JPH11297443A - Burn-in socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount terminals for bringing into contact with a solder ball of an IC package at a high density, in a housing of a burn-in socket. SOLUTION: A burn-in socket 1 comprises a socket main body 2 and an open top type cover 21. The socket main body 2 comprises an inner and an outer housings 4, 3, plural terminal installation holes 7 having rectangular openings are formed in the inner housing 4, on which an IC package 24 is placed as seen in a plan view, the plural terminal installation holes 7 are disposed in a grid form, and a longer sidewall surface of one terminal installation hole 7 desired is faced with a shorter sidewall surface of another terminal installation hole 7 which is adjacent to it via a wall. In each terminal installation hole 7, a terminal 12 comprising spring parts 14 from a contact part 13 to reach a tail part 15 to direct round parts alternately in opposite directions, to form a zigzag form as a whole via a straight line part is installed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in socket, and more particularly to a socket suitable for a burn-in test (heating operation test) of an IC package having solder balls as contacts.

[0002]

2. Description of the Related Art As is well known, a socket body is provided in a terminal mounting hole of the socket body, and a plurality of terminals including a contact portion, a spring portion and a tail portion are provided, and an IC package is soldered as a contact. There are many burn-in sockets that are mounted on a socket body so that the balls correspond to the contact portions of the terminals, and the terminals and the solder balls are brought into contact with each other to perform a burn-in test of the IC package 24.

Focusing on the terminal of the conventional burn-in socket, the spring portion from the contact portion to the tail portion of the terminal has a linear shape that can be elastically deformed. Focusing on the arrangement of terminal mounting holes formed on the socket body for mounting such terminals, each terminal mounting hole is formed as a rectangular opening and has a long side wall surface and a short side wall surface. The arrangement of one terminal mounting hole and the terminal mounting hole located adjacent to the side is arranged in a lattice pattern with the long side walls facing each other across the wall or the short side walls facing each other. They were arranged or arranged diagonally. That is, the terminal mounting holes are arranged in one direction. Further, the contact portion of each terminal has a structure in which the solder ball of the IC package is bifurcated or the semi-spherical surface of the solder ball is wrapped around, that is, the contact is made in a planar manner with the spherical surface of the solder ball. .

[0004]

According to the above-mentioned prior art, since the spring portion of the terminal is linear, it is made thinner for easy elastic deformation and for high-density mounting. When it is elastically deformed to generate the contact force, it may be deformed toward the wall surface of the terminal mounting hole and hit the wall surface. The terminal mounting holes must be formed apart. Then, the thickness between the plurality of walls formed on the socket body increases, and the size of the socket body increases. In other words, many terminal mounting holes cannot be formed per unit area on the plane of the socket main body, which limits the high-density mounting of terminals.

Further, all of the rectangular terminal mounting holes are formed in one direction on the socket body, that is, the long side wall surface or the short side wall surface is uniformly formed. And the wall thickness between the long side wall of the terminal mounting hole adjacent to the short side wall of one terminal mounting hole and the short side wall of the next side terminal mounting hole. The wall thickness is reduced by the length of the long side. However, since a certain required strength is required for the wall on the socket body, the wall thickness between the short side wall surfaces also needs to be constant. Then, the size of the socket body increases. In other words, many terminal mounting holes cannot be formed per unit area on the plane of the socket main body, which limits the high-density mounting of terminals.

In addition, the contact portion of the conventional terminal is inserted into the spherical surface of the solder ball of the IC package,
Since it is a wrapping shape and is a surface contact method, there is a possibility that an air layer may intervene while the solder ball and the contact part are in contact at the time of testing, which results in a large electrical resistance and an electrical contact property for the test There was a risk of failure.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for mounting a terminal on a socket body, even if the terminal is made small in size, by contacting a solder ball of an IC package with a contact portion to form a spring portion of the terminal. When elastically deformed,
Provided is a burn-in socket having a terminal that is stably elastically deformed and does not have a risk of contacting a surrounding wall surface, so that the terminal mounting hole does not need to be excessively large, thereby enabling high-density mounting per unit area. Another object of the present invention is to provide a burn-in socket having a terminal capable of generating a stable contact force.

Still another object is to make the wall thickness between the terminal mounting holes having rectangular openings arranged in a lattice, where the terminals are mounted, equal everywhere, and therefore the wall between the terminal mounting holes can be made equal. It is an object of the present invention to provide a burn-in socket having a terminal mounting hole that does not need to be extra thick while ensuring the required strength. .

In addition, the present invention provides a burn-in socket having a terminal having a contact portion having good electrical contact with a solder ball of an IC package during a burn-in test.
In addition, during the burn-in test of the IC package, the IC package can be firmly held, and while the IC package is opened after the burn-in test is completed or the test is shifted to the test after the IC package to be burn-in mounted is mounted, It is another object of the present invention to provide a burn-in socket capable of holding an IC package immediately before the opening or mounting and effectively preventing the IC package from being accidentally dropped during the transition operation.

[0010]

In order to achieve the above object, the present invention has the following technical means. That is, this will be described with reference to the reference numerals in the accompanying drawings corresponding to the embodiments of the present invention. The present invention is characterized in that the socket body 2 is mounted in the terminal mounting hole 7 of the socket body 2, and the contact portion 13 A plurality of terminals 12 each comprising a spring portion 14 and a tail portion 15 are provided, and an IC package 24 is placed on the socket body 2 such that solder balls 25 as contacts thereof correspond to the contact portions 13 of the terminals 12. In the burn-in socket 1 for performing the burn-in test of the IC package 24 by bringing the terminals 12 and the solder balls 25 into contact with each other, the spring portions 14 of the respective terminals 12 mounted in the respective terminal mounting holes 7 From the contact portion 13 toward the tail portion 15, a plurality of R-shaped portions 14b are formed.
The burn-in socket is characterized in that the rounded surfaces are successively arranged alternately in opposite directions to form a meandering shape as a whole. According to the above description, when the solder ball 25 of the IC package 24 and the contact portion 13 come into contact with each other at the time of testing, the spring portion 14 extends in the direction in which each portion of the spring element unexpectedly contacts the wall surface of the terminal mounting hole 7 over its entire length. Without being deformed, it is compacted in a direction to narrow the pitch between the round portions 14b. Therefore, the terminals can be mounted in the socket with high density without requiring any extra clearance between the terminal mounting holes 7 and the surrounding wall. In addition, a burn-in socket having a terminal capable of providing a stable contact force can be obtained.

Further, according to the present invention, the terminal 1 which is mounted in the terminal mounting hole 7 of the socket main body 2 and comprises a contact portion 13, a spring portion 14, and a tail portion 15 is provided.
The IC package 24 is mounted on the socket body 2 so that the solder balls 25 as contacts correspond to the contact portions 13 of the terminals 12, and the terminals 12 and the solder balls 25 are attached to each other. In the burn-in socket 1 for contacting and performing the burn-in test of the IC package 24, the plurality of terminal mounting holes 7 for mounting the terminals 12 are arranged in a lattice pattern as a whole, and The mounting hole 7 is formed in a rectangular shape when viewed from a plane, so that the mounting hole 7 includes a pair of long side wall surfaces 8 and a pair of short side wall surfaces 9. Another terminal mounting hole 7 located adjacent to the long side wall 8 via the wall 10 on the side of the long side wall 8 is arranged such that the short side wall 9 is opposed to the terminal mounting hole 7 at an arbitrary position.
The other terminal mounting hole 7 located adjacent to the wall 10 on the side of the short side wall surface 9 faces the long side wall 8 so that the plurality of terminal mounting holes 7 are entirely formed in the socket body 2. A burn-in socket, which is arranged in a housing. As a result, the wall thickness between the terminal mounting holes can be made substantially equal everywhere, so that the wall thickness does not need to be extraly thickened while securing the required strength, and the socket body 2 has a high density per unit area. Terminals can be mounted. In addition, the contact portion 13 of the terminal 12 of the present invention
A pair of contact pieces 13 which are symmetrical with respect to 3d
During testing, the solder balls 25 of the IC package 24 are connected to a pair of contact pieces 13b and 13c.
This is characterized in that the contact is made so as to bite into the substantially V-shaped contact end surface formed by the slanted contact end surfaces 16b and 16c. Thereby, IC package 2
No. 4 can be a burn-in socket having terminals that excel in electrical contact with the solder balls 25.

The socket body 2 according to the present invention comprises:
An IC package 24 is opened on the socket body 2 and includes an outer housing 3 and an inner housing 4 which is housed in the outer housing 3 so as to be vertically movable and has a plurality of terminal mounting holes 7 formed therein. Peripheral frame 2 having a central opening 23 for attaching and detaching in a top type
The cover 21 and the internal housing 4 are positioned at the upper limit during the test, and the solder ball 25 of the IC package 24 on the internal housing 4 and the contact portion 13 of the terminal 12 are arranged. Are brought into contact with a predetermined contact force, and at the time of opening, the cover 21 is pressed to position the cover 21 and the inner housing 4 at the lower limit, and the solder balls 25 of the IC package 24 and the contact portions 13 of the terminals 12 are separated. A pair of cams 27 tiltably attached to the outer housing 3, and a cam return spring 26 for urging each of the pair of cams 27 upright. Each of the cams 27
And a cam receiving surface 33 formed on the lower surface of the cover 21 for receiving the cam surface 32.

In addition, at the time of the test, the IC package 2
4 is provided with a latch mechanism for holding the position of the IC package 24 by holding down the upper part of the IC package 24 and releasing the IC package 24 when the IC package 24 is opened. The latch mechanism is provided with a pair of tiltably attached to the outer housing 3. Latch arm 3
4 and the latch surfaces 34a of the pair of latch arms 34 during the test are
A latch return spring 35 for urging the latch arm 34 so as to be seated on the upper surface of the latch arm 3;
It is also characterized by a latch operation body 38 provided on the lower surface of the cover 21 for pushing down 4 to tilt the latch arm 34 in the opening direction against the latch return spring 35.

The cam receiving surface 33 on the lower surface of the cover 21 for receiving the cam surface 32 of the cam 27 has a gentle slope portion 33a.
When the test cover 21 and the inner housing 4 are located at the upper limit, the cam surface 32 of the cam 27 is positioned on the starting point of the gentle slope 33a, and then the test is performed. In the transition from the time to the opening of the IC package 24, the cam 27 is guided so that the cam surface 32 of the cam 27 is guided on the gentle slope portion 33a.
Is tilted in the middle, thereby suppressing the downward movement of the cover 21 and the downward movement of the latch operation body 38 connected to the cover 21 to hold the latch arm 34 in the latch position. The cam 27 is tilted to the last limit so that the cam surface 32 of the cam 27 can be guided on the steep slope portion 33b just before reaching the position. The cam surface 32 of the cam 27 is formed by the gentle slope portion 33a and the steep slope portion 33b so as to be tilted.
Guide timing and cover 21 and latch operating body 38
, And the tilt timing of the latch arm 34 is set.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the present invention will be described in detail with reference to FIGS. The entire burn-in socket is shown as 1. The burn-in socket 1 has a socket main body 2, and the socket main body 2 includes an outer housing 3 having a mounting peg 3a at a bottom portion, and an inner housing 4 housed in the outer housing 3. The inner housing 4 is housed in the outer housing 3 in a state where the engaging claws 6 of the inner housing 4 are engaged with the engaging pieces 5 formed on the inner wall of the outer housing 3. The inner housing 4 is accommodated therein. In this case, the mode of engagement of the engagement claws 6 with the engagement pieces 5 is such that the inner housing 4 is engaged with each other so as not to protrude upward from the inside of the outer housing 3, but within the outer housing 3. The inner housings 4 are engaged with one another in such a way that they can move downward.

A concave portion 4b is formed in the upper surface 4a of the inner housing 4 except for a peripheral edge, and a plurality of terminal mounting holes 7 are formed through the concave portion 4b between the upper surface 4c and the lower surface 4d. I have. As shown in FIGS. 11 and 12, each of the plurality of terminal mounting holes 7 is opened in a rectangular shape when viewed from a plane, and the plurality of terminal mounting holes 7 having the rectangular openings are arranged so as to be positioned in a lattice pattern. Have been. Focusing on one terminal mounting hole 7, each terminal mounting hole 7 is defined by a pair of long side wall surfaces 8 and a pair of short side wall surfaces 9 because it is defined as a rectangular opening when viewed from a plane. The arrangement relationship between the mounting hole 7 and another terminal mounting hole 7 located next to the terminal side in a grid-like arrangement is such that the long side wall surface 8 of one terminal mounting hole 7 and the short side wall surface 9 of another terminal mounting hole 7. All terminals 12 are arranged so that they are opposed to each other with the wall 10 inside. In this example,
Since the length of the long side wall 8 is set to twice the length of the short side wall 9, the long side wall 8 of one terminal mounting hole 7 is set.
The wall thickness of the wall 10 between the short side wall surfaces 9 of another terminal mounting hole 7 adjacent to the side, the short side wall surface 9 of the one terminal mounting hole 7, and another still another terminal mounting hole. When the wall thicknesses of the walls 10 between the long side wall surfaces 8 are compared with each other, they are set substantially equal to each other. That is, the thickness of all the walls 10 is equal. By doing so, the upper surface 4 of the concave portion in the inner housing 4 is formed.
Even when the terminal mounting holes 7 are formed at a high density per unit area c, a plurality of the terminal mounting holes of the conventional rectangular opening are formed by turning the long side wall surface or the short side wall surface in one direction. In this manner, the wall thickness between one terminal mounting hole and the terminal mounting holes located adjacent to the four sides thereof can be made equal to each other as compared with the case where the entirety is arranged in a lattice or obliquely arranged. Therefore, regarding the thickness of the entire wall around all the terminal mounting holes,
The terminal mounting holes can be formed with high density per unit area of the internal housing 4 because it is not necessary to increase the thickness while securing the strength required for design. Thus, tail support holes 11 for a plurality of terminals are formed in the outer housing 3 in accordance with the manner in which the plurality of terminal mounting holes 7 in the inner housing 4 are formed.

Next, the terminals 12 mounted in the respective terminal mounting holes 7 will be described with reference to FIGS. 13, 14 and 15. Each of the terminals 12 is connected to an upper contact portion 13.
And a spring portion 14 forming an intermediate contact beam;
The lower tail portion 15 is connected in series, and the contact portion 13 is composed of a pair of contact pieces 13b and 13c which are divided into left and right on a contact base 13a. 13c
The gap is formed as a valley 13d. As a result, the shape of the contact end face formed by the oblique contact end face 16b of the one contact piece 13b, the oblique contact end face 16c of the other contact piece 13c, and the valley bottom 16d of the valley 13d is substantially the same. It has a V-shape. Next, the spring part 1
Reference numeral 2 denotes a series of a plurality of rounded portions 14b connected from the contact base 13a to the tail base 15a. The next rounded portion 14b is opposed to one rounded portion 14b by 180 degrees. Are formed in a meandering shape from the contact portion 13 toward the tail portion 15 as a whole. In this embodiment, an example is shown in which a plurality of rounded portions 14b are successively connected in series via a linear portion 14a. And the said tail part 15,
The tail base 15a and a tail contact 15b connected to a conductor on a burn-in board (not shown) ahead of the tail base 15a.
Are formed. Therefore, as shown in FIG. 13 or FIG. 14, since each of the terminals 12 has a meandering shape as a whole, the spring portion 14 is formed by sequentially connecting the round portions 14b by the linear portions 14a, and the surface orthogonal to the meandering direction is a wide surface. In contrast, the end surface in the meandering direction is formed as a narrow surface 18. It is desirable that such a terminal 12 be formed by press stamping and processing from a metal plate.
Alternatively, a metal plate may be first punched into a pin shape or a wire shape, and then the spring portion 14 may be bent into a meandering shape. Further, the spring portion 14 may be made of a spring material made of a wire, and may be connected to the contact portion 13 and the tail portion 15.

In order to mount the terminals in the terminal mounting holes 7 of the inner housing 4 and the tail support holes 11 of the outer housing 3, the wide surface 17 of each terminal must be connected to the long side of the terminal mounting hole 7. The terminal is mounted so as to face the wall surface 8, so that the narrow surface 18 of each terminal faces the short side wall surface 9 of each terminal mounting hole 7. In the above mounting, before the inner housing 4 is mounted in the outer housing 3, each of the terminals 12 is inserted into each of the terminal mounting holes 7 from below the inner housing 4 with the contact portions 13 of the terminals 12 as heads. A pair of contact pieces 13b and 13c of the contact portion 13 of the terminal 12 are exposed on the upper surface 4c of the recess 4b of the inner housing 4. At this time, as shown in FIG.
The pair of left and right shoulders 19 a face the pair of stopper pieces 20 at the upper part of each terminal mounting hole 7 of the internal housing 4.
Next, the inner housing 4 on which the terminals 12 are mounted is mounted on the outer housing 3. At this time, the tail base 15 a of the tail portion 15 of each terminal 12 is inserted into the tail support hole 11 of the outer housing 3. Attach it as it is. That is, by pulling the tail portion 15 from the bottom surface side of the socket body 2, the tail base portion 15a
Engages with the wall surface of the tail support hole 11, thereby supporting each terminal 12. Looking at the mounting state of each terminal 12 to the inner and outer housings 4 and 3, as described above, the plurality of terminal mounting holes 7 are determined in a lattice-like arrangement relationship with each other, and The arrangement relationship of each terminal mounting hole 7 located on each side in the four directions is as follows.
The long side wall surface 8 of one terminal mounting hole 7 and the short side wall surface 9 of each terminal mounting hole 7 are opposed to each other with the wall 10 at the center. Since the wide surface 17 is mounted so as to face the long side wall 8 when mounted on the terminal, one terminal 12 in a certain terminal mounting hole 7 and the terminal mounting holes located adjacent to each side in four directions with respect to it. Each terminal 12 in 7 is mounted in a state different from each other by 90 degrees. That is, as shown in FIG. 15, one terminal 12 has a wide surface 17 shown, and the terminal 12 next to the one has a narrow surface 18. Therefore, what is important here is that each terminal 12 is elastically deformed by the spring portion 14, so that each terminal 12 has a long side wall surface 8 and a short side wall surface 9 inside each terminal mounting hole 7 of the internal housing 4. In other words, not only the linear portion 14a of the spring portion 14 during elastic deformation but also the radius portion 14b of the elastic portion 14 have the long side wall surface 8,
The relationship between the dimensions of the round portion 14b and the straight portion 14a and the dimensions of the long side wall 8 and the short side wall 9 is determined so as not to contact the short side wall 9. Since the spring portion 14 is formed in a meandering shape as a whole from the contact portion 13 to the tail portion 15, during the burn-in test of the IC package, the contact portion 13 of this terminal becomes a solder ball as a contact of the IC package. When the contact is made, the spring length enough to generate a stable contact force every time, which is necessary for the test, can be ensured. Therefore, the terminals can be mounted at a high density.

Next, the burn-in socket 1 has an open top type cover 21. That is, the cover 21
An IC package 2 having a square peripheral frame portion 22 and a central opening 23 in the frame portion to be burn-in tested.
4 is mounted on or removed from the internal housing 4 of the burn-in socket by an automatic machine through the central opening 23 described above. That is, it is an open top type. When the pressing force is released by the cams 27 which return by the pair of cam return springs 26 arranged on both sides of the outer housing 3, the cover 21 returns to the upper limit position shown in FIG. Cover 2 from the state
When 1 is depressed, it is pushed down to the lower limit position in FIG. 9 via the intermediate operation in FIG.

More specifically, the cam return springs 26 on both sides of the outer housing 3 are disposed between the inner bottom surface of the outer housing 3 and the spring receiving portions 29 of the cams 27. Are urged to rotate about the cam shaft 28 in the direction toward the other cam 27. A pair of cams 27 arranged on both sides have a cam surface 32 formed above each, and this cam surface 32 is in contact with a cam receiving surface 33 of the cover 21.
The cam receiving surface 33 includes a gentle slope portion 33a and a steep slope portion 33b. In the state shown in FIG. 5, the cam surface 32 of the cam 27 is on the gentle slope portion 33a. The cam surface 32 has a gentle slope portion 33a.
When the cover 27 is pushed down and the cover 21 is still pushed down, the cam surface 32 of the cam 27 is guided by the steeply inclined portion 33b and tilts as shown in FIG. Upon release, the cam 27 is sequentially returned from the state of FIG. 9 to the state of FIGS. 7 and 5 by the cam return spring 26, and the cover 21 returns to the upper limit of the original position.

In the above description, the vertical movement of the cover 21 and the tilting movement of the cam 27 have been described in relation to each other.
The tilting operation of the cam 27 mainly relates to the vertical movement of the inner housing 4. That is, on each side of the inner housing 4, each wing piece 30 is formed to protrude in the lateral direction,
Each of the wing pieces 30 is housed in the wing piece holding groove 31 of each of the cams 27. As shown in FIG. 5, when the cam 27 stands upright and no pressing force is applied to the cover 21 and the cover 21 is at the upper limit position, the wing piece 30 of the inner housing 4 holds the wing piece. The inner housing 4 is completely accommodated in the groove 31 so that the inner housing 4 is at the upper limit position in a state where the engagement claws 6 are engaged with the engagement pieces of the outer housing 3 (cover upper limit return state). Then, as shown in FIG. 7, the cover 21 is slightly pressed down, and the cam surface 32 of the cam 27 is pressed.
Finishes guiding the gentle slope portion 33a, and when the cam 27 starts to slightly tilt by approaching the steep slope portion 33b, the wing piece 30 of the inner housing 4 starts to move from inside the wing piece holding groove 31;
The wing piece 30, that is, the inner housing 4 is slightly moved downward by the upper surface 31a of the wing piece holding groove 31 (intermediate state of pressing the cover), and further, as shown in FIG.
When the cam surface 32 of the cam 27 is guided by the steep slope portion 33b and the end cam 27 is completely tilted, the wing piece 30 of the inner housing 4 moves from the inside of the wing piece holding groove 31 to the movement limit. The cam 27 and the cover 21 are moved so that the wing 30, that is, the inner housing 4 is completely moved down to the lower limit position by the upper surface 31 a of the wing holding groove 31 (the cover lower limit state). Inner housing 4
Are defined. 5 and FIG. 6 in the upper limit state of the cover indicate a burn-in test of the IC package 24 (hereinafter simply referred to as "test time"), and the states of FIGS. Is in the process of releasing the IC package 24 after the burn-in test is completed, or I
A test transfer process of the C package is shown (hereinafter, simply referred to as a transfer process). Further, in the state of FIGS. The IC package 24 to be burn-in-tested just before it is taken out from an automatic machine or an open-top type cover 2
1 shows a state of being placed on the inner housing 4 through one central opening 23 (hereinafter simply referred to as an open state).

By the way, at the time of testing in the state shown in FIGS.
To securely hold the C package 24, a latch mechanism including a latch arm 34 and a latch return spring 35 is provided. That is, burn-in socket 1
In the outer housing 3, a pair of L-shaped latch arms as shown in FIGS. 16 and 17 are provided on both sides in directions different from each other by 90 degrees with respect to both sides on which the pair of cams 27 are disposed. A latch tilting piece 36 with 34 is provided so as to face both sides via the IC package 24, and each of the latch tilting pieces 36 is tiltably supported by a latch support shaft 37. Each latch arm 34 is constantly urged in the latch direction by a latch return spring 35. For this reason, FIG. 5, in which the cover 21 is not pressed,
In the test in the state shown in FIG. 6, each latch arm 34 returns to the IC package 24 on the inner housing 4 by a latch return spring 35, and the latch surface 34a
The IC package 24 is seated on the upper surface of the C package 24.
Holding. Since the IC package 24 needs to be free in the open state after the transition process in which the cover 21 starts to be pushed, the lower surface of the cover 21 is
As shown in FIG. 19, four latching members 38 are disposed downward in a state suitable for engaging with a total of four places on both sides of the pair of latch tilting pieces 36. Reference numeral 22a in the figure denotes a main body engaging portion for maintaining the state of engagement with the socket main body 2. In the transition process in which the cover 21 in FIG. 7 and FIG. 8 starts to be pushed, the tip of the latch operation body 38 comes into contact with the latch tilting piece 36, and the cover 2 in FIG.
When the cover 1 is completely lowered, the latch arm 34 is moved downward by the lowering of the latch operation body 38 accompanying the lowering of the cover 21.
Is tilted, and its latch surface 34a is opened apart from the upper surface of the IC package 24. Therefore, the IC package 24 can be taken out or mounted by an automatic machine.

In the above-described process, when the cover 21 starts to be pushed, the state of FIGS.
Since the test using the burn-in socket cannot be smoothly performed if the plug 4 falls off from the inner housing 4 of the burn-in socket or moves unexpectedly, the latch arm 34 is in the upright state as shown in FIG. And the latch arm 34 is opened as shown in FIG. 9 just before reaching the open state of FIGS. For this reason, the cam surface 32 of the cam 27 guides the gentle slope 33a so that the cover 21 slowly moves down from the time of the test to the end of the transition process. Reference numeral 21 denotes a cam surface 32 of the cam 27 which guides the steep slope portion 33b so as to move down suddenly. As a result, the IC package 24 is substantially held by the latch arm 34 immediately before the IC package 24 can be freely taken out or mounted, and the burn-in test of the IC package 24 is smoothly performed. .

Next, a burn-in test operation of the IC package 24 using such a burn-in socket 1 will be described. In the test in the state of FIGS. 5 and 6, since no pressing force is applied to the cover 21, each cam 27 is in an upright state by the bias of each return spring 26,
Is located at the starting point on the gentle slope portion 33a where the guide is started,
The cover 21 is at the upper limit position. Each wing piece 30 of the inner housing 4 is accommodated in each wing piece holding groove 31 of each cam 27, and the inner housing 4 is moved to the upper limit in a state in which each engagement claw 6 is engaged with each engagement piece 5. On the other hand, each latch arm 34 is in the upright state, and the latch surface 34a of each latch arm 34 suppresses the upper part of the IC package 24 and holds it. At this time, each solder ball 25 as a contact of the IC package 24 is connected to each terminal 12 of the internal housing 4.
, And a test is performed.
According to FIG. 15, this will be described more specifically. Since the inner housing 4 is held at the upper limit as described above and the IC package 24 is latched from above as described above, When the solder ball 25 of the IC package 24 comes into contact with the contact portion 13 of the terminal 12, each terminal 12 is elastically deformed by the spring portion 14. That is, the R-shaped portions 14b are successively connected via the linear portion 14a, and the spring portion 14 having a meandering shape as a whole is compacted so as to reduce the pitch between the R-shaped portions 14b as a whole, thereby storing elasticity. At this time, the round portion 14 of the spring portion 14
b, the narrow surface 18 is deformed so as to face the short side wall surface 9,
Since the wide surface 17 is not deformed so as to face the long side wall surface 8, the spring portion 14 of each terminal 12 does not contact any of the long and short side wall surfaces 8, 9 of the terminal mounting hole 7, and the elastic deformation is caused by the spring. Part 1
4 is averaged at each point over the entire length. Therefore,
For each terminal 12, every time at the time of testing or a plurality of terminals 12
Each produce a stable elasticity on average. This is because even if the dimensions such as the width and length of each terminal 12 are reduced in order to mount the terminals 12 at a high density, the strength of the spring portion is not reduced and the effective spring length is sufficiently increased. A terminal that generates stable elasticity can be provided. Conversely, the required strength of the spring portion is ensured, the effective spring length is sufficiently secured, and the design of a small-sized terminal for high-density mounting that also generates stable elasticity becomes easier. In particular, there is no need to create an extra clearance with the surrounding wall.

Now, the solder balls 2 of the IC package 24
5 is in contact between the pair of contact pieces 13b and 13c, but the elasticity stored in the spring portion 14 urges the pair of contact pieces 13b and 13c of the contact portion 13 to the solder balls 25 of the IC package 24, Ensure necessary contact force. More specifically, the above-mentioned contact force causes IC
The solder balls 25 of the package 24 make contact with the contact end surfaces 16b and 16c of the pair of contact pieces 13b and 13c, respectively. Therefore, solder ball 2
Since there is little possibility that an unexpected air layer is interposed between the contact surface 5 and the contact end surfaces 16b and 16c, there is almost no contact failure due to an increase in electric resistance at the time of contact. Also, should the solder balls 2 of the IC package 24
Even if there is a slight difference in size or deviation from the specified position in 5, the valley 1
A pair of contact pieces 13b and 13c with 3d as the center, and a substantially V-shaped contact end face is formed by the oblique contact end face 16b, the valley bottom 16d, and the oblique contact end face 16c. The contact goodness of No. 13 is almost ensured.

In the above description, the group of terminal mounting holes 7 of the inner housing 4 is such that the relationship between one terminal mounting hole 7 and another terminal mounting hole 7 at each position on four sides is determined by each terminal mounting hole 7. Are arranged as a whole such that the long side wall surface 8 and the short side wall surface 9 are opposed to each other via the wall 10.
2 is mounted with its wide surface 17 parallel to the long side wall 8 and its narrow surface 18 parallel to the short side wall 9. The terminal mounting holes 7 and the terminals 12 are arranged in a grid. In addition, since the solder balls 25 of the IC package 24 are also in a lattice-like arrangement that matches the above-mentioned lattice-like arrangement, all the terminals 12 and all the solder balls 25 are in accurate contact as described above. By the way, with such an arrangement, the thickness of each wall 10 between a certain terminal mounting hole 7 and the four terminal mounting holes 7 can be all equal. This is suitable for high-density mounting of terminals, since each wall 10 does not become excessively thick.

After the burn-in test of the IC package 24 is completed in this way, when the cover 21 is pushed down as shown at the time of transition to the state of FIGS. Then, the contact pieces 13b and 13c of the contact portion 13 of each terminal 12 begin to separate from the solder ball 25. At this time, the latch arm 34 is still at the latch position. Then, when the cover 21 is further depressed to reach the opening state in FIGS. 9 and 10, the inner housing 4 reaches the lower limit, and a pair of contact pieces 13 of the contact portion 13 of each terminal 12 is reached.
b and 13c are completely separated from the solder ball 25, and the latch arm 34 is completely tilted as described above, and the latch surface 34a is located at a position outside and above the IC package 24. As described above, since the latch arm 34 is located outside the latch holding position immediately before the IC package 24 is opened, there is almost no unexpected drop of the IC package 24 at the time of transition. Thereafter, the IC package 24 after the test is taken out of the burn-in socket 1 by an automatic machine. From now on I
When performing the burn-in test on the C package 24, the IC package 24 is placed on the inner housing 4 in the state shown in FIG.
The burn-in test is performed by reversing the operation in the order of FIG. 9, FIG. 7, and FIG.

[0028]

As described above in detail, according to the first aspect of the present invention, at the time of the burn-in test of the IC package, the terminal is stably elastically deformed so that the pitch between the rounded portions of the spring portion becomes narrow. Only, there is almost no possibility of hitting the wall surface of the terminal mounting hole.Therefore, there is no need to make the terminal mounting hole an extra large space, and eventually many terminal mounting holes can be formed per unit area on the socket body. Enables high-density mounting. In addition, even if this terminal is small in size for high-density mounting, a burn-in socket having a terminal having a spring portion that can provide a sufficient effective spring length and always provide a stable contact force by a meandering spring portion. Can be provided.

According to the second aspect of the present invention, the wall thickness between the terminal mounting holes can be made equal, and it is not necessary to make the wall thickness extra large regardless of the wall thickness. Many terminal mounting holes can be formed per contact, and terminals can be mounted with high density. In addition, according to the third aspect of the invention, the terminals can be mounted at a higher density. In other words, a burn-in socket that can be easily designed for high-density mounting of terminals can be provided.

According to the fourth aspect of the present invention, in addition to the above effects, the electrical contact with the solder balls of the IC package is improved. Further, according to the fifth and sixth aspects of the present invention, it is possible to provide a burn-in socket having a terminal which is easy to manufacture for achieving the above-mentioned effects. According to the seventh aspect of the present invention, in addition to the above effects, it is easy to design and manufacture a burn-in socket having a terminal mounting hole group for mounting terminals at high density. In addition, according to the eighth, ninth and tenth aspects of the present invention, in addition to the above effects, the IC package can be mounted or removed from the burn-in socket in an open-top type, and the test operation and the opening operation of the IC package can be performed smoothly and reliably. A burn-in socket can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view of a burn-in socket according to an embodiment of the present invention.

FIG. 2 is a view on arrow P of the burn-in socket of FIG. 1;

FIG. 3 is a view as seen from an arrow Q of the burn-in socket of FIG. 1;

FIG. 4 is a cross-sectional view taken along the line 4-4 of the burn-in socket of FIG. 1 and showing a burn-in test of the IC package.

FIG. 5 is a one-side sectional view taken along the line 4-4 of the burn-in socket of FIG. 1 and showing a burn-in test of the IC package;

FIG. 6 is a one-side sectional view taken along the line 6-6 of the burn-in socket of FIG. 1 and showing a burn-in test of the IC package.

FIG. 7 is a one-side cross-sectional view taken along the line 4-4 of the burn-in socket of FIG. 1, showing the IC package being opened after the burn-in test or at the time of test transfer of the IC package to be burn-in tested.

FIG. 8 is a one-side cross-sectional view along the line 6-6 of the burn-in socket of FIG. 1, showing the IC package being opened after the burn-in test or at the time of test transfer of the IC package to be burn-in tested.

9 is a one-side cross-sectional view along the line 4-4 of the burn-in socket of FIG. 1, showing a state in which the IC package subjected to the burn-in test is completely opened or a state in which the IC package to be subjected to the burn-in test is mounted.

FIG. 10 is a sectional view taken along the line 6-6 of the burn-in socket shown in FIG. 1;
It is a one side sectional view showing the state where a package was attached.

FIG. 11 is a view showing an arrangement state of a plurality of terminal mounting holes of the burn-in socket.

FIG. 12 is a cut-away view of a portion indicated by an arrow A in FIG. 1 showing an arrangement state of terminal mounting holes in which terminals are mounted.

FIG. 13 is a front view of a terminal.

FIG. 14 is a side view of a terminal.

FIG. 15 is a partial cut-away view of a portion indicated by an arrow B in FIG. 4 showing a state where a solder ball of an IC package is in contact with a contact portion of a terminal.

FIG. 16 is a plan view of a latch tilting piece.

FIG. 17 is a side view of the latch tilting piece.

FIG. 18 is a one-side cross-sectional view from the front of the cover.

FIG. 19 is a one-side cross-sectional view from the side of the cover.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Burn-in socket 2 Socket main body 3 External housing 3a Mounting peg 4 Inner housing 4a Upper surface 4b Recess 4c Recess upper surface 4d Lower surface 5 Engagement piece 6 Engagement claw 7 Terminal mounting hole 8 Long side wall surface of terminal mounting hole 9 Short terminal mounting hole Side wall surface 10 Wall between terminal mounting holes 11 Terminal tail support hole 12 Terminal 13 Contact part 13a Contact base 13b One contact piece 13c The other contact piece 13d Valley 14 Spring part 14a Straight part 14b R-shaped part 15 Tail part 15a Tail Base 15b Tail contact 15c Locking claw 16b, 16c Contact end face 16d Valley bottom 17 Wide surface 18 Narrow surface 19 Shoulder 20 Stopper piece 21 formed on top of each terminal mounting hole 7 of inner housing 4 21 Cover 22 Peripheral frame 22a Main body Engagement part 23 Central opening 24 IC package 25 Solder ball 26 Cam return spring 27 Cam 28 Cam spindle 29 Spring receiving part 30 Wing piece of inner housing 31 Wing piece holding groove 31a Upper surface of wing piece holding groove 32 Cam surface 33 Cam receiving surface of cover 33a Loose Slope portion 33b Steep slope portion 34 Latch arm 34a Latch surface 35 Latch return spring 36 Latch tilting piece 37 Latch support shaft 38 Latch operating body

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[Procedure amendment]

[Submission date] May 27, 1999

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction contents]

[Document Name] Statement

[Title of the Invention] Burn-in socket

[Claims]

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in socket, and more particularly to a socket suitable for a burn-in test (heating operation test) of an IC package having solder balls as contacts.

[0002]

2. Description of the Related Art As is well known, a socket body is provided in a terminal mounting hole of the socket body, and a plurality of terminals including a contact portion, a spring portion and a tail portion are provided, and an IC package is soldered as a contact. There are many burn-in sockets that are mounted on a socket body so that the balls correspond to the contact portions of the terminals, and the terminals and the solder balls are brought into contact with each other to perform a burn-in test of the IC package 24.

Focusing on the terminal of the conventional burn-in socket, the spring portion from the contact portion to the tail portion of the terminal has a linear shape that can be elastically deformed. Further, the contact portion of each terminal has a structure in which the solder ball of the IC package is bifurcated or the semi-spherical surface of the solder ball is wrapped around, that is, the contact is made in a planar manner with the spherical surface of the solder ball. .

[0004]

According to the above-mentioned prior art, since the spring portion of the terminal is linear, it is made thinner for easy elastic deformation and for high-density mounting. When it is elastically deformed to generate the contact force, it may be deformed toward the wall surface of the terminal mounting hole and hit the wall surface. The terminal mounting holes must be formed apart. Then, the thickness between the plurality of walls formed on the socket body increases, and the size of the socket body increases. In other words, many terminal mounting holes cannot be formed per unit area on the plane of the socket main body, which limits the high-density mounting of terminals.

In addition, the contact portion of the conventional terminal is inserted into the spherical surface of the solder ball of the IC package,
Since it is a wrapping shape and is a surface contact method, there is a possibility that an air layer may intervene while the solder ball and the contact part are in contact at the time of testing, which results in a large electrical resistance and an electrical contact property for the test There was a risk of failure.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for mounting a terminal on a socket body, even if the terminal is made small in size, by contacting a solder ball of an IC package with a contact portion to form a spring portion of the terminal. When elastically deformed,
Provided is a burn-in socket having a terminal that is stably elastically deformed and does not have a risk of contacting a surrounding wall surface, so that the terminal mounting hole does not need to be excessively large, thereby enabling high-density mounting per unit area. Another object of the present invention is to provide a burn-in socket having a terminal capable of generating a stable contact force.

[0007] In addition, to provide a burn-in socket having a terminal having a contact portion having good electrical contact with a solder ball of an IC package during a burn-in test;
In addition, during the burn-in test of the IC package, the IC package can be firmly held, and while the IC package is opened after the burn-in test is completed or the test is shifted to the test after the IC package to be burn-in mounted is mounted, It is another object of the present invention to provide a burn-in socket capable of holding an IC package immediately before the opening or mounting and effectively preventing the IC package from being accidentally dropped during the transition operation.

[0008]

In order to achieve the above object, the present invention has the following technical means. That is, this will be described with reference to the reference numerals in the accompanying drawings corresponding to the embodiments of the present invention. The present invention is characterized in that the socket body 2 is mounted in the terminal mounting hole 7 of the socket body 2, and the contact portion 13 A plurality of terminals 12 each comprising a spring portion 14 and a tail portion 15 are provided, and an IC package 24 is placed on the socket body 2 such that solder balls 25 as contacts thereof correspond to the contact portions 13 of the terminals 12. In the burn-in socket 1 for performing the burn-in test of the IC package 24 by bringing the terminals 12 and the solder balls 25 into contact with each other, the spring portions 14 of the respective terminals 12 mounted in the respective terminal mounting holes 7 From the contact portion 13 toward the tail portion 15, a plurality of R-shaped portions 14b are formed.
The burn-in socket is characterized in that the rounded surfaces are successively arranged alternately in opposite directions to form a meandering shape as a whole. According to the above description, when the solder ball 25 of the IC package 24 and the contact portion 13 come into contact with each other at the time of testing, the spring portion 14 extends in the direction in which each portion of the spring element unexpectedly contacts the wall surface of the terminal mounting hole 7 over its entire length. Without being deformed, it is compacted in a direction to narrow the pitch between the round portions 14b. Therefore, the terminals can be mounted in the socket with high density without requiring any extra clearance between the terminal mounting holes 7 and the surrounding wall. In addition, a burn-in socket having a terminal capable of providing a stable contact force can be obtained.

Further, the contact portion 13 of the terminal 12 according to the present invention comprises a pair of contact pieces 13b and 13c which are symmetrical with respect to the valley 13d. Contact piece 1
It is also characterized in that the contact is made so as to bite into the substantially V-shaped contact end surface formed by the oblique contact end surfaces 16b and 16c of 3b and 13c. With this IC
A burn-in socket having terminals that excel in electrical contact with the solder balls 25 of the package 24 can be provided.

The socket body 2 according to the present invention comprises:
An IC package 24 is opened on the socket body 2 and includes an outer housing 3 and an inner housing 4 which is housed in the outer housing 3 so as to be vertically movable and has a plurality of terminal mounting holes 7 formed therein. Peripheral frame 2 having a central opening 23 for attaching and detaching in a top type
The cover 21 and the internal housing 4 are positioned at the upper limit during the test, and the solder ball 25 of the IC package 24 on the internal housing 4 and the contact portion 13 of the terminal 12 are arranged. Are brought into contact with a predetermined contact force, and at the time of opening, the cover 21 is pressed to position the cover 21 and the inner housing 4 at the lower limit, and the solder balls 25 of the IC package 24 and the contact portions 13 of the terminals 12 are separated. A pair of cams 27 tiltably attached to the outer housing 3, and a cam return spring 26 for urging each of the pair of cams 27 upright. Each of the cams 27
And a cam receiving surface 33 formed on the lower surface of the cover 21 for receiving the cam surface 32.

In addition, at the time of the test, the IC package 2
4 is provided with a latch mechanism for holding the position of the IC package 24 by holding down the upper part of the IC package 24 and releasing the IC package 24 when the IC package 24 is opened. The latch mechanism is provided with a pair of tiltably attached to the outer housing 3. Latch arm 3
4 and the latch surfaces 34a of the pair of latch arms 34 during the test are
A latch return spring 35 for urging the latch arm 34 so as to be seated on the upper surface of the latch arm 3;
It is also characterized by a latch operation body 38 provided on the lower surface of the cover 21 for pushing down 4 to tilt the latch arm 34 in the opening direction against the latch return spring 35.

Further, the cam receiving surface 33 on the lower surface of the cover 21 for receiving the cam surface 32 of the cam 27 has a gentle slope portion 33a.
When the test cover 21 and the inner housing 4 are located at the upper limit, the cam surface 32 of the cam 27 is positioned on the starting point of the gentle slope 33a, and then the test is performed. In the transition from the time to the opening of the IC package 24, the cam 27 is guided so that the cam surface 32 of the cam 27 is guided on the gentle slope portion 33a.
Is tilted in the middle, thereby suppressing the downward movement of the cover 21 and the downward movement of the latch operation body 38 connected to the cover 21 to hold the latch arm 34 in the latch position. The cam 27 is tilted to the last limit so that the cam surface 32 of the cam 27 can be guided on the steep slope portion 33b just before reaching the position. The cam surface 32 of the cam 27 is formed by the gentle slope portion 33a and the steep slope portion 33b so as to be tilted.
Guide timing and cover 21 and latch operating body 38
, And the tilt timing of the latch arm 34 is set.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the present invention will be described in detail with reference to FIGS. The entire burn-in socket is shown as 1. The burn-in socket 1 has a socket main body 2, and the socket main body 2 includes an outer housing 3 having a mounting peg 3a at a bottom portion, and an inner housing 4 housed in the outer housing 3. The inner housing 4 is housed in the outer housing 3 in a state where the engaging claws 6 of the inner housing 4 are engaged with the engaging pieces 5 formed on the inner wall of the outer housing 3. The inner housing 4 is accommodated therein. In this case, the mode of engagement of the engagement claws 6 with the engagement pieces 5 is such that the inner housing 4 is engaged with each other so as not to protrude upward from the inside of the outer housing 3, but within the outer housing 3. The inner housings 4 are engaged with one another in such a way that they can move downward.

A concave portion 4b is formed on the upper surface 4a of the inner housing 4 except for a peripheral edge. A plurality of terminal mounting holes 7 are formed between the upper surface 4c and the lower surface 4d in the concave portion 4b. I have. As shown in FIGS. 11 and 12, each of the plurality of terminal mounting holes 7 is opened in a rectangular shape when viewed from a plane, and the plurality of terminal mounting holes 7 having the rectangular openings are arranged so as to be positioned in a lattice pattern. Have been. Focusing on one terminal mounting hole 7, each terminal mounting hole 7 is defined by a pair of long side wall surfaces 8 and a pair of short side wall surfaces 9 because it is defined as a rectangular opening when viewed from a plane. The arrangement relationship between the mounting hole 7 and another terminal mounting hole 7 located next to the terminal side in a grid-like arrangement is such that the long side wall surface 8 of one terminal mounting hole 7 and the short side wall surface 9 of another terminal mounting hole 7. All terminals 12 are arranged so that they are opposed to each other with the wall 10 inside. In this example,
Since the length of the long side wall 8 is set to twice the length of the short side wall 9, the long side wall 8 of one terminal mounting hole 7 is set.
The wall thickness of the wall 10 between the short side wall surfaces 9 of another terminal mounting hole 7 adjacent to the side, the short side wall surface 9 of the one terminal mounting hole 7, and another still another terminal mounting hole. When the wall thicknesses of the walls 10 between the long side wall surfaces 8 are compared with each other, they are set substantially equal to each other. That is, the thickness of all the walls 10 is equal. By doing so, the upper surface 4 of the concave portion in the inner housing 4 is formed.
Even when the terminal mounting holes 7 are formed at a high density per unit area c, a plurality of the terminal mounting holes of the conventional rectangular opening are formed by turning the long side wall surface or the short side wall surface in one direction. In this manner, the wall thickness between one terminal mounting hole and the terminal mounting holes located adjacent to the four sides thereof can be made equal to each other as compared with the case where the entirety is arranged in a lattice or obliquely arranged. Therefore, regarding the thickness of the entire wall around all the terminal mounting holes,
The terminal mounting holes can be formed with high density per unit area of the internal housing 4 because it is not necessary to increase the thickness while securing the strength required for design. Thus, tail support holes 11 for a plurality of terminals are formed in the outer housing 3 in accordance with the manner in which the plurality of terminal mounting holes 7 in the inner housing 4 are formed.

Next, the terminals 12 mounted in the terminal mounting holes 7 will be described with reference to FIGS. Each of the terminals 12 is connected to an upper contact portion 13.
And a spring portion 14 forming an intermediate contact beam;
The lower tail portion 15 is connected in series, and the contact portion 13 is composed of a pair of contact pieces 13b and 13c which are divided into left and right on a contact base 13a. 13c
The gap is formed as a valley 13d. As a result, the shape of the contact end face formed by the oblique contact end face 16b of the one contact piece 13b, the oblique contact end face 16c of the other contact piece 13c, and the valley bottom 16d of the valley 13d is substantially the same. It has a V-shape. Next, the spring part 1
Reference numeral 2 denotes a series of a plurality of rounded portions 14b connected from the contact base 13a to the tail base 15a. The next rounded portion 14b is opposed to one rounded portion 14b by 180 degrees. Are formed in a meandering shape from the contact portion 13 toward the tail portion 15 as a whole. In this embodiment, an example is shown in which a plurality of rounded portions 14b are successively connected in series via a linear portion 14a. And the said tail part 15,
The tail base 15a and a tail contact 15b connected to a conductor on a burn-in board (not shown) ahead of the tail base 15a.
Are formed. Therefore, as shown in FIG. 13 or FIG. 14, since each of the terminals 12 has a meandering shape as a whole, the spring portion 14 is formed by sequentially connecting the round portions 14b by the linear portions 14a, and the surface orthogonal to the meandering direction is a wide surface. In contrast, the end surface in the meandering direction is formed as a narrow surface 18. It is desirable that such a terminal 12 be formed by press stamping and processing from a metal plate.
Alternatively, a metal plate may be first punched into a pin shape or a wire shape, and then the spring portion 14 may be bent into a meandering shape. Further, the spring portion 14 may be made of a spring material made of a wire, and may be connected to the contact portion 13 and the tail portion 15.

In order to mount the terminals in the terminal mounting holes 7 of the inner housing 4 and the tail support holes 11 of the outer housing 3, the wide surface 17 of each terminal is connected to the long side of the terminal mounting hole 7. The terminal is mounted so as to face the wall surface 8, so that the narrow surface 18 of each terminal faces the short side wall surface 9 of each terminal mounting hole 7. In the above mounting, before the inner housing 4 is mounted in the outer housing 3, each of the terminals 12 is inserted into each of the terminal mounting holes 7 from below the inner housing 4 with the contact portions 13 of the terminals 12 as heads. A pair of contact pieces 13b and 13c of the contact portion 13 of the terminal 12 are exposed on the upper surface 4c of the recess 4b of the inner housing 4. At this time, as shown in FIG.
The pair of left and right shoulders 19 a face the pair of stopper pieces 20 at the upper part of each terminal mounting hole 7 of the internal housing 4.
Next, the inner housing 4 on which the terminals 12 are mounted is mounted on the outer housing 3. At this time, the tail base 15 a of the tail portion 15 of each terminal 12 is inserted into the tail support hole 11 of the outer housing 3. Attach it as it is. That is, by pulling the tail portion 15 from the bottom surface side of the socket body 2, the tail base portion 15a
Engages with the wall surface of the tail support hole 11, thereby supporting each terminal 12. Looking at the mounting state of each terminal 12 to the inner and outer housings 4 and 3, as described above, the plurality of terminal mounting holes 7 are determined in a lattice-like arrangement relationship with each other, and The arrangement relationship of each terminal mounting hole 7 located on each side in the four directions is as follows.
The long side wall surface 8 of one terminal mounting hole 7 and the short side wall surface 9 of each terminal mounting hole 7 are opposed to each other with the wall 10 at the center. Since the wide surface 17 is mounted so as to face the long side wall 8 when mounted on the terminal, one terminal 12 in a certain terminal mounting hole 7 and the terminal mounting holes located adjacent to each side in four directions with respect to it. Each terminal 12 in 7 is mounted in a state different from each other by 90 degrees. That is, as shown in FIG. 15, one terminal 12 has a wide surface 17 shown, and the terminal 12 next to the one has a narrow surface 18. Therefore, what is important here is that each terminal 12 is elastically deformed by the spring portion 14, so that each terminal 12 has a long side wall surface 8 and a short side wall surface 9 inside each terminal mounting hole 7 of the internal housing 4. In other words, not only the linear portion 14a of the spring portion 14 during elastic deformation but also the radius portion 14b of the elastic portion 14 have the long side wall surface 8,
The relationship between the dimensions of the round portion 14b and the straight portion 14a and the dimensions of the long side wall 8 and the short side wall 9 is determined so as not to contact the short side wall 9. Since the spring portion 14 is formed in a meandering shape as a whole from the contact portion 13 to the tail portion 15, during the burn-in test of the IC package, the contact portion 13 of this terminal becomes a solder ball as a contact of the IC package. When the contact is made, the spring length enough to generate a stable contact force every time, which is necessary for the test, can be ensured. Therefore, the terminals can be mounted at a high density.

Next, the burn-in socket 1 has an open top type cover 21. That is, the cover 21
An IC package 2 having a square peripheral frame portion 22 and a central opening 23 in the frame portion to be burn-in tested.
4 is mounted on or removed from the internal housing 4 of the burn-in socket by an automatic machine through the central opening 23 described above. That is, it is an open top type. When the pressing force is released by the cams 27 which return by the pair of cam return springs 26 arranged on both sides of the outer housing 3, the cover 21 returns to the upper limit position shown in FIG. Cover 2 from the state
When 1 is depressed, it is pushed down to the lower limit position in FIG. 9 via the intermediate operation in FIG.

The cam mechanism will be described in detail. First, the cam return springs 26 on both sides of the outer housing 3 are disposed between the inner bottom surface of the outer housing 3 and the spring receiving portions 29 of the cams 27, respectively. Are urged to rotate about the cam shaft 28 in the direction toward the other cam 27. A pair of cams 27 arranged on both sides have a cam surface 32 formed above each, and this cam surface 32 is in contact with a cam receiving surface 33 of the cover 21.
The cam receiving surface 33 includes a gentle slope portion 33a and a steep slope portion 33b. In the state shown in FIG. 5, the cam surface 32 of the cam 27 is on the gentle slope portion 33a. The cam surface 32 has a gentle slope portion 33a.
When the cover 27 is pushed down and the cover 21 is still pushed down, the cam surface 32 of the cam 27 is guided by the steeply inclined portion 33b and tilts as shown in FIG. Upon release, the cam 27 is sequentially returned from the state of FIG. 9 to the state of FIGS. 7 and 5 by the cam return spring 26, and the cover 21 returns to the upper limit of the original position.

In the above description, the vertical movement of the cover 21 and the tilt movement of the cam 27 have been described in relation to each other.
The tilting operation of the cam 27 mainly relates to the vertical movement of the inner housing 4. That is, on each side of the inner housing 4, each wing piece 30 is formed to protrude in the lateral direction,
Each of the wing pieces 30 is housed in the wing piece holding groove 31 of each of the cams 27. As shown in FIG. 5, when the cam 27 stands upright and no pressing force is applied to the cover 21 and the cover 21 is at the upper limit position, the wing piece 30 of the inner housing 4 holds the wing piece. The inner housing 4 is completely accommodated in the groove 31 so that the inner housing 4 is at the upper limit position in a state where the engagement claws 6 are engaged with the engagement pieces of the outer housing 3 (cover upper limit return state). Then, as shown in FIG. 7, the cover 21 is slightly pressed down, and the cam surface 32 of the cam 27 is pressed.
Finishes guiding the gentle slope portion 33a, and when the cam 27 starts to slightly tilt by approaching the steep slope portion 33b, the wing piece 30 of the inner housing 4 starts to move from inside the wing piece holding groove 31;
The wing piece 30, that is, the inner housing 4 is slightly moved downward by the upper surface 31a of the wing piece holding groove 31 (intermediate state of pressing the cover), and further, as shown in FIG.
When the cam surface 32 of the cam 27 is guided by the steep slope portion 33b and the end cam 27 is completely tilted, the wing piece 30 of the inner housing 4 moves from the inside of the wing piece holding groove 31 to the movement limit. The cam 27 and the cover 21 are moved so that the wing 30, that is, the inner housing 4 is completely moved down to the lower limit position by the upper surface 31 a of the wing holding groove 31 (the cover lower limit state). Inner housing 4
Are defined. 5 and FIG. 6 in the upper limit state of the cover indicate a burn-in test of the IC package 24 (hereinafter simply referred to as "test time"), and the states of FIGS. Is in the process of releasing the IC package 24 after the burn-in test is completed, or I
A test transfer process of the C package is shown (hereinafter, simply referred to as a transfer process). Further, in the state of FIGS. The IC package 24 to be burn-in-tested just before it is taken out from an automatic machine or an open-top type cover 2
1 shows a state of being placed on the inner housing 4 through one central opening 23 (hereinafter simply referred to as an open state).

By the way, at the time of the test in the state of FIGS.
To securely hold the C package 24, a latch mechanism including a latch arm 34 and a latch return spring 35 is provided. That is, burn-in socket 1
In the outer housing 3, a pair of L-shaped latch arms as shown in FIGS. 16 and 17 are provided on both sides in directions different from each other by 90 degrees with respect to both sides on which the pair of cams 27 are disposed. A latch tilting piece 36 with 34 is provided so as to face both sides via the IC package 24, and each of the latch tilting pieces 36 is tiltably supported by a latch support shaft 37. Each latch arm 34 is constantly urged in the latch direction by a latch return spring 35. For this reason, FIG. 5, in which the cover 21 is not pressed,
In the test in the state shown in FIG. 6, each latch arm 34 returns to the IC package 24 on the inner housing 4 by a latch return spring 35, and the latch surface 34a
The IC package 24 is seated on the upper surface of the C package 24.
Holding. Since the IC package 24 needs to be free in the open state after the transition process in which the cover 21 starts to be pushed, the lower surface of the cover 21 is
As shown in FIG. 19, four latching members 38 are disposed downward in a state suitable for engaging with a total of four places on both sides of the pair of latch tilting pieces 36. Reference numeral 22a in the figure denotes a main body engaging portion for maintaining the state of engagement with the socket main body 2. In the transition process in which the cover 21 in FIG. 7 and FIG. 8 starts to be pushed, the tip of the latch operation body 38 comes into contact with the latch tilting piece 36, and the cover 2 in FIG.
When the cover 1 is completely lowered, the latch arm 34 is moved downward by the lowering of the latch operation body 38 accompanying the lowering of the cover 21.
Is tilted, and its latch surface 34a is opened apart from the upper surface of the IC package 24. Therefore, the IC package 24 can be taken out or mounted by an automatic machine.

In the above-described process, when the cover 21 starts to be pushed, the state of FIGS.
Since the test using the burn-in socket cannot be smoothly performed if the plug 4 falls off from the inner housing 4 of the burn-in socket or moves unexpectedly, the latch arm 34 is in the upright state as shown in FIG. And the latch arm 34 is opened as shown in FIG. 9 just before reaching the open state of FIGS. For this reason, the cam surface 32 of the cam 27 guides the gentle slope 33a so that the cover 21 slowly moves down from the time of the test to the end of the transition process. Reference numeral 21 denotes a cam surface 32 of the cam 27 which guides the steep slope portion 33b so as to move down suddenly. As a result, the IC package 24 is substantially held by the latch arm 34 immediately before the IC package 24 can be freely taken out or mounted, and the burn-in test of the IC package 24 is smoothly performed. .

Next, a burn-in test operation of the IC package 24 using such a burn-in socket 1 will be described. In the test in the state of FIGS. 5 and 6, since no pressing force is applied to the cover 21, each cam 27 is in an upright state by the bias of each return spring 26,
Is located at the starting point on the gentle slope portion 33a where the guide is started,
The cover 21 is at the upper limit position. Each wing piece 30 of the inner housing 4 is accommodated in each wing piece holding groove 31 of each cam 27, and the inner housing 4 is moved to the upper limit in a state in which each engagement claw 6 is engaged with each engagement piece 5. On the other hand, each latch arm 34 is in the upright state, and the latch surface 34a of each latch arm 34 suppresses the upper part of the IC package 24 and holds it. At this time, each solder ball 25 as a contact of the IC package 24 is connected to each terminal 12 of the internal housing 4.
, And a test is performed.
According to FIG. 15, this will be described more specifically. Since the inner housing 4 is held at the upper limit as described above and the IC package 24 is latched from above as described above, When the solder ball 25 of the IC package 24 comes into contact with the contact portion 13 of the terminal 12, each terminal 12 is elastically deformed by the spring portion 14. That is, the R-shaped portions 14b are successively connected via the linear portion 14a, and the spring portion 14 having a meandering shape as a whole is compacted so as to reduce the pitch between the R-shaped portions 14b as a whole, thereby storing elasticity. At this time, the round portion 14 of the spring portion 14
b, the narrow surface 18 is deformed so as to face the short side wall surface 9,
Since the wide surface 17 is not deformed so as to face the long side wall surface 8, the spring portion 14 of each terminal 12 does not contact any of the long and short side wall surfaces 8, 9 of the terminal mounting hole 7, and the elastic deformation is caused by the spring. Part 1
4 is averaged at each point over the entire length. Therefore,
For each terminal 12, every time at the time of testing or a plurality of terminals 12
Each produce a stable elasticity on average. This is because even if the dimensions such as the width and length of each terminal 12 are reduced in order to mount the terminals 12 at a high density, the strength of the spring portion is not reduced and the effective spring length is sufficiently increased. A terminal that generates stable elasticity can be provided. Conversely, the required strength of the spring portion is ensured, the effective spring length is sufficiently secured, and the design of a small-sized terminal for high-density mounting that also generates stable elasticity becomes easier. In particular, there is no need to create an extra clearance with the surrounding wall.

Now, the solder balls 2 of the IC package 24
5 is in contact between the pair of contact pieces 13b and 13c, but the elasticity stored in the spring portion 14 urges the pair of contact pieces 13b and 13c of the contact portion 13 to the solder balls 25 of the IC package 24, Ensure necessary contact force. More specifically, the above-mentioned contact force causes IC
The solder balls 25 of the package 24 make contact with the contact end surfaces 16b and 16c of the pair of contact pieces 13b and 13c, respectively. Therefore, solder ball 2
Since there is little possibility that an unexpected air layer is interposed between the contact surface 5 and the contact end surfaces 16b and 16c, there is almost no contact failure due to an increase in electric resistance at the time of contact. Also, should the solder balls 2 of the IC package 24
Even if there is a slight difference in size or deviation from the specified position in 5, the valley 1
A pair of contact pieces 13b and 13c with 3d as the center, and a substantially V-shaped contact end face is formed by the oblique contact end face 16b, the valley bottom 16d, and the oblique contact end face 16c. The contact goodness of No. 13 is almost ensured.

In the above description, the group of terminal mounting holes 7 of the inner housing 4 is such that the relation between one terminal mounting hole 7 and another terminal mounting hole 7 at each position in four directions is as follows. Are arranged as a whole such that long side wall surfaces 8 and short side wall surfaces 9 are opposed to each other via a wall 10.
2 is mounted with its wide surface 17 parallel to the long side wall 8 and its narrow surface 18 parallel to the short side wall 9. The terminal mounting holes 7 and the terminals 12 are arranged in a grid. In addition, since the solder balls 25 of the IC package 24 are also in a lattice-like arrangement that matches the above-mentioned lattice-like arrangement, all the terminals 12 and all the solder balls 25 are in accurate contact as described above. By the way, with such an arrangement, the thickness of each wall 10 between a certain terminal mounting hole 7 and the four terminal mounting holes 7 can be all equal. This is suitable for high-density mounting of terminals, since each wall 10 does not become excessively thick.

After the burn-in test of the IC package 24 has been completed in this way, when the cover 21 is pushed down as shown at the time of transition to the state of FIGS. Then, the contact pieces 13b and 13c of the contact portion 13 of each terminal 12 begin to separate from the solder ball 25. At this time, the latch arm 34 is still at the latch position. Then, when the cover 21 is further depressed to reach the opening state in FIGS. 9 and 10, the inner housing 4 reaches the lower limit, and a pair of contact pieces 13 of the contact portion 13 of each terminal 12 is reached.
b and 13c are completely separated from the solder ball 25, and the latch arm 34 is completely tilted as described above, and the latch surface 34a is located at a position outside and above the IC package 24. As described above, since the latch arm 34 is located outside the latch holding position immediately before the IC package 24 is opened, there is almost no unexpected drop of the IC package 24 at the time of transition. Thereafter, the IC package 24 after the test is taken out of the burn-in socket 1 by an automatic machine. From now on I
When performing the burn-in test on the C package 24, the IC package 24 is placed on the inner housing 4 in the state shown in FIG.
The burn-in test is performed by reversing the operation in the order of FIG. 9, FIG. 7, and FIG.

[0026]

As described above in detail, according to the first aspect of the present invention, at the time of the burn-in test of the IC package, the terminal is stably elastically deformed so that the pitch between the rounded portions of the spring portion becomes narrow. Only, there is almost no possibility of hitting the wall surface of the terminal mounting hole.Therefore, there is no need to make the terminal mounting hole an extra large space, and eventually many terminal mounting holes can be formed per unit area on the socket body. Enables high-density mounting. In addition, even if this terminal is small in size for high-density mounting, a burn-in socket having a terminal having a spring portion that can provide a sufficient effective spring length and always provide a stable contact force by a meandering spring portion. Can be provided.

Further, according to the second aspect of the present invention, the terminals can be mounted at a higher density. In other words, a burn-in socket that can be easily designed for high-density mounting of terminals can be provided.

According to the third aspect of the present invention, in addition to the above-described effects, the electrical contact with the solder balls of the IC package is improved. Further, according to the fourth and fifth aspects of the present invention, it is possible to provide a burn-in socket having a terminal which can be easily manufactured to achieve the above-mentioned effects. According to the invention of claim 6, in addition to the above-mentioned effects, it is easy to design and manufacture a burn-in socket having a terminal mounting hole group for mounting terminals at high density. In addition, according to the seventh, eighth, and ninth aspects of the present invention, in addition to the above-mentioned effects, the IC package can be mounted or removed from the burn-in socket in an open-top type, and the test operation and the opening operation of the IC package can be performed smoothly and reliably. A burn-in socket can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view of a burn-in socket according to an embodiment of the present invention.

FIG. 2 is a view on arrow P of the burn-in socket of FIG. 1;

FIG. 3 is a view as seen from an arrow Q of the burn-in socket of FIG. 1;

FIG. 4 is a cross-sectional view taken along the line 4-4 of the burn-in socket of FIG. 1 and showing a burn-in test of the IC package.

FIG. 5 is a one-side sectional view taken along the line 4-4 of the burn-in socket of FIG. 1 and showing a burn-in test of the IC package;

FIG. 6 is a one-side sectional view taken along the line 6-6 of the burn-in socket of FIG. 1 and showing a burn-in test of the IC package.

FIG. 7 is a one-side cross-sectional view taken along the line 4-4 of the burn-in socket of FIG. 1, showing the IC package being opened after the burn-in test or at the time of test transfer of the IC package to be burn-in tested.

FIG. 8 is a one-side cross-sectional view along the line 6-6 of the burn-in socket of FIG. 1, showing the IC package being opened after the burn-in test or at the time of test transfer of the IC package to be burn-in tested.

9 is a one-side cross-sectional view along the line 4-4 of the burn-in socket of FIG. 1, showing a state in which the IC package subjected to the burn-in test is completely opened or a state in which the IC package to be subjected to the burn-in test is mounted.

FIG. 10 is a sectional view taken along the line 6-6 of the burn-in socket shown in FIG. 1;
It is a one side sectional view showing the state where a package was attached.

FIG. 11 is a view showing an arrangement state of a plurality of terminal mounting holes of the burn-in socket.

FIG. 12 is a cut-away view of a portion indicated by an arrow A in FIG. 1 showing an arrangement state of terminal mounting holes in which terminals are mounted.

FIG. 13 is a front view of a terminal.

FIG. 14 is a side view of a terminal.

FIG. 15 is a partial cut-away view of a portion indicated by an arrow B in FIG. 4 showing a state where a solder ball of an IC package is in contact with a contact portion of a terminal.

FIG. 16 is a plan view of a latch tilting piece.

FIG. 17 is a side view of the latch tilting piece.

FIG. 18 is a one-side cross-sectional view from the front of the cover.

FIG. 19 is a one-side cross-sectional view from the side of the cover.

[Description of Signs] 1 Burn-in socket 2 Socket body 3 External housing 3a Mounting peg 4 Inner housing 4a Upper surface 4b Depression 4c Depression upper surface 4d Lower surface 5 Engagement piece 6 Engagement claw 7 Terminal mounting hole 8 Long side wall surface of terminal mounting hole 9 Short side wall surface of terminal mounting hole 10 Wall between terminal mounting holes 11 Tail support hole of terminal 12 Terminal 13 Contact part 13a Contact base 13b One contact piece 13c The other contact piece 13d Valley 14 Spring part 14a Straight part 14b Round part 15 Tail 15a Tail base 15b Tail contact 15c Locking claw 16b, 16c Contact end face 16d Valley bottom 17 Wide surface 18 Narrow surface 19 Shoulder 20 Stopper piece 21 formed on top of each terminal mounting hole 7 of internal housing 4 21 Cover 22 Peripheral frame part 22a Main body engaging part 2 Central opening 24 IC package 25 Solder ball 26 Cam return spring 27 Cam 28 Cam spindle 29 Spring receiving part 30 Inner housing wing piece 31 Wing piece holding groove 31a Upper surface of wing piece holding groove 32 Cam surface 33 Cover cam receiver Surface 33a Slow slope portion 33b Steep slope portion 34 Latch arm 34a Latch surface 35 Latch return spring 36 Latch tilting piece 37 Latch support shaft 38 Latch operating body

Claims (10)

[Claims] A socket body (2) and said socket body (2)
Of the contact portion 13
The IC package 24 is mounted on the socket body 2 such that a solder ball 25 as a contact thereof corresponds to the contact portion 13 of the terminal 12. Then, in the burn-in socket 1 for performing the burn-in test of the IC package 24 by bringing the terminals 12 and the solder balls 25 into contact with each other, the spring portions 14 of the respective terminals 12 mounted in the respective terminal mounting holes 7. Is the contact portion 13
A plurality of rounded portions 14b
Are formed in a series in a meandering shape as a whole, with their rounded surfaces alternately oriented in opposite directions. 2. The socket body 2 and the socket body 2
Of the contact portion 13
The IC package 24 is mounted on the socket body 2 such that the solder balls 25 as contacts correspond to the contact portions 13 of the terminals 12. Then, in the burn-in socket 1 for bringing the terminals 12 and the solder balls 25 into contact with each other and performing a burn-in test of the IC package 24, the plurality of terminal mounting holes 7 for mounting the terminals 12 are mutually connected as a whole. Are arranged in a grid,
Each of the terminal mounting holes 7 is formed in a rectangular shape when viewed from a plane, and thus includes a pair of long side wall surfaces 8 and a pair of short side wall surfaces 9. Terminals at arbitrary positions in the group of the plurality of terminal mounting holes 7 are provided. Another terminal mounting hole 7 located adjacent to the side of the mounting hole 7 via the wall 10 on the long side wall surface 8 side has a short side wall 9 so that the short side wall 9 is opposed to the terminal mounting hole 7 at an arbitrary position. Another terminal mounting hole 7 located adjacent to the side wall 9 on the side of the side wall 9 faces the long side wall 8 so that the plurality of terminal mounting holes 7 are entirely formed in the housing of the socket body 2. A burn-in socket characterized by being formed in an array. 3. The socket body 2 and the socket body 2
Of the contact portion 13
The IC package 24 is mounted on the socket body 2 such that the solder balls 25 as contacts correspond to the contact portions 13 of the terminals 12. Then, in the burn-in socket 1 for bringing the terminals 12 and the solder balls 25 into contact with each other and performing a burn-in test of the IC package 24, the plurality of terminal mounting holes 7 for mounting the terminals 12 are mutually connected as a whole. Are arranged in a grid,
Each of the terminal mounting holes 7 is formed in a rectangular shape when viewed from a plane, and thus includes a pair of long side wall surfaces 8 and a pair of short side wall surfaces 9. Terminals at arbitrary positions within the group of the plurality of terminal mounting holes 7 are provided. Another terminal mounting hole 7 located on the side of the wall 10 on the long side wall surface 8 side of the mounting hole 7 has the short side wall 9 so as to be opposed to the short side wall 9 and has the short side of the terminal mounting hole 7 at an arbitrary position. Another terminal mounting hole 7 located adjacent to the side wall 9 on the side of the side wall 9 faces the long side wall 8 so that the plurality of terminal mounting holes 7 are entirely formed in the housing of the socket body 2. The spring portion 14 of each terminal 12 which is formed in an array and is mounted in each of the terminal mounting holes 7 has a plurality of rounded portions 14b which are alternately formed on the round surface from the contact portion 13 toward the tail portion 15. In a series while turning in the opposite direction, as a whole meandering shape Burn-in socket, characterized in that the formed. 4. The contact portion 13 of the terminal 12 has a valley 1
A pair of contact pieces 13 which are symmetrical with respect to 3d
b, 13c, and the solder ball 25 of the IC package 24 at the time of the test is substantially V formed by the oblique contact end faces 16b, 16c of the pair of contact pieces 13b, 13c.
The burn-in socket according to any one of claims 1, 2 and 3, wherein the burn-in socket is in contact with the contact end face in the shape of a letter. 5. The terminal 12 is formed such that a surface perpendicular to the meandering direction of the spring portion 14 is formed as a wide surface 17 and, conversely, an end surface in the meandering direction is formed as a narrow surface 18. The burn-in socket according to claim 1, wherein the burn-in socket is formed by punching a metal plate from a hole. 6. After the terminal 12 is once punched from a metal plate, its spring portion 14 is formed into a plurality of rounded portions 14b.
The burn-in socket according to any one of claims 1 and 3, characterized in that the burn-in sockets are bent so as to form a meandering shape as a whole by connecting them in a series while alternately turning them in opposite directions. 7. The length of the long side wall 8 of the terminal mounting hole 7 having the rectangular opening is set to be longer than the length of the short side wall 9 and the thickness of the wall 10 between the plurality of terminal mounting holes 7. The burn-in socket according to any one of claims 2 and 3, wherein? 8. The socket body 2 includes an outer housing 3 and an inner housing 4 which is housed vertically movable with respect to the outer housing 3 and has a plurality of the terminal mounting holes 7 formed therein. On the main body 2,
A cover 21 composed of a peripheral frame portion 22 having a central opening 23 for attaching and detaching the IC package 24 in an open-top manner is provided so as to be movable up and down.
And the inner housing 4 is positioned at the uppermost limit to bring the solder balls 25 of the IC package 24 on the inner housing 4 into contact with the contact portions 13 of the terminals 12 with a predetermined contact force. , The cover 21 and the inner housing 4 are positioned at the lower limit, and the solder balls 25 of the IC package 24 and the contact portions 13 of the terminals 12 are positioned.
And a pair of cams 27 tiltably attached to the outer housing 3 and respective cam return springs 26 for urging the pair of cams 27 upright. And each cam receiving surface 33 formed on the lower surface of the cover 21 for receiving the cam surface 32 of each cam 27
4. The method according to claim 1, further comprising:
The burn-in socket according to any one of items 6 and 7. 9. At the time of said test, while holding the position of the IC package 24 by holding down the upper part of the IC package 24,
A latch mechanism for releasing the holding of the IC package 24 at the time of opening; the latch mechanism includes a pair of latch arms 34 tiltably attached to the outer housing 3;
During a test, a latch return spring 35 for urging the latch arm 34 so that each latch surface 34a of the pair of latch arms 34 is seated on the IC package 24 on the inner housing 4, and a cover is opened by pressing the cover 21 when opened. When the lever 21 is located at the lower limit, the latch arm 34 is depressed to release the latch arm 34 from the latch return spring 35.
9. The burn-in socket according to claim 8, further comprising a latch actuating member provided on a lower surface of the cover for tilting in an opening direction against the opening. 10. A cam receiving surface 33 on the lower surface of the cover 21 for receiving the cam surface 32 of the cam 27 includes a gentle slope portion 33a and a steep slope portion 33b. When the IC package 24 is located, the cam surface 32 of the cam 27 is positioned above the starting point of the gentle slope portion 33a. The cam 27 is tilted intermediately so that it can be guided on the surface of the gentle slope portion 33a, thereby suppressing the sudden downward movement of the cover 21 and suppressing the downward movement of the latch operation body 38 connected to the cover 21, thereby latching the latch arm 34. So that the cam surface 32 of the cam 27 is guided on the steep slope 33b just before the cover 21 and the inner housing 4 reach the lower limit. Tilt the cam 27 to the final limit,
In such a manner that the latch arm 34 is tilted in the opening direction from above the IC package 24 just before the full opening,
10. The guide timing of the cam surface 32 of the cam 27 by the gentle slope portion 33a and the steep slope portion 33b, the downward movement timing of the cover 21 and the latch operation body 38, and the tilt timing of the latch arm 34 are set.
Burn-in socket.