JP3364134B2 - Wafer cassette - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer cassette for collectively burning in electrical characteristics of a plurality of semiconductor integrated circuit elements formed on a semiconductor wafer in a wafer state.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor integrated circuit device, after the semiconductor integrated circuit element and the lead frame are electrically connected by a bonding wire, the semiconductor integrated circuit element and the lead of the lead frame are sealed with resin or ceramics. It is supplied in the state of being mounted and mounted on a printed circuit board.

However, due to the demand for downsizing and cost reduction of electronic equipment, a method of mounting a semiconductor integrated circuit device on a circuit board in a bare chip state as it is cut out from a semiconductor wafer has been developed, and its quality is guaranteed. It is desired to supply bare chips at a low price.

In order to guarantee the quality of the bare chip, it is necessary to burn-in the electrical characteristics of the semiconductor integrated circuit elements collectively in a wafer state.

Therefore, for example, NIKKEI MICRODEVICES 19
As described in the July 1997 issue, a wafer tray holding a semiconductor wafer on which a plurality of semiconductor integrated circuit elements are formed, and a semiconductor wafer held on the wafer tray are provided so as to face each other. There has been proposed an inspection cassette including a probe card having bumps connected to the inspection terminals of the semiconductor integrated circuit device.

The inspection cassette will be described below with reference to FIGS. 6 and 7. 6 shows a sectional structure of the inspection cassette, and FIG. 7 shows a partially enlarged surface structure of the inspection cassette.

As shown in FIGS. 6 and 7, a wafer tray 11 holding a semiconductor wafer 10 and a probe card 12 held on a wiring board 13 are provided so as to face each other, and a peripheral portion of the wafer tray 11 is provided. An annular seal material 14 is provided on the wafer tray 11. When the wafer tray 11 and the probe card 12 are brought close to each other, the wafer tray 11,
A sealed space 15 is formed by the probe card 12 and the seal member 14.

As shown in FIG. 7, an external electrode 16 is formed on each semiconductor integrated circuit element on the semiconductor wafer 10.

As shown in FIG. 6 and FIG. 7, bumps 17 are provided on the probe card 12 at positions corresponding to the external electrodes 16 of the semiconductor integrated circuit element on the semiconductor wafer 10, and the probe card 12 has The peripheral portion is held by a rigid ring 18.

Further, as shown in FIGS. 6 and 7, the wiring board 13 has a connector 19 for connecting to an inspection device 25 for supplying an inspection voltage such as a power supply voltage, a ground voltage or a signal voltage, and one end. The multilayer wiring 20 whose side is connected to the connector 19, the other end of the multilayer wiring 20, and the probe card 12
And an anisotropic conductive rubber 21 for connecting to the bumps 17 are provided.

As shown in FIG. 6, the wafer tray 11 is provided with an opening / closing valve 22 connected to a vacuum pump 26 for depressurizing the sealed space 15 formed by the wafer tray 11, the probe card 12 and the seal member 14. Has been.

In the state shown in FIG. 6, after connecting the on-off valve 22 of the wafer tray 11 to the vacuum pump 26, the vacuum pump 2
6 to operate the wafer tray 11 and the probe card 1
When the pressure in the sealed space 15 formed by 2 and the seal member 14 is reduced, the wafer tray 11 and the probe card 12 come closer to each other, and as shown in FIG.
The external electrodes 16 of the upper semiconductor integrated circuit element and the bumps 17 of the probe card 12 are electrically and reliably connected. After that, the inspection device 25 is connected to the connector 19 of the wiring board 13, and the inspection voltage is supplied from the inspection device 25 to each of the semiconductor wafer 10 via the connector 19, the multilayer wiring 20, the anisotropic conductive rubber 21 and the bumps 17. The output signal from each semiconductor integrated circuit element is input to the inspection device 25 while being applied to the external electrode 16 of the semiconductor integrated circuit element, and the inspection device 25 evaluates the electrical characteristics of each semiconductor integrated circuit element.

[0013]

DISCLOSURE OF THE INVENTION The inventors of the present invention have shown in FIG.
In order to collectively burn-in the electrical characteristics of a plurality of semiconductor integrated circuit elements formed on a semiconductor wafer in a wafer state by using the inspection cassette shown in FIG.
We devised a wafer burn-in system as shown in.

The wafer burn-in system shown in FIG. 8 will be described below.

In FIG. 8, A is an alignment device for aligning the semiconductor wafer 10 with the probe card 12, and B is an electrical characteristic of each semiconductor integrated circuit element formed on the semiconductor wafer 10 evaluated at high temperature. C is a wafer take-out device for taking out the semiconductor wafer 10 from the wafer tray 11.

First, the wiring board 13 holding the probe card 12 and the wafer tray 11 for holding the semiconductor wafer 10 are carried into the left side portion of the alignment apparatus A, and the semiconductor wafer 10 is held by the wafer tray 11. The cassette D is carried into the right side portion of the alignment apparatus A.
The alignment apparatus A takes out the semiconductor wafer 10 from the transport cassette D, places the taken-out semiconductor wafer 10 on the wafer tray 11 and holds it, and then holds the semiconductor wafer 10 held by the wafer tray 11 in the wiring board 1.
The probe card 12 held by No. 3 is aligned. When the alignment of the semiconductor wafer 10 with the probe card 12 is completed, the opening / closing valve 22 of the wafer tray 11 is connected to the vacuum pump 26, and then the vacuum pump 26 is connected.
Is operated to reduce the pressure in the sealed space 15 formed by the wafer tray 11, the wiring board 13, and the seal member 14,
The wafer tray 11 holding the semiconductor wafer 10 and the wiring board 13 holding the probe card 12 are integrated (see FIGS. 6 and 7). As a result, the semiconductor wafer 10 is in a state in which the external electrodes 16 of the semiconductor wafer 10 and the bumps 17 of the probe card 12 are electrically connected to the inspection cassette E including the wafer tray 11 and the probe card 12. It is stored.

The inspection cassette E containing the semiconductor wafer 10 is transferred from the alignment apparatus A to the burn-in apparatus B, and the burn-in apparatus B performs wafer burn-in on the semiconductor wafer 10. That is, the burn-in device B
The electrical characteristics of each semiconductor integrated circuit element on the semiconductor wafer 10 are evaluated at a high temperature by an inspection device provided inside.

When the burn-in is completed, the semiconductor wafer 1
The inspection cassette E containing 0 is a burn-in device B
From the wafer to the wafer unloading device C. The wafer take-out device C takes out the semiconductor wafer 10 from the inspection cassette E and carries the taken-out semiconductor wafer 10 to the carrying cassette D.
To store. As a result, the semiconductor wafer 10 is ready to be shipped. On the other hand, the inspection cassette E from which the semiconductor wafer 10 is taken out is separated into the wiring substrate 13 holding the probe card 12 and the wafer tray 11,
It is again transported to the alignment apparatus A.

By the way, the above-mentioned wafer burn-in system has the following two problems.

The first problem is that the alignment apparatus A must position the semiconductor wafer 10 with respect to the probe card 12 and the wafer tray 11 with respect to the probe card 12.

The first problem will be described below with reference to FIGS. 6 and 7.

In order to electrically connect the external electrodes 16 of the semiconductor wafer 10 and the bumps 17 of the probe card 12, the semiconductor wafer 10 needs to be positioned with respect to the probe card 12, and the opening / closing valve 22 of the wafer tray 11 is also required. The wafer tray 11 needs to be positioned with respect to the vacuum pump 26 so that the wafer tray 11 is securely connected to the vacuum pump 26.

However, the opening / closing valve 22 of the wafer tray 11
If the wafer tray 11 is positioned with respect to the vacuum pump 26 so that the semiconductor wafer 10 is reliably connected to the vacuum pump 26, the positional relationship between the semiconductor wafer 10 held on the wafer tray 11 and the probe card 12 is changed, The external electrodes 16 of the semiconductor wafer 10 are no longer connected to the bumps 17 of the probe card 12. On the other hand, when the semiconductor wafer 10 is positioned with respect to the probe card 12 so that the external electrodes 16 of the semiconductor wafer 10 are securely connected to the bumps 17 of the probe card 12, the positional relationship between the wafer tray 11 and the vacuum pump 26 is determined. And the open / close valve 22 of the wafer tray 11 is changed to the vacuum pump 26.
Will not be connected to.

The above problem has been described in connection with the case where the opening / closing valve 22 of the wafer tray 11 is connected to the vacuum pump 26 and the sealed space 15 formed by the wafer tray 11, the probe card 12 and the seal member 14 is depressurized. The present invention is not limited to this, and also occurs when the wafer tray 11 holding the semiconductor wafer 10 is placed on a temperature adjusting device (not shown) that adjusts the temperature of the semiconductor wafer 10. If the semiconductor wafer 10 and the probe card 12 are positioned relative to the temperature adjustment device, the positional relationship between the semiconductor wafer 10 and the probe card 12 is misaligned. If the semiconductor wafer 10 is positioned relative to the probe card 12, the wafer tray 11 and the temperature adjustment device are related to each other. Goes crazy.

As described above, when the wafer tray holding the semiconductor wafer is positioned with respect to the probe card in a state where the probe card is held at a predetermined position with respect to the inspection device, an external device (vacuum pump or temperature control) of the wafer tray is used. The positional relationship with respect to
When the wafer tray is positioned with respect to the external device, there is a problem that the positional relationship of the semiconductor wafer held on the wafer tray with respect to the probe card is changed.

The relative position of the inspection device to which the probe card is connected and the external device to which the wafer tray is connected can be regulated in advance. Therefore, when the wafer tray is positioned with respect to the probe card, the wafer tray is positioned with respect to the external device. Therefore, in the above wafer burn-in system, the semiconductor wafer is positioned with respect to the probe card and the wafer tray is positioned with the probe card. It will need to be positioned relative to the card.

The second problem is a problem in transporting the inspection cassette E. That is, the sealed space 15 formed by the wafer tray 11, the wiring board 13, and the seal member 14.
Inspection cassette E integrated by depressurizing
Is transferred from the alignment apparatus A to the burn-in apparatus B, and at the same time, from the burn-in apparatus B to the wafer unloading apparatus C.
However, if the depressurized state of the sealed space 15 is lowered for some reason during the transfer, the wafer tray 1
Since 1 and the wiring board 13 are separated, there is a problem that the semiconductor wafer 10 and the wafer tray 11 need to be realigned with the probe card 12 or the semiconductor wafer 10 is damaged.

In view of the above, it is a first object of the present invention to make it possible to easily and reliably position a semiconductor wafer with respect to a probe card and a wafer tray with respect to a probe card. The second object is to prevent the wafer tray and the probe card (wiring board) from being separated even if the reduced pressure state in which the above (1) and (3) are integrated is reduced.

[0029]

To achieve the above object, a first wafer cassette according to the present invention comprises a wafer tray for holding a semiconductor wafer on which a plurality of semiconductor integrated circuit elements are formed, and a wafer holding for the wafer tray. A probe card having a probe terminal connected to the external electrode of the semiconductor integrated circuit element and a positioning means for restricting the relative position between the wafer tray and the probe card.

According to the first wafer cassette, since the first wafer cassette is provided with the positioning means for regulating the relative position between the wafer tray and the probe card, the first wafer cassette can be used as an alignment device, a burn-in device, or a wafer unloading device. If the positional relationship between an external device such as a vacuum pump provided and the probe card is regulated in advance, the wafer tray is automatically positioned with respect to the external device.

The first wafer cassette is a holding substrate holding the probe card, and electrodes for external connection which are provided on the holding substrate and are connected to an inspection device for inspecting the electrical characteristics of the plurality of semiconductor integrated circuit elements. And provided on the holding substrate,
It is preferable to further include wiring for electrically connecting the probe terminal of the probe card and the external connection electrode.

The first wafer cassette further comprises a holding substrate holding the probe card, and the positioning means has a plurality of engaging recesses formed dispersedly on the wafer tray and the holding substrate inward and outward directions. It is preferable that the front end portion is movably provided and has a plurality of engaging members whose end portions are locked in the respective engaging recesses of the wafer tray when moved inward.

A second wafer cassette according to the present invention is provided so as to face a wafer tray holding a semiconductor wafer on which a plurality of semiconductor integrated circuit elements are formed and a wafer holding portion of the wafer tray, and A probe card having a probe terminal connected to an external electrode, a holding substrate holding the probe card, and an annular seal member provided between the wafer tray and the probe card to form a sealed space together with the wafer tray and the probe card. And an opening / closing valve that opens and closes a communication path that connects the sealed space and the outside, and a fixing unit that detachably fixes the wafer tray and the holding substrate.

According to the second wafer cassette, since the fixing means for fixing the wafer tray and the holding substrate to each other in a separable manner is provided, the wafer tray and the holding substrate can be integrally conveyed by the fixing means and the wafer tray can be conveyed. When holding the semiconductor wafer on top, the wafer tray and the holding substrate can be separated.

In the second wafer cassette, the holding substrate has electrodes for external connection connected to an inspection device for inspecting electrical characteristics of a plurality of semiconductor integrated circuit elements, probe terminals of a probe card, and electrodes for external connection. It is preferable to have a wiring for electrically connecting

In the second wafer cassette, the fixing means is provided with a plurality of engaging concave portions formed dispersedly on the wafer tray and the holding substrate so as to be movable inward and outward, and the tip end portion when moved inward. It is preferably composed of a plurality of engaging members that are locked in the respective engaging recesses of the wafer tray.

In the second wafer cassette, the annular seal member has a cross-sectional shape that forms a sealed space together with the wafer tray and the probe card when the wafer tray and the holding substrate are fixed by the fixing means. Is preferred.

In the first or second wafer cassette,
The holding substrate preferably has a rectangular planar shape.

[0039]

BEST MODE FOR CARRYING OUT THE INVENTION A wafer cassette according to one embodiment of the present invention (corresponding to the above-mentioned inspection cassette).
And its operation will be described with reference to FIGS.

FIG. 1 is a perspective view showing the overall structure of a wafer cassette according to one embodiment, and FIGS. 2A to 2D are partial sectional views for explaining the operation of the wafer cassette according to one embodiment. Yes, FIG. 3 is a rear view of the wafer tray that constitutes the wafer cassette according to the embodiment.

In the wafer cassette according to the embodiment of the present invention, the bumps 17 of the probe card 12 are connected to the external electrodes 16 formed on the semiconductor integrated circuit elements on the semiconductor wafer 10 to form the semiconductor integrated circuits. This is a device for collectively burning in elements in a wafer state (see FIGS. 6 and 7). 1 to 3, the external electrodes 16 formed on each semiconductor integrated circuit element on the semiconductor wafer 10 and the bumps 17 formed on the probe card 12 are omitted for convenience of illustration. .

As shown in FIG. 3, the wafer holder 100a
In the wafer tray 100 that holds the semiconductor wafer 10, a pair of protrusions 101 is provided at one peripheral edge in the diametrical direction (horizontal direction in FIG. 3).
On the lower surface of 1, a pair of engaging recesses 102 spaced from each other are provided.
Are formed. Further, an opening / closing valve 103 connected to the above-described vacuum pump is provided on the peripheral portion of the wafer tray 100 in the other diameter direction (vertical direction in FIG. 3) perpendicular to the one diameter direction.

As shown in FIG. 2, an annular seal member 105 made of an elastic body is provided outside the semiconductor wafer 10 held by the wafer holding portion 100a of the wafer tray 100. At a position facing the semiconductor wafer 10 held on the wafer tray 100, a circular probe card 12 having a structure similar to the structure shown in FIGS. The periphery of the probe card 12 is held by a rigid ring 18.

On the upper surface side of the probe card 12, a rectangular holding substrate 110 made of, for example, glass epoxy is arranged, and the holding substrate 110 holds the wiring substrate 13, so that the probe card 12 has a wiring substrate. It is held on the holding substrate 110 via 13.

As shown in FIG. 1, a rectangular frame-shaped reinforcing member 112 made of, for example, metal is fixed to the peripheral portion of the upper surface of the holding substrate 110. The holding substrate 110 and the reinforcing member 112 are provided with a notch 113 in a pair of side portions of the wafer tray 100 on which the protruding portion 101 is provided, and the notch 113 on the upper surface of the reinforcing member 112. A connecting member 114 having a hat shape in plan view is attached to a portion corresponding to, and the reinforcing member 112 is integrated.

Notch 1 on the upper surface of the holding substrate 110
A pair of side edge portions on which 13 is not formed are provided with connectors 11 for connecting to an inspection device that supplies an inspection voltage.
Although not shown, multilayer wiring is formed inside the holding substrate 110, one end side of which is connected to the connector 119 and the other end side of which is connected to the bump 17 of the probe card 12.

A pair of rotating shafts 115 that are parallel to each other extend through the tip of the connecting member 114, and the swinging member 11 extends downward at both ends of each rotating shaft 115.
6 is fixed. At the lower end of each swing member 116,
The wafer tray 10 extends horizontally to the wafer tray side.
No. 117a of a shape that can be inserted into the engaging recess 102 of 0
Is connected to the engaging member 117 having the. A lever 118 is fixed to the central portion of the outer rotary shaft 115 of the pair of rotary shafts 115. Therefore, when the free end side of the lever 118 is moved up and down, the outer rotating shaft 115 rotates, so that the lower end portion of the outer swinging member 116 swings in an arcuate direction inward and outward, and accordingly The lower end of the rocking member 16 and the engaging member 117 move inward and outward. In the embodiment of the present invention, when the free end of the lever 118 is horizontal to the fixed end, the engaging member 117
The tip 117a of the wafer tray 100 moves inward to move the wafer tray 100
2 (see FIG. 2A), and when the free end of the lever 118 rotates slightly upward, the tip 117a of the engaging member 117 moves slightly outward and the engaging concave 102 (See FIG. 2B), and when the free end of the lever 118 rotates largely upward, the tip 117a of the engaging member 117 largely moves outward and completely separates from the wafer tray 100 (FIG. 2). (See (c)).

The operation of the wafer cassette according to the embodiment of the present invention and the method of wafer burn-in using the wafer cassette will be described below with reference to FIGS. 2 (a) to 2 (d) and FIG.
Will be described with reference to. FIG. 5 is a diagram showing a wafer burn-in system for carrying out wafer burn-in using the wafer cassette according to the embodiment of the present invention.

First, as shown in FIG. 2A, with the wafer tray 100 placed close to the lower side of the probe card 12 held by the holding substrate 110, the free ends of the pair of levers 118 are respectively set. Move down. By doing so, the tip portions 117a of the four engaging members 117 move inward to move the engaging concave portions 102 of the wafer tray 100.
Wafer tray 100 is inserted into the holding substrate 11
The wafer tray 100 is integrally held by the holding substrate 110 in a state where the wafer tray 100 is positioned with respect to the probe card 12. That is, the positioning member that regulates the relative position between the wafer tray 100 and the probe card 12 by the engagement member 117 provided on the holding substrate 110 and the engagement recess 102 formed on the wafer tray 100, and the wafer tray 100 and the holding substrate 110. Is configured so as to be separably fixed, and the positioning operation of the wafer tray 100 with respect to the probe card 12 and the holding operation of the wafer tray 100 by the holding substrate 110 can be simultaneously performed.

Next, as shown in FIG. 5, the wafer tray 1
00 and the holding substrate 110 are integrated into the wafer cassette F to the left side portion of the alignment apparatus A, and the carrying cassette D holding the semiconductor wafer 10 is held.
Is carried into the right side portion of the alignment apparatus A. In this case, since the holding substrate 110 that constitutes the wafer cassette F has a rectangular shape, the wafer cassette F, and thus the wafer tray 100 and the holding substrate 110 are automatically moved to the alignment apparatus A when they are carried into the alignment apparatus A. Positioned. Therefore, the negative pressure valve of the vacuum pump provided in the alignment apparatus A is previously provided at a position corresponding to the opening / closing valve 103 of the wafer tray 100 to be carried in, and the connector of the contact inspection apparatus provided in the alignment apparatus A is provided. Holding substrate 110 to be loaded
If it is provided at a position corresponding to the connector 119 of
When the wafer cassette F is loaded into the alignment apparatus A, the wafer tray 100 is automatically positioned with respect to the vacuum pump and the holding substrate 110 is positioned with respect to the contact inspection apparatus.

Inside the alignment apparatus A, the free end of the lever 118 is largely moved upward to
As shown in (c), the tip portion 117a of the engaging member 117.
After the wafer is completely removed from the wafer tray 100, the semiconductor wafer 1 is placed on the wafer mounting portion 100a of the wafer tray 100.
Holds 0. Then, after aligning the semiconductor wafer 10 with the probe card 12, the semiconductor wafer 1
0, the sealed space formed by the probe card 12 and the seal member 105 is decompressed, and the external electrodes 16 of the semiconductor wafer 10 and the bumps 17 of the probe card 12 are reliably connected as shown in FIG. 2D. . After that, the free end of the lever 118 is largely moved downward to insert the tip 117a of the engaging member 117 into the engaging recess 102 of the wafer tray 100, as shown in FIG. By doing so, the semiconductor wafer 10 is stored in the wafer cassette F including the wafer tray 100 and the holding substrate 110 in a state where the positioning with respect to the probe card 12 is completed.

The wafer cassette F accommodating the semiconductor wafer 10 is taken out from the alignment apparatus A, then accommodated in the cassette rack G and conveyed to the burn-in apparatus B. At this time, since the tip portion 117a of the engaging member 117 is inserted into the engaging concave portion 102 of the wafer tray 100,
The wafer tray 100 and thus the semiconductor wafer 10 are transported from the alignment apparatus A to the burn-in apparatus B while being reliably held by the holding substrate 110, that is, in the state of being reliably stored in the wafer cassette F. Even if the depressurized state of the sealed space formed by 12 and the seal member 105 is lowered, the semiconductor wafer 10 is not damaged and the semiconductor wafer 1
There is no need to reposition the 0 probe card 12.

In addition, the negative pressure valve of the vacuum pump provided in the burn-in device B is loaded into the wafer tray 100.
When the connector of the electrical characteristic inspection device provided in the burn-in device B is provided in advance at a position corresponding to the on-off valve 103 of FIG. When the wafer cassette F is loaded into the burn-in system B, the wafer tray 100 is automatically positioned with respect to the vacuum pump and the holding substrate 110 is positioned with respect to the electrical characteristic inspection device.

When the burn-in to the semiconductor wafer 10 is completed, the wafer cassette F is taken out from the burn-in device B, then stored in the cassette rack G and conveyed to the wafer take-out device C. The wafer take-out device C takes out the semiconductor wafer 10 from the wafer cassette F and stores the taken-out semiconductor wafer 10 in the carrying cassette D.
Even if the depressurized state of the sealed space formed by the semiconductor wafer 10, the probe card 12 and the seal member 105 is released during the transfer from the burn-in device B to the wafer unloading device C, the semiconductor wafer 10 is not damaged.

Incidentally, from the wafer cassette F to the semiconductor wafer 1
When taking out 0, the wafer tray 100 and the holding substrate 11
If 0 is not separated, the sealed space may be pressurized to separate the wafer tray 100 and the holding substrate 110, and then the semiconductor wafer 10 may be taken out. In this case, the wafer tray 1 loaded into the wafer unloading apparatus C is
It is preferable to provide a pressurizing pump having a pressurizing valve at a position corresponding to the on-off valve 103 of 00. With this arrangement, when the wafer cassette F is taken into the unloading device C, the wafer tray 100 is automatically positioned with respect to the pressure pump.

When the semiconductor wafer 10 is taken out from the wafer cassette F, it is in a shipping state. On the other hand, the wafer cassette F from which the semiconductor wafer 10 is taken out is again transported to the alignment apparatus A in a state where the wafer tray 100 and the holding substrate 110 are integrated.

As shown in FIG. 2A, the holding substrate 1
The tip portion 117 a of the engaging member 117 of No. 10 is inserted into the engaging concave portion 102 of the wafer tray 100, and the wafer tray 1
00 is held integrally with the holding substrate 110, the tip of the seal member 105 contacts the probe card 12, and as shown in FIG.
0, the seal member 105 when the sealed space formed by the probe card 12 and the seal member 105 is decompressed.
If the cross-sectional shape of the seal member 105 is formed so that the front end side of the wafer tray 100 expands to the outside, the wafer tray 100 and the probe card 12 are transferred when the wafer cassette F in which the wafer tray 100 and the holding substrate 110 are integrated is transported. Since dust does not enter through the gap between the semiconductor wafer 10 and
The situation that dust adheres to the surface of the can be avoided.

4 (a) and 4 (b) show a modified example of the wafer cassette according to the above-described embodiment, in which the semiconductor wafer 10 held on the wafer mounting portion 100a of the wafer tray 100 is provided on the outside. A seal member 120 having a circular hollow portion is provided. When the seal member 120 has a hollow portion, it is easy to increase the height of the seal member 120. Therefore, when the wafer tray 100 is integrally held by the holding substrate 110, the seal member 1
A structure in which the tip portion of 20 contacts the probe card 12 can be reliably realized.

[0059]

According to the first wafer cassette of the present invention, the external device is preliminarily positioned with respect to the probe card because it is provided with the positioning means for regulating the relative position between the wafer tray and the probe card. Due to
The wafer tray can be automatically positioned with respect to the external device and the wafer tray can be automatically positioned with respect to the probe card.

When the first wafer cassette includes the holding substrate holding the probe card and the external connection electrodes and wirings provided on the holding substrate, a plurality of semiconductors formed on the semiconductor wafer are provided. There is no need to separately provide a wiring board having an external connection electrode connected to an inspection device that inspects the electrical characteristics of the integrated circuit element and a wiring that electrically connects the probe terminal of the probe card and the external connection electrode. Therefore, the structure of the first wafer cassette is simplified.

The first wafer cassette is provided with a holding substrate holding the probe card, and the positioning means is provided with a plurality of engaging concave portions formed in the wafer tray and a plurality of holding substrates provided so as to be movable inward and outward. With the engaging member, the wafer tray can be easily and surely positioned with respect to the probe card.

According to the second wafer cassette of the present invention, since the fixing means for separating the wafer tray and the holding substrate is provided so as to be separable, the wafer tray and the holding substrate can be integrated and conveyed by the fixing means. Even if the depressurized state in which the wafer tray and the probe card are integrated during transportation is lowered, the wafer tray and the probe card are not separated, and the semiconductor wafer is damaged and the semiconductor wafer is misaligned with the probe card. It can be avoided. Further, when the wafer tray and the holding substrate are separated, the semiconductor wafer can be stored on the wafer tray.

In the second wafer cassette, when the holding substrate is provided with the electrodes for external connection and the wiring, it is connected to the inspection device for inspecting the electrical characteristics of the plurality of semiconductor integrated circuit elements formed on the semiconductor wafer. Since it is not necessary to separately provide a wiring board having an external connection electrode and a wiring for electrically connecting the probe terminal of the probe card and the external connection electrode, the structure of the second wafer cassette becomes simple.

In the second wafer cassette, if the fixing means is composed of a plurality of engaging concave portions formed on the wafer tray and a plurality of engaging members rotatably provided on the holding substrate, the holding substrate of the wafer tray is held. It can be fixed easily and reliably.

In the second wafer cassette, when the annular seal member has a cross-sectional shape that forms a sealed space when the wafer tray and the holding substrate are fixed by the fixing means, the wafer tray and the holding substrate are held. It is possible to prevent dust from entering between the wafer tray and the probe card and adhering to the surface of the semiconductor wafer when the wafer cassette in which the substrate is integrated is transported.

In the first or second wafer cassette,
When the holding substrate has a rectangular planar shape, the probe card held by the holding substrate and the wafer tray fixed on the holding substrate can be easily positioned with respect to an external device.

[Brief description of drawings]

FIG. 1 is a perspective view of a wafer cassette according to an embodiment of the present invention.

2A to 2D are cross-sectional views illustrating the operation of the wafer cassette according to the embodiment of the present invention.

FIG. 3 is a plan view of the back surface of the wafer tray in the wafer cassette according to the embodiment of the present invention.

FIG. 4 is an overall view of a wafer burn-in system performed using the wafer cassette according to the embodiment of the present invention.

5A and 5B are cross-sectional views showing a modified example of the seal member in the wafer cassette according to the embodiment of the present invention.

FIG. 6 is a sectional view of a conventional wafer cassette.

FIG. 7 is a partially enlarged sectional view of a conventional wafer cassette.

FIG. 8 is an overall view of a wafer burn-in system performed using a conventional wafer cassette.

[Explanation of symbols]

A alignment device B burn-in equipment C Wafer take-out device D transport cassette E inspection cassette F wafer cassette 10 Semiconductor wafer 12 probe cards 13 wiring board 16 external electrodes 17 bumps 18 Rigid ring 100 wafer tray 100a Wafer holder 101 protrusion 102 engaging recess 103 open / close valve 105 seal member 110 holding substrate 112 Reinforcement member 113 Notch 114 Connection member 115 rotation axis 116 rocking member 117 Engagement member 117a tip 118 lever 119 connector 120 seal member

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-8-5666 (JP, A) JP-A-7-283280 (JP, A) JP-A-8-50146 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01L 21/66 B65D 85/86 H01L 21/68

Claims (5)

(57) [Claims] 1. A wafer tray holding a semiconductor wafer on which a plurality of semiconductor integrated circuit elements are formed, and a probe which is provided so as to face a wafer holding portion of the wafer tray and is connected to an external electrode of the semiconductor integrated circuit element. A probe card having a terminal, a holding substrate for holding the probe card, and a positioning means for restricting a relative position between the wafer tray and the probe card are provided, and the positioning means includes a plurality of positioning means provided on the wafer tray.
Number of engagement recesses and a plurality of engagements provided on the holding substrate
And a tip of each of the plurality of engaging members.
Since the parts are locked in the corresponding engaging recesses,
The probe card held on the holding substrate and the wafer
The hat tray is positioned, and the holding substrate and the front
A wafer cassette characterized by being integrated with a wafer tray. 2. A tip portion of each of the plurality of engaging members.
Is released from the corresponding engaging recess, the holding substrate
The wafer cassette according to claim 1, wherein the wafer tray is separated from the wafer tray. 3. The wafer tray and the probe card
Is provided between the wafer tray and the probe car.
With an annular seal member that forms a sealed space with the
Wafer cassette according to claim 1, characterized in that it comprises. 4. The circular seal member has a circular hollow portion.
The wafer cassette according to claim 3, which has . 5. The wafer tray is provided outside the sealed space.
It has an on-off valve that opens and closes a communication passage that communicates with the
The wafer cassette according to claim 3, wherein the wafer cassette is a wafer cassette.