DE69842191D1 - Halbleiterscheibenhaltevorrichtung - Google Patents

Halbleiterscheibenhaltevorrichtung

Info

Publication number
DE69842191D1
DE69842191D1 DE69842191T DE69842191T DE69842191D1 DE 69842191 D1 DE69842191 D1 DE 69842191D1 DE 69842191 T DE69842191 T DE 69842191T DE 69842191 T DE69842191 T DE 69842191T DE 69842191 D1 DE69842191 D1 DE 69842191D1
Authority
DE
Germany
Prior art keywords
wafer holder
wafer
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69842191T
Other languages
English (en)
Inventor
Kunihiro Furuya
Toshihiro Yonezawa
Ken Inoue
Yoichi Nakagomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31891997A external-priority patent/JP3467548B2/ja
Priority claimed from JP31892297A external-priority patent/JP3294175B2/ja
Priority claimed from JP31891897A external-priority patent/JP3294174B2/ja
Priority claimed from JP31892097A external-priority patent/JP3400692B2/ja
Priority claimed from JP31892197A external-priority patent/JP3368461B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of DE69842191D1 publication Critical patent/DE69842191D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE69842191T 1997-11-05 1998-10-27 Halbleiterscheibenhaltevorrichtung Expired - Lifetime DE69842191D1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP31891997A JP3467548B2 (ja) 1997-11-05 1997-11-05 温度制御体の接合装置及びウエハ収納室
JP31892297A JP3294175B2 (ja) 1997-11-05 1997-11-05 信頼性試験用ウエハ収納室
JP31891897A JP3294174B2 (ja) 1997-11-05 1997-11-05 ウエハ保持体の温度測定装置及びウエハ収納室
JP31892097A JP3400692B2 (ja) 1997-11-05 1997-11-05 ウエハ温度制御装置及びウエハ収納室
JP31892197A JP3368461B2 (ja) 1997-11-05 1997-11-05 シェル

Publications (1)

Publication Number Publication Date
DE69842191D1 true DE69842191D1 (de) 2011-05-05

Family

ID=27531096

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69842191T Expired - Lifetime DE69842191D1 (de) 1997-11-05 1998-10-27 Halbleiterscheibenhaltevorrichtung

Country Status (5)

Country Link
US (1) US6084215A (de)
EP (1) EP0915499B1 (de)
KR (1) KR100342016B1 (de)
DE (1) DE69842191D1 (de)
TW (1) TW392274B (de)

Families Citing this family (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999048139A2 (en) * 1998-03-18 1999-09-23 Applied Materials, Inc. Apparatus for reducing heat loss
JP3282800B2 (ja) * 1998-05-20 2002-05-20 東京エレクトロン株式会社 アライナー
US6583638B2 (en) * 1999-01-26 2003-06-24 Trio-Tech International Temperature-controlled semiconductor wafer chuck system
JP2001007165A (ja) * 1999-06-21 2001-01-12 Mitsubishi Electric Corp プローブカード装置
US6214121B1 (en) * 1999-07-07 2001-04-10 Applied Materials, Inc. Pedestal with a thermally controlled platen
US6562636B1 (en) 1999-07-14 2003-05-13 Aehr Test Systems Wafer level burn-in and electrical test system and method
AU6747300A (en) * 1999-07-14 2001-01-30 Aehr Test Systems Inc. Wafer-level burn-in and test cartridge and methods
US6580283B1 (en) * 1999-07-14 2003-06-17 Aehr Test Systems Wafer level burn-in and test methods
US6340895B1 (en) 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
EP1199908A4 (de) * 1999-10-22 2003-01-22 Ibiden Co Ltd Keramisches heizelement
US6481886B1 (en) * 2000-02-24 2002-11-19 Applied Materials Inc. Apparatus for measuring pedestal and substrate temperature in a semiconductor wafer processing system
US6650135B1 (en) * 2000-06-29 2003-11-18 Motorola, Inc. Measurement chuck having piezoelectric elements and method
US6353210B1 (en) * 2000-04-11 2002-03-05 Applied Materials Inc. Correction of wafer temperature drift in a plasma reactor based upon continuous wafer temperature measurements using and in-situ wafer temperature optical probe
US6717115B1 (en) * 2000-04-25 2004-04-06 Teradyne, Inc. Semiconductor handler for rapid testing
US6677557B2 (en) * 2000-05-02 2004-01-13 Ibiden Co., Ltd. Ceramic heater
JP2002043381A (ja) * 2000-07-19 2002-02-08 Tokyo Electron Ltd ウエハ温度制御装置
US6541989B1 (en) * 2000-09-29 2003-04-01 Motorola, Inc. Testing device for semiconductor components and a method of using the device
US6441606B1 (en) 2000-10-17 2002-08-27 Micron Technology, Inc. Dual zone wafer test apparatus
US7080940B2 (en) * 2001-04-20 2006-07-25 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
US6572265B1 (en) * 2001-04-20 2003-06-03 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
WO2002089531A1 (en) * 2001-04-30 2002-11-07 Lam Research, Corporation Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
US20050211385A1 (en) 2001-04-30 2005-09-29 Lam Research Corporation, A Delaware Corporation Method and apparatus for controlling spatial temperature distribution
US6847014B1 (en) * 2001-04-30 2005-01-25 Lam Research Corporation Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
US20030016727A1 (en) * 2001-06-29 2003-01-23 Tokyo Electron Limited Method of and apparatus for measuring and controlling substrate holder temperature using ultrasonic tomography
US7334826B2 (en) * 2001-07-13 2008-02-26 Semitool, Inc. End-effectors for handling microelectronic wafers
US7281741B2 (en) * 2001-07-13 2007-10-16 Semitool, Inc. End-effectors for handling microelectronic workpieces
JP3639546B2 (ja) * 2001-07-25 2005-04-20 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP4173306B2 (ja) * 2001-11-30 2008-10-29 東京エレクトロン株式会社 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法
US6847218B1 (en) * 2002-05-13 2005-01-25 Cypress Semiconductor Corporation Probe card with an adapter layer for testing integrated circuits
US20070014656A1 (en) * 2002-07-11 2007-01-18 Harris Randy A End-effectors and associated control and guidance systems and methods
US20060043750A1 (en) * 2004-07-09 2006-03-02 Paul Wirth End-effectors for handling microfeature workpieces
US6976822B2 (en) * 2002-07-16 2005-12-20 Semitool, Inc. End-effectors and transfer devices for handling microelectronic workpieces
US7100389B1 (en) 2002-07-16 2006-09-05 Delta Design, Inc. Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
US6759865B1 (en) 2002-07-30 2004-07-06 Cypress Semiconductor Corporation Array of dice for testing integrated circuits
US6838646B2 (en) * 2002-08-22 2005-01-04 Sumitomo Osaka Cement Co., Ltd. Susceptor device
US6695886B1 (en) * 2002-08-22 2004-02-24 Axcelis Technologies, Inc. Optical path improvement, focus length change compensation, and stray light reduction for temperature measurement system of RTP tool
JP3671951B2 (ja) * 2002-10-08 2005-07-13 住友電気工業株式会社 測温装置及びそれを用いたセラミックスヒータ
US6907742B2 (en) * 2002-12-19 2005-06-21 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for controlling wafer temperature
US6770852B1 (en) 2003-02-27 2004-08-03 Lam Research Corporation Critical dimension variation compensation across a wafer by means of local wafer temperature control
US6975028B1 (en) 2003-03-19 2005-12-13 Delta Design, Inc. Thermal apparatus for engaging electronic device
US7230204B2 (en) * 2003-03-28 2007-06-12 Tokyo Electron Limited Method and system for temperature control of a substrate
KR20060038925A (ko) * 2003-05-07 2006-05-04 액셀리스 테크놀러지스, 인크. 광역온도범위의 척 시스템
KR100536610B1 (ko) * 2003-08-29 2005-12-14 삼성전자주식회사 프로브 스테이션 교정 도구
US7355428B2 (en) * 2004-01-14 2008-04-08 Delta Design, Inc. Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing
US20050189342A1 (en) * 2004-02-23 2005-09-01 Samer Kabbani Miniature fluid-cooled heat sink with integral heater
US7394271B2 (en) * 2004-02-27 2008-07-01 Wells-Cti, Llc Temperature sensing and prediction in IC sockets
KR20070006768A (ko) * 2004-03-17 2007-01-11 코레플로우 사이언티픽 솔루션스 리미티드 비접촉 열 플랫폼
US7332921B2 (en) * 2004-03-26 2008-02-19 Cypress Semiconductor Corporation Probe card and method for constructing same
US20070020080A1 (en) * 2004-07-09 2007-01-25 Paul Wirth Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine
DE102004055449B4 (de) * 2004-11-17 2008-10-23 Steag Hamatech Ag Verfahren und Vorrichtung zum thermischen Behandeln von Substraten
US7731798B2 (en) * 2004-12-01 2010-06-08 Ultratech, Inc. Heated chuck for laser thermal processing
US7330038B2 (en) * 2004-12-14 2008-02-12 Silicon Light Machines Corporation Interleaved MEMS-based probes for testing integrated circuits
US7577493B2 (en) * 2004-12-27 2009-08-18 Hitachi Kokusai Electric Inc. Temperature regulating method, thermal processing system and semiconductor device manufacturing method
US8038796B2 (en) 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
JP4356661B2 (ja) * 2005-07-25 2009-11-04 住友電気工業株式会社 ウェハ保持体およびそれを搭載したウェハプローバ
JP2007042911A (ja) * 2005-08-04 2007-02-15 Sumitomo Electric Ind Ltd ウェハ保持体およびそれを搭載したウェハプローバ
JP4667158B2 (ja) * 2005-08-09 2011-04-06 パナソニック株式会社 ウェーハレベルバーンイン方法
JP3972944B2 (ja) * 2005-09-12 2007-09-05 住友電気工業株式会社 セラミックスヒータ及びそれを備えた半導体製造装置
US7755742B2 (en) * 2005-10-11 2010-07-13 Asml Netherlands B.V. Lithographic apparatus with mounted sensor
CN100361288C (zh) * 2005-12-07 2008-01-09 北京北方微电子基地设备工艺研究中心有限责任公司 控制静电卡盘温度系统
US7906982B1 (en) 2006-02-28 2011-03-15 Cypress Semiconductor Corporation Interface apparatus and methods of testing integrated circuits using the same
US8573836B2 (en) * 2006-10-26 2013-11-05 Tokyo Electron Limited Apparatus and method for evaluating a substrate mounting device
US20080160462A1 (en) * 2007-01-03 2008-07-03 Sokudo Co., Ltd. Method and system for bake plate heat transfer control in track lithography tools
JP4564973B2 (ja) 2007-01-26 2010-10-20 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP5379685B2 (ja) * 2007-06-29 2013-12-25 株式会社アドバンテスト 試験装置
US7651269B2 (en) * 2007-07-19 2010-01-26 Lam Research Corporation Temperature probes having a thermally isolated tip
US7500781B1 (en) * 2007-10-25 2009-03-10 Sokudo Co., Ltd. Method and apparatus for detecting substrate temperature in a track lithography tool
JP4457180B1 (ja) * 2009-08-07 2010-04-28 株式会社アドバンテスト ウエハトレイおよび試験装置
US9176186B2 (en) * 2009-08-25 2015-11-03 Translarity, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed
NL2008751A (en) 2011-06-06 2012-12-10 Asml Netherlands Bv Temperature sensing probe, burl plate, lithographic apparatus and method.
US9759772B2 (en) 2011-10-28 2017-09-12 Teradyne, Inc. Programmable test instrument
US10776233B2 (en) 2011-10-28 2020-09-15 Teradyne, Inc. Programmable test instrument
CN103208440B (zh) * 2012-01-17 2016-01-20 中国科学院微电子研究所 腔室加热装置
JP6246685B2 (ja) * 2014-09-12 2017-12-13 株式会社東芝 静電チャック機構、基板処理方法及び半導体基板処理装置
KR102219361B1 (ko) * 2016-03-28 2021-02-23 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 온도 측정 유닛 및 반도체 장치의 제조 방법
EP3465238A4 (de) 2016-06-02 2020-01-22 KES Systems, Inc. System und verfahren für burn-in-test eines halbleiters
US10393592B2 (en) * 2016-12-21 2019-08-27 Intel Corporation Systems and methods for measuring surface temperature
JP6839556B2 (ja) * 2017-02-08 2021-03-10 リンナイ株式会社 熱交換器
KR102222455B1 (ko) * 2018-01-15 2021-03-04 세메스 주식회사 기판 처리 장치
JP7154160B2 (ja) * 2019-03-18 2022-10-17 東京エレクトロン株式会社 温度測定機構、温度測定方法、およびステージ装置
CN112735966A (zh) * 2020-12-25 2021-04-30 广州粤芯半导体技术有限公司 腔室温度监测方法
US12007414B2 (en) * 2021-02-01 2024-06-11 Mitsubishi Electric Corporation Semiconductor test apparatus and semiconductor test method
CN112946010B (zh) * 2021-02-07 2021-12-28 宏茂科技(珠海)有限公司 一种用于半导体纳米材料热性能测试装置
US20230052496A1 (en) * 2021-08-10 2023-02-16 Kla Corporation Spring mechanism for self-lock and centering during loading
CN117214676B (zh) * 2023-11-09 2024-01-23 成都梓峡信息技术有限公司 一种fpga老炼测试系统

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4147571A (en) * 1977-07-11 1979-04-03 Hewlett-Packard Company Method for vapor epitaxial deposition of III/V materials utilizing organometallic compounds and a halogen or halide in a hot wall system
GB2069299B (en) * 1980-01-30 1983-06-22 Riccar Co Ltd Induction heating apparatus
US4551192A (en) * 1983-06-30 1985-11-05 International Business Machines Corporation Electrostatic or vacuum pinchuck formed with microcircuit lithography
US4609037A (en) * 1985-10-09 1986-09-02 Tencor Instruments Apparatus for heating and cooling articles
US4788416A (en) * 1987-03-02 1988-11-29 Spectrum Cvd, Inc. Direct wafer temperature control
US4955590A (en) * 1988-12-08 1990-09-11 Tokyo Electron Limited Plate-like member receiving apparatus
US5198752A (en) * 1987-09-02 1993-03-30 Tokyo Electron Limited Electric probing-test machine having a cooling system
US4944860A (en) * 1988-11-04 1990-07-31 Eaton Corporation Platen assembly for a vacuum processing system
DE69111493T2 (de) * 1990-03-12 1996-03-21 Ngk Insulators Ltd Wafer-Heizgeräte für Apparate, zur Halbleiterherstellung Heizanlage mit diesen Heizgeräten und Herstellung von Heizgeräten.
GB9010833D0 (en) * 1990-05-15 1990-07-04 Electrotech Research Limited Workpiece support
US5238499A (en) * 1990-07-16 1993-08-24 Novellus Systems, Inc. Gas-based substrate protection during processing
JP2892787B2 (ja) * 1990-07-20 1999-05-17 東京エレクトロン株式会社 電気信号の抽出方法
DE69118315T2 (de) * 1990-11-01 1996-08-14 Canon Kk Waferhaltebefestigung für Belichtungsgerät
US5378971A (en) * 1990-11-30 1995-01-03 Tokyo Electron Limited Probe and a method of manufacturing the same
JP3014770B2 (ja) * 1990-12-20 2000-02-28 富士通株式会社 半導体製造装置
JPH04364746A (ja) * 1991-06-12 1992-12-17 Tokyo Electron Yamanashi Kk プローブ装置
US5294778A (en) * 1991-09-11 1994-03-15 Lam Research Corporation CVD platen heater system utilizing concentric electric heating elements
KR100248571B1 (ko) * 1992-08-31 2000-03-15 히가시 데쓰로 프로우브 장치
JP3049981B2 (ja) * 1992-12-04 2000-06-05 株式会社村田製作所 チップ部品の電極形成システム
US5665167A (en) * 1993-02-16 1997-09-09 Tokyo Electron Kabushiki Kaisha Plasma treatment apparatus having a workpiece-side electrode grounding circuit
US5366002A (en) * 1993-05-05 1994-11-22 Applied Materials, Inc. Apparatus and method to ensure heat transfer to and from an entire substrate during semiconductor processing
US5656945A (en) * 1993-05-12 1997-08-12 Tribotech Apparatus for testing a nonpackaged die
US5329097A (en) * 1993-05-19 1994-07-12 The United States Of America As Represented By The Secretary Of The Navy Compact substrate heater for use in an oxidizing atmosphere
US5511799A (en) * 1993-06-07 1996-04-30 Applied Materials, Inc. Sealing device useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential
US5591269A (en) * 1993-06-24 1997-01-07 Tokyo Electron Limited Vacuum processing apparatus
US5570032A (en) * 1993-08-17 1996-10-29 Micron Technology, Inc. Wafer scale burn-in apparatus and process
JPH07161788A (ja) * 1993-12-03 1995-06-23 Tokyo Electron Ltd バーンイン用コンタクタ及びプローブカード
KR0140034B1 (ko) * 1993-12-16 1998-07-15 모리시다 요이치 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법
JP2828410B2 (ja) * 1993-12-21 1998-11-25 松下電器産業株式会社 プローブカード及び半導体チップの検査方法
JP2925964B2 (ja) * 1994-04-21 1999-07-28 松下電器産業株式会社 半導体ウェハ収納器及び半導体集積回路の検査方法
US5730801A (en) * 1994-08-23 1998-03-24 Applied Materials, Inc. Compartnetalized substrate processing chamber
JP2830757B2 (ja) * 1994-12-01 1998-12-02 日本電気株式会社 シリコン・テスタの測定治具
JPH08340030A (ja) * 1995-04-13 1996-12-24 Tokyo Electron Ltd バーンイン装置およびバーンイン用ウエハトレイ
US6104203A (en) * 1995-05-16 2000-08-15 Trio-Tech International Test apparatus for electronic components
JPH09145485A (ja) * 1995-11-28 1997-06-06 Kokusai Electric Co Ltd 温度検出装置
US5885353A (en) * 1996-06-21 1999-03-23 Micron Technology, Inc. Thermal conditioning apparatus
US5811762A (en) * 1996-09-25 1998-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Heater assembly with dual temperature control for use in PVD/CVD system
US5756157A (en) * 1996-10-02 1998-05-26 Silicon Valley Group Method for processing flat panel displays and large wafers
EP0837333A3 (de) * 1996-10-18 1999-06-09 Tokyo Electron Limited Gerät zur Ausrichtung eines Wafers mit einem Prüfkontaktfeld
JPH10256325A (ja) * 1997-03-07 1998-09-25 Orion Mach Co Ltd 半導体ウェーハの試験装置用温度調節プレート
US5844208A (en) * 1997-04-04 1998-12-01 Unisys Corporation Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature

Also Published As

Publication number Publication date
US6084215A (en) 2000-07-04
TW392274B (en) 2000-06-01
KR100342016B1 (ko) 2002-09-18
KR19990045000A (ko) 1999-06-25
EP0915499A2 (de) 1999-05-12
EP0915499A3 (de) 2004-06-02
EP0915499B1 (de) 2011-03-23

Similar Documents

Publication Publication Date Title
DE69842191D1 (de) Halbleiterscheibenhaltevorrichtung
DE59813814D1 (de) Haltevorrichtung
DE69806578T2 (de) Waferhaltevorrichtung
DE10082995T1 (de) Wafer-Haltevorrichtung
DE69500752D1 (de) Wafer Träger
DE69841511D1 (de) Halbleiter
DE69724663D1 (de) Abstandshalter
DE59813852D1 (de) Haltevorrichtung
FR2760345B1 (fr) Porte-bouteille
DE59813815D1 (de) Haltevorrichtung
DE69800037D1 (de) Spannfutter
DE69809439D1 (de) Werkzeughalter
DE69841156D1 (de) Halbleiter
DE69821621D1 (de) Bürstenhalter
DE69736302D1 (de) Bürstenhalter
DE59810297D1 (de) Brausehalter
DE19782032T1 (de) Konzepthalter
DK0999921T3 (da) Spændepatron
KR950031497U (ko) 웨이퍼 홀더
KR960025264U (ko) 웨이퍼 홀더
KR950034371U (ko) 웨이퍼 홀더
KR950028699U (ko) 웨이퍼 홀더
SE9704327D0 (sv) Sågsvärdhållare
KR960025434U (ko) 웨이퍼 캐리어
NL1007832A1 (nl) Houder.