCD array test

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6166908A (en) * 1999-10-01 2000-12-26 Intel Corporation Integrated circuit cartridge
US6367263B1 (en) 2000-05-31 2002-04-09 Intel Corporation Integrated circuit refrigeration device
US7411337B2 (en) 2001-11-16 2008-08-12 Intel Corporation Electrical energy-generating system and devices and methods related thereto
US6859057B2 (en) * 2002-09-17 2005-02-22 Aehr Test Systems Die carrier
TWI490508B (en) 2012-12-17 2015-07-01 Princo Corp Flexible testing device and testing method thereof
TWI716906B (en) * 2019-06-19 2021-01-21 萬潤科技股份有限公司 Method and equipment for attaching heat dissipation rubber pad

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62160676A (en) * 1985-12-31 1987-07-16 日本テキサス・インスツルメンツ株式会社 Socket
JPH0518708Y2 (en) * 1986-04-14 1993-05-18
JPH0726714Y2 (en) * 1988-08-11 1995-06-14 セイコー電子工業株式会社 IC socket
JPH03102848A (en) * 1989-09-18 1991-04-30 Hitachi Ltd Aging method of semiconductor device
JP3346425B2 (en) * 1992-01-30 2002-11-18 富士通株式会社 Bare chip test socket
JPH05218153A (en) * 1992-02-03 1993-08-27 Fujitsu Ltd Semiconductor testing carrier and attaching and removing method of chip from semiconductor testing carrier

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7847566B2 (en) 2004-02-12 2010-12-07 Applied Materials, Inc. Configurable prober for TFT LCD array test
US7746088B2 (en) 2005-04-29 2010-06-29 Applied Materials, Inc. In-line electron beam test system
US7786742B2 (en) 2006-05-31 2010-08-31 Applied Materials, Inc. Prober for electronic device testing on large area substrates

Also Published As

Publication number Publication date
JP2716663B2 (en) 1998-02-18
JPH07113840A (en) 1995-05-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees