DE69841511D1 - Halbleiter - Google Patents

Halbleiter

Info

Publication number
DE69841511D1
DE69841511D1 DE69841511T DE69841511T DE69841511D1 DE 69841511 D1 DE69841511 D1 DE 69841511D1 DE 69841511 T DE69841511 T DE 69841511T DE 69841511 T DE69841511 T DE 69841511T DE 69841511 D1 DE69841511 D1 DE 69841511D1
Authority
DE
Germany
Prior art keywords
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69841511T
Other languages
English (en)
Inventor
Hanae Shimokawa
Tasao Soga
Hiroaki Okudaira
Toshiharu Ishida
Tetsuya Nakatsuka
Yoshiharu Inaba
Asao Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Application granted granted Critical
Publication of DE69841511D1 publication Critical patent/DE69841511D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/004—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a metal of the iron group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
DE69841511T 1997-12-16 1998-12-09 Halbleiter Expired - Lifetime DE69841511D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34681197A JP3622462B2 (ja) 1997-12-16 1997-12-16 半導体装置

Publications (1)

Publication Number Publication Date
DE69841511D1 true DE69841511D1 (de) 2010-04-01

Family

ID=18385972

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69837224T Expired - Lifetime DE69837224T2 (de) 1997-12-16 1998-12-09 Mit bleifreiem Lötmittel verbundene elektronische Vorrichtung
DE69841511T Expired - Lifetime DE69841511D1 (de) 1997-12-16 1998-12-09 Halbleiter
DE69836230T Expired - Lifetime DE69836230T2 (de) 1997-12-16 1998-12-09 Mit einem bleifreien lötmittel verbundene struktur und elektronische vorrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69837224T Expired - Lifetime DE69837224T2 (de) 1997-12-16 1998-12-09 Mit bleifreiem Lötmittel verbundene elektronische Vorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69836230T Expired - Lifetime DE69836230T2 (de) 1997-12-16 1998-12-09 Mit einem bleifreien lötmittel verbundene struktur und elektronische vorrichtung

Country Status (11)

Country Link
US (5) US7013564B2 (de)
EP (4) EP1275463B1 (de)
JP (1) JP3622462B2 (de)
KR (3) KR100681361B1 (de)
CN (4) CN101604668B (de)
AU (1) AU1504699A (de)
CA (1) CA2314116C (de)
DE (3) DE69837224T2 (de)
MY (1) MY130764A (de)
TW (1) TW408468B (de)
WO (1) WO1999030866A1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3622462B2 (ja) 1997-12-16 2005-02-23 株式会社日立製作所 半導体装置
MY133357A (en) 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
JP4502430B2 (ja) * 1999-10-07 2010-07-14 ディップソール株式会社 はんだ濡れ性向上処理剤、及び錫及び錫合金のはんだ濡れ性の向上方法
JP2001230360A (ja) * 2000-02-18 2001-08-24 Hitachi Ltd 半導体集積回路装置およびその製造方法
WO2001078931A1 (fr) * 2000-04-17 2001-10-25 Fujitsu Limited Assemblage par brasure
JP2002299540A (ja) 2001-04-04 2002-10-11 Hitachi Ltd 半導体装置およびその製造方法
KR100431090B1 (ko) * 2001-06-20 2004-05-12 정재필 저융점 도금층을 이용한 무연솔더
JP4073183B2 (ja) 2001-08-01 2008-04-09 株式会社日立製作所 Ｐｂフリーはんだを用いた混載実装方法及び実装品
KR100400606B1 (ko) * 2001-09-08 2003-10-08 정재필 저융점 무연솔더 도금층을 이용한 2중 프리코팅 기판 및그 제조방법
JP4447215B2 (ja) * 2002-12-16 2010-04-07 Ｎｅｃエレクトロニクス株式会社 電子部品
JP2004200249A (ja) * 2002-12-16 2004-07-15 Nec Electronics Corp 電子部品及びその製造方法並びに製造装置
US20050067699A1 (en) * 2003-09-29 2005-03-31 Intel Corporation Diffusion barrier layer for lead free package substrate
KR20060030356A (ko) * 2004-10-05 2006-04-10 삼성테크윈 주식회사 반도체 리이드 프레임과, 이를 포함하는 반도체 패키지와,이를 도금하는 방법
WO2007023284A1 (en) * 2005-08-24 2007-03-01 Fry's Metals Inc. Reducing joint embrittlement in lead-free soldering processes
JP4275656B2 (ja) * 2005-09-02 2009-06-10 住友金属工業株式会社 鋼管用ねじ継手
JP4799997B2 (ja) * 2005-10-25 2011-10-26 富士通株式会社 電子機器用プリント板の製造方法およびこれを用いた電子機器
KR100743190B1 (ko) 2005-12-26 2007-07-27 재단법인 포항산업과학연구원 저융점 무연 솔더 및 그의 제조 방법
CN101801588B (zh) * 2007-07-13 2015-03-25 千住金属工业株式会社 车载安装用无铅焊料以及车载电路
US8168890B2 (en) * 2008-01-15 2012-05-01 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and component package having the same
CN101491866B (zh) * 2008-01-25 2014-06-04 深圳市亿铖达工业有限公司 低温无铅焊锡膏
CN101960932B (zh) * 2008-02-29 2013-02-13 住友电木株式会社 焊料连接的方法、电子器件及其制造方法
CN102066043B (zh) * 2008-04-23 2014-05-07 千住金属工业株式会社 抑制缩孔的无铅焊料合金
US7929314B2 (en) * 2008-06-20 2011-04-19 International Business Machines Corporation Method and apparatus of changing PCB pad structure to increase solder volume and strength
EP2340559A1 (de) * 2008-09-16 2011-07-06 Agere Systems, Inc. Pb-freie lothügel mit verbesserten mechanischen eigenschaften
DE102009054068A1 (de) * 2009-11-20 2011-05-26 Epcos Ag Lotmaterial zur Befestigung einer Außenelektrode bei einem piezoelektrischen Bauelement und piezoelektrisches Bauelement mit einem Lotmaterial
US8534136B2 (en) 2010-03-31 2013-09-17 Flextronics Ap, Llc. Pin soldering for printed circuit board failure testing
CN101862925A (zh) * 2010-05-17 2010-10-20 天津大学 锡铋银系无铅焊料及制备方法
CN102275043A (zh) * 2010-06-10 2011-12-14 中国科学院金属研究所 一种消除SnBi焊料与铜基底连接界面脆性的方法
US8361899B2 (en) * 2010-12-16 2013-01-29 Monolithic Power Systems, Inc. Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
US9964563B1 (en) 2014-07-18 2018-05-08 Flextronics Ap, Llc Method and apparatus for ICT fixture probe cleaning
DE102014220802A1 (de) 2014-10-14 2016-04-14 Robert Bosch Gmbh Elektronisches Bauelement mit einem Anschlusselement
JP6648468B2 (ja) * 2014-10-29 2020-02-14 Tdk株式会社 Ｐｂフリーはんだ及び電子部品内蔵モジュール
JP6777365B2 (ja) * 2016-12-09 2020-10-28 大口マテリアル株式会社 リードフレーム
KR101982555B1 (ko) * 2018-11-27 2019-05-27 제엠제코(주) 복합 클립 구조체 및 이를 이용한 반도체 패키지
CN109590633A (zh) * 2019-01-01 2019-04-09 王伟 用于集成电路封装的引线焊接钎料及其制备方法和应用
JP7213390B1 (ja) * 2022-10-24 2023-01-26 松田産業株式会社 銀めっき皮膜及び該銀めっき皮膜を備えた電気接点

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607253A (en) * 1969-12-24 1971-09-21 Ibm Tin base solder alloy
DE2356351C3 (de) * 1973-11-12 1980-07-03 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen eines feuerverzinnten Drahtes für elektrotechnische Zwecke
JPS63102247A (ja) 1986-10-17 1988-05-07 Hitachi Cable Ltd 樹脂封止型半導体装置
US4793770A (en) * 1987-08-06 1988-12-27 General Electric Company Gas turbine engine frame assembly
US5039576A (en) 1989-05-22 1991-08-13 Atochem North America, Inc. Electrodeposited eutectic tin-bismuth alloy on a conductive substrate
GB9103073D0 (en) * 1991-02-13 1991-03-27 Astromed Ltd Improvements in or relating to electrophoresis
JP2637863B2 (ja) * 1991-07-02 1997-08-06 九州日本電気株式会社 半導体装置
US5320272A (en) 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
US5540378A (en) * 1993-09-27 1996-07-30 Olin Corporation Method for the assembly of an electronic package
JPH07229981A (ja) * 1993-12-21 1995-08-29 Toshiba Corp 電子式タイムスイッチ
JPH07211165A (ja) * 1994-01-25 1995-08-11 Kansei Corp ハーネスとその製造方法
JP3224185B2 (ja) 1994-09-29 2001-10-29 富士通株式会社 はんだ合金及びはんだ粉末及びはんだペースト及びプリント配線板及び電子部品及びはんだ付け方法及びはんだ付け装置
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
JP3232963B2 (ja) 1994-10-11 2001-11-26 株式会社日立製作所 有機基板接続用鉛レスはんだ及びそれを用いた実装品
JPH08132277A (ja) * 1994-11-01 1996-05-28 Ishikawa Kinzoku Kk 無鉛はんだ
US5569433A (en) * 1994-11-08 1996-10-29 Lucent Technologies Inc. Lead-free low melting solder with improved mechanical properties
DE4443459C2 (de) 1994-12-07 1996-11-21 Wieland Werke Ag Bleifreies Weichlot und seine Verwendung
JPH08296050A (ja) 1995-04-27 1996-11-12 Ishihara Chem Co Ltd ホイスカー防止用スズメッキ浴、及びスズメッキのホイスカー防止方法
KR970000021A (ko) * 1995-06-09 1997-01-21 소호연 동물 훈련기의 벨트 구조
EP0834376A4 (de) * 1995-06-20 2003-01-22 Matsushita Electric Ind Co Ltd Lot, gelötetes elektronisches teil und elektronische leiterplatte
CN1040302C (zh) * 1995-06-30 1998-10-21 三星电机株式会社 供电子部件中接线用的无铅焊料
JP2942476B2 (ja) * 1995-07-26 1999-08-30 協和電線株式会社 多層メッキのリード線とリードフレーム
JP3181015B2 (ja) * 1995-08-11 2001-07-03 京セラ株式会社 半導体素子収納用パッケージ
JP3481020B2 (ja) 1995-09-07 2003-12-22 ディップソール株式会社 Ｓｎ−Ｂｉ系合金めっき浴
JP3299091B2 (ja) 1995-09-29 2002-07-08 千住金属工業株式会社 鉛フリーはんだ合金
US6224690B1 (en) * 1995-12-22 2001-05-01 International Business Machines Corporation Flip-Chip interconnections using lead-free solders
JPH09266373A (ja) 1996-01-25 1997-10-07 Fujitsu Ltd 電子部品及びその接合方法、並びに回路基板
US5851482A (en) * 1996-03-22 1998-12-22 Korea Institute Of Machinery & Metals Tin-bismuth based lead-free solder for copper and copper alloys
JPH09266372A (ja) * 1996-03-29 1997-10-07 Aiphone Co Ltd クリームハンダ印刷劣化検出方法
JPH1041621A (ja) * 1996-07-18 1998-02-13 Fujitsu Ltd 錫−ビスマスはんだの接合方法
JPH1093004A (ja) 1996-09-11 1998-04-10 Matsushita Electron Corp 電子部品およびその製造方法
JP3226213B2 (ja) * 1996-10-17 2001-11-05 松下電器産業株式会社 半田材料及びそれを用いた電子部品
US6110608A (en) 1996-12-10 2000-08-29 The Furukawa Electric Co., Ltd. Lead material for electronic part, lead and semiconductor device using the same
US5985212A (en) * 1996-12-12 1999-11-16 H-Technologies Group, Incorporated High strength lead-free solder materials
JP3243195B2 (ja) 1997-01-28 2002-01-07 古河電気工業株式会社 リフロー半田めっき材およびその製造方法
JP3622462B2 (ja) 1997-12-16 2005-02-23 株式会社日立製作所 半導体装置
JPH11251503A (ja) 1998-03-04 1999-09-17 Matsushita Electron Corp 電子部品およびその製造方法
JPH11330340A (ja) 1998-05-21 1999-11-30 Hitachi Ltd 半導体装置およびその実装構造体
JPH11354705A (ja) * 1998-06-04 1999-12-24 Toshiba Corp 半導体装置及び半導体装置の製造方法
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
JP3492554B2 (ja) * 1999-05-07 2004-02-03 ニシハラ理工株式会社 Ｐｂに代わる接合材料の機能合金メッキ及びその機能合金メッキを施した被実装用電子部品材料
US6512304B2 (en) * 2000-04-26 2003-01-28 International Rectifier Corporation Nickel-iron expansion contact for semiconductor die
AU2003228106A1 (en) * 2002-05-24 2003-12-12 Nippon Shokubai Co., Ltd. Fire retardant resin composition, method of its production, shaped articles comprising the same, and silica

Also Published As

Publication number Publication date
EP1048392B1 (de) 2006-10-18
US20060115994A1 (en) 2006-06-01
US7709746B2 (en) 2010-05-04
DE69837224T2 (de) 2007-11-15
KR100716094B1 (ko) 2007-05-09
JPH11179586A (ja) 1999-07-06
US20100214753A1 (en) 2010-08-26
CN1282286A (zh) 2001-01-31
EP1048392A4 (de) 2002-04-17
CN1142843C (zh) 2004-03-24
US8907475B2 (en) 2014-12-09
EP2140963B1 (de) 2013-12-04
CN1897789B (zh) 2011-05-18
CN1298051C (zh) 2007-01-31
CN101604668A (zh) 2009-12-16
US8503189B2 (en) 2013-08-06
MY130764A (en) 2007-07-31
DE69837224D1 (de) 2007-04-12
EP1681131B1 (de) 2010-02-17
DE69836230T2 (de) 2007-08-23
EP1681131A1 (de) 2006-07-19
US20130286621A1 (en) 2013-10-31
EP2140963A1 (de) 2010-01-06
TW408468B (en) 2000-10-11
KR20010033137A (ko) 2001-04-25
EP1275463A2 (de) 2003-01-15
CN1505137A (zh) 2004-06-16
CN101604668B (zh) 2011-11-30
EP1275463B1 (de) 2007-02-28
EP1275463A3 (de) 2003-02-12
KR20060122984A (ko) 2006-11-30
US20020019077A1 (en) 2002-02-14
WO1999030866A1 (en) 1999-06-24
KR100693983B1 (ko) 2007-03-14
AU1504699A (en) 1999-07-05
CA2314116C (en) 2006-08-01
CN1897789A (zh) 2007-01-17
CA2314116A1 (en) 1999-06-24
US7013564B2 (en) 2006-03-21
DE69836230D1 (de) 2006-11-30
KR20040020911A (ko) 2004-03-09
JP3622462B2 (ja) 2005-02-23
US20020163085A1 (en) 2002-11-07
EP1048392A1 (de) 2000-11-02
US6960396B2 (en) 2005-11-01
KR100681361B1 (ko) 2007-02-12

Similar Documents

Publication Publication Date Title
DE69841511D1 (de) Halbleiter
IT1294293B1 (it) Dissipatore di calore
DE69822280D1 (de) Halbleiterspeicher
DE19823069B8 (de) Halbleiterbauelement
DE69820040D1 (de) Halbleiter-speicher-bauteile
ID22500A (id) Turunan sulfonamida
ID24430A (id) Turunan-turunan benzamidina
DE19810476B4 (de) Laryngomaske
ATA93198A (de) Fluoxetinpellets
NO995325D0 (no) Skjaereverktöysammenstilling
NO993048D0 (no) Halvlederelement
DE69801974D1 (de) Halbleiterlaser
DE69940029D1 (de) Halbleiterbauelement
DE69834540D1 (de) Halbleiterspeicher
DE69737320D1 (de) Halbleitervorrichtung
NO20001494L (no) Overligger
DE69841446D1 (de) Halbleiterspeicher
BR9801805A (pt) Dioxacicloalcan-8-ona
DE69841156D1 (de) Halbleiter
DE69822710D1 (de) Kühlkörperbefestigung
ATE236897T1 (de) 3-benzylpiperidine
DE69816499D1 (de) Kodemultiplexnachrichtenübertragungssystem
ATA112597A (de) Snowboard - bindung
NL1009352A1 (nl) Halfgeleiderscomponent.
DE59814348D1 (de) Halbleiterdiode

Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: RENESAS ELECTRONICS CORP., KAWASAKI-SHI, KANAG, JP

8364 No opposition during term of opposition