KR20010013205A - Test socket lattice - Google Patents

Abstract

A socket is provided for burn-in testing of an integrated circuit package having electrical leads. The socket includes a socket body having an array of columns and rows of generally rectangular terminal-receiving cavities therein, each of the generally rectangular terminal-receiving cavities having a longitudinal direction corresponding to its longer dimension and a plurality of terminals disposed in the terminal-receiving cavities for contacting the leads of the integrated circuit package. Each column and row of the array includes a sequence of at least three adjacent cavities wherein for each cavity of the sequence other than the first and last, the longitudinal direction of the cavity is substantially perpendicular to the longitudinal direction of the two cavities in the sequence adjacent the cavity on either side.

Description

Grid array of test sockets {TEST SOCKET LATTICE}

Prior art burn-in sockets typically include a plurality of terminals fitted in a number of corresponding terminal-receiving cavities. These terminals typically have a contact portion for contacting a lead from an integrated circuit package, a tail section for electrical connection with other electronic components, and a contact pressure to ensure a secure electrical path through the terminal. And an elastic portion between the contact portion and the tail portion to provide.

Most commonly, the terminal-accommodating cavities are rectangular and aligned in a single direction. Examples such as obliquely aligned or arbitrary misaligned rectangular cavities exist, but the rectangular cavities are typically consistently aligned parallel or perpendicular to the sides of the socket housing.

However, regardless of the alignment, it is generally desirable to increase the density of the terminals across the sockets due to the continued miniaturization of electrical components and the continuing demand for higher speeds and parallel paths. Thus, it is an object of the present invention to allow for increased densities of terminals per unit area within the socket body while maintaining sufficient strength to withstand cycled stresses that are repeatedly connected and disconnected from the IC package being tested continuously. To provide a burn-in socket.

Another factor related to the quality of sockets designed for burn-in testing of integrated circuit packages is the efficiency of testing the integrated circuit package. Thus, it is important to ensure that the integrated circuit package inserted into the burn-in socket is properly aligned in the socket for testing. In particular, a misaligned package can provide incomplete test results because the leads from the integrated circuit package may not have a reliable electrical path to electrical test elements such as burn-in boards. Conventional burn-in test sockets comprising a device for lowering an integrated circuit package into contact with the terminals of the socket often have unsatisfactory means to ensure the lateral position of the package, and thus unsatisfactory burn-in test results. And unsatisfactory efficiency.

It is therefore an object of the present invention to provide a burn-in socket that allows terminals to be internally at increased density without harming the physical strength and performance of the socket. It is a further object of the present invention to ensure that each terminal is in firm contact with a suitable lead of the inserted integrated circuit package in order to provide a more efficient burn-in test of the integrated circuit package.

FIELD OF THE INVENTION The present invention generally relates to electrical connectors, and more particularly to burn-in sockets suitable for testing of integrated circuit (IC) packages.

1 is a plan view of a burn-in socket constructed in accordance with the principles of the present invention;

FIG. 2 is a side view of the burn-in socket of FIG. 1 taken along the direction indicated by arrow P shown in FIG.

3 is a side view of the burn-in socket of FIG. 1 taken from the direction indicated by arrow Q of FIG.

4 is a cross-sectional view illustrating the relative placement of burn-in socket components when the IC package is under burn-in test, taken along line 4-4 of FIG.

FIG. 5 is a partial cross sectional view showing another component of the burn-in socket when the IC package is inside the socket, similar to FIG. 4; FIG.

FIG. 6 is a partial cross-sectional view showing other components of the burn-in socket of FIG. 1 when the IC package is also inside the socket, taken along line 6-6 of FIG.

FIG. 7 is a partial cross-sectional view illustrating the components of the socket when the socket is in an intermediate state prior to being fully inserted into the IC package, taken along line 4-4 of FIG.

FIG. 8 is a partial cross-sectional view showing how often components of the burn-in socket are placed when the burn-in socket is in the same state as in FIG. 7, taken along line 6-6 of FIG.

FIG. 9 illustrates certain components of the burn-in socket when the IC package is removed after testing, or when the IC package is initially located in the burn-in socket, taken along line 4-4 of FIG. Partial section made.

FIG. 10 is a cross-sectional view illustrating components of the burn-in socket in the same state as FIG. 9 taken along the line '6-6' of FIG.

FIG. 11 is a schematic plan view showing a grid arrangement of terminal-receiving cavities arranged in the test socket of FIG. 1; FIG.

12 is an enlarged detail view showing the lattice arrangement of FIG. 11 at the position indicated by arrow A of FIG.

Figure 13 is a side view of a terminal constructed in accordance with the principles of the present invention.

14 is a side view of the terminal of FIG. 13;

FIG. 15 is an enlarged detail view showing how the contact portions of selected terminals, taken along arrow B of FIG. 4, contact the solder balls of the IC package.

16 is a plan view of a pivot latch portion used with the burn-in socket of FIG.

17 is a side view of the latch portion of FIG. 16.

FIG. 18 is a partial cross-sectional view of the top cover used for the burn-in socket of FIG. 1. FIG.

19 is another partial cross-sectional view of the top cover.

In order to achieve the above objects, a socket for burn-in testing of an integrated circuit package with electrical leads is provided. In one embodiment of the invention, the socket comprises an outer socket housing, an inner socket housing capable of sliding between an upper limit position and a lower limit position with respect to the outer housing, the inner housing supporting the integrated circuit package. And a plurality of terminal-receiving cavities therein. The socket includes a plurality of terminals disposed within the terminal-receiving cavity of the inner housing for contacting the lead of the integrated circuit package, a cam mechanism for raising and lowering the inner housing between an upper limit position and a lower limit position relative to the outer housing, and an inner A latch mechanism is further included to secure and release the integrated circuit package with respect to the housing.

In another aspect, the socket of the present invention includes an opening for insertion of an IC package, an outer socket housing, and an inner socket housing capable of sliding between an upper limit position and a lower limit position with respect to the outer housing. The inner housing has a plurality of terminal-receiving cavities therein, a plurality of terminals disposed within the terminal-receiving cavities of the inner housing, a cam mechanism having an actuator, and a latch mechanism having an actuator identical to the cam mechanism. It is provided. At least one of the cam mechanism and the latch mechanism includes a return biasing apparatus, and the latch mechanism includes a latch arm.

The unique grating arrangement of the terminal-receiving cavities and the terminals allows for increased terminal density without compromising the strength and physical properties of the test socket. In addition, the inherent interaction of the cam mechanism and the latch mechanism during insertion / removal of the integrated circuit, and the relatively gentle slope and steep slope of the interaction between the cam surface and the cam follower surface It provides a reliable socket and method for burn-in testing of integrated circuits, so that integrated circuits are dropped or misplaced.

Referring to FIG. 1, it is shown that the burn-in socket 1 comprises a socket body 2, which in turn has an attachment peg 3a integrally connected to the floor. The outer housing 3, and the inner housing (4) fitted to the outer housing (3). In particular, the inner housing 4 allows the inner housing 4 to descend into the outer housing 3 while preventing the inner housing 4 from being separated from the outer housing 3. It is fitted to the outer housing 3 by the engaging nail 6 of the inner housing 4 which emerges identically to the corresponding engaging nail 5.

The inner housing 4 has a recess 4b at the top 4a and a plurality of terminal-receiving cavities 7 extending from the top 4c to the bottom 4d of the inner housing 4.

As best seen in FIGS. 11 and 12, the terminal-receiving cavity 7 is rectangular in shape, with each cavity 7 facing perpendicular to the short side 9 of two adjacent rectangular cavities. It is arranged to form a lattice pattern arranged with a corresponding long side 8 of the rectangle and a corresponding short side 9 of the rectangle perpendicularly opposite the long side of the two adjacent rectangular cavities. This arrangement leaves a predetermined interspace 10 of equal size between each side of the rectangular cavity 7 and the opposing side of each of the rectangular cavity surrounding the rectangle. In the particular embodiment shown, each long side 8 of the rectangular cavity 7 is about twice as long as each short side 9.

This lattice arrangement in the recess 4c of the inner housing 4 also ensures that the inner housing 4 has the physical strength of the housing distributed relatively uniformly over this inner housing 4, while also receiving terminal-receiving. It is possible for the cavities 7 to be arranged with increased density. In contrast, more conventionally aligned cavity arrangements tend to reduce physical strength in directions parallel or perpendicular to the alignment direction. Thus, compared to the conventional arrangement of aligned cavities, there may be an increased number of rectangular cavities per unit area without loss of strength. The outer housing 3 has a corresponding plurality of terminal tail-receiving cavities 11, aligned perpendicular to the cavities 7 of the grid arrangement just described.

Referring to FIGS. 13, 14 and 15, it is shown that each terminal 12 includes a contact portion 13, an elastic portion 14, and a tail portion 15. These parts are integrally connected with the elastic part 14 disposed between the contact part 13 and the tail part 15. In one embodiment, the contact portion 13 comprises a pair of contact pieces 13b and 13c integrally connected to the base plate 13a. These contacts 13b and 13c are arranged symmetrically to form a V-shaped contact plane defining an inclined contact surface 16b and 16c and a narrow valley bottom 13d.

In one embodiment, the elastic portions 14 of each terminal 12 are alternately arranged in opposite directions and comprise a row of U-shaped portions 14b extending from the contact portion 13 to the tail portion 15. do. As shown in FIG. 13, the U-shaped portions 14b may be connected to each other by a straight portion 14a. Alternatively, this straight portion 14a can be omitted by having the U-shaped portions 14b connect directly to each other.

In one embodiment, the tail portion 15 includes a base portion 15a and a tail contact 15b integrally connected to the base portion 15a. Tail contacts 15b are for electrical connection to electronic components on a burn-in substrate (not shown). In one embodiment, the base portion 15a has an interlocking nail 15c formed on opposite sides.

The terminal 12 is relatively wide in the plane extending from the contact portion 13 to the tail portion 15 in a serpentine shape of the elastic portion 14, and the elastic portion 14 extends in a serpentine shape. It is relatively narrow in the plane perpendicular to the plane being. The terminal 12 may be a metal sheet stamped by a punch in a direction perpendicular to the relatively wide side 17. Precise and serpentine-shapes can be stamped from metal sheets. It is also possible to form such a terminal 12 by first stamping the elastic portion 14 and then bending it alternately in opposite directions to form a row of U-shaped portions as shown in FIG.

In order to insert the terminal 12 into the selected terminal-receiving cavity 7 in the inner housing 4 and the corresponding tail-receiving cavity 11 in the outer housing 3, the terminals 12 are each wide. The side 17 and narrow side 18 are aligned with the terminal-receiving cavity 7 selected to be parallel to the long side 8 and the short side 9 of the rectangular cavity 7. Then, the contact portion 13 of the terminal 12 is inserted into the rectangular cavity 7 until it appears in the recess 4b from the bottom of the inner housing 4, whereby the base portion of the contact portion 13 ( The opposite shoulder 19 in 13a) allows abutting the opposing stop projection 20 formed at the open end of the selected terminal-receiving cavity 7. After all these terminal-receiving cavities 7 of the inner housing 4 have been filled by the terminals 12, the inner housing 4 is fitted into the outer housing 3, whereby the The base portion 15a in the tail portion 15 enters the tail-receiving cavity 11 of the outer housing 3. By pulling the tail portions 15 protruding from the bottom of the socket body 2, the opposing engagement nails 15c in the base portion 15a of each terminal 12 are connected to the wall of the tail-receiving cavity 11. Is interlocked with In this way all the terminals 12 can be securely fixed in the socket body 2.

When the terminal 12 is mounted in the inner housing 4 and the outer housing 3, each terminal is surrounded by (or centers between) four adjacent terminals which are rotated 90 ° with respect to this terminal. . Thus, the wide and narrow sides of the base portion 17 in the contact portion 13 appear alternately in rows or columns of the inner housing 4 (see FIGS. 11, 12 and 15).

Preferably, the sinuous elastic portion 14 and its components, the U-shaped portion 14b, are U-shaped when the contact portion 13 of the terminal 12 comes into contact with the solder ball of the IC package. The shaped portion 14b has a size relative to the rectangular cavity 7 so that the terminal 12 can be compressed without touching the peripheral wall of the rectangular cavity.

The burn-in socket preferably has an annular top cover 21 having an opening 23 surrounded by a square frame 22. The burn-in socket is thus open at the top, and an automatic loading-retrieving device inserts the IC package 24 into the inner housing 4 of the substantially burn-in socket, and after testing the IC It makes it possible to remove packages.

The top cover 21 can move up and down with respect to the outer housing 3, the socket body 2 preferably having a pair of cams 27 pivotably fixed to the outer housing 3. Mechanism, a cam return spring 26 coupled with a cam 27 that biases the cam 27 in a vertical position, and a cam follower surface formed on the bottom plane of the top cover 21. With this structure, when the top cover 21 is released by removing the downward pressing force acting from the outside, the top cover 21 and the inner housing 4 rise to the upper limit position as shown in FIG. Is allowed. Conversely, when the top cover 21 is pressed down by the external force, the top cover 21 and the inner housing 4 are lowered to the lower limit position as shown in FIG. The intermediate, or transitional position of these components relative to each other is shown in FIG. 7.

In the illustrated embodiment, each cam return spring 26 is disposed between the bottom of the outer housing 3 and a spring seat 29 corresponding to the cam 27, thereby applying a compressive force to counter the pivoting motion of the cam. When the external force does not act to cause the cam 27 to rotate to a position perpendicular to the pivot axis. The cam 27 has a cam surface 32 formed at the top to allow sliding movement with the cam follower plane 33 of the annular top cover 22. In the illustrated embodiment, the cam follower surface 33 includes a gentle inclined portion 33a and a steep inclined portion 33b. As shown in FIG. 5, in the upper limit position, the cam surface 32 of each cam 27 moves on the gentle inclined portion 33a of the cam follower surface 33. Lowering the upper cover 21 (by the external force in the downward direction) causes the cam surface 32 of each cam 27 to move on the gentle inclined portion 33a, thereby as shown in FIG. 27) Tilt. Lowering the top cover 21 further will cause the cam surface 32 to move from the gentle inclined portion 33a to the steep inclined portion 33b, thereby lowering the cam 27 as shown in FIG. Tilt it out more towards the location. Subsequent removal of the force acting to push down the top cover 21 causes each cam 27 to be driven by the biasing action of the return spring 26, via a transient position as shown in FIG. Allow to return to the upper limit position as shown.

The rotation of the cam 37 coincides not only with the up-down movement of the top cover 21 but also with the up-down movement of the inner housing 4. The inner housing 4 has a pair of lateral protrusions 30 formed on opposite sides, which are adapted to loosely fit in the lateral recesses 31 of the opposing cam 27. It is supposed to be done. When the cam 27 is in the upright position (upper limit position--see FIG. 5) without any downward force acting on the cam 27, the lateral protrusions 30 of the opposing cam 27 It fits into the lateral recess 31 and the engagement nail 6 of the inner housing 4 is caught by the corresponding-engagement nail 5 of the outer housing 3. This is referred to as "upper limit position, at which the cover returns". Prior to the next in-in test, the top cover 21 is pressed down to force each cam 27 outward so that the cam surface 32 of each cam 27 is in a gentle slope. The steep slope becomes transient, and each lateral protrusion 30 of the inner housing 4 begins to exit the lateral recess 31 of the cam 27. Thus, the lateral protrusion 30 of the inner housing 4 and essentially the inner housing 4 itself descends to the transient or intermediate position of FIG. 7. This position is referred to as the "intermediate position at which the cover is lowered".

Subsequently, the top cover 21 is lowered to the lower limit position as the cam surface 32 of each cam 27 moves on the steep inclined portion 33b until the cam 27 is in a fully inclined position. do. Thus, the inner housing 4 is lowered to the lowest position (see FIG. 9). This position is the "lower limit position at which the cover is lowered". The cam 27, the cover 21, and the inner housing 4 are of a shape and size that can operate with each other as described above.

In the "upper limit position, where the cover returns" (Figures 5 and 6), IC package 24 can be placed under burn-in test (referred to as "burn-in test application time"). In the " intermediate position where the cover is lowered " (FIGS. 7 and 8), the burn-in test is completed and the IC package 24 is in a state immediately before being removed from the socket or just before performing the burn-in test ( "Transient time"). In the “lower limit position, with the cover lowered” (FIGS. 9 and 10), the burn-in test is completed and the IC package is removed from the burn-in socket 1 through the central opening 23 of the top cover 21. The IC package 24 to be tested can be removed or placed on the inner housing 4 substantially through the central opening 23 of the cover 21 for burn-in testing (“release or mounting time”). ").

During the "burn-in test application time" (FIGS. 5 and 6), the IC package 24 must be securely fixed. To this end, the burn-in socket has a latching mechanism located under the top cover 21. In the illustrated embodiment, the latch mechanism rotates the angle 34a of the latch arm 34 relative to the IC package 24, a pair of L-shaped latch arms 34 pivotally fixed to the outer housing 3. A latch return spring 35 associated with the L-shaped latch arm 34 for biasing, and an L-shaped latch arm 34 to tilt the latch arm 34 toward the release position relative to the latch return spring 35. And a latch actuator 38 associated with it. With this structure, the IC package 24 can be fixed with respect to the inner housing at the top portion of the "burn-in test application time" (Fig. 6), and then released after the end of the burn-in test, which will be described in detail below. Can be.

Each L-shaped latch arm 34 (FIGS. 16 and 17) is inclined portion 36 pivotally fixed to the outer housing 3 at an angular position of 90 ° from each cam 27. It is provided. This means that each L-shaped latch arm 34 is pivoted toward the opposing latch arm 34 to secure the IC package 24 or away from the opposing latch arm 34 to release the IC package 24. To allow. Normally, the opposing L-shaped latch arms 34 are fixed in the locked position under the action of the latch return spring 35. At the "burn-in test application time" (the upper cover 21 is not pushed down), the opposing L-shaped latch arm 34 moves the latch surface 34a of the latch arm 34 to the IC package 24. (See FIGS. 5 and 6) to secure the IC package 24 by tight contact on the top surface thereof. 18 and 19, the top cover 21 has four release rods 38 formed on the bottom to abut against the inclined portion 36 in the opposite direction, thereby acting as a latch actuator. . The top cover 21 has an engagement rod 22a formed on the bottom to catch the socket body 2.

In the "transient time" (when the upper cover 21 is being pressed down), the disengagement rod 38 approaches the inclined portion 36 (see FIGS. 7 and 8), and the "release or mount time" ", Prior to the time when the top cover 21 is in the lowest position (see FIGS. 9 and 10), the disengagement rod 38 causes the L-shaped latch arm 34 to be placed on the top surface of the IC package 24. To force away from it, whereby the automatic mounting / removing machine removes the IC package 24 from the burn-in socket 1 (or positions the IC package 24 into the burn-in socket 1). Make it possible.

The opposing L-shaped latch arm 34 remains perpendicular to the “transient time” (FIGS. 7 and 8) in order to secure the IC package 24 with respect to the inner housing 4, thereby providing an IC package 24. ) Is prevented from falling from the inner housing 4 or from lateral displacement from the inner housing 4. L-shaped latch arm 34 is opened just prior to "release or mount time". For this purpose, the cam surface 32 of each cam 27 is designed to move by riding on the gentle inclined portion 33a of the cam follower surface 33, so that the top cover 21 and the inner housing 4 are moved. Slowly descend from the end of the "burn-in test application time" to the end of the "transient time" and quickly descend from the end of the "transient time" to the end of the "mount and unload time".

If the IC package 24 drops away from the inner housing 4 or causes some displacement on the inner housing at the “transient time” (see FIGS. 7 and 8), the burn-in test may not produce satisfactory results. To avoid this inconvenience, the L-shaped latch arm 34 is held vertical to fix the IC package 24 in "transient time" and immediately before the "release or mount time" (see FIG. 10). Will be opened. In order to prevent falling or displacement before it is secured, the top cover 21 and the inner housing 4 have a cam surface of the cam 27 from the "burn-in test application time" to the end of the "transient time". Slowly descend by allowing the 32 to move along the gentle inclined portion 33a of the cam follower surface 33. Then, from the "transient time" to the "release and mount time", the top cover 21 and the inner housing 4 have the cam surface 32 along the steep inclined portion 33b of the cam follower surface 33. Go down more quickly as you move. In this way, the IC package 24 is placed on the inner housing 4 with the aid of the L-shaped latch arm 34 just before the "release or mount time" so that the burn-in test can produce satisfactory results. Can be fixed stably. The burn-in test scheme made by the burn-in socket 1 is described below.

Referring now to FIGS. 5 and 6, no force is applied downwards to the top cover 21 during the burn-in test, thus allowing the cam 27 to stand vertically, and the cam of the cam 27 The surface 32 is disposed at the starting position on the gentle inclined portion 33a of the cam follower surface 33. The top cover 21 is placed in the upper limit position, and the opposing protrusion 30 of the inner housing 4 is loosely fitted in the recess 31 of the cam 27. The engaging nail 6 of the inner housing 4 is caught by the corresponding engaging nail 5 of the outer housing 3. By positioning the latch surface 34a on the top surface of the IC package 24, the opposing L-shaped latch arm 34 is held vertical to secure the IC package 24 relative to the inner housing 4. . In this way, the solder balls of the IC package 24 are placed in contact with the contact portion 13 of the terminal 12 disposed in the inner housing 4, so that a burn-in test can be performed.

Referring now to FIG. 15, the inner housing 4 is held in an upper limit position and the IC package 24 is secured to the inner housing 4 by an L-shaped latch arm 34. When the solder ball 25 of the IC package 24 contacts the contact portion 13 in the terminal 12 of the inner housing 4, the terminals 12 are placed in a compressed state, and the accumulated compressive force is partially The spacing between the and portions is reduced causing a concentration phenomenon of the U-shaped portion 14b. However, absorbing the compressive force in this manner minimizes lateral warpage, so that the serpentine elastic portion 13 of the terminal 12 places the terminal-receiving cavity 7 in which the terminal 12 is located. Will not enter the wall. Rather, the elastic portion of each terminal is reduced evenly over the entire length. This causes each terminal 12 to generate a stable resilient force acting on the corresponding solder ball each time the burn-in test is performed, regardless of whether the terminal side has been reduced in an attempt to increase terminal density. The sinuous resilient portion 13 of the terminal 12 thus facilitates smaller size terminal design and arrangement with increased density, while ensuring good physical and electrical contact with the corresponding solder balls.

As mentioned above, all the terminals 12 can generate a stable elastic force acting on the selected solder ball. More specifically, the solder balls 25 are brought into contact with the pair of contacts 13b and 13c, which are in contact with the solder balls 25 under the action of the elastic force accumulated in the elastic portions 14 of the terminals 12. Under pressure). Thus, the pair of opposing contacts 13b and 13c are reliably in contact with the solder ball 25, whereby an error exists at the interface between the pair of opposing contacts 13b and 13c and the solder ball 25. Do not do it. Eliminating errors prevents significant electrical resistance from appearing at the interface. Even if the selected solder balls are sized within specified tolerances, the paired contacts that define the V-shaped contact surfaces ensure good electrical contact.

As previously described, the terminal-receiving cavities 7 are arranged to form a unique grating pattern in which each cavity is arranged in a particular orientation with respect to each adjacent cavity. As best shown in FIGS. 1 and 11, each cavity 7 is generally illustrated in a rectangular shape, a pair interconnected by a second (and also short) opposing side 9 of a pair of terms. A first (also long) opposing side 8. In the lattice pattern, at least one of the long sides 8 opposite each cavity faces one short side 9 of each of two adjacent cavities. Similarly, at least one of the short sides 9 opposite each cavity faces the long side 8 of the adjacent cavity (shown in the figure as in two adjacent cavities). This arrangement allows for a gap 10 that occurs between the sides of one selected cavity and the opposing sides of each of the surrounding and adjacent cavities.

Each terminal-receiving cavity 7 has a wide or long side 17 arranged parallel to the long side 8 and short side 9 of the combined cavity 7, respectively, and a narrow or short side ( And a terminal 12 having 18). The solder balls 25 of the IC package 24 are arranged to match the terminals received in the cavity of the designated grating pattern as described. This lattice arrangement allows all terminals 12 to be arranged at substantially equal spacing 10 between the cavity and the cavity, which makes it possible to increase the density of the terminals 12.

As can be seen from the foregoing description, the sockets and methods of the present invention provide significant advantages over conventional burn-in test sockets and methods of performing burn-in tests of integrated circuits. The unique lattice arrangement of the terminal-receiving cavity and the terminals within this terminal-receiving cavity allows for increased terminal density without compromising the strength and physical performance characteristics of the test socket. In addition, the relatively gentle slope and steep slope of the interaction between the cam mechanism and the latch mechanism during insertion / removal of the integrated circuit from the socket, and the interaction between the cam surface and the cam follower surface are the burn-in of the integrated circuit. It provides a reliable socket and method for testing, which minimizes the risk of the integrated circuit falling or being misplaced.

The invention is not limited to the embodiment (s) described herein or any particular embodiment. Without limitation, certain examples of alternative embodiments contemplated within the scope of the present invention are that the actuation mechanism common to the cam mechanism and latch mechanism does not resemble the top cover, and the cam and latch mechanism is more than two rotatable components. Components, wherein the cam and latch feedback bias forces are achieved by means other than springs, and the non-uniform slope associated with the interaction between the cam surface and the cam follower surface is not limited to a single component. The portion of the vertical side of the terminal-receiving cavity includes an embodiment different from that described or illustrated herein. Other variations than the described embodiments can be made within the scope of the invention. The invention is defined by the following claims.

Claims (9)

A burn-in test socket for an integrated circuit ("IC") package, the IC package having a plurality of conductive electrical leads arranged on the IC package. In the socket for A socket body for receiving at least a portion of the IC package during a test, the socket body including a base member in contact with the IC package lead, the base member having a cavity arrangement disposed therein; With the socket body, A plurality of conductive terminals, wherein only one terminal is disposed in only one cavity, the terminal including the plurality of conductive terminals contacting the lead wire of the IC package when the IC package is received in the socket. But Each of the cavities has at least four sides arranged in two pairs of opposing first and second sides, the first side being longer than the second side, The cavities are arranged in a lattice arrangement in the base member, each of the cavities being surrounded by three or more adjacent cavities, wherein at least one of the first side of the cavities faces a second side of the adjacent cavities. , Socket for burn-in test. 2. The IC of claim 1, wherein the leads of the IC package include solder balls disposed on the IC package, each of the terminal portions corresponding to the corresponding solder when the IC package is located in the socket. A burn-in test socket comprising a contact portion arranged to form a V-shaped contact plane by at least two contact surfaces for engaging the ball. The burn-in test socket of claim 1, wherein the cavity is disposed in the lattice arrangement in the form of columns and rows of discontinuous cavity. The burn-in test socket of claim 1, wherein the cavity is generally rectangular in shape. The burn-in test socket of claim 1, wherein the cavities are arranged in the lattice arrangement such that each of the cavities extends perpendicular to an adjacent cavity. The burn-in test socket of claim 1, wherein pairs of adjacent cavities are separated by uniformly spaced gaps. In a burn-in test socket of an IC package having an electrical lead, A socket body having a plurality of terminals embedded in a corresponding plurality of terminal-receiving cavities, The terminal-receiving cavity is generally rectangular in shape, with the longer side of each of the cavities facing the shorter side of the adjacent cavity and the shorter side of each of the cavities facing the longer side of the adjacent cavity. And to form a grid pattern in which each of the cavities is arranged. 8. The burn-in test socket of claim 7 wherein a uniformly spaced gap exists between each of said generally rectangular terminal-receiving cavities and their corresponding opposing adjacent cavities. 8. The contact of claim 7 wherein the leads of the IC package are generally spherical solder balls and each of the plurality of terminals is inclined contact to engage a corresponding solder ball when the integrated circuit package is under burn-in test. A burn-in test socket comprising a contact section comprising a pair of contact pieces arranged symmetrically to form a V-shaped contact plane defining a surface.