WO2001004641A3 - Wafer level burn-in and electrical test system and method - Google Patents

Wafer level burn-in and electrical test system and method Download PDF

Info

Publication number
WO2001004641A3
WO2001004641A3 PCT/US2000/019482 US0019482W WO0104641A3 WO 2001004641 A3 WO2001004641 A3 WO 2001004641A3 US 0019482 W US0019482 W US 0019482W WO 0104641 A3 WO0104641 A3 WO 0104641A3
Authority
WO
WIPO (PCT)
Prior art keywords
pcb
probe
zone
rigid
cartridges
Prior art date
Application number
PCT/US2000/019482
Other languages
French (fr)
Other versions
WO2001004641A2 (en
Inventor
Donald Paul Ii Richmond
John Dinh Hoang
Jerzy Lobacz
Original Assignee
Aehr Test Systems Inc
Donald Paul Ii Richmond
John Dinh Hoang
Jerzy Lobacz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/353,121 external-priority patent/US6562636B1/en
Priority claimed from US09/353,214 external-priority patent/US6340895B1/en
Application filed by Aehr Test Systems Inc, Donald Paul Ii Richmond, John Dinh Hoang, Jerzy Lobacz filed Critical Aehr Test Systems Inc
Priority to AU73292/00A priority Critical patent/AU7329200A/en
Priority to JP2001510000A priority patent/JP2003504889A/en
Publication of WO2001004641A2 publication Critical patent/WO2001004641A2/en
Publication of WO2001004641A3 publication Critical patent/WO2001004641A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

A burn-in and electrical test system (20) includes a temperature controlled zone (22) and a cool zone (24) separated by a transition zone (25. The temperature controlled zone (22) is configured to receive a plurality of wafer cartridges (26) and connect the cartridges (26) to test electronics (28) and power electronics (30), which are mounted in the cool zone (24). Each of the wafer cartridges (26) contains a semiconductor wafer incorporating a plurality of integrated circuits. The test electronics (28) consists of a pattern generator PCB (100) and a signal driver and fault analysis PCB (102) connected together by a parallel bus (104). The pattern generator PCB (100) and the fault analysis PCB (102) are connected to a rigid signal probe PCB (104) in cartridge (26) to provide a straight through signal path. The probe PCB (104) is rigid in order to allow close control of capacitance between each signal line and a backplane, thus providing impedance controlled interconnections between a semiconductor wafer under test and the test electronics (28). The power distribution system (30) is connected to a probe power PCB (106) in the cartridge (26). The probe power PCB (106) has at least a bendable portion in order to allow it to be positioned closely adjacent to and parallel with the rigid probe PCB (104), yet extend a substantial distance away from the probe PCB (106) at its interconnection (109).
PCT/US2000/019482 1999-07-14 2000-07-13 Wafer level burn-in and electrical test system and method WO2001004641A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU73292/00A AU7329200A (en) 1999-07-14 2000-07-13 Wafer level burn-in and electrical test system and method
JP2001510000A JP2003504889A (en) 1999-07-14 2000-07-13 Wafer level burn-in and electrical test apparatus and method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/353,121 US6562636B1 (en) 1999-07-14 1999-07-14 Wafer level burn-in and electrical test system and method
US09/353,214 US6340895B1 (en) 1999-07-14 1999-07-14 Wafer-level burn-in and test cartridge
US09/353,214 1999-07-14
US09/353,121 1999-07-14

Publications (2)

Publication Number Publication Date
WO2001004641A2 WO2001004641A2 (en) 2001-01-18
WO2001004641A3 true WO2001004641A3 (en) 2001-12-06

Family

ID=26997804

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/019482 WO2001004641A2 (en) 1999-07-14 2000-07-13 Wafer level burn-in and electrical test system and method

Country Status (4)

Country Link
JP (1) JP2003504889A (en)
KR (1) KR100751068B1 (en)
AU (1) AU7329200A (en)
WO (1) WO2001004641A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6815966B1 (en) * 2002-06-27 2004-11-09 Aehr Test Systems System for burn-in testing of electronic devices
EP2273279A1 (en) 2005-04-27 2011-01-12 Aehr Test Systems, Inc. Apparatus for testing electronic devices
KR20060122387A (en) * 2005-05-27 2006-11-30 삼창기업 주식회사 Analog to digtal converter module
WO2008124068A1 (en) * 2007-04-05 2008-10-16 Aehr Test Systems Electronics tester with a signal distribution board and a wafer chuck having different coefficients of thermal expansion
CN101644741B (en) * 2008-08-04 2011-11-09 京元电子股份有限公司 Multi-layer pre-sintering plate structure with power towers
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
KR101215945B1 (en) 2012-07-27 2012-12-27 (주) 에이피 시스템 Smart power and distribution system, and apparatus for testing memory module including the same
TWI836645B (en) 2016-01-08 2024-03-21 美商艾爾測試系統 Tester apparatus and method of testing microelectronic device
CN115210589B (en) * 2020-03-25 2023-07-18 华为技术有限公司 Chip testing device and testing method
KR102386473B1 (en) * 2020-11-05 2022-04-13 광운대학교 산학협력단 Wafer-level test method and apparatus of RF beamforming IC

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5103168A (en) * 1988-10-27 1992-04-07 Grumman Aerospace Corporation Stress testing equipment with an integral cooling plenum
EP0579993A1 (en) * 1992-07-02 1994-01-26 Lsi Logic Corporation Testing and exercising individual, unsingulated dies on a wafer
US5385487A (en) * 1993-08-30 1995-01-31 At&T Corp. Apparatus for electrically operating devices in a controlled environment
US5429510A (en) * 1993-12-01 1995-07-04 Aehr Test Systems, Inc. High-density interconnect technique
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
US5654588A (en) * 1993-07-23 1997-08-05 Motorola Inc. Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure
US5701666A (en) * 1994-08-31 1997-12-30 Motorola, Inc. Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located on a product wafer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3151203B2 (en) * 1988-11-23 2001-04-03 テキサス インスツルメンツ インコーポレイテツド Integrated circuit self-inspection equipment
JP3194040B2 (en) * 1992-04-27 2001-07-30 カシオ計算機株式会社 IC module
JP2925964B2 (en) * 1994-04-21 1999-07-28 松下電器産業株式会社 Semiconductor wafer container and method of inspecting semiconductor integrated circuit
JPH10163281A (en) * 1996-10-04 1998-06-19 Hitachi Ltd Semiconductor element and its manufacture
JP3364134B2 (en) * 1997-10-20 2003-01-08 松下電器産業株式会社 Wafer cassette
JP3294175B2 (en) * 1997-11-05 2002-06-24 東京エレクトロン株式会社 Wafer storage room for reliability test

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5103168A (en) * 1988-10-27 1992-04-07 Grumman Aerospace Corporation Stress testing equipment with an integral cooling plenum
EP0579993A1 (en) * 1992-07-02 1994-01-26 Lsi Logic Corporation Testing and exercising individual, unsingulated dies on a wafer
US5654588A (en) * 1993-07-23 1997-08-05 Motorola Inc. Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure
US5385487A (en) * 1993-08-30 1995-01-31 At&T Corp. Apparatus for electrically operating devices in a controlled environment
US5429510A (en) * 1993-12-01 1995-07-04 Aehr Test Systems, Inc. High-density interconnect technique
US5701666A (en) * 1994-08-31 1997-12-30 Motorola, Inc. Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located on a product wafer
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in

Also Published As

Publication number Publication date
JP2003504889A (en) 2003-02-04
KR100751068B1 (en) 2007-08-22
WO2001004641A2 (en) 2001-01-18
AU7329200A (en) 2001-01-30
KR20020036835A (en) 2002-05-16

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