JPH04340735A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To easily check electric continuity of a semiconductor integrated circuit device. CONSTITUTION:From above the peripheral part or the peripheral edge part of a package 3 of a semiconductor integrated circuit device 1, contact holes 4 are formed on the surfaces of inner leads 5 corresponding with the respective outer leads 2. From the upper surface of the semiconductor integrated circuit device 1, electric continuity of leads can be easily checked.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] This invention relates to a semiconductor integrated circuit device (hereinafter referred to as IC) that makes it easy to check electrical continuity.
It is related to.

0002

[Prior Art] In conventional ICs, leads are connected to each electrode of a semiconductor chip, and the semiconductor chip and a portion of those leads (inner leads) are covered with a resin or ceramic package, and the parts not covered with the inner leads are covered with a resin or ceramic package. Lead (
In particular, surface-mounted ICs such as PLCC and SPLCC as shown in FIG. It is constructed in a curved manner.

0003

Due to this configuration, it is difficult to check electrical continuity from above the IC. Moreover, as electronic devices incorporating such ICs have become more and more miniaturized in recent years, as shown in FIG.
Since C1 and electronic components are mounted in an ultra-high density, it is difficult to check electrical continuity from the side surface of the outer lead 2. The present invention attempts to obtain an IC that allows this electrical continuity check of IC1 to be easily performed.

0004

[Means for Solving the Problems] Therefore, the present invention provides electrical connection by forming contact holes communicating with each of the inner leads from above the inner leads covered with the package in the periphery or periphery of the package. The above problem was solved by ensuring continuity.

[0005]

[Function] Therefore, with the IC of the present invention, even if ICs and electronic components are mounted in an electronic device at a very high density, the electrical continuity of the IC can be easily checked.

[0006]

Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of an IC that is a first embodiment of this invention, FIG. 2 is a perspective view of an IC that is a second embodiment of this invention, and FIG. 3 is a perspective view of an IC that is a second embodiment of this invention. IC which is an example
FIG. 4 is a partial perspective view for explaining how the IC of the present invention is used.

First, the configuration of the IC of the present invention will be explained using FIG. 1. Note that the same parts as those of the conventional IC will be described with the same reference numerals. In this example, IC1 is a PLCC
Expressed in package form. 2 is an outer lead, which is bent toward the bottom of the package 3. package 3
is made of resin or ceramic. Reference numeral 4 denotes a contact hole, which is a feature of the present invention, and is connected to each outer lead 2 and is opened so that an inner lead 5 (see FIG. 3) located inside the package 3 is exposed. These contact holes 4 are therefore linearly arranged around the periphery of the package 3. These contact holes 4 can be formed by processing a mold in advance when the package 3 is made of resin.

The IC1 of the second embodiment shown in FIG.
Contact hole 4 is formed in a zigzag shape, and S
It can also be easily applied to packages with narrow lead spacing, such as PLCC packages.

The IC1 of the third embodiment shown in FIG.
A contact hole 4 is formed in the peripheral edge of the package 3 at the base of each outer lead 2, as if cut out.

As shown in FIG. 4, even when the IC 1 of the present invention is surface-mounted on a printed wiring board 6 and other ICs and electronic components are mounted around it in an extremely high density, By inserting the contact probe 7 into the contact hole 4 opened in the upper part of the IC 1, it is possible to contact the inner lead 5, and it is possible to easily check whether or not adjacent leads are short-circuited by solder. .

[0011]

[Effects of the Invention] As is clear from the above explanation, since the IC of the present invention has a contact hole in the package, there is no need to check electrical continuity from the bottom or side of the IC leads as in the prior art. Not only can the probe pin 7 be used to inspect and measure products, but even when surface-mounted on a printed wiring board as described above, short circuits between leads can be detected extremely easily. In particular, the present invention becomes even more effective when electronic equipment becomes ultra-miniaturized and accordingly ultra-high-density packaging is performed.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a semiconductor integrated circuit device according to a first embodiment of the invention.

FIG. 2 is a perspective view of a semiconductor integrated circuit device according to a second embodiment of the invention.

FIG. 3 is a perspective view of a semiconductor integrated circuit device according to a third embodiment of the invention.

FIG. 4 is a partial perspective view for explaining how the semiconductor integrated circuit device of the present invention is used.

FIG. 5 is a perspective view for explaining a conventional semiconductor integrated circuit device.

FIG. 6 is a perspective view for explaining the state of use of a conventional semiconductor integrated circuit device.

[Explanation of symbols]

1 Semiconductor integrated circuit device 2 Outer lead 3 Package 4 Contact hole 5 Inner lead 6 Printed wiring board 7 Contact probe

Claims (1)

[Claims] 1. In a semiconductor integrated circuit device configured such that leads are connected to each electrode of a semiconductor chip and each lead is covered with a resin or ceramic package, each of the inner leads is A semiconductor integrated circuit device characterized in that a contact hole leading to an inner lead is formed in a peripheral portion or a peripheral portion of the package.