JPH0645718A - Printed wiring substrate - Google Patents
Printed wiring substrateInfo
- Publication number
- JPH0645718A JPH0645718A JP23628092A JP23628092A JPH0645718A JP H0645718 A JPH0645718 A JP H0645718A JP 23628092 A JP23628092 A JP 23628092A JP 23628092 A JP23628092 A JP 23628092A JP H0645718 A JPH0645718 A JP H0645718A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- inspection
- wiring board
- connection pattern
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は印刷配線基板、特にフレ
キシブル印刷配線基板の部品実装状態に於いて試験及び
調整を容易にした印刷配線基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to a printed wiring board which is easily tested and adjusted in a component mounting state of a flexible printed wiring board.
【０００２】[0002]
【従来の技術】フレキシブル印刷配線基板にはプラスチ
ックリード付きチップキャリアのＬＳＩ、リードレスチ
ップ部品等、各種面実装用電子部品が面実装される。
又、フレキシブル印刷配線基板に部品が実装されると性
能検査、或は調整の為試験器、或は調整機器が前記フレ
キシブル印刷配線基板上の電子回路に接続される。2. Description of the Related Art On a flexible printed wiring board, various surface-mounting electronic parts such as a chip carrier LSI having a plastic lead and leadless chip parts are surface-mounted.
Further, when a component is mounted on the flexible printed wiring board, a tester or an adjusting device for performance inspection or adjustment is connected to the electronic circuit on the flexible printed wiring board.
【０００３】図３は従来のフレキシブル印刷配線基板１
を示しており、該フレキシブル印刷配線基板１にはリー
ドレスチップ部品２、プラスチックリード付きチップキ
ャリアのＬＳＩ３が実装されている。又、フレキシブル
印刷配線基板１の所要位置には検査すべきラインと接続
する検査用パッド４が形成されている。FIG. 3 shows a conventional flexible printed wiring board 1
The leadless chip component 2 and the LSI 3 of the chip carrier with a plastic lead are mounted on the flexible printed wiring board 1. Further, an inspection pad 4 connected to a line to be inspected is formed at a required position of the flexible printed wiring board 1.
【０００４】調整機器に接続されるプローブピン５は、
プローブピンボード６の前記検査用パッド４と対応する
位置に植設されている。The probe pin 5 connected to the adjusting device is
The probe pin board 6 is planted at a position corresponding to the inspection pad 4.
【０００５】フレキシブル印刷配線基板１上の電子回路
と調整機器との接続を行う場合、前記フレキシブル印刷
配線基板１を台座７上に載置し、前記プローブピンボー
ド６をフレキシブル印刷配線基板１に対して位置合せ
し、次に該プローブピンボード６を前記検査用パッド４
に押し当てている。When connecting an electronic circuit on the flexible printed wiring board 1 to an adjusting device, the flexible printed wiring board 1 is placed on a base 7 and the probe pin board 6 is attached to the flexible printed wiring board 1. The probe pin board 6 and then the inspection pad 4
Are pressed against.
【０００６】[0006]
【発明が解決しようとする課題】ところが、電子製品の
小型化、高性能化が進み、配線基板に対する部品の実装
密度は益々高くなってきている。前記した様に、従来の
フレキシブル印刷配線基板では検査調整の為、所定数の
検査用パッドをフレキシブル印刷配線基板の回路内に設
けなければならず、検査用パッドを回路内に設けた場
合、該検査用パッドと試験又は調整しようとする回路と
を接続する為のパターンも必要となる。従って、この検
査用パッドが電子部品の実装の妨げとなり、部品の実装
密度を高くする上での弊害となっていた。However, the miniaturization and high performance of electronic products have advanced, and the mounting density of components on a wiring board has become higher and higher. As described above, in the conventional flexible printed wiring board, a predetermined number of inspection pads must be provided in the circuit of the flexible printed wiring board for inspection adjustment, and when the inspection pad is provided in the circuit, A pattern for connecting the inspection pad and the circuit to be tested or adjusted is also required. Therefore, this inspection pad hinders the mounting of electronic components, which is an obstacle to increasing the mounting density of components.
【０００７】更に、前記フレキシブル印刷配線基板の裏
面にも部品２′を実装する場合があるが、この場合台座
７に部品２′を逃げる為の凹部８を必要とする。この凹
部８を利用して前記プローブピンボード６を前記検査用
パッド４に押圧させると前記フレキシブル印刷配線基板
１が凹み、パターンの剥離、半田の接続不良等を引起こ
す原因となっていた。Further, there is a case where the component 2'is also mounted on the back surface of the flexible printed wiring board, but in this case, the pedestal 7 needs a recess 8 for escaping the component 2 '. When the probe pin board 6 is pressed against the inspection pad 4 by using the recessed portion 8, the flexible printed wiring board 1 is recessed, which causes peeling of the pattern, defective solder connection, and the like.
【０００８】本発明は斯かる実情に鑑み、印刷配線基板
の電子部品の実装密度を向上させると共に検査調整の作
業性を向上させようとするものである。In view of the above situation, the present invention aims to improve the mounting density of electronic components on a printed wiring board and improve the workability of inspection and adjustment.
【０００９】[0009]
【課題を解決するための手段】本発明は、印刷配線基板
に設けられるコネクタの近傍に接続パターン部を連設
し、該接続パターン部に前記コネクタの端子と接続する
検査用パッドを形成すると共に前記接続パターン部を除
去可能としたことを特徴とするものである。SUMMARY OF THE INVENTION According to the present invention, a connection pattern portion is continuously provided in the vicinity of a connector provided on a printed wiring board, and an inspection pad for connecting to a terminal of the connector is formed in the connection pattern portion. The connection pattern portion can be removed.
【００１０】[0010]
【作用】部品実装後の回路の検査調整は、前記接続パタ
ーン部に形成した検査用パッドに検査用プローブを当接
させて行い、検査調整後は前記接続パターン部を削除す
る。The inspection and adjustment of the circuit after the component mounting is performed by bringing the inspection probe into contact with the inspection pad formed on the connection pattern portion, and the connection pattern portion is deleted after the inspection and adjustment.
【００１１】[0011]
【実施例】以下、図面を参照しつつ本発明の一実施例を
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００１２】前述したフレキシブル印刷配線基板１は図
２の様に、コネクタ９が設けられ、該コネクタ９を介し
てフレキシブル印刷配線基板１内の電子回路と付属する
回路、或は他の電子機器と接続される様になっている。The flexible printed wiring board 1 described above is provided with a connector 9 as shown in FIG. 2, and through the connector 9, an electronic circuit in the flexible printed wiring board 1 and a circuit attached thereto, or another electronic device is connected. It is designed to be connected.
【００１３】本発明者は、該コネクタ９にはフレキシブ
ル印刷配線基板１内の回路の全ての配線パターンが集約
されていることに着目し、フレキシブル印刷配線基板１
の前記コネクタ９接続用パターンを利用したものであ
る。The present inventor has noticed that all the wiring patterns of the circuits in the flexible printed wiring board 1 are integrated in the connector 9, and the flexible printed wiring board 1
The pattern for connecting the connector 9 is used.
【００１４】更に詳述する。Further details will be described.
【００１５】フレキシブル印刷配線基板１の一部には前
記コネクタ９を設ける為の基板突出部１０が形成され、
該基板突出部１０は更にコネクタ取付け部１０ａと接続
パターン部１０ｂから成り、前記コネクタ取付け部１０
ａと前記接続パターン部１０ｂとの境界１１の両端には
エッチ１２を形成している。A board protrusion 10 for forming the connector 9 is formed on a part of the flexible printed wiring board 1.
The board projecting portion 10 further comprises a connector mounting portion 10a and a connection pattern portion 10b.
Etches 12 are formed at both ends of a boundary 11 between a and the connection pattern portion 10b.
【００１６】前記接続パターン部１０ｂには所定数の検
査用パッド４が形成され、該検査用パッド４は前記コネ
クタ９の接続用パターン１３が延出して接続されてい
る。A predetermined number of inspection pads 4 are formed in the connection pattern portion 10b, and the connection patterns 13 of the connector 9 are extended and connected to the inspection pads 4.
【００１７】特に図示しないが、フレキシブル印刷配線
基板１の回路内部には、前記検査用パッド４は一切設け
ない。Although not particularly shown, the inspection pad 4 is not provided inside the circuit of the flexible printed wiring board 1.
【００１８】フレキシブル印刷配線基板１に電子部品を
実装した後、回路の調整検査を行う場合、前記プローブ
ピン５を前記接続パターン部１０ｂの検査用パッド４に
当接させ前記接続用パターン１３を介して回路と調整機
器とを接続する。When the circuit adjustment inspection is performed after the electronic parts are mounted on the flexible printed wiring board 1, the probe pins 5 are brought into contact with the inspection pads 4 of the connection pattern portion 10b and the connection patterns 13 are interposed therebetween. Connect the circuit to the adjustment equipment.
【００１９】検査、調整が完了すると前記境界１１に沿
って切断する（図２参照）。言う迄もなく、フレキシブ
ル印刷配線基板の材質は合成樹脂製で、且薄いので容易
に切断することができる。ここで、前記接続パターン部
１０ｂは回路外に形成されるので、切断しても回路構成
には全く影響がない。When the inspection and adjustment are completed, cutting is performed along the boundary 11 (see FIG. 2). Needless to say, the flexible printed wiring board is made of synthetic resin and is thin so that it can be easily cut. Here, since the connection pattern portion 10b is formed outside the circuit, even if the connection pattern portion 10b is cut, the circuit configuration is not affected at all.
【００２０】而して、前記検査調整作業に於いて、検査
用パッド４は回路外の接続パターン部１０ｂに形成され
るので、裏面に部品はなく、台座７には凹部を形成する
必要がない。従ってプローブピン５押接時の凹みが生ず
ることもなく、又回路内には検査用パッド４を設ける必
要がないので、フレキシブル印刷配線基板に対して無駄
無く部品を実装することができる。In the inspection adjustment work, since the inspection pad 4 is formed on the connection pattern portion 10b outside the circuit, there is no component on the back surface, and it is not necessary to form a recess on the pedestal 7. . Therefore, no depression occurs when the probe pin 5 is pressed, and it is not necessary to provide the inspection pad 4 in the circuit, so that the component can be mounted on the flexible printed wiring board without waste.
【００２１】又、前記検査用パッド４を回路内に設けた
場合は、回路の変更がある度に位置が異なるので、前記
プローブピンボード６に対するプローブピン５の配置が
異なるが、本発明では検査用パッド４の配置を規格化で
き、前記プローブピンボード６の汎用化が可能となる。When the inspection pad 4 is provided in the circuit, the position of the probe pin 5 relative to the probe pin board 6 is different because the position is changed each time the circuit is changed. It is possible to standardize the arrangement of the pads 4 for use and make the probe pin board 6 versatile.
【００２２】尚、上記実施例ではフレキシブル印刷配線
基板について説明したが、通常の硬板の印刷配線基板で
も実施可能であることは言う迄もなく、この場合前記境
界１１に沿って溝を刻設する等して折除しやすくしてお
けばよい。更に、接続パターン部１０ｂの形成位置も前
記例示したものに限定されるものではなく、要はコネク
タ９の近傍に在り、且回路に影響ない部分であればよ
い。Although the flexible printed wiring board has been described in the above embodiment, it is needless to say that the printed wiring board of a normal hard plate can be used. In this case, a groove is formed along the boundary 11. It should be easy to remove by doing, for example. Further, the formation position of the connection pattern portion 10b is not limited to the above-exemplified one, and it may be any portion as long as it is in the vicinity of the connector 9 and does not affect the circuit.
【００２３】[0023]
【発明の効果】以上述べた如く本発明によれば、一時的
に形成される接続パターン部に検査用パッドを形成し、
該検査用パッドを利用して検査、調整を行うので、回路
内に検査用パッドを設ける必要がなく、印刷配線基板の
実装密度を上げることが可能であると共に、接続パター
ン部、特に該接続パターン部の裏面には部品が実装され
ないので、基板がフレキシブル印刷配線基板であった場
合等に生じるフレキシブル印刷配線基板の凹みを防止で
き、検査調整時の基板の損傷を防止できる。As described above, according to the present invention, the inspection pad is formed on the connection pattern portion which is temporarily formed,
Since the inspection and adjustment are performed by using the inspection pad, it is not necessary to provide the inspection pad in the circuit, it is possible to increase the mounting density of the printed wiring board, and the connection pattern portion, particularly the connection pattern. Since no component is mounted on the back surface of the section, it is possible to prevent a dent in the flexible printed wiring board that occurs when the board is a flexible printed wiring board, and prevent damage to the board during inspection and adjustment.
【図１】本発明の一実施例を示す説明図である。FIG. 1 is an explanatory diagram showing an embodiment of the present invention.
【図２】同前実施例の説明図である。FIG. 2 is an explanatory view of the same embodiment.
【図３】部品実装状態の印刷配線基板の一部を示す斜視
図である。FIG. 3 is a perspective view showing a part of the printed wiring board in a component mounted state.
【図４】印刷配線基板の回路の検査状態を示す説明図で
ある。FIG. 4 is an explanatory diagram showing an inspection state of a circuit on a printed wiring board.
【図５】印刷配線基板とプローブピンとの関係を示す説
明図である。FIG. 5 is an explanatory diagram showing a relationship between a printed wiring board and probe pins.
【図６】印刷配線基板とプローブピンとの関係を示す説
明図である。FIG. 6 is an explanatory diagram showing a relationship between a printed wiring board and probe pins.
１ フレキシブル印刷配線基板 ４ 検査用パッド ５ プローブピン ９ コネクタ １０ 基板突出部 １０ａ コネクタ取付け部 １０ｂ 接続パターン部 １１ 境界 １２ エッチ １３ 接続用パターン DESCRIPTION OF SYMBOLS 1 Flexible printed wiring board 4 Inspection pad 5 Probe pin 9 Connector 10 Board protruding part 10a Connector mounting part 10b Connection pattern part 11 Boundary 12 Etch 13 Connection pattern
Claims (1)
傍に接続パターン部を連設し、該接続パターン部に前記
コネクタの端子と接続する検査用パッドを形成すると共
に前記接続パターン部を除去可能としたことを特徴とす
る印刷配線基板。1. A connection pattern portion is continuously provided in the vicinity of a connector provided on a printed wiring board, an inspection pad for connecting to a terminal of the connector is formed in the connection pattern portion, and the connection pattern portion can be removed. A printed wiring board characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23628092A JPH0645718A (en) | 1992-07-21 | 1992-07-21 | Printed wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23628092A JPH0645718A (en) | 1992-07-21 | 1992-07-21 | Printed wiring substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0645718A true JPH0645718A (en) | 1994-02-18 |
Family
ID=16998450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23628092A Pending JPH0645718A (en) | 1992-07-21 | 1992-07-21 | Printed wiring substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0645718A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6249114B1 (en) | 1997-08-25 | 2001-06-19 | Nec Corporation | Electronic component continuity inspection method and apparatus |
| JP2012064869A (en) * | 2010-09-17 | 2012-03-29 | Toshiba Hokuto Electronics Corp | Method of manufacturing flexible printed wiring board |
-
1992
- 1992-07-21 JP JP23628092A patent/JPH0645718A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6249114B1 (en) | 1997-08-25 | 2001-06-19 | Nec Corporation | Electronic component continuity inspection method and apparatus |
| JP2012064869A (en) * | 2010-09-17 | 2012-03-29 | Toshiba Hokuto Electronics Corp | Method of manufacturing flexible printed wiring board |
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