JPS63285962A - Electrode for surface mounting electronic component - Google Patents
Electrode for surface mounting electronic componentInfo
- Publication number
- JPS63285962A JPS63285962A JP12070487A JP12070487A JPS63285962A JP S63285962 A JPS63285962 A JP S63285962A JP 12070487 A JP12070487 A JP 12070487A JP 12070487 A JP12070487 A JP 12070487A JP S63285962 A JPS63285962 A JP S63285962A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electronic component
- recess
- probe
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 abstract description 12
- 239000000758 substrate Substances 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- 235000014121 butter Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000004720 fertilization Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は基板の一面に表面実装される電子部品の外部取
り出し電極の改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in an external lead-out electrode of an electronic component that is surface-mounted on one surface of a substrate.
従来の表面実装用の電子部品の形状の一例としてＩＣパ
ッケージを第２図に示す。即ちプラスチックあるいはセ
ラミックのケース１に収められた半導体チップの電極は
電極２に接続されて外部に取り出されている。第２図に
示すＩＣの形状はスモール・アウトライン・パッケージ
あるいはフラット・パッケージと呼ばれ、回路基板の表
面に実装されるものである。FIG. 2 shows an IC package as an example of the shape of a conventional surface-mounted electronic component. That is, the electrodes of a semiconductor chip housed in a plastic or ceramic case 1 are connected to electrodes 2 and taken out to the outside. The shape of the IC shown in FIG. 2 is called a small outline package or flat package, and is mounted on the surface of a circuit board.
近年、回路基板の高集積化の要望が強く、表面実装電子
部品の需要は拡大しているが、一般に回路基板には回路
基板のチェック、調整等を行なうための電極（テストポ
イント）が必要である。電子部品のＴｒｉ極がちょうど
このテストポイントとなった際、従来の電極は測定器の
プローブを接触させるのに適当でない。特にテストポイ
ントのチェックを回路基板の製造ラインで行なう場合、
従来の電極はプローブの位置決めが困難である。In recent years, there has been a strong demand for higher integration of circuit boards, and the demand for surface-mounted electronic components is expanding.However, circuit boards generally require electrodes (test points) to check and adjust the circuit board. be. When the Tri-pole of the electronic component just becomes this test point, the conventional electrode is not suitable for contacting the probe of the measuring instrument. Especially when checking test points on a circuit board manufacturing line,
Conventional electrodes make probe positioning difficult.
またプローブを接触させ易いように回路基板上にテスト
ポイント用の電極を別途形成するとなると電子部品の高
密度実装の妨げとなる。Further, if electrodes for test points are separately formed on the circuit board so that the probes can easily be contacted with the electrodes, this will impede high-density mounting of electronic components.
本発明はこの様な問題点を克服した、プローブを接触し
やすい表面電子部品を提供せんとするものである。The present invention aims to overcome these problems and provide a surface electronic component that is easy to contact with a probe.
本発明は、表面実装部品の電極に、（ぼみあるいは穴を
形成したことを特徴とする。The present invention is characterized in that a recess or hole is formed in the electrode of the surface mount component.
（実施例〕
第１図は本発明の１実施例を示す図である。プラスチッ
クのケース１に納められた半導体チップの電極は外部に
取り出された電極２に接続されている。電極２には（ぼ
み３が形成されており、測定器のプローブを接触させた
時、プローブが電極からずれ落ちないようになっている
。この様子を第３図に更に詳しく示す。プラスチックケ
ース１と外部電極２からなる表面実装電子部品は、基板
４０表面に実装される。即ち、基板４０表面に配された
電極バター７５に対し、表面実装電子部品の外部電極２
がハンダ６によって固定される。外部ｔＸ極２には基板
４と相対する面の逆面にくぼみ３が形成されている。基
板上への電子部品の実装を終えた後、基板の電気的特性
を検査する際、測定器のプローブ７は前述のくぼみ３に
対し位置決めされる。プローブ７はくぼみ３の存在によ
り外部電極２からずれ落ちることがない。(Embodiment) Fig. 1 is a diagram showing one embodiment of the present invention.The electrodes of a semiconductor chip housed in a plastic case 1 are connected to an electrode 2 taken out to the outside. (A recess 3 is formed to prevent the probe of the measuring instrument from slipping off the electrode when it comes into contact with the electrode. This situation is shown in more detail in Figure 3.Plastic case 1 and external electrode The surface mount electronic component consisting of 2 is mounted on the surface of the board 40. That is, the external electrode 2 of the surface mount electronic component is mounted on the electrode butter 75 arranged on the surface of the board 40.
is fixed with solder 6. A recess 3 is formed in the external tX pole 2 on a surface opposite to the surface facing the substrate 4 . After the electronic components have been mounted on the board, the probe 7 of the measuring instrument is positioned relative to the recess 3 when testing the electrical characteristics of the board. The presence of the recess 3 prevents the probe 7 from slipping off from the external electrode 2.
次に第４図は表面実装電子部品の外部電極２に穴８を設
けた例である。外部電極２を基板４上に電極パターン５
にハンダ付けする際、ハンダは六８内にも侵入し表面張
力に応じた形状で冷却固化する。この場合は既に述べた
プローブ位置決めの効果のみならず、外部電極２とハン
ダ６の接触面積の増大による固定力の増大が得られる。Next, FIG. 4 shows an example in which a hole 8 is provided in the external electrode 2 of a surface-mounted electronic component. An electrode pattern 5 is formed on the external electrode 2 on the substrate 4.
When soldering, the solder also penetrates into the 68 and cools and solidifies in a shape according to the surface tension. In this case, not only the probe positioning effect described above but also an increase in fixing force due to an increase in the contact area between the external electrode 2 and the solder 6 can be obtained.
本発明の構成によれば、表面実装電子部品の電極に測定
器のプローブを接触させ易く、回路基板のチェックが容
易になる。また回路基板上にチェック、調整のためのテ
ストポイントを別途設ける必要がなくなり回路の一層の
高密度実装が可能になる。According to the configuration of the present invention, it is easy to bring the probe of the measuring device into contact with the electrode of the surface-mounted electronic component, making it easy to check the circuit board. Furthermore, there is no need to separately provide test points for checking and adjustment on the circuit board, allowing higher density mounting of circuits.
第１図は本発明による一実施例の表面実装電子部品の外
形図。
第２図は従来の表面実装用ＩＣの外形図。
第３図は本発明の一実施例を説明する図。
第４図は本発明の他の実施例を説明する図。
第２図
４ 黍穣
７ ７０−゛λ
斗
第４１図FIG. 1 is an outline diagram of a surface-mounted electronic component according to an embodiment of the present invention. FIG. 2 is an outline drawing of a conventional surface mount IC. FIG. 3 is a diagram illustrating an embodiment of the present invention. FIG. 4 is a diagram illustrating another embodiment of the present invention. Fig. 2 4 Fertilization 7 70-゛λ Do Fig. 41
Claims (1)
電子部品の電極。An electrode for a surface-mounted electronic component characterized by having a depression or a hole formed therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12070487A JPS63285962A (en) | 1987-05-18 | 1987-05-18 | Electrode for surface mounting electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12070487A JPS63285962A (en) | 1987-05-18 | 1987-05-18 | Electrode for surface mounting electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63285962A true JPS63285962A (en) | 1988-11-22 |
Family
ID=14792919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12070487A Pending JPS63285962A (en) | 1987-05-18 | 1987-05-18 | Electrode for surface mounting electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63285962A (en) |
-
1987
- 1987-05-18 JP JP12070487A patent/JPS63285962A/en active Pending
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