KR970000835Y1 - Ic socket - Google Patents
Ic socket Download PDFInfo
- Publication number
- KR970000835Y1 KR970000835Y1 KR2019900021174U KR900021174U KR970000835Y1 KR 970000835 Y1 KR970000835 Y1 KR 970000835Y1 KR 2019900021174 U KR2019900021174 U KR 2019900021174U KR 900021174 U KR900021174 U KR 900021174U KR 970000835 Y1 KR970000835 Y1 KR 970000835Y1
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- KR
- South Korea
- Prior art keywords
- socket
- package
- size
- present
- test
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안의 사시도.1 is a perspective view of the present invention.
제2도는 본 고안의 사용상태 종단면도.Figure 2 is a longitudinal cross-sectional view of the use state of the present invention.
제3도 및 제4도는 종래의 소켓을 나타낸 종단면도.3 and 4 are longitudinal cross-sectional views showing conventional sockets.
*도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of drawing
1 : 소켓 2, 3 : 접속홈1: Socket 2, 3: Connection groove
본 고안은 디바이스 테스터용 소켓의 구조에 관한 것으로서, 특히 팩케이지의 크기에 구애받지 않고 겸용으로 사용할 수 있도록 한 것이다.The present invention relates to a structure of a socket for a device tester, and in particular, to be able to be used interchangeably regardless of the size of the package.
종래에는 제3도 및 제4도에 도시한 바와 같이 디바이스 테스터용 소켓 아답타를 제작시에 팩캐이지의 크기(300㎜ 또는 600㎜)에 따라 소켓(11)(12)을 각각 별도로 형성하도록 되어 있다.Conventionally, as shown in FIGS. 3 and 4, the sockets 11 and 12 are separately formed according to the size of the pack cage (300 mm or 600 mm) when the socket adapter for the device tester is manufactured. .
따라서 300㎜의 팩케이지(13a)를 가진 디바이스(13)를 테스트 하고자할 경우에는 제3도와 같은 소켓(11)을 사용하게 되고, 600㎜의 팩케이지(14a)를 가진 디바이스(14)를 테스트하고자 할 경우에는 제4도와 같은 소켓(2)을 사용하게 된다. 그러나 이러한 종래의 소켓은 팩케이지의 크기에 따라 각각 별도의 소켓(11)(12)을 제작하여야 되었으므로 제작비가 상승되었고, 또한 디바이스(13)(14)의 테스트시에 팩케이지(13a)(14a)의 크기가 각각 달라 소켓(11)(12)을 교체시켜 주어야 되었으므로 생산성이 저하되는 결점이 있었다.Therefore, when the device 13 having the package 13a of 300 mm is to be tested, the socket 11 as shown in FIG. 3 is used, and the device 14 having the package 14a of 600 mm is tested. If you want to use a socket (2) as shown in FIG. However, since the conventional sockets had to be manufactured with separate sockets 11 and 12, respectively, according to the size of the package, the manufacturing cost was increased, and the packages 13a and 14a were tested when the devices 13 and 14 were tested. ), So that the size of each socket (11, 12) had to be replaced, there was a drawback that the productivity is lowered.
본 고안은 종래의 이와 같은 결점을 감안하여 안출한 것으로서, 소켓을 팩케이지의 크기에 구애받지 않고 겸용으로 사용할 수 있도록 제작하여 소켓을 교체시키지 않고도 디바이스를 테스트할 수 있도록 하는데 그 목적이 있다.The present invention has been made in view of the above drawbacks of the prior art, and the purpose of the device is to be able to test the device without replacing the socket by making the socket can be used for both purposes regardless of the size of the package.
상기 목적을 달성하기 위해, 본 고안은 소켓에 한쌍의 접촉홈을 나란히 형성하여 팩케이지의 크기가 다른 디바이스 결합시킬 수 있도록 한 디바이스 테스트용 소켓의 구조가 제공된다.In order to achieve the above object, the present invention provides a structure of a socket for a device test to form a pair of contact grooves in the socket side by side to be coupled to the device of a different package size.
이하, 본 고안을 일실시예로 도시한 첨부된 도면 제1도 제2도를 참고로 하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to FIGS. 1 and 2 of the accompanying drawings showing an embodiment as follows.
첨부도면 제1도는 본 고안의 사시도이고, 제2도는 사용상태 종단면도로서, 소켓(1)에 300㎜용 접속홈(2)과 600㎜용 접속홈(3)이 나란히 형성되어 있어 팩케이지(4a)(5a)의 크기에 따라 디바이스(4)(5)의 리드(4b)(5b)를 접속홈(2)(3)에 선택적으로 삽입시켜 테스트할 수 있도록 되어 있다.FIG. 1 is a perspective view of the present invention, and FIG. 2 is a longitudinal cross-sectional view of a state of use. A 300 mm connecting groove 2 and a 600 mm connecting groove 3 are formed side by side in the socket 1. Depending on the size of 4a) and 5a), the leads 4b and 5b of the devices 4 and 5 can be selectively inserted into the connection grooves 2 and 3 for testing.
이와 같이 구성된 본 고안은 제2도에 도시한 바와 같이 소켓(1) 300㎜용 접속용(2)과 600㎜용 접속용(3)이 나란히 형성되어 있어 300㎜용 팩케이지(4a)를 가진 디바이스(4)를 테스트하고자 할 경우에는 300㎜용 접속용(2)에 디바이스(4)의 리드 (4b)를 결합하여 테스트를 실시하고, 600㎜용 팩케이지(5a)를 가진 디바이스(5)를 테스트하고자 할 경우에는 600㎜용 접속홈(3)에 디바이스(5)의 리드(5b)를 결합하여 테스트를 실시할 수 있게 되어 있어 소켓(1)을 팩케이지의 크기에 따라 별도로 제작할 필요가 없게 되므로 소켓(1)의 제작비를 절감시킬 수 있게 됨은 물론 테스트시에 소켓을 교체시킬 필요가 없게 되므로 생산성을 향상시킬 수 있게 되는 효과가 있다.According to the present invention configured as shown in FIG. 2, the socket (1) for connection of 300 mm (2) and the connection for use for 600 mm (3) are formed side by side to have a package (4a) for 300 mm. When the device 4 is to be tested, the test is performed by coupling the lead 4b of the device 4 to the connection 2 for 300 mm, and the device 5 having the package 5a for 600 mm. In order to test the test, the lead 5b of the device 5 can be combined with the connection groove 3 for 600 mm, so that the test can be performed. Therefore, the socket 1 needs to be manufactured separately according to the size of the package. Since there is no need to reduce the manufacturing cost of the socket (1) of course there is no need to replace the socket during the test, there is an effect that can improve the productivity.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019900021174U KR970000835Y1 (en) | 1990-12-27 | 1990-12-27 | Ic socket |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019900021174U KR970000835Y1 (en) | 1990-12-27 | 1990-12-27 | Ic socket |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920013838U KR920013838U (en) | 1992-07-27 |
KR970000835Y1 true KR970000835Y1 (en) | 1997-02-10 |
Family
ID=19307960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019900021174U KR970000835Y1 (en) | 1990-12-27 | 1990-12-27 | Ic socket |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970000835Y1 (en) |
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1990
- 1990-12-27 KR KR2019900021174U patent/KR970000835Y1/en not_active IP Right Cessation
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Publication number | Publication date |
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KR920013838U (en) | 1992-07-27 |
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