JPH10335375A - Tape-carrier package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tape-carrier package (TPC), with which an electrical check is enabled, even when a region other than a the user area is excluded. SOLUTION: This TPC is provided with a substrate 1 for which holes 10a and 10b for positioning are formed inside a user area A, semiconductor chip 2 provided on the substrate 1, a lead 7a for inputting a test signal to the semiconductor chip 2, and a terminal 11 for the test signal formed in the surrounding region of the hole 10a for positioning and being electrically connected with the lead 7a. Since the test signal is inputted/read from a test pad 7b before the user area A is punched out or from the terminal 11 for the test signal after the user area A has been punched out, the electrical check of the TPC is enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier package (hereinafter referred to as "TCP").

[0002]

2. Description of the Related Art FIG. 3 shows a conventional TCP.
The TCP includes an IC chip (semiconductor chip) 2 at a position corresponding to a film carrier (base material) 1 extending in the vertical direction of FIG. 3 and a device hole 3 formed in the film carrier 1.
Is arranged. The IC chip 2 is provided with a plurality of input bumps 5 on one side and a plurality of output bumps 6 on the other side.

[0005] The IC chip 2 is provided with a test signal input bump 7 at a position adjacent to the endmost input bump 5.
By inputting a signal for fixing the state in the IC chip 2 from the device and reading out the electrical characteristics of the IC chip 2 in each state, the test of the IC chip 2 can be performed.

[0004] One end of a lead 5a, 6a, 7a is bonded to each of the bumps 5, 6, 7 respectively.

As is well known, when a TCP is mounted on an electronic device, not all of the area is used, and
A predetermined area centering on the chip 2 is punched out, and only the punched out area is used (in this specification, a predetermined area punched out and provided for mounting is referred to as a “user area”). ".) The user area is an area determined by a TCP user designating the manufacturer. In the case of the TCP shown in FIG. 1, an area A defined by an alternate long and short dash line is a user area. Then, the leads 5a, 6 in the user area
The routing of a and 7a is determined based on specifications specified by the user.

On the other hand, the area of the TCP outside the user area is an area that can be used arbitrarily by the manufacturer. Normally, in a region outside the user area, the intervals between the leads 5a, 6a, 7a are widened so as to be compatible with a device for TCP electrical inspection (probe inspection, burn-in inspection, etc.), and the leads 5a, 6a, 7a Are formed with test pads 5b, 6b, 7b having a width larger than the width of the lead.

TCP before user area is punched out
In the electrical inspection, the TCP is positioned with respect to the inspection device by using a sprocket hole 9 formed outside the user area of the film carrier 1, and then the probe of the inspection device is attached to the test pads 5b and 6b or 7b. Is performed by inputting and outputting a predetermined signal.

[0008]

On the other hand, there is a case where it is necessary to carry out an electrical inspection of the TCP in which an area outside the user area is removed in order to provide for mounting. For example, there is a case where a manufacturer wants to analyze TCP returned by a user due to malfunction.

In such a case, since the sprocket hole 9 and the test pads 5b, 6b, 7b have already been removed from the TCP, the TCP cannot be positioned with respect to the above-described inspection apparatus. Even if the positioning can be performed, the test pads 5b, 6b, and 7b cannot be used, so that it is extremely difficult to inspect the TCP.

[0010] The present invention has been made in view of the above, and has been made in consideration of the above-described problems.
The purpose of this TC is to provide
An object is to provide an electrical inspection device suitable for P.

[0011]

In order to achieve the above object, a first means is to provide a tape carrier package comprising a base material having a positioning hole formed in a user area, and a base material provided on the base material. A semiconductor chip, a lead for inputting a test signal to the semiconductor chip, and a test signal terminal formed in a region around the positioning hole and electrically connected to the lead. It is a feature.

According to the first means, even after the user area is punched out, the electrical test of the TPC can be performed by inputting / reading out the test signal from the test signal terminal.

The second means includes: a base material having a positioning hole formed in a user area; a sprocket hole formed outside the user area; a semiconductor chip provided in the base material; A test signal terminal formed in a peripheral area of the positioning hole and electrically connected to the lead, and a test signal terminal provided outside the user area; Electrically connected to a test pad, and an electrical inspection device for a tape carrier package comprising:
An inspection device main body, a first positioning protrusion provided on one surface of the inspection device main body so as to be insertable into the sprocket hole, and a first positioning protrusion provided on one surface of the inspection device main body and insertable into a positioning hole in the user area. A second positioning protrusion provided on the sprocket hole, wherein a position of the second positioning protrusion coincides with a position of the positioning hole. A first probe for inputting a test signal to the test pad, the first probe being provided at a position corresponding to the position of the test pad on one surface of the inspection apparatus main body; A second probe provided in a peripheral area of the positioning projection, for inputting a test signal to the test signal terminal, the first probe and the second probe; Selectively supplying means said test signal to the lobe, is characterized in that it comprises a.

According to the second means, the electrical inspection of the tape carrier package can be easily performed before and after the punching of the user area.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are views showing one embodiment of the present invention. Note that, in the present embodiment, the same portions as those of the related art are denoted by the same reference numerals, and detailed description is omitted.

As shown in FIG. 1, a pair of positioning through holes 10a, 1
0b is formed. The pair of through holes 10a, 10
A test signal electrode 11 is formed around the through hole 10a on the side closer to the lead 7a in b. The test signal electrode 11 is connected to the lead 7a by the lead 11a. That is, the test signal electrode 11 is provided at the end of the lead 11a that branches off from the lead 7a.

In the user area A of the base 1,
In many cases, a positioning hole (not shown) for the user to mount the TCP is formed. If the user approves that a test signal electrode is provided around the positioning hole, the positioning hole is not used. May be shared as the positioning through-hole.

Next, an inspection apparatus suitable for performing an electrical inspection of TCP according to the present invention will be described with reference to FIG.

As shown in FIG. 2, the inspection device 20
1 and a lid 29. On the upper surface 22 of the main body 21, T
A plurality of positioning projections 23 projecting from the sprocket holes 9 of the CP are provided. In addition, T
A plurality of probes 25 and 26 and a probe 27 respectively corresponding to the test pads 5b, 6b and 7b of the CP are protruded.

The upper surface 22 has a through hole 10 for TCP.
a, 10b, a pair of positioning projections 24a,
24b is protruded. Further, a probe 28 is provided around the projection 24a so as to correspond to the test signal electrode 11 around the through hole 10a.

The probe 25 is connected to a signal input device 25a, the probe 26 is connected to a signal detection device, and the probes 27 and 28 are connected to a test signal input / readout device 27a.

Next, the operation of the present embodiment having the above configuration will be described.

First, a TCP stamped with a dashed line shown in FIG. 1 (in this case, the TCP is a user area A portion) so that the surface on which the leads 5a, 6a, 7a, 11a are formed is in contact with the upper surface 22 of the inspection device 20. Only) is placed on the upper surface 22 of the inspection apparatus 20. In this case, T
The positioning between the CP and the upper surface 22 is performed by inserting the protrusions 24a and 24b into the through holes 10a and 10b, respectively.

Next, when the lid 29 is closed, the test signal electrode 11 of the TCP comes into close contact with the probe 28.

Next, a signal for fixing the state in the IC chip 2 is input from the test signal input / readout device 27a, and the electrical characteristics of the IC chip 2 in each state are read. Thus, the user area A
An electrical inspection of the TCP after cutting is performed.

Further, according to the present inspection apparatus 20, an electrical inspection of TCP before cutting the user area A can be performed. That is, in this case, the TCP is electrically inspected by inserting the projection 23 into the sprocket hole 9 of the TCP to position the TCP and the upper surface 22, inputting a signal from the probe 25, and reading a signal from the probe 26. Is performed. Further, by performing positioning in the same manner as described above, and by inputting and reading out a test signal from the probe 27 via the test pad 7b, an electrical inspection of TCP can be performed.

As described above, according to the present embodiment, the TCP can be easily positioned on the inspection apparatus even after the user area A has been cut, and the test signal can be easily transmitted through the test signal electrode 11. By performing input and read, electrical inspection of TCP can be easily performed.

Further, by preparing the inspection apparatus 20 as described above, the TCP electrical inspection can be easily performed before and after the user area A is cut.

[0029]

As described above, according to the present invention,
It is possible to provide a TCP that can perform an electrical inspection even when an area outside the user area A is removed.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a TCP according to the present invention.

FIG. 2 is a perspective view showing an inspection apparatus suitable for performing an electrical inspection of TCP according to the present invention.

FIG. 3 is a plan view showing a conventional TCP.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 base 2 semiconductor chip 7a, 11a lead 9 sprocket hole 10a, 10b positioning hole 11 test signal terminal 21 inspection device main body 22 (of inspection device main body) upper surface 23 first positioning protrusion 24a, 24b second Positioning projection 27 First probe 27a Means for supplying a test signal (test signal input / readout device) 28 Second probe A User area A

Claims (4)

[Claims] 1. A base material having a positioning hole formed in a user area; a semiconductor chip provided on the base material; a lead for inputting a test signal to the semiconductor chip; And a test signal terminal formed in a peripheral region of the hole and electrically connected to the lead. 2. The semiconductor device according to claim 1, further comprising a test pad provided outside the user area, for inputting a test signal, wherein the test pad is provided at an end of the lead, and the test signal terminal is connected to the semiconductor chip for testing. 2. The tape carrier package according to claim 1, wherein the tape carrier package is provided at an end of a lead branching from the lead for connecting to a pad. 3. The semiconductor device according to claim 1, wherein a signal for fixing a state in the semiconductor chip is input from the test signal terminal, and an electrical characteristic of the semiconductor chip is read. Tape carrier package. 4. A base material in which a positioning hole is formed in a user area, a sprocket hole is formed outside the user area, and a semiconductor chip provided in the base material.
A lead for inputting a test signal to the semiconductor chip, a test signal terminal formed in a peripheral region of the positioning hole and electrically connected to the lead, and provided outside the user area; An electrical inspection device for a tape carrier package, comprising: a test pad electrically connected to a lead; an inspection device main body; and a first surface provided on one surface of the inspection device main body so as to be inserted into the sprocket hole. And a second positioning projection provided on one surface of the inspection apparatus main body so as to be inserted into a positioning hole in the user area, wherein the first positioning projection is the sprocket hole. When inserted in the position, the position of the second positioning protrusion coincides with the position of the positioning hole,
A second positioning protrusion, a first probe provided at a position corresponding to the position of the test pad on one surface of the inspection apparatus main body, and configured to input a test signal to the test pad; and a second positioning. A second probe provided in a peripheral region of the test projection for inputting a test signal to the test signal terminal; and a means for selectively supplying the test signal to the first probe and the second probe. An electrical inspection device for a tape carrier package, comprising: