MY123246A - Test socket lattice - Google Patents

Test socket lattice

Info

Publication number
MY123246A
MY123246A MYPI99001233A MYPI9901233A MY123246A MY 123246 A MY123246 A MY 123246A MY PI99001233 A MYPI99001233 A MY PI99001233A MY PI9901233 A MYPI9901233 A MY PI9901233A MY 123246 A MY123246 A MY 123246A
Authority
MY
Malaysia
Prior art keywords
terminal
cavities
cavity
longitudinal direction
sequence
Prior art date
Application number
MYPI99001233A
Inventor
Isamu Yamamoto
Tomohiro Nakano
Akira Kaneshige
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of MY123246A publication Critical patent/MY123246A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A SOCKET (1) IS PROVIDED FOR BURN-IN TESTING OF AN INTEGRATED CIRCUIT PACKAGE (24) HAVING ELECTRICAL LEADS. THE SOCKET INCLUDES A SOCKET BODY (2) HAVING AN ARRAY OF COLUMNS AND ROWS OF GENERALLY RECTANGULAR TERMINAL-RECEIVING CAVITIES (7) THEREIN, EACH OF THE GENERALLY RECTANGULAR TERMINAL-RECEIVING CAVITIES HAVING A LONGITUDINAL DIRECTION CORRESPONDING TO ITS LONGER DIMENSION AND A PLURALITY OF TERMINAL (12) DISPOSED IN THE TERMINAL-RECEIVING CAVITIES FOR CONTACTING THE LEADS OF THE INTEGRATED CIRCUIT PACKAGE (24). EACH COLUMN AND ROW OF THE ARRAY INCLUDES A SEQUENCE OF AT LEAST THREE ADJACENT CAVITIES (7) WHEREIN FOR EACH CAVITY OF THE SEQUENCE OTHER THAN THE FIRST AND LAST, THE LONGITUDINAL DIRECTION OF THE CAVITY IS SUBSTANTIALLY PERPENDICULAR TO THE LONGITUDINAL DIRECTION OF THE CAVITIES IN THE SEQUENCE ADJACENT THE CAVITY ON EITHER SIDE.(FIGURE 1)
MYPI99001233A 1998-04-01 1999-03-31 Test socket lattice MY123246A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10105894A JP3020030B2 (en) 1998-04-01 1998-04-01 Burn-in socket

Publications (1)

Publication Number Publication Date
MY123246A true MY123246A (en) 2006-05-31

Family

ID=14419623

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI99001233A MY123246A (en) 1998-04-01 1999-03-31 Test socket lattice
MYPI99001225A MY124410A (en) 1998-04-01 1999-03-31 Burn-in test socket.

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI99001225A MY124410A (en) 1998-04-01 1999-03-31 Burn-in test socket.

Country Status (6)

Country Link
JP (1) JP3020030B2 (en)
KR (2) KR100581240B1 (en)
CN (2) CN1178065C (en)
MY (2) MY123246A (en)
TW (2) TW399814U (en)
WO (2) WO1999050676A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6267603B1 (en) 1998-04-01 2001-07-31 Molex Incorporated Burn-in test socket
US6283780B1 (en) 1998-04-01 2001-09-04 Molex Incorporated Test socket lattice
JP2002164135A (en) * 2000-11-26 2002-06-07 Isao Kimoto Socket
JP3789789B2 (en) * 2001-08-31 2006-06-28 株式会社エンプラス Socket for electrical parts
JP4368132B2 (en) 2003-04-25 2009-11-18 株式会社エンプラス Socket for electrical parts
KR100898409B1 (en) 2007-07-05 2009-05-21 주식회사 오킨스전자 Burn-in socket for lead-frame type chip package
KR101090303B1 (en) * 2009-06-12 2011-12-07 (주)브이알인사이트 Bank structure of FPGA board for a semiconductor design verification
US8888503B2 (en) * 2011-12-28 2014-11-18 Enplas Corporation Socket for electric parts
JP5836112B2 (en) * 2011-12-28 2015-12-24 株式会社エンプラス Socket for electrical parts
KR101485779B1 (en) * 2013-06-28 2015-01-26 황동원 Socket device for testing an IC
KR101931623B1 (en) * 2016-12-20 2018-12-21 주식회사 오킨스전자 Soket comprising locker for fixing latch
CN109342773A (en) * 2018-08-17 2019-02-15 北方电子研究院安徽有限公司 A kind of Can aging board clamp
CN111742228B (en) * 2019-01-31 2023-03-21 山一电机株式会社 Socket for inspection
KR102606908B1 (en) * 2020-12-23 2023-11-24 (주)마이크로컨텍솔루션 Test socket

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245747B2 (en) * 1991-09-18 2002-01-15 日本テキサス・インスツルメンツ株式会社 socket
JPH0677467B2 (en) * 1992-12-25 1994-09-28 山一電機株式会社 IC socket
JP3259109B2 (en) * 1993-02-08 2002-02-25 日本テキサス・インスツルメンツ株式会社 socket
JP2667633B2 (en) * 1994-02-24 1997-10-27 山一電機株式会社 IC holding device in IC socket
JPH0888063A (en) * 1994-09-16 1996-04-02 Yamaichi Electron Co Ltd Contact structure of ic socket
JPH09162332A (en) * 1995-12-13 1997-06-20 Toshiba Chem Corp Ic test socket for bga
JP3714642B2 (en) * 1996-07-30 2005-11-09 株式会社エンプラス Electrical connection device

Also Published As

Publication number Publication date
TW399814U (en) 2000-07-21
TW411060U (en) 2000-11-01
CN1178066C (en) 2004-12-01
KR20010013205A (en) 2001-02-26
CN1266492A (en) 2000-09-13
KR100581240B1 (en) 2006-05-22
CN1266491A (en) 2000-09-13
WO1999050676A1 (en) 1999-10-07
WO1999050677A1 (en) 1999-10-07
CN1178065C (en) 2004-12-01
MY124410A (en) 2006-06-30
KR100581237B1 (en) 2006-05-22
JPH11297443A (en) 1999-10-29
JP3020030B2 (en) 2000-03-15
KR20010013206A (en) 2001-02-26

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