KR100389909B1 - Probe card of wafer level test and connection method between test equipments - Google Patents

Probe card of wafer level test and connection method between test equipments Download PDF

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Publication number
KR100389909B1
KR100389909B1 KR1019950042610A KR19950042610A KR100389909B1 KR 100389909 B1 KR100389909 B1 KR 100389909B1 KR 1019950042610 A KR1019950042610 A KR 1019950042610A KR 19950042610 A KR19950042610 A KR 19950042610A KR 100389909 B1 KR100389909 B1 KR 100389909B1
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South Korea
Prior art keywords
probe card
test equipment
test
wafer level
probe
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KR1019950042610A
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Korean (ko)
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KR970030565A (en
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김청수
김원규
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삼성전자주식회사
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Priority to KR1019950042610A priority Critical patent/KR100389909B1/en
Publication of KR970030565A publication Critical patent/KR970030565A/en
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Publication of KR100389909B1 publication Critical patent/KR100389909B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

PURPOSE: A probe card of a wafer level test and a connection method between test equipments are provided to be capable of easily connecting the probe card with the test equipments and improving the compatibility between equipments of a probe station. CONSTITUTION: The second test equipment connecting part(204) is located between a probe card pin(201) and the first test equipment connecting part(206) for being connected with an additional test equipment. Preferably, the test equipment is capable of being connected with the end portion of a probe card. Preferably, the test equipment is capable of being connected with the upper surface of the probe card. Preferably, the test equipment is capable of being connected with the lower surface of the probe card.

Description

웨이퍼 레벨 테스트에서 프로우브 카드와 테스트 장비간의 연결 방법How to connect probe cards to test equipment in wafer level testing

본 발명은 프로우브 카드와 반도체 테스트 장비간의 연결 방법에 관한 것으로서, 특히 웨이퍼 레벨 테스트시에 프로우브 카드와 테스트 장비간의 연결 방법에 관한 것이다.The present invention relates to a connection method between a probe card and semiconductor test equipment, and more particularly, to a connection method between a probe card and test equipment during wafer level testing.

종래의 웨이퍼 레벨 테스트시 웨이퍼내의 칩과 테스트 장비간에 연결되는 중간 단계로 프로우브(Probe) 카드로 연결된다. 여기서 프로우브 카드는 반도체 칩의 전기적 특성을 테스트하는 카드이다.In a conventional wafer level test, an intermediate step between the chip in the wafer and the test equipment is connected to a Probe card. Probe card is a card for testing the electrical characteristics of the semiconductor chip.

제1도는 종래의 프로우브 카드와 테스트 장비간의 연결 방법을 도시한 것이다.1 illustrates a connection method between a conventional probe card and test equipment.

제1도에 도시한 바와 같이 종래의 프로우브 카드는 윗면 및 아래면이 대칭적인 형태를 프로우브 카드 핀(101)에서 부터 끝부분인 테스트 장비 연결부(104)에서만 테스트 장비와 연결하여 사용하는 하고 있다. 즉, 프로우브 카드내의 핀(101)으로 부터 맨 끝 부분에 연결 할 수 있는 지역을 만들어 사용하였다.As shown in FIG. 1, the conventional probe card is connected to the test equipment only at the test equipment connection part 104, which is the end of the probe card pin 101, in which the top and bottom surfaces are symmetrical. have. That is, it was used to make a region that can be connected to the far end from the pin 101 in the probe card.

그러나 상기와 같은 종래의 방법은 프로우브 스테이션(Station) 장비에 따라서 사용 할 수 있는 프로우브 카드가 개별적인 다른 형태로 제작해야 하는 불편함이 있다.However, the conventional method as described above is inconvenient to produce a probe card that can be used according to the probe station equipment.

따라서 본 발명의 목적은 종래의 웨이퍼 레벨 테스트시 프로우브 카드와 테스트 장비간에 연결이 용이하고 프로우브 스테이션의 장비간에 호환성을 갖도록 하는 방법을 제공하는 데 있다.Accordingly, an object of the present invention is to provide a method for easily connecting between a probe card and test equipment and compatibility between probe devices in a conventional wafer level test.

상기의 목적을 위하여 본 발명은 웨이퍼 레벨 테스트 장비와 프로우브 카드를 연결시키는 방법에 있어서,In order to achieve the above object, the present invention provides a method for connecting a probe level probe device with a probe card

상기 프로우브 카드에서의 프로우브 핀과 상기 제1 웨이퍼 레벨 테스트 장비 연결부의 사이의 소정의 위치에 제2 테스트 장비 연결부를 포함하는 것을 특징으로 하는 웨이퍼 레벨 테스트에서 프로우브 카드와 테스트 장비간의 연결 방법이다.And a second test equipment connection portion at a predetermined position between the probe pin on the probe card and the first wafer level test equipment connection portion. to be.

이하에서 첨부한 도면을 참조하여 본 발명의 바람직한 실시 예를 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

제2A도 및 제2B도는 본 발명의 프로우브 카드와 테스트 장비간의 연결 방법을 도시한 실시예이다.2A and 2B are embodiments showing a connection method between a probe card and test equipment of the present invention.

제2A도는 프로우브 카드의 윗면을 도시한 평면도이며, 프로우브 카드핀(201)과 제1 테스트 장비 연결부(206)의 중간에 소정의 지역에 위치하는 제2 테스트 장비 연결부(204)로 구성된다.FIG. 2A is a plan view showing the top surface of the probe card, and includes a second test equipment connection part 204 positioned at a predetermined area in the middle of the probe card pin 201 and the first test equipment connection part 206. .

제2B도는 프로우브 카드의 아랫면을 도시한 평면도이며, 프로우브 카드핀(210)과 제1 테스트 장비 연결부(206)의 중간에 소정의 지역에 위치하는 제2 테스트 장비 연결부(204)로 구성된다.FIG. 2B is a plan view showing the bottom surface of the probe card, and includes a second test equipment connection part 204 located at a predetermined area in the middle of the probe card pin 210 and the first test equipment connection part 206. FIG. .

제2A도 및 제2B도와 같이 프로우브 카드핀(201,210)과 제1 테스트 장비 연결부(206)사이에 별개의 테스트 장비 연결부(204)를 구성하면 프로우브 카드의 맨 끝단(206)에서 테스트 장비를 연결 할 수 있을 뿐 만 아니라 프로우브 카드 윗면(제2A도)에서 테스트 장비(도시 안됨)와 연결이 가능하고, 또한 프로우브 카드 아래 면(제2B도)에서도 테스트 장비(도시 안됨)와 연결이 가능하다.Configuring separate test equipment connections 204 between the probe card pins 201 and 210 and the first test equipment connection 206, as shown in FIGS. 2A and 2B, allows the test equipment to be removed from the far end 206 of the probe card. Not only can it be connected, it can also be connected to the test equipment (not shown) on the top of the probe card (Figure 2A), and also connected to the test equipment (not shown) on the bottom of the probe card (Figure 2B). It is possible.

상술한 바와 같이 본 발명에 의하면, 웨이퍼 레벨 테스트 장비와 연결되어지는 프로우브 카드에서 프로우브 핀과 끝단 사이의 어떤지역에도 연결 할 수 있다.As described above, according to the present invention, the probe card connected to the wafer level test equipment can be connected to any region between the probe pin and the end.

제1도는 종래의 프로우브 카드와 테스트 장비간의 연결 방법을 도시한 것이다.1 illustrates a connection method between a conventional probe card and test equipment.

제2A도 및 제2B도는 본 발명의 프로우브 카드와 테스트 장비간의 연결방법을 도시한 실시예이다.2A and 2B are exemplary embodiments illustrating a connection method between a probe card and test equipment of the present invention.

Claims (2)

웨이퍼 레벨 테스트 장비와 프로우브 카드를 연결 시키는 방법에 있어서,In the method of connecting the wafer level test equipment and the probe card, 상기 프로우브 카드에서의 프로우브 핀과 상기 웨이퍼 레벨 테스트 장비 연결부의 사이의 소정의 위치에 별개의 테스트 장비에 연결되는 또 하나의 웨이퍼 레벨 테스트 장비 연결부를 포함하는 것을 특징으로 하는 웨이퍼 레벨 테스트에서 프로우브 카드와 테스트 장비간의 연결 방법.And another wafer level test rig connection connected to a separate test rig at a predetermined location between the probe pin on the probe card and the wafer level test rig connection. How to connect a ube card and test equipment. 제1항에 있어서, 상기 프로우브 카드는 윗면 또는 아래면에서 연결하는 것을 특징으로 웨이퍼 레벨 테스트에서 프로우브 카드와 테스트 장비간의 연결 방법.The method of claim 1, wherein the probe card is connected from a top surface or a bottom surface thereof.
KR1019950042610A 1995-11-21 1995-11-21 Probe card of wafer level test and connection method between test equipments KR100389909B1 (en)

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KR100389909B1 true KR100389909B1 (en) 2003-08-30

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265443A (en) * 1987-04-23 1988-11-01 Tokyo Electron Ltd Probe device
JPH0357238A (en) * 1989-07-25 1991-03-12 Nec Corp Probe card
JPH03120484A (en) * 1989-10-02 1991-05-22 Matsushita Electron Corp Integrated circuit inspection device
JPH04129239A (en) * 1990-09-20 1992-04-30 Fujitsu Ltd Wafer-scale-memory and manufacture thereof
JPH0582605A (en) * 1991-09-24 1993-04-02 Mitsubishi Electric Corp Semiconductor integrated circuit element and wafer test inspection
KR940004346U (en) * 1992-07-10 1994-02-24 금성일렉트론 주식회사 Test board device of semiconductor test equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265443A (en) * 1987-04-23 1988-11-01 Tokyo Electron Ltd Probe device
JPH0357238A (en) * 1989-07-25 1991-03-12 Nec Corp Probe card
JPH03120484A (en) * 1989-10-02 1991-05-22 Matsushita Electron Corp Integrated circuit inspection device
JPH04129239A (en) * 1990-09-20 1992-04-30 Fujitsu Ltd Wafer-scale-memory and manufacture thereof
JPH0582605A (en) * 1991-09-24 1993-04-02 Mitsubishi Electric Corp Semiconductor integrated circuit element and wafer test inspection
KR940004346U (en) * 1992-07-10 1994-02-24 금성일렉트론 주식회사 Test board device of semiconductor test equipment

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