MY125628A - Ic testing apparatus - Google Patents

Ic testing apparatus

Info

Publication number
MY125628A
MY125628A MYPI99001250A MYPI9901250A MY125628A MY 125628 A MY125628 A MY 125628A MY PI99001250 A MYPI99001250 A MY PI99001250A MY PI9901250 A MYPI9901250 A MY PI9901250A MY 125628 A MY125628 A MY 125628A
Authority
MY
Malaysia
Prior art keywords
contact section
testing apparatus
semiconductor devices
test
ejecting
Prior art date
Application number
MYPI99001250A
Inventor
Hiroto Nakamura
Shin Nemoto
Kazuyuki Yamashita
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of MY125628A publication Critical patent/MY125628A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

AN IC TESTING APPARATUS PROVIDED WITH A FIRST SUCTION HEAD 304C FOR TRANSFERRING SEMICONDUCTOR DEVICES CONVEYED TO A FIRST POSITION CR5 IN A TEST PORTION TO A CONTACT SECTION 302A OF A TEST HEAD 302 FOR A TEST, THEN EJECTING THE SEMICONDUCTOR DEVICES FROM THE CONTACT SECTION 302A AND A SECOND SUCTION HEAD 304C FOR TRANSFERRING SEMICONDUCTOR DEVICES COVEYED TO A SECOND POSITION CR5 IN THE TEST PORTION TO THE CONTACT SECTION 302A, THEN EJECTING THE SEMICONDUCTORDEVICES FROM THE CONTACT SECTION 302A.(FIG.2)
MYPI99001250A 1998-04-02 1999-04-01 Ic testing apparatus MY125628A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10106913A JPH11287843A (en) 1998-04-02 1998-04-02 Ic-tester

Publications (1)

Publication Number Publication Date
MY125628A true MY125628A (en) 2006-08-30

Family

ID=14445680

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI99001250A MY125628A (en) 1998-04-02 1999-04-01 Ic testing apparatus

Country Status (7)

Country Link
JP (1) JPH11287843A (en)
KR (1) KR100722644B1 (en)
CN (1) CN1232184A (en)
DE (1) DE19914776A1 (en)
MY (1) MY125628A (en)
SG (1) SG81269A1 (en)
TW (1) TW429315B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4566482B2 (en) * 2001-09-07 2010-10-20 ヤマハ発動機株式会社 Parts testing equipment
KR100440780B1 (en) * 2002-01-23 2004-07-19 삼성테크윈 주식회사 Apparatus placing electronic part on tray
KR100679155B1 (en) * 2005-01-25 2007-02-05 (주)테크윙 Test handler
KR100714106B1 (en) 2005-12-15 2007-05-02 (주)테크윙 Test handler and operation method of test handler
CN101339204B (en) * 2007-07-05 2010-10-27 京元电子股份有限公司 Disc conveyer device
JP5087634B2 (en) 2007-10-31 2012-12-05 株式会社アドバンテスト Abnormality detection device for detecting abnormalities in contact part of contact arm
JP6069831B2 (en) * 2011-12-16 2017-02-01 富士電機株式会社 Semiconductor test equipment
KR101428655B1 (en) * 2013-02-08 2014-08-13 바이옵트로 주식회사 Apparatus for testing
CN109911541B (en) * 2019-01-29 2021-06-25 迈克医疗电子有限公司 Assembly line system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869636A (en) * 1987-06-24 1989-09-26 Reid-Ashman Manufacturing, Inc. Handler for IC packages
KR960007507B1 (en) * 1990-10-08 1996-06-05 가부시끼가이샤 아드반테스트 Ic test equipment
US5307011A (en) * 1991-12-04 1994-04-26 Advantest Corporation Loader and unloader for test handler
JP3316075B2 (en) * 1994-02-03 2002-08-19 株式会社アドバンテスト Auto handler for IC test equipment
US5588797A (en) * 1994-07-18 1996-12-31 Advantek, Inc. IC tray handling apparatus and method
JPH08170976A (en) * 1994-09-06 1996-07-02 Advantest Corp Handler mechanism for semiconductor tester
JP3412114B2 (en) * 1995-07-26 2003-06-03 株式会社アドバンテスト IC test equipment
JPH09113581A (en) * 1995-10-20 1997-05-02 Advantest Corp Ic testing device

Also Published As

Publication number Publication date
KR19990082894A (en) 1999-11-25
JPH11287843A (en) 1999-10-19
DE19914776A1 (en) 1999-11-25
CN1232184A (en) 1999-10-20
KR100722644B1 (en) 2007-05-28
TW429315B (en) 2001-04-11
SG81269A1 (en) 2001-06-19

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