JP2001013209A - Dut board with ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To arrange by-pass capacitors close to contacts and in the same plane as an IC socket body in a DUT board with an IC socket to be in contact with an IC. SOLUTION: Contacts 2A come into contact with the terminals of an IC, an IC socket body 1 holds the contacts 2A in a housing 2B, and the IC socket body 1 is mounted to a DUT board. Recessed parts 11 and 12 open to the surface side to be in contact with a printed circuit board 4 are formed in the housing 2B of the IC socket 1. By-pass capacitors 5 and 6 to be mounted to the printed circuit board 4 are housed in the recesses 11 and 12. It is possible to mount the by-pass capacitors 5 and 6 to be normally used for the power supply pins of an IC to the same plane as the contacts 2A and to obtain a DUT board for high frequencies.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to, for example, BGA (B
all Grid Array) DUT with IC socket (Devic) used in semiconductor integrated circuit test equipment for testing the characteristics of ICs
e Under Test) This is for the board.

[0002]

2. Description of the Related Art FIG. 2 shows the structure of a conventional DUT board with an IC socket.
A is a contact, 2B is a housing, 3 is a positioning pin, 4 is a printed circuit board, and 7 and 8 are bypass capacitors. The contact 2 </ b> A expands and contracts at both ends, one end is pressed against a terminal of an IC (not shown), and the other end is pressed against a pattern on the printed circuit board 4. Normally, in the IC socket 1, contacts 2A, 2A, 2A,... That contact the terminals of the IC are held by a housing 2B, as shown in the figure, and the contacts 2A, 2A, 2A,. It is difficult to arrange the bypass capacitors 7 and 8 necessary for the power supply pins. For this reason, conventionally, the bypass capacitors 7 and 8 are arranged around the housing 2B, or the back side opposite to the IC socket 1 mounting surface of the printed circuit board 4 on which the IC socket 1 is mounted as shown in the drawing. Are provided with bypass capacitors 7 and 8.

[0003]

However, when the bypass capacitors 7 and 8 are arranged around the IC socket 1 as in the prior art, the distance from the power supply pins becomes long, and therefore the pattern of the printed circuit board 4 is increased. , The bypass effect of the bypass capacitors 7 and 8 is reduced. Also, as shown in FIG. 2, when the bypass capacitors 7 and 8 are mounted on the back side of the IC socket 1 (the back side opposite to the mounting surface of the printed circuit board 4 on which the IC socket 1 is mounted), the thickness of the printed circuit board is usually It is about 2 to 3 mm, and the inductance value of the through hole penetrating the printed circuit board 4 is also several nanohenries, which also has a problem that the bypass effect of the bypass capacitors 7 and 8 is reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a DUT board with an IC socket in which a bypass capacitor can be arranged close to the contact and on the same surface as the IC socket when the IC socket having a contact for contacting the IC is mounted on the DUT board. To provide.

[0005]

According to the first aspect of the present invention, as shown in FIG. 1, for example, as shown in FIG. 1, a contact 2A contacts an IC terminal, and an IC socket 1 connects a contact 2A. A DUT board that holds the IC socket 1 and is held in the housing 2B,
Are concave portions 11, 1 opened on the surface side in contact with the printed circuit board 4.
2 is formed.

As described above, according to the first aspect of the present invention, an IC socket in which a recess is formed in a housing for holding a contact that contacts a terminal of an IC, the recess being opened on a surface contacting a printed circuit board on which the IC socket is mounted. DUT with
Since it is a board, a bypass capacitor normally used for a power supply pin of the IC is housed in a concave portion opened on the side where the IC socket contacts the printed circuit board, and the bypass capacitor can be mounted on the same surface as the contact. That is, the bypass capacitor can be mounted on the printed circuit board at a place where there is no inductance due to the power supply through hole. Thereby, IC
When performing a high-speed test of an IC under test (DUT) with a tester,
Since the test can be performed while minimizing the inductance of the power supply pin of C, measurement can be performed with higher accuracy. Also, when testing an IC that operates at high speed with the DUT board with an IC socket of the present invention, power supply noise can be minimized.

[0007] The invention according to claim 2 is the invention according to claim 1.
In a DUT board with a C socket, for example, as shown in FIG. 1, bypass capacitors 5 and 6 mounted on a printed board 4 are provided with recesses 11 and 1 formed in a housing 2B.
2 is housed.

According to the second aspect of the present invention, the bypass capacitor mounted on the printed circuit board is housed in the recess of the housing according to the first aspect, so that the bypass capacitor can be mounted on the same surface as the contact.

According to the third aspect of the present invention, for example, as shown in FIG. 1, the contact 2A contacts the terminal of the IC, and the IC socket 1 connects the contact 2A to the housing 2B.
And a DUT board on which the IC socket 1 is mounted, wherein bypass capacitors 5 and 6 are arranged on the surface of the printed circuit board 4 in contact with the IC socket 1.

As described above, according to the third aspect of the present invention, a DUT with an IC socket in which a bypass capacitor is arranged on a printed circuit board surface in contact with an IC socket having a housing for holding a contact that contacts a terminal of an IC.
Since it is a board, a bypass capacitor can be mounted on the same surface as the contact. That is, the bypass capacitor can be mounted on the printed circuit board at a place where there is no inductance due to the power supply through hole. Thus, when performing a high-speed test of an IC under test (DUT) with an IC tester, the test can be performed while minimizing the inductance of the power supply pins of the IC, so that measurement can be performed with higher accuracy. In addition, I which operates at high speed
When C is tested with the DUT board with IC socket of the present invention, power supply noise can be minimized.

[0011] The invention according to claim 4 is the invention according to claim 3.
A DUT board with a C socket, for example, as shown in FIG. 1, is characterized in that recesses 11 and 12 for housing bypass capacitors 5 and 6 are formed in a housing 2B of an IC socket 1.

According to the fourth aspect of the present invention, since the recess for accommodating the bypass capacitor according to the third aspect is formed in the housing of the IC socket, the bypass capacitor can be mounted on the same surface as the contact.

[0013] The invention according to claim 5 is the invention according to claims 1, 2, and 3.
Or a DUT board with an IC socket described in 4, wherein, for example, as shown in FIG. 1, the DUT board is provided with positioning pins 3, and the IC socket 1 is positioned by the positioning pins 3. .

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a DUT board with an IC socket according to the present invention will be described below with reference to FIG. FIG. 1 is a longitudinal sectional view showing a main part of a DUT board with an IC socket as an example to which the present invention is applied. In the drawing, 1 is an IC socket, 2A is a contact, 2B is a housing, 3 is a positioning pin, and 4 is a positioning pin. Printed circuit board, 5,6
Is a bypass capacitor, and 11 and 12 are recesses. This DUT board is a high frequency I
As shown in the figure, a plurality (two in the figure) of recesses 11 and 12 are formed in the housing 2B of the IC socket 1 and open on the side in contact with the printed circuit board 4 as a DUT board, as shown in the figure. One of the concave portions 11 accommodates the bypass capacitor 5, and the other concave portion 12 accommodates the bypass capacitor 6.

That is, the housing 2B of the IC socket 1 has a plurality of contacts 2A, 2
Two concave portions 11 and 12 shown in the figure are opened on the lower surface side between A, 2A,... And a plurality of positioning pins 3 and 3 penetrating the peripheral portion. Two bypass capacitors 5 and 6 are mounted on the upper surface of the printed circuit board 4 between the two positioning pins 3 and 3 provided at the center and the periphery thereof. And I
When inserting the positioning pins 3 and 3 into the C socket 1 and assembling the IC socket 1 on the printed board 4, the bypass capacitors 5 and 6 on the printed boards 4 and 4 are formed in the housing 2B of the IC socket 1. Recesses 11, 12
Housed in

As described above, when the DUT board mounts the IC to be measured (not shown) on the printed circuit board 4 via the IC socket 1, the DUT board includes the bypass capacitors 5 and 6.
, And arranged on the same plane as the IC socket 1. The contacts 2A, 2A, 2A,... That is, the bypass capacitors 5 and 6 can be mounted on the printed circuit board 4 in a place where there is no inductance due to the power supply through hole as in the related art. As a result, when performing a high-speed test of an IC to be measured by an IC tester, the test can be performed while minimizing the inductance of the power supply pin of the IC, so that the measurement can be performed with higher accuracy. In addition, IC that operates at high speed
Is tested on a DUT board with an IC socket, there is an advantage that power supply noise can be minimized.

In the above embodiment, the DUT board with an IC socket for high frequency is used. However, the present invention is not limited to the measurement frequency, and can be used as a DUT board with an ordinary IC socket. Also, the shape and size of the concave portion are arbitrary, and it goes without saying that a plurality of IC sockets are mounted and arranged on one DUT board, and the specific detailed structure can be appropriately changed.

[0018]

As described above, according to the DUT board with the IC socket according to the first aspect of the present invention, the recess serving as the main body of the IC socket is formed with an opening on the side in contact with the printed circuit board. The bypass capacitor can be housed in the recess, and the bypass capacitor can be mounted on the same surface as the contact. That is, the bypass capacitor can be mounted on the printed circuit board at a place where there is no inductance due to the power supply through hole. Therefore, when performing a high-speed test of an IC to be measured by an IC tester, the test can be performed while minimizing the inductance of the power supply pin of the IC, so that the measurement can be performed with higher accuracy. Further, an IC that operates at a high speed is replaced with a D with an IC socket of the present invention.
When testing on a UT board, power supply noise can be minimized.

According to the DUT board with the IC socket according to the second aspect of the present invention, since the bypass capacitor mounted on the DUT board is housed in the recess formed in the housing, the bypass capacitor is mounted on the same surface as the contact. The effect obtained by the invention of claim 1 can be exhibited.

According to the DUT board with an IC socket according to the third aspect of the present invention, since the bypass capacitor is arranged on the surface of the printed circuit board in contact with the IC socket, there is no inductance due to the power supply through hole of the printed circuit board. Can be mounted with a bypass capacitor. Therefore, when performing a high-speed test of an IC to be measured by an IC tester, the test can be performed while minimizing the inductance of the power supply pin of the IC, so that the measurement can be performed with higher accuracy. Further, when testing an IC operating at high speed with the DUT board with an IC socket of the present invention, power supply noise can be minimized.

According to the DUT board with the IC socket according to the fourth aspect of the present invention, since the recess for accommodating the bypass capacitor is formed in the housing of the IC socket, the bypass capacitor is mounted on the same surface as the contact. The effects obtained by the described invention can be exerted.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a main part showing a configuration of a DUT board with an IC socket as an example to which the present invention is applied.

FIG. 2 is a vertical sectional view showing a main part of a conventional DUT board with an IC socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC socket 2A Contact 2B Housing 3 Positioning pin 4 Printed circuit board 5, 6 Bypass capacitor 11, 12 Recess

Claims (5)

[Claims] A contact contacting a terminal of the IC; an IC socket holding the contact in a housing;
A DUT board on which a C socket is mounted, wherein the housing has a concave portion opened on a surface in contact with the DUT board. 2. The DUT board with an IC socket according to claim 1, wherein a bypass capacitor mounted on the DUT board is accommodated in a recess formed in the housing. 3. A contact contacts an IC terminal, an IC socket holds the contact in a housing, and
A DUT board mounting a C socket, wherein the DUT board has a bypass capacitor disposed on a surface in contact with the IC socket. 4. The DUT board with an IC socket according to claim 3, wherein a recess for accommodating a bypass capacitor is formed in a housing of the IC socket. 5. The DUT board with an IC socket according to claim 1, wherein the DUT board has a positioning pin erected, and the IC socket is positioned by the positioning pin.