TWI716906B - Method and equipment for attaching heat dissipation rubber pad - Google Patents
Method and equipment for attaching heat dissipation rubber pad Download PDFInfo
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- TWI716906B TWI716906B TW108121378A TW108121378A TWI716906B TW I716906 B TWI716906 B TW I716906B TW 108121378 A TW108121378 A TW 108121378A TW 108121378 A TW108121378 A TW 108121378A TW I716906 B TWI716906 B TW I716906B
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- heat
- rubber pad
- dissipating
- dissipating rubber
- seat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H18/00—Winding webs
- B65H18/08—Web-winding mechanisms
- B65H18/10—Mechanisms in which power is applied to web-roll spindle
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Labeling Devices (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
本發明提供一種散熱膠墊貼合方法及設備,包括:使被貼物被盛載於一載盤並於一輸送流路被搬送;使散熱膠墊間隔排列於一料帶上;使一貼合裝置設置該料帶並將該散熱膠墊貼覆在該載盤上的被貼物;藉此使散熱膠墊可以自動化方式進行貼合於被貼物,以獲取較佳經濟效益。 The present invention provides a method and equipment for attaching heat-dissipating rubber pads, which include: placing an object to be attached on a tray and being transported in a conveying flow path; arranging the heat-dissipating rubber pads on a material belt at intervals; The bonding device sets the material tape and sticks the heat-dissipating rubber pad to the affixed object on the carrier plate; thereby, the heat-dissipating rubber pad can be attached to the affixed object in an automated manner to obtain better economic benefits.
Description
本發明係有關於一種貼合方法及設備,尤指一種將散熱膠墊以自動化方式貼覆在被貼物上的散熱膠墊貼合方法及設備。 The present invention relates to a bonding method and equipment, in particular to a heat-dissipating rubber pad bonding method and equipment for automatically attaching a heat-dissipating rubber pad to a substrate.
按,一般的晶片封裝製程中常會先在一基板上塗覆黏膠,再將一晶粒黏附在基板上,而晶粒的上方必須再塗覆一層散熱膠液,然後再將一散熱片黏附在該散熱膠液上並罩覆在該晶粒及該基板上方;近來該散熱膠液已逐漸被以一種具有散熱功能的散熱膠墊取代,該散熱膠墊通常具有上、下兩面呈雙面膠的狀態,每片該散熱膠墊的上、下表面各黏覆一層包膜,操作者先將一層包膜撕下,再將已無包膜的該散熱膠墊表面貼在該晶粒上表面,然後將另一側面的包膜撕下,再將該散熱片貼在該散熱膠墊上方。 According to the general chip packaging process, adhesive is often applied to a substrate, and then a die is attached to the substrate. A layer of heat dissipation adhesive must be applied on the die, and then a heat sink is attached to the The heat-dissipating glue liquid covers and covers the die and the substrate; recently, the heat-dissipating glue liquid has been gradually replaced by a heat-dissipating glue pad with heat dissipation function. The heat-dissipating glue pad usually has upper and lower sides with double-sided adhesive The upper and lower surfaces of each piece of the heat-dissipating rubber pad are each covered with a layer of coating film. The operator first tears off the layer of coating film, and then sticks the surface of the heat-dissipating rubber pad that has no coating on the upper surface of the die , And then tear off the film on the other side, and then stick the heat sink on top of the heat sink pad.
先前技術以該散熱膠墊來取代散熱膠液,雖然可以減少散熱膠液的塗覆製程,但以人為方式進行每片該散熱膠墊的黏附亦無法提昇製程的效益,且每片該散熱膠墊貼附的品質不一,在大量生產上不具經濟效益。 The prior art replaces the heat-dissipating glue with the heat-dissipating glue pad. Although the coating process of the heat-dissipating glue can be reduced, it is impossible to improve the efficiency of the process by manually adhering each heat-dissipating glue pad. The quality of the pads is different, and it is not economical in mass production.
爰是,本發明的目的,在於提供一種具有較佳經濟效益的散熱膠墊貼合方法。 The purpose of the present invention is to provide a method for attaching heat dissipation rubber pads with better economic benefits.
本發明的另一目的,在於提供一種具有較佳經濟效益的散熱膠墊貼合設備。 Another object of the present invention is to provide a heat-dissipating rubber pad bonding equipment with better economic benefits.
本發明的又一目的,在於提供一種用以執行如所述散熱膠墊貼合方法的設備。 Another object of the present invention is to provide a device for performing the heat-dissipating rubber pad bonding method.
依據本發明目的之散熱膠墊貼合方法,包括:使被貼物被盛載於一載盤並於一輸送流路被搬送;使散熱膠墊間隔排列於一料帶上;使一貼合裝置設置該料帶並將該散熱膠墊貼覆在該載盤上的被貼物。 The method for attaching heat-dissipating rubber pads according to the object of the present invention includes: placing the object to be attached on a carrier plate and being transported in a conveying flow path; arranging the heat-dissipating rubber pads on a material belt at intervals; The device sets the material tape and sticks the heat-dissipating rubber pad on the affixed object on the carrier plate.
依據本發明另一目的之散熱膠墊貼合設備,包括:一輸送流路,該輸送流路上設有被貼物被盛載於一載盤被搬送;一料帶,包覆有間隔排列的散熱膠墊;一貼合裝置,供設置該料帶,並可被位移於輸送流路上方,將該料帶中的該散熱膠墊貼覆在該載盤上的被貼物。 According to another object of the present invention, a heat-dissipating rubber pad laminating device includes: a conveying flow path, the conveying flow path is provided with a to-be-applied object to be carried on a carrier plate to be conveyed; a material belt covered with spaced arrangement Heat-dissipating rubber pad; a bonding device for setting the material belt, and can be displaced above the conveying flow path, the heat-dissipating rubber pad in the material belt is pasted on the substrate on the carrier.
依據本發明又一目的之散熱膠墊貼合設備,包括:用以執行如所述散熱膠墊貼合方法的設備。 According to another object of the present invention, a heat-dissipating rubber pad bonding device includes: a device for performing the heat-dissipating rubber pad bonding method.
本發明實施例之散熱膠墊貼合方法及設備,由於操作者可以不用再以人工作貼合,自動化的貼合操作使生產效率提昇,精度增加且品質一致,具有實質的效益。 The heat-dissipating rubber pad bonding method and equipment of the embodiment of the present invention, because the operator does not need to use human work for bonding, the automated bonding operation improves the production efficiency, increases the precision and the quality is consistent, and has substantial benefits.
A:被貼物 A: Object
A1:基板 A1: substrate
A2:晶粒 A2: Die
A3:散熱膠墊 A3: Thermal pad
A31:第一包膜 A31: The first film
A32:第二包膜 A32: Second film
A321:針孔 A321: Pinhole
A4:散熱片 A4: Heat sink
A5:料帶 A5: Material belt
A6:料捲 A6: Reel
A61:軸孔 A61: Shaft hole
A62:套筒 A62: Sleeve
B:機台 B: Machine
C:輸送流路 C: Conveying flow path
C1:第一軌架 C1: The first rail frame
C11:治具 C11: Fixture
C12:軌座 C12: Rail seat
C111:吸附座 C111: Adsorption seat
C112:側架 C112: Side frame
C113:皮帶 C113: Belt
C114:軌道 C114: Orbit
C2:第二軌架 C2: Second rail
C21:側架 C21: Side frame
C22:皮帶 C22: belt
C23:軌道 C23: Orbit
C3:載盤 C3: Disk
C31:鏤空區間 C31: hollow interval
D:貼合裝置 D: Fitting device
D1:貼合機構 D1: Fitting mechanism
D11:載座 D11: Carrier
D12:擺座 D12: Seating
D121:上擺座 D121: upper seat
D122:下擺座 D122: hem seat
D13:偏轉機構 D13: Deflection mechanism
D131:樞軸 D131: pivot
D132:樞動部 D132: Pivot
D133:驅動件 D133: Driver
D134:固定件 D134: fixed parts
D135:輸出軸 D135: output shaft
D136:擺臂 D136: swing arm
D137:連接件 D137: Connector
D14:昇降座 D14: Lift seat
D141:固定件 D141: fixed parts
D142:滑軌 D142: Slide rail
D143:驅動件 D143: Driver
D144:連接件 D144: Connector
D145:微調件 D145: Fine tuning parts
D15:貼抵頭 D15: Stick to the head
D151:輪座 D151: Wheel seat
D151:輪座 D151: Wheel seat
D152:滑軌 D152: Slide rail
D153:齒條 D153: rack
D154:驅動件 D154: Driver
D155:固定架 D155: fixed frame
D156:齒輪 D156: Gear
D16:位移導桿 D16: Displacement guide rod
D161:驅動件 D161: Driver
D162:滑軌 D162: Slide rail
D2:固定板 D2: fixed plate
D21:鏤設區間 D21: Cut out the interval
D22:固定部 D22: Fixed part
D23:導桿 D23: Guide rod
D3:軌座 D3: Rail seat
D4:對位檢視單元 D4: Alignment inspection unit
D5:驅動機構 D5: Drive mechanism
D51:驅動件 D51: Driver
D52:皮帶 D52: Belt
D53:驅動軸 D53: Drive shaft
D531:凸鍵 D531: convex key
D54:針輪 D54: pin wheel
D541:凹溝 D541: groove
D542:嵌體 D542: Inlay
D55:軸桿 D55: Shaft
D551:聯結件 D551: coupling
D56:嵌抵件 D56: Embedded parts
D57:間隔件 D57: Spacer
D58:壓帶機構 D58: Belt pressing mechanism
D581:驅度件 D581: Drive parts
D582:壓抵件 D582: Compression piece
D583:鏤空區間 D583: hollow interval
D584:桿狀軸輪 D584: Rod axle wheel
D59:孔位檢測單元 D59: Hole detection unit
D591:調整桿 D591: Adjusting lever
D592:檢測器 D592: detector
D6:料帶輪 D6: Material pulley
D61:距離感測器 D61: Distance sensor
D62:皮帶 D62: Belt
D7:第一捲輪 D7: The first reel
D71:驅動件 D71: Driver
D72:皮帶 D72: Belt
D8:第二捲輪 D8: Second reel
E:龍門軌架 E: Gantry rail frame
E1:懸臂 E1: Cantilever
E11:滑軌 E11: Slide rail
E2:立柱 E2: Column
E3:驅動件 E3: Driver
E4:螺桿 E4: Screw
F:荷重單元 F: load cell
G:散熱膠墊檢視單元 G: Thermal pad inspection unit
H:量測機構 H: Measuring mechanism
H1:壓抵件 H1: Compression piece
H11:鏤空區間 H11: hollow interval
H12:上框座 H12: Upper frame seat
H13:下框座 H13: Lower frame seat
H2:軌座 H2: Rail seat
H3:滑軌 H3: Slide rail
H4:軌座 H4: Rail seat
H5:入料檢視單元 H5: Incoming inspection unit
H6:厚度量測單元 H6: Thickness measurement unit
H61:上檢視元件 H61: Upper view component
H62:下檢視元件 H62: View component down
圖1係本發明實施例中被貼物示意圖。 Figure 1 is a schematic diagram of an object to be attached in an embodiment of the present invention.
圖2係本發明實施例中被貼物貼上散熱膠墊及散熱片的分解示意圖。 FIG. 2 is an exploded schematic diagram of the heat-dissipating rubber pad and the heat-dissipating fin attached to the sticker in the embodiment of the present invention.
圖3係本發明實施例中設有散熱膠墊的料帶形成料捲之立體示意圖。 Fig. 3 is a three-dimensional schematic diagram of a roll formed by a material strip provided with a heat dissipation rubber pad in an embodiment of the present invention.
圖4係本發明實施例中貼合設備的立體示意圖。 Fig. 4 is a three-dimensional schematic diagram of the laminating device in the embodiment of the present invention.
圖5係本發明實施例中貼合裝置與下方各機構配置關係示意圖。 Figure 5 is a schematic diagram of the configuration relationship between the laminating device and the various mechanisms below in the embodiment of the present invention.
圖6係本發明實施例中量測機構示意圖。 Fig. 6 is a schematic diagram of the measurement mechanism in the embodiment of the present invention.
圖7係本發明實施例中貼合裝置的立體示意圖。 Fig. 7 is a perspective schematic view of the laminating device in the embodiment of the present invention.
圖8係本發明實施例中貼合裝置一側的後側立體示意圖。 Fig. 8 is a perspective schematic view of the rear side of the laminating device in the embodiment of the present invention.
圖9係本發明實施例中貼合裝置另一側的後側立體示意圖。 Fig. 9 is a perspective schematic view of the other side of the laminating device in the embodiment of the present invention.
圖10係本發明實施例中貼合裝置的貼合機構立體示意圖。 Fig. 10 is a perspective schematic view of the laminating mechanism of the laminating device in the embodiment of the present invention.
圖11係本發明實施例中貼合機構卸下昇降座及其下方機構的立體示意圖。 Figure 11 is a perspective schematic view of the laminating mechanism removing the lifting seat and its lower mechanism in the embodiment of the present invention.
圖12係本發明實施例中貼合機構之昇降座及其下方機構的立體示意圖。 Fig. 12 is a three-dimensional schematic diagram of the lifting seat and the lower mechanism of the laminating mechanism in the embodiment of the present invention.
圖13係本發明實施例中貼抵頭與位於昇降座下方的機構立體示意圖。 Fig. 13 is a three-dimensional schematic diagram of the pressing head and the mechanism under the lifting seat in the embodiment of the present invention.
圖14係本發明實施例中驅動機構立體示意圖。 Fig. 14 is a three-dimensional schematic diagram of the driving mechanism in the embodiment of the present invention.
圖15係本發明實施例中驅動機構側面示意圖。 Fig. 15 is a schematic side view of the driving mechanism in the embodiment of the present invention.
圖16係本發明實施例中貼合裝置繞設料帶之示意圖。 Fig. 16 is a schematic diagram of the wrapping device of the laminating device in the embodiment of the present invention.
圖17係本發明實施例中貼合機構下抵作貼合散熱膠墊的示意圖。 FIG. 17 is a schematic diagram of the bonding mechanism pressing down to bond the heat dissipation rubber pad in the embodiment of the present invention.
圖18係本發明實施例中貼合機構上移使第二包膜與散熱膠墊自一側分離的示意圖。 FIG. 18 is a schematic diagram of the laminating mechanism moving upward to separate the second coating film and the heat dissipation rubber pad from one side in the embodiment of the present invention.
請參閱圖1,本發明實施例之散熱膠墊貼合方法係以圖中所示已在基板A1上黏附晶粒A2的物件作為被貼物A,在進行本發明散熱膠墊貼合方法時,將如圖2所示地在該被貼物A的晶粒A2上方貼覆一片散熱膠墊A3,至於在後續製程中將散熱片A4黏附在該散熱膠墊A3上而覆蓋該基板A1及該晶粒A2則非本發明所討論。 Please refer to FIG. 1, the heat-dissipating rubber pad bonding method of the embodiment of the present invention uses the object shown in the figure to which the die A2 has been bonded to the substrate A1 as the to-be-attached object A. When performing the heat-dissipating rubber pad bonding method of the present invention , As shown in Figure 2, a heat dissipation pad A3 will be pasted on the die A2 of the substrate A, and the heat sink A4 will be adhered to the heat dissipation pad A3 in the subsequent process to cover the substrate A1 and The die A2 is not discussed in the present invention.
請參閱圖3,本發明實施例之散熱膠墊貼合方法將使該散熱膠墊A3被長條帶狀的第一包膜A31及第二包膜A32所包覆而形成一料帶A5,複數個該散熱膠墊A3被依序等間隔連續排列,各該散熱膠墊A3上、下兩面各具黏性而分別與該第一包膜A31及第二包膜A32內層黏附,其中,該第二包膜A32的兩側各具有一排等間隔連續排列的複數個針孔A321,兩排針孔A321間相隔一間距,該間距大於該散熱膠墊A3的寬度 並供該散熱膠墊A3黏置其中,該料帶A5可供捲在一設有軸孔A61的套筒A62外徑上而成一環捲狀的料捲A6。 Please refer to FIG. 3, the heat-dissipating rubber pad bonding method of the embodiment of the present invention will cause the heat-dissipating rubber pad A3 to be covered by the strip-shaped first coating film A31 and the second coating film A32 to form a strip A5. A plurality of the heat-dissipating rubber pads A3 are sequentially arranged at equal intervals, and the upper and lower sides of each heat-dissipating rubber pad A3 are respectively adhesive and adhere to the inner layers of the first coating film A31 and the second coating film A32, respectively. Each side of the second envelope A32 has a row of a plurality of pinholes A321 arranged continuously at equal intervals, and the two rows of pinholes A321 are separated by a distance which is greater than the width of the heat dissipation rubber pad A3 And the heat-dissipating rubber pad A3 is stuck in it, and the material tape A5 can be wound on the outer diameter of a sleeve A62 provided with a shaft hole A61 to form a ring-shaped material roll A6.
請參閱圖4,本發明實施例之散熱膠墊貼合設備可以如圖所示的裝置來實施,其係在一機台D上設有:一輸送流路C,其由一第一軌架C1及一第二軌架C2所構成;該第一軌架C1中設有一治具C11,該治具C11上設有矩陣排列的複數個凸起狀的矩形吸附座C111,每一吸附座C111各提供負壓的吸力;該第一軌架C1上設有由相間隔的兩個側架C112及分別各靠置兩個該側架C112相對之內側的二條皮帶C113所構成的軌道C114,該皮帶C113可受驅動使一矩形的載盤C3於該軌道C114中作直線位移搬送或定位在該治具C11上方;該載盤C3上設有矩陣排列的複數個鏤空區間C31,每一個該鏤空區間C31上方可供一被貼物A定位於該處,該治具C11可作上下昇降使其上的吸附座C111經該鏤空區間C31對被貼物A吸附作上頂或下降操作,該治具C11同時可受下方一軌座C12所驅動而在該軌座C12上於兩個側架C112間的該軌道C114下方循X軸向作位移;該第二軌架C2上設有由相間隔的兩個側架C21及分別各靠置兩個該側架C21相對之內側的二條皮帶C22所構成的軌道C23,該皮帶C22可受驅動使該載盤C3於該軌道23中作直線位移或定位;該第一軌架C1較第二軌架C2的長度大,並具有約略兩個該載盤C3的長度;該第一軌架C1上的該軌道C114與該第二軌架C2上的該軌道23以X軸向直線串聯對接並共同形成具有X軸向直線位移搬送的該輸送流路C;一貼合裝置D,設於該輸送流路C靠第一軌架C1的一端,該貼合裝置D設於該輸送流路C上方並設於一龍門軌架E水平橫設之Y軸向的一懸臂 E1上,而該懸臂E1兩端的二Z軸向立柱E2則分別各跨置於該輸送流路C的Y軸向兩側。 Please refer to FIG. 4, the heat-dissipating rubber pad bonding equipment of the embodiment of the present invention can be implemented by the device shown in the figure, which is provided on a machine D: a conveying flow path C, which consists of a first rail C1 and a second rail frame C2; the first rail frame C1 is provided with a jig C11, the jig C11 is provided with a plurality of convex rectangular adsorption seats C111 arranged in a matrix, each adsorption seat C111 Each provides suction of negative pressure; the first rail C1 is provided with a rail C114 composed of two spaced side racks C112 and two belts C113 respectively resting on the inner sides of the two side racks C112. The belt C113 can be driven to make a rectangular carrier C3 move linearly in the track C114 or be positioned above the fixture C11; the carrier C3 is provided with a plurality of hollow sections C31 arranged in a matrix, each of which is hollow Above the section C31, an object A can be positioned there, and the fixture C11 can be raised and lowered so that the suction seat C111 on it can be used for uplifting or lowering the object A through the hollow section C31. The tool C11 can be driven by the lower rail seat C12 to move on the rail seat C12 under the track C114 between the two side frames C112 to move along the X axis; the second rail frame C2 is provided with a distance The two side frames C21 and the two belts C22 respectively leaning on the inner sides of the two side frames C21 constitute a track C23. The belts C22 can be driven to make the disk carrier C3 linearly move or move in the track 23 Positioning; the first rail C1 is longer than the second rail C2, and has approximately two lengths of the carrier C3; the track C114 on the first rail C1 and the second rail C2 The rails 23 are connected in series with the X-axis in a straight line and jointly form the conveying flow path C with X-axis linear displacement conveying; a bonding device D is provided at one end of the conveying flow path C close to the first rail frame C1, the The laminating device D is arranged above the conveying flow path C and is arranged on a horizontal cantilever of the Y-axis of a gantry rail E E1, and the two Z-axis uprights E2 at both ends of the cantilever E1 are respectively straddling the two sides of the Y-axis of the conveying flow path C.
請參閱圖4、5,該貼合裝置D可受一馬達構成的驅動件E3驅動的螺桿E4所連動而在該懸臂E1的水平橫向滑軌E11上作Y軸向位移;該輸送流路C一側的機台D上的該貼合裝置D作Y軸向位移的路徑上,於該貼合裝置D下方分別各設有一荷重單元F及一由下往上進行檢視的散熱膠墊檢視單元G。 Please refer to Figures 4 and 5, the laminating device D can be linked by a screw E4 driven by a driving element E3 formed by a motor to make Y-axis displacement on the horizontal transverse slide E11 of the cantilever E1; the conveying flow path C On the path where the laminating device D on the machine D on one side moves in the Y-axis direction, a load unit F and a heat dissipation pad inspection unit for inspection from bottom to top are respectively provided below the laminating device D G.
請參閱圖4、6,該輸送流路C靠該第二軌架C2的一端設有一量測機構H,該量測機構H以一矩形的壓抵件H1設於一Y軸向軌座H2上,該軌座H2可驅動該壓抵件H1作Y軸向位移,該軌座H2兩端並跨設於分別各位於該第二軌架C2的Y軸向兩側的X軸向一滑軌H3及一軌座H4上,該軌座H2可受該軌座H4驅動而連動該壓抵件H1在該軌座H4及該滑軌H3上作X軸向位移;該壓抵件H1設有一鏤空區間H11而區隔出一上框座H12及一下框座H13,該壓抵件H1被連動在該軌座H4及該滑軌H3上作X軸向位移時,該上框座H12在該輸送流路C的該第二軌架C2上方位移,而下框座H13則位移於該輸送流路C的該第二軌架C2下方;該上框座H12上設有一入料檢視單元H5,可對該輸送流路C的該第二軌架C2上該載盤C3的被貼物A進行方位的檢視;該入料檢視單元H5一側的該壓抵件H1上設有一厚度量測單元H6,該厚度量測單元H6於上下相對應的該上框座H12上設有由上往下檢視一上檢視元件H61,而在下框座H13上則設有由下往上檢視的一下檢視元件H62,可依據該入料檢視單元H5取得的方位資訊對該輸送流路C的該第二軌架C2上該載盤C3的被貼物A進行厚度的檢視。 4 and 6, the conveying flow path C is provided with a measuring mechanism H at one end of the second rail frame C2, and the measuring mechanism H is arranged on a Y-axis rail seat H2 with a rectangular pressing member H1 On the upper side, the rail seat H2 can drive the pressing member H1 to move in the Y-axis direction. The two ends of the rail seat H2 are straddling the X-axis on both sides of the Y-axis of the second rail frame C2. On the rail H3 and a rail seat H4, the rail seat H2 can be driven by the rail seat H4 to link the pressing member H1 to make X-axis displacement on the rail seat H4 and the slide rail H3; the pressing member H1 is provided A hollow section H11 separates an upper frame seat H12 and a lower frame seat H13. When the pressing member H1 is linked to the rail seat H4 and the slide rail H3 for X-axis displacement, the upper frame seat H12 is The second rail frame C2 of the conveying flow path C is displaced above, and the lower frame seat H13 is displaced below the second rail frame C2 of the conveying flow path C; the upper frame seat H12 is provided with an incoming inspection unit H5 , The direction of the object A to be attached to the tray C3 on the second rail C2 of the conveying flow path C can be inspected; a thickness measurement is provided on the pressing member H1 on the side of the feeding inspection unit H5 Unit H6, the thickness measurement unit H6 is provided with a top-to-bottom viewing element H61 on the upper frame seat H12 corresponding to the top and bottom, and a bottom-to-up viewing element H61 is provided on the lower frame seat H13. The component H62 can inspect the thickness of the object A of the carrier plate C3 on the second rail C2 of the conveying flow path C according to the orientation information obtained by the input inspection unit H5.
請參閱圖7~9,該貼合裝置D以一貼合機構D1的一載座D11經一固定板D2的一鏤設區間D21固設於該固定板D2後側的一Z軸向軌座D3上,該貼合機構D1並以一擺座D12與該固定板D2固設,藉此使該貼合機構D1以該載座D11受該與該軌座D3驅動作Z軸向位移時,可一併連動該固定板D2作Z軸向同步位移;該擺座D12包括分別各位於該載座D11上、下方的上擺座D121及下擺座D122;該貼合機構D1的一側設有一由上往下作檢視的對位檢視單元D4,該對位檢視單元D4並未設於該固定板D2上,而係位於該固定板D2一側在相隔間距下以一固定件D41與該固定板D2後側的該軌座D3固設並受該軌座D3連動;該固定板D2前側表面上設有包括:一驅動機構D5,設於該貼合機構D1相對該對位檢視單元D4的另一側;該驅動機構D5受一驅動件D51在該固定板D2後側以一皮帶D52所連動而對如圖3中該料帶A5的第二包膜A32進行牽引驅動;一料帶輪D6,設於該貼合機構D1的上方,並受該固定板D2後側一驅動件D61以一皮帶D62所驅動而可作旋轉,該料帶輪D6用以套置如圖3中該料捲A6,該固定板D2前側表面上設有一距離感測器D61,用以偵測與該料捲A6圓周間的間距變化,以推算測知該料捲A6是否以將用盡而應進行更換;一第一捲輪D7,設於該貼合機構D1相對該對位檢視單元D4的另一側,並位於該驅動機構D5上方,其受該固定板D2後側一驅動件D71所驅動可作旋轉;用以捲收如圖3中該料帶A5的第一包膜A31;一第二捲輪D8,設於該貼合機構D1相對該對位檢視單元D4的另一側,並位於該驅動機構D5上方與該第一捲輪D7下方之間,其受該固定板 D2後側該驅動件D71所驅動的皮帶D72與該第一捲輪D7同步連動作旋轉;用以捲收如圖3中該料帶A5的第二包膜A32。 Please refer to Figures 7-9, the laminating device D uses a carrier D11 of a laminating mechanism D1 to be fixed to a Z-axis rail seat on the rear side of the fixing plate D2 via a hollow section D21 of a fixing plate D2 On D3, the laminating mechanism D1 is fixed with a swing seat D12 and the fixing plate D2, so that when the laminating mechanism D1 uses the carrier D11 to be driven by the rail seat D3 for Z-axis displacement, The fixed plate D2 can be linked together for Z-axis synchronous displacement; the swing seat D12 includes an upper swing seat D121 and a lower swing seat D122 respectively located on and below the carrier D11; one side of the bonding mechanism D1 The alignment inspection unit D4 is viewed from top to bottom. The alignment inspection unit D4 is not provided on the fixing plate D2, but is located on the side of the fixing plate D2 at a distance from the fixing member D41 to the fixing The rail seat D3 on the rear side of the plate D2 is fixed and linked by the rail seat D3; the front surface of the fixed plate D2 is provided with a driving mechanism D5, which is arranged on the bonding mechanism D1 relative to the alignment inspection unit D4 The other side; the driving mechanism D5 is linked by a driving member D51 on the rear side of the fixed plate D2 with a belt D52 to drive the second envelope A32 of the material belt A5 as shown in FIG. 3; a material pulley D6 is set above the laminating mechanism D1, and is driven by a driving member D61 on the rear side of the fixing plate D2 to rotate by a belt D62. The material pulley D6 is used to cover the material as shown in FIG. Roll A6, a distance sensor D61 is provided on the front surface of the fixing plate D2 to detect the change in the distance between the circumference of the roll A6 and calculate whether the roll A6 is about to be used up and should be replaced A first reel D7, located on the other side of the attaching mechanism D1 relative to the alignment inspection unit D4, and located above the driving mechanism D5, which is driven by a driving member D71 on the rear side of the fixing plate D2 For rotating; used to wind up the first wrapping film A31 of the tape A5 as shown in Figure 3; a second reel D8, located on the other side of the laminating mechanism D1 relative to the alignment inspection unit D4, and located Between the upper part of the driving mechanism D5 and the lower part of the first reel D7, it is affected by the fixed plate The belt D72 driven by the driving member D71 on the rear side of D2 rotates synchronously with the first reel D7; it is used for winding the second wrapping film A32 of the material belt A5 as shown in FIG. 3.
請參閱圖10,該貼合機構D1的該載座D11與該擺座D12間設有一偏轉機構D13,該偏轉機構D13係在該載座D11與該擺座D12的上擺座D121、下擺座D122間以Z軸向共同串設一樞軸D131,於該樞軸D131兩側的該擺座D12的上擺座D121兩側分別各設有外凸的二樞動部D132,一馬達構成的驅動件D133藉一固定件D134固設於該載座D11前側上,其輸出軸D135與一擺臂D136中央固設,該擺臂D136兩側分別各以一連接件D137與該二樞動部D132樞設,使該擺臂D136及二連接件D137、二樞動部D132共同形成一四連桿機構,當該驅動件D133驅動該輸出軸D135旋轉時,與該輸出軸D135固設的該擺臂D136將作水平旋擺,使兩側樞設的二連接件D137形成一前、一後的錯動,令二樞動部D132連動該擺座D12的上擺座D121,使與該上擺座D121、下擺座D122固設的該固定板D2以該樞軸D131為軸心連動其上的各構件作偏擺;該載座D11下方設有一可作Z軸向上下位移的昇降座D14,該昇降座D14下方設有一貼抵頭D15,該貼抵頭D15由中心軸呈X軸向設置之桿狀的輪體所構成,該貼抵頭D15一側的該固定板D2上以X軸向設有一與該貼抵頭D15平行的位移導桿D16,該位移導桿D15受圖8所示該固定板D2後方汽壓缸所構成的一驅動件D161所驅動,而可在一Z軸向的滑軌D162上作上、下位移。 Please refer to FIG. 10, a deflection mechanism D13 is provided between the carrier D11 and the swing seat D12 of the laminating mechanism D1, and the deflection mechanism D13 is attached to the upper swing seat D121 and the lower swing seat of the carrier D11 and the swing seat D12 A pivot D131 is connected in series in the Z-axis between D122. On both sides of the upper swing seat D121 of the swing seat D12 on both sides of the pivot D131, two convex pivot parts D132 are respectively provided. The driving member D133 is fixed on the front side of the carrier D11 by a fixing member D134, and the output shaft D135 and a swing arm D136 are fixed at the center. The two sides of the swing arm D136 are respectively provided with a connecting member D137 and the two pivoting parts D132 is pivoted so that the swing arm D136, the two connecting parts D137, and the two pivoting parts D132 jointly form a four-link mechanism. When the driving part D133 drives the output shaft D135 to rotate, the The swing arm D136 will swing horizontally, so that the two connecting members D137 pivoted on both sides form a front and one rear displacement, so that the two pivoting parts D132 link the upper swing seat D121 of the swing seat D12 to make the The fixed plate D2 fixed to the swing seat D121 and the bottom swing seat D122 uses the pivot D131 as the axis to move the components thereon for deflection; under the carrier D11 is provided a lift seat D14 that can move up and down in the Z axis A sticking head D15 is arranged under the lifting seat D14. The sticking head D15 is composed of a rod-shaped wheel body with a central axis in the X-axis direction. The fixing plate D2 on the side of the sticking head D15 is marked with X A displacement guide rod D16 parallel to the abutment head D15 is provided in the axial direction. The displacement guide rod D15 is driven by a driving member D161 formed by a pressure cylinder behind the fixing plate D2 as shown in FIG. The axial slide rail D162 moves up and down.
請參閱圖11~12,該昇降座D14以一固定件D141設於該固定板D2前側的二Z軸向滑軌D142上,並受該載座D11兩側之該固定板D2上二固定部D22下方固設的二驅動件D143所驅動而可作上下位移,該昇降座D14與下擺座D122藉一連接件D144固設,並自該昇降座D14底 部一通孔(圖中未示)螺經一螺絲構成的微調件D145至該連接件A144;該昇降座D14隨該固定板D2的偏轉而可被連動偏轉,並可藉該微調件D145微調該昇降座D14的下限位移距離。 Please refer to Figures 11 to 12, the lifting seat D14 is provided with a fixing member D141 on the two Z-axis slide rails D142 on the front side of the fixing plate D2, and is supported by two fixing parts on the fixing plate D2 on both sides of the carrier D11 The two driving parts D143 fixed below D22 can be driven to move up and down. The lifting seat D14 and the lower swing seat D122 are fixed by a connecting piece D144, and from the bottom of the lifting seat D14 A through hole (not shown in the figure) is screwed to the connecting piece A144 through a fine adjustment piece D145 formed by a screw; the lifting seat D14 can be deflected in conjunction with the deflection of the fixing plate D2, and the fine adjustment piece D145 can be used to fine-tune the The lower limit displacement distance of the lifting seat D14.
請參閱圖13,該貼抵頭D15藉一輪座D151設於該昇降座D14底部相隔間距的X軸向滑軌D152上,該輪座D151前側固設以Y軸向固設一齒條D153,一馬達構成的驅動件D154藉一固定架155固設於該昇降座D14前側,該驅動件D154以一齒輪D156囓合該齒條D153,藉此以驅動該齒條D153連動該輪座D151及該貼抵頭D15作Y軸向左右位移。 Please refer to Fig. 13, the sticking head D15 is arranged on the X-axis sliding rail D152 spaced apart at the bottom of the lifting seat D14 by a wheel seat D151, and a rack D153 is fixed on the front side of the wheel seat D151 in the Y axis. A driving member D154 composed of a motor is fixed on the front side of the lifting base D14 by a fixing frame 155. The driving member D154 engages the rack D153 with a gear D156 to drive the rack D153 to link the wheel base D151 and the The sticking head D15 moves left and right in the Y axis.
請參閱圖14、15,該驅動機構D5設有相隔間距同軸套嵌於X軸向的一驅動軸D53的二針輪D54,該驅動軸D53上設有徑向的凸鍵D531,該凸鍵D531的軸向長度超過二針輪D54間的間距,二針輪受該凸鍵D531嵌設而在徑向上受限制與該驅動軸D53相對旋轉,二針輪D54在該驅動軸D53的軸向上則可相併靠或遠離地自由作X軸向位移;該驅動軸D53可受驅動進行旋轉並連動二針輪D54同步旋轉,每一該針輪D54的外圓周上設有環設的V型的凹溝D541及等間距環列佈設複數個凸設的嵌體D542,其中,二針輪D5上的二環設的該凹溝D54相對位於相向的內側,二環列佈設的該嵌體D542相對位於相向的外側;該驅動軸D53上、下兩側相互平行分別各設有一軸桿D55,每一軸桿D55上分別相隔間距同軸套嵌各設有二嵌抵件D56,該嵌抵件D56為一圓盤狀的輪體,其圓形周緣形成倒V狀配合該針輪D54之凹溝D541的形狀,其中位於該驅動軸D53下方之一側的該軸桿D55上於二嵌抵件D56間樞套有一間隔件D57後被鎖固定位,而位於該驅動軸D53上方之另一側的該軸桿D55上於二嵌抵件D56則可於該軸桿D55上自由作X軸向位移;每一軸桿D55上的該嵌抵件D56分別各以周緣嵌抵入該驅動軸D53上的該針輪D54的外圓周上相 對應的凹溝D541;二軸桿D55的前端部間設有一聯結件D551;該間隔件D57依圖1中料帶A5的寬度規格可作更換,改變料帶A5的寬度規格時,僅需改變該間隔件D57並改變該驅動軸D53下方該軸桿D55上的二嵌抵件D56間距,在調整該二嵌抵件D56時,該驅動軸D53上的二針輪D54及該驅動軸D53上方該軸桿D55上的二嵌抵件D56均將被連動而作調整;該驅動軸D53上的二針輪D54一側設有一壓帶機構D58,其設有可受由汽壓缸構成的一驅動件D581驅動作Y軸向朝該驅動軸D53上的二針輪D54靠近或遠離位移的壓抵件D582,該壓抵件D582與該驅動軸D53相隔間距並相互平行,該壓抵件D582呈一矩形框狀並設有一鏤空區間D583,該鏤空區間D583的上、下方分別各為桿狀軸輪D584,該壓抵件D582可在被驅動靠近該驅動軸D53上的二針輪D54時,使二針輪D54可部份靠入該鏤空區間D583中,使該二針輪D54牽引一帶狀物時,自該驅動軸D53上的二針輪D54一側提供將該帶狀物壓靠該針輪D54的一施力;該驅動軸D53上的二針輪D54上方的該固定板D2上設有一孔位檢測單元D59,該孔位檢測單元D59設有X軸向在相隔圖3中該料帶A5的兩排該針孔A321寬度間距下位於一調整桿D591上的二檢測器D592,該檢測器D592用以檢測該料帶A5的該針孔A321位置,以確認輸經該驅動軸D53上的二針輪D54與該壓帶機構D58的該壓抵件D582間的料帶A5是否該針孔A321與該針輪D54上的該嵌體D542對應,以傳遞訊息控制該壓帶機構D58的該壓抵件D582被驅動向該驅動軸D53上的二針輪D54移靠。 14 and 15, the drive mechanism D5 is provided with two pin wheels D54 coaxially sleeved on a drive shaft D53 in the X-axis at a distance apart, and the drive shaft D53 is provided with a radial convex key D531, the convex key The axial length of D531 exceeds the distance between the two needle wheels D54. The two needle wheels are embedded by the convex key D531 and are restricted to rotate relative to the drive shaft D53 in the radial direction. The two needle wheels D54 are in the axial direction of the drive shaft D53. Then it can move side by side or far away freely in the X-axis direction; the drive shaft D53 can be driven to rotate and link the two needle wheels D54 to rotate synchronously, and the outer circumference of each needle wheel D54 is provided with a ring V-shaped A plurality of convex inlays D542 are arranged in an evenly spaced groove D541 and a plurality of convex inlays D542 arranged in an equally spaced array. Among them, the two-ring grooves D54 on the two needle wheels D5 are relatively located on the opposite inner side, and the inlays D542 arranged in two-ring rows Located on the opposite outer side; the upper and lower sides of the drive shaft D53 are parallel to each other with a shaft D55 respectively, and each shaft D55 is coaxially sleeved at a distance from each other and each is provided with two embedding pieces D56, the embedding piece D56 It is a disc-shaped wheel body whose circular periphery forms an inverted V shape to fit the groove D541 of the pin wheel D54, wherein the shaft D55 located on one side of the driving shaft D53 is on two inserting pieces A spacer D57 is pivotally sleeved between D56 and then locked in place, and the shaft D55 on the other side above the drive shaft D53 on the two inserting parts D56 can freely move the X axis on the shaft D55 Displacement; the inserting piece D56 on each shaft D55 is respectively inserted into the outer circumference of the pin wheel D54 on the drive shaft D53 with a peripheral edge Corresponding groove D541; there is a connecting piece D551 between the front ends of the two shafts D55; the spacer D57 can be replaced according to the width specification of the material belt A5 in Figure 1. When changing the width specification of the material belt A5, only need to change The spacer D57 changes the distance between the two inserting pieces D56 on the shaft D55 below the drive shaft D53. When adjusting the two inserting pieces D56, the two pin wheels D54 on the drive shaft D53 and the upper part of the drive shaft D53 The two inserts D56 on the shaft D55 will be linked for adjustment; the drive shaft D53 on the side of the two pin wheels D54 is provided with a belt pressing mechanism D58, which is provided with a pressure cylinder composed of The driving member D581 drives as a pressing member D582 that moves toward or away from the two pin wheels D54 on the driving shaft D53 in the Y-axis direction. The pressing member D582 and the driving shaft D53 are spaced apart and parallel to each other. The pressing member D582 It is in the shape of a rectangular frame and is provided with a hollow section D583. The upper and lower sections of the hollow section D583 are respectively rod-shaped axle wheels D584. The pressing member D582 can be driven close to the second pin wheel D54 on the drive shaft D53. , So that the two needle wheels D54 can partially lean into the hollow space D583, so that when the two needle wheels D54 pull a belt, the belt is pressed from the side of the two needle wheels D54 on the drive shaft D53. Relying on a force of the pin wheel D54; the fixed plate D2 above the two pin wheels D54 on the drive shaft D53 is provided with a hole position detection unit D59, and the hole position detection unit D59 is provided with an X axis at a distance. Two detectors D592 located on an adjusting rod D591 under the width spacing of the two rows of pinholes A321 of the strip A5, the detector D592 is used to detect the position of the pinhole A321 of the strip A5 to confirm the passing of the The tape A5 between the two needle wheels D54 on the drive shaft D53 and the pressing member D582 of the belt pressing mechanism D58 is the pinhole A321 corresponding to the inlay D542 on the needle wheel D54 to transmit information to control the pressing The pressing member D582 of the belt mechanism D58 is driven to move against the second pin wheel D54 on the driving shaft D53.
請參閱圖3、16,該料帶輪D6上的該料帶A5在該貼合裝置D上,係先撥取該第一包膜A31使其捲繞於該第一捲輪D7上,而該仍黏附有該散熱膠墊A3的該第二包膜A32則以該散熱膠墊A3朝該對位檢 視單元D4一側的方式,被沿著該固定板D2上的複數支X軸向導桿D23牽引而經由該貼合機構D1與該對位檢視單元D4間繞至該貼合機構D1之該貼抵頭D15下方,使該散熱膠墊A3朝下方並進行貼合作業,完成貼合後僅剩的該第二包膜A32再繞經該驅動機構D5的該針輪D54與該壓抵件D582間,並在可受該孔位檢測單元D59偵測下被捲繞於該第二捲輪D8上。 Please refer to Figures 3 and 16, the material tape A5 on the material belt wheel D6 is on the laminating device D, and the first wrapping film A31 is first pulled out to wind it on the first reel wheel D7, and The second film A32 still attached to the heat dissipation rubber pad A3 uses the heat dissipation rubber pad A3 to face the alignment check The way on the side of the viewing unit D4 is drawn along the plurality of X-axis guide rods D23 on the fixed plate D2, and is routed between the bonding mechanism D1 and the alignment inspection unit D4 to the bonding mechanism D1 Place the bottom of the abutment head D15 so that the heat dissipation rubber pad A3 faces downward and perform the bonding operation. After the bonding is completed, only the second coating film A32 that remains is passed around the pin wheel D54 of the driving mechanism D5 and the pressing member D582, and can be wound on the second reel D8 under the detection of the hole position detection unit D59.
本發明實施例在進行散熱膠墊A3的貼合製程時,盛載該被貼物A的該載盤C3由該輸送流路C的該第二軌架C2上之該軌道23被進行輸送,並在該第二軌架C2上之該軌道23上先被該入料檢視單元H5檢視並取得該被貼物A的方位,該厚度量測單元H6再依據該方位資訊對該被貼物A進行檢視,使該上檢視元件H61對應於該被貼物A的晶粒A2上方,而下檢視元件H62經該載盤C3的該鏤空區間C31對應該被貼物A的該基板A1底部下方,以取得該被貼物A包括該基板A1及該晶粒的A2總高度的厚度資訊。 In the embodiment of the present invention, during the laminating process of the heat-dissipating rubber pad A3, the carrier plate C3 containing the object A is transported by the rail 23 on the second rail C2 of the transport flow path C, And the track 23 on the second rail C2 is first inspected by the input inspection unit H5 to obtain the orientation of the object A, and the thickness measurement unit H6 then performs the inspection on the object A according to the orientation information. Perform inspection so that the upper viewing element H61 corresponds to the top of the die A2 of the object A, and the lower viewing element H62 corresponds to the bottom of the substrate A1 of the object A through the hollow section C31 of the carrier C3. In order to obtain the thickness information of the object A including the total height of the substrate A1 and the total height of the die A2.
完成厚度測量後,盛載該被貼物A的該載盤C3由該第二軌架C2上之該軌道23被進行輸送至該輸送流路C的該第一軌架C1的該軌道C114上進行該散熱膠墊A3的貼合;在該散熱膠墊A3貼合前,該載盤C3位於該軌道C114的該治具C11上方,該治具C11將作上昇使其上的吸附座C111經該鏤空區間C31對被貼物A吸附並作上頂脫離該載盤C3至一預設定位的操作;在完成該散熱膠墊A3貼合後,該治具C11將作下降使其上的吸附座C111經該鏤空區間C31對被貼物A吸附並作下降,並使吸附已貼有該散熱膠墊A3的該被貼物A被連動下降至位於該載盤C3上。 After the thickness measurement is completed, the tray C3 containing the object A is transported from the rail 23 on the second rail C2 to the rail C114 of the first rail C1 of the conveying flow path C Carry out the bonding of the heat dissipation rubber pad A3; before the heat dissipation rubber pad A3 is bonded, the carrier plate C3 is located above the fixture C11 of the track C114, and the fixture C11 will be raised so that the suction seat C111 on it will pass The hollow space C31 adsorbs the object A and performs an operation of lifting off the carrier plate C3 to a preset position; after the heat dissipation rubber pad A3 is attached, the jig C11 will be lowered to make it adsorb on it The seat C111 adsorbs and lowers the sticker A through the hollow space C31, and the sticker A with the heat dissipation rubber pad A3 attached to it is moved down to be on the carrier plate C3.
進行該散熱膠墊A3的貼合時,該貼合裝置D在該龍門軌架E的該懸臂E1上位移至該散熱膠墊檢視單元G上方,使該貼合機構D1下 方該第二包膜A32下表面黏附的該散熱膠墊A3被該散熱膠墊檢視單元G由下往上檢視取得該散熱膠墊A3方位資訊,並根據該方位資訊,在該貼合裝置D續移至該第一軌架C1的該軌道C114上該載盤C3的該被貼物A上方時,將先以該對位檢視單元D4對該被貼物A由上往下檢視取得該被貼物A方位資訊,比對該散熱膠墊A3的方位資訊及該被貼物A的方位資訊,若該被貼物A的方位與該散熱膠墊檢視單元G取得的該散熱膠墊A3方位資訊不對應時,該偏轉機構D13將驅動使該貼合裝置D執行整個該固定板D2連動其上的構件相對該載座D11偏轉,以連動該第二包膜A32下表面黏附的該散熱膠墊A3的方位作偏轉,以調整與該被貼物A的方位對應,然後該Z軸向之該軌座D3再驅動該載座D11,使該貼合機構D1及固定板D2和其上的構件下移,以如圖17所示將該第二包膜A32下表面黏附的該散熱膠墊A3黏附貼合在該被貼物A上;該Z軸向之該軌座D3驅動使該貼合機構D1下移時的下限位移距離,可以由該昇降座D14受二驅動件D143驅動所作的上下位移在配合該微調件D145下作微調。 When the heat dissipation rubber pad A3 is bonded, the bonding device D is displaced on the cantilever E1 of the gantry rail E to above the heat dissipation rubber pad inspection unit G, so that the bonding mechanism D1 is lowered The heat-dissipating rubber pad A3 adhered to the lower surface of the second coating film A32 is inspected by the heat-dissipating rubber pad inspection unit G from bottom to top to obtain the position information of the heat-dissipating rubber pad A3, and according to the position information, the laminating device D When moving to the track C114 of the first rail C1 above the object A on the carrier C3, the alignment inspection unit D4 is used to view the object A from top to bottom to obtain the object A. The position information of the sticker A is compared with the position information of the heat dissipation pad A3 and the position information of the sticker A. If the position of the sticker A is compared with the position of the heat dissipation pad A3 obtained by the heat dissipation pad inspection unit G When the information does not correspond, the deflection mechanism D13 will drive the laminating device D to execute the entire fixing plate D2 and move the components on it to deflect relative to the carrier D11, so as to link the heat dissipation glue attached to the lower surface of the second envelope A32 The position of the pad A3 is deflected to adjust the position corresponding to the position of the object A, and then the rail seat D3 in the Z-axis drives the carrier D11 to make the bonding mechanism D1 and the fixed plate D2 and the above The component is moved down, and the heat dissipating rubber pad A3 attached to the lower surface of the second envelope A32 is adhered to the object A as shown in FIG. 17; the rail seat D3 in the Z axis drives the paste The lower limit displacement distance when the closing mechanism D1 moves down can be fine-tuned by the up-and-down displacement of the lifting seat D14 driven by the two driving parts D143 in cooperation with the fine-adjusting part D145.
請參閱圖17,該貼合機構D1的該貼抵頭D15兩側分別各設有依輸送方向區分為位於進入側固定不能位移的一固定導桿D24,及位於輸出側的可作上、下位移的該位移導桿D16;該第二包膜A32下表面黏附的該散熱膠墊A3寬度在該固定導桿D24與該位移導桿D16間,在執行該散熱膠墊A3黏附貼合於該被貼物A時,該位移導桿D16被驅動下降至與該固定導桿D24等高的水平高度定位,該貼抵頭D15較該水平高度定位略低;該散熱膠墊A3抵觸該被貼物A時,該貼抵頭D15的被驅動以其桿狀的輪體滾動間接經由該下表面黏附該散熱膠墊A3的該第二包膜A32接觸該散熱膠墊A3的方式,自該散熱膠墊A3相對該被貼物A的另一側,由該固 定導桿D24往該位移導桿D16方向移輥位移,使該散熱膠墊A3被黏附貼合於該被貼物A上。 Please refer to FIG. 17, the sticking head D15 of the sticking mechanism D1 is respectively provided with a fixed guide rod D24 which is located on the entry side and can not be displaced according to the conveying direction, and is located on the output side for up and down The displacement guide D16 of the displacement; the width of the heat dissipation rubber pad A3 adhered to the lower surface of the second envelope A32 is between the fixed guide rod D24 and the displacement guide D16, and the heat dissipation rubber pad A3 is adhered to the When the object A is attached, the displacement guide rod D16 is driven down to the same height as the fixed guide rod D24. The attachment head D15 is positioned slightly lower than the horizontal height; the heat dissipation rubber pad A3 resists the attachment When the object A, the sticking head D15 is driven to roll with its rod-shaped wheel body indirectly through the lower surface adhered to the second envelope A32 of the heat dissipation pad A3 to contact the heat dissipation pad A3, from the heat dissipation The rubber pad A3 is opposite to the other side of the object A, The fixed guide rod D24 moves a roller displacement in the direction of the displacement guide rod D16, so that the heat-dissipating rubber pad A3 is adhered to the object A.
請參閱圖18,在該散熱膠墊A3黏附貼合完成時,該貼抵頭D15被驅動由該位移導桿D16往該固定導桿D24方向回位,此時在該第二包膜A32貼靠該位移導桿D16連動下使位移導桿D16被驅動上移,而令該位移導桿D16側的該散熱膠墊A3一側之該第二包膜A32先被自已黏附貼合於該被貼物A上的該散熱膠墊A3表面剝離,並在該貼合機構D1被驅動上移時,使該第二包膜A32與已黏附貼合於該被貼物A上的該散熱膠墊A3完全分離。 Please refer to FIG. 18, when the heat-dissipating rubber pad A3 is adhered, the sticking head D15 is driven to return to the fixed guide rod D24 by the displacement guide rod D16. At this time, the second film A32 is pasted The displacement guide D16 is driven to move upward under the linkage of the displacement guide D16, so that the second coating film A32 on the side of the heat dissipation rubber pad A3 on the side of the displacement guide D16 is first self-adhered to the cover. The surface of the heat-dissipating rubber pad A3 on the sticker A is peeled off, and when the laminating mechanism D1 is driven to move up, the second wrapping film A32 is bonded to the heat-dissipating rubber pad attached to the sticker A A3 is completely separated.
該貼合裝置D之該貼合機構D1下壓該被貼物A的荷重控制,可以使該貼合機構D1先至該荷重單元F上方,並在剝離黏附該散熱膠墊A3的該第二包膜A32下,使該貼合機構D1的該貼抵頭D15直接抵至該荷重單元F測量下壓的荷重值,以控制貼合時下壓的荷重。 The laminating mechanism D1 of the laminating device D presses down the load control of the to-be-attached object A, so that the laminating mechanism D1 can go to the top of the load unit F first, and peel off the second adhesive pad A3. Under the envelope A32, the abutting head D15 of the bonding mechanism D1 is directly abutted to the load cell F to measure the load value of the pressing down, so as to control the pressing load during bonding.
本發明實施例之散熱膠墊貼合方法及設備,由於操作者可以不用再以人工作貼合,自動化的貼合操作使生產效率提昇,精度增加且品質一致,具有實質的效益。 The heat-dissipating rubber pad bonding method and equipment of the embodiment of the present invention, because the operator does not need to use human work for bonding, the automated bonding operation improves the production efficiency, increases the precision and the quality is consistent, and has substantial benefits.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the foregoing are only preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the description of the invention, All are still within the scope of the invention patent.
A:被貼物 A: Object
B:機台 B: Machine
C:輸送流路 C: Conveying flow path
C1:第一軌架 C1: The first rail frame
C11:治具 C11: Fixture
C12:軌座 C12: Rail seat
C111:吸附座 C111: Adsorption seat
C112:側架 C112: Side frame
C113:皮帶 C113: Belt
C114:軌道 C114: Orbit
C2:第二軌架 C2: Second rail
C21:側架 C21: Side frame
C22:皮帶 C22: belt
C23:軌道 C23: Orbit
C3:載盤 C3: Disk
C31:鏤空區間 C31: hollow interval
D:貼合裝置 D: Fitting device
E:龍門軌架 E: Gantry rail frame
E1:懸臂 E1: Cantilever
E2:立柱 E2: Column
Claims (23)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108121378A TWI716906B (en) | 2019-06-19 | 2019-06-19 | Method and equipment for attaching heat dissipation rubber pad |
| CN201910957211.7A CN112110179B (en) | 2019-06-19 | 2019-10-10 | Method and equipment for attaching heat dissipation rubber pad |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108121378A TWI716906B (en) | 2019-06-19 | 2019-06-19 | Method and equipment for attaching heat dissipation rubber pad |
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| Publication Number | Publication Date |
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| TW202101608A TW202101608A (en) | 2021-01-01 |
| TWI716906B true TWI716906B (en) | 2021-01-21 |
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| TWI764497B (en) * | 2021-01-08 | 2022-05-11 | 萬潤科技股份有限公司 | Heat-dissipating rubber pad conveying, laminating method and equipment |
| TW202235200A (en) * | 2021-03-12 | 2022-09-16 | 南茂科技股份有限公司 | Heat sink attachment machine |
| TWI767611B (en) * | 2021-03-15 | 2022-06-11 | 萬潤科技股份有限公司 | Heat dissipation pad bonding method and equipment |
| TWI802403B (en) * | 2021-03-15 | 2023-05-11 | 萬潤科技股份有限公司 | Thermal pad bonding equipment |
| TWI806502B (en) * | 2022-03-18 | 2023-06-21 | 萬潤科技股份有限公司 | Laminating method, device and equipment for heat dissipation rubber pad |
| TWI887672B (en) * | 2023-06-06 | 2025-06-21 | 萬潤科技股份有限公司 | Laminating method, laminating module, laminating device and laminating equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07113840A (en) * | 1993-09-21 | 1995-05-02 | Micron Technol Inc | Carrier having replaceable substrate used in test of semiconductor die |
| CN2661658Y (en) * | 2003-11-05 | 2004-12-08 | 盛健安 | Adhesive tape paste device |
| CN207326046U (en) * | 2017-07-25 | 2018-05-08 | 东莞新蓁电子材料有限公司 | A heat conduction sheet cutting machine with automatic loading and unloading |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2883837B2 (en) * | 1995-06-22 | 1999-04-19 | 龍彦 高橋 | Electronic component taping equipment |
| JP3876031B2 (en) * | 1996-11-28 | 2007-01-31 | 株式会社小森コーポレーション | Double-sided adhesive tape application device |
| CN103895897B (en) * | 2014-04-02 | 2016-04-27 | 广州市广达精密机械有限公司 | A kind of precision lining machine |
| CN104627722B (en) * | 2015-01-16 | 2017-01-25 | 歌尔股份有限公司 | Automatic double-sided adhesive tape sticking device |
| CN107116612A (en) * | 2016-02-25 | 2017-09-01 | 苏州达翔新材料有限公司 | A kind of automatic press make-up machine |
| TWI567011B (en) * | 2016-06-15 | 2017-01-21 | 萬潤科技股份有限公司 | Method and device for conveying the components of the bonding process |
| TWI620694B (en) * | 2017-03-14 | 2018-04-11 | All Ring Tech Co Ltd | Feeding mechanism |
| TWI668158B (en) * | 2017-03-14 | 2019-08-11 | 萬潤科技股份有限公司 | Component bonding method and device |
| CN109626054A (en) * | 2019-01-14 | 2019-04-16 | 东莞市臻精智能科技有限公司 | Automatic attaching equipment |
-
2019
- 2019-06-19 TW TW108121378A patent/TWI716906B/en active
- 2019-10-10 CN CN201910957211.7A patent/CN112110179B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07113840A (en) * | 1993-09-21 | 1995-05-02 | Micron Technol Inc | Carrier having replaceable substrate used in test of semiconductor die |
| CN2661658Y (en) * | 2003-11-05 | 2004-12-08 | 盛健安 | Adhesive tape paste device |
| CN207326046U (en) * | 2017-07-25 | 2018-05-08 | 东莞新蓁电子材料有限公司 | A heat conduction sheet cutting machine with automatic loading and unloading |
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| TW202101608A (en) | 2021-01-01 |
| CN112110179B (en) | 2022-10-25 |
| CN112110179A (en) | 2020-12-22 |
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