DE69822710D1 - Kühlkörperbefestigung - Google Patents

Kühlkörperbefestigung

Info

Publication number
DE69822710D1
DE69822710D1 DE69822710T DE69822710T DE69822710D1 DE 69822710 D1 DE69822710 D1 DE 69822710D1 DE 69822710 T DE69822710 T DE 69822710T DE 69822710 T DE69822710 T DE 69822710T DE 69822710 D1 DE69822710 D1 DE 69822710D1
Authority
DE
Germany
Prior art keywords
heatsink attachment
heatsink
attachment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69822710T
Other languages
English (en)
Other versions
DE69822710T2 (de
Inventor
Cornu Herbert E Le
Ronald Barnes
Nagaraj P Mitty
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Application granted granted Critical
Publication of DE69822710D1 publication Critical patent/DE69822710D1/de
Publication of DE69822710T2 publication Critical patent/DE69822710T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69822710T 1997-06-27 1998-06-25 Kühlkörperbefestigung Expired - Fee Related DE69822710T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US883849 1992-05-14
US08/883,849 US6134112A (en) 1997-06-27 1997-06-27 Heat sink attachment

Publications (2)

Publication Number Publication Date
DE69822710D1 true DE69822710D1 (de) 2004-05-06
DE69822710T2 DE69822710T2 (de) 2005-02-10

Family

ID=25383458

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69822710T Expired - Fee Related DE69822710T2 (de) 1997-06-27 1998-06-25 Kühlkörperbefestigung

Country Status (3)

Country Link
US (1) US6134112A (de)
EP (1) EP0888039B1 (de)
DE (1) DE69822710T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6700782B1 (en) * 2002-11-27 2004-03-02 Intel Corporation Apparatus and method to retain an electronic component in a precise position during assembly manufacturing
TW556475B (en) * 2003-02-19 2003-10-01 Accton Technology Corp A cover apparatus for dissipating heat and shielding electromagnetic interference
US7323358B1 (en) * 2003-08-13 2008-01-29 Hewlett-Packard Development Company, L.P. Method and system for sizing a load plate
US7502229B2 (en) 2004-10-15 2009-03-10 Alcatel Lucent Heat dissipation system for multiple integrated circuits mounted on a printed circuit board
US7388747B2 (en) * 2006-04-07 2008-06-17 Inventec Corporation Heat plate fixing structure
US7447035B2 (en) * 2006-12-01 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device assembly
US7589972B2 (en) * 2007-05-26 2009-09-15 Hon Hai Precision Ind. Co., Ltd. Electrical connector with clip mechanism
CN201263285Y (zh) * 2008-07-21 2009-06-24 鸿富锦精密工业（深圳）有限公司 电子元件散热组合
WO2017086974A1 (en) 2015-11-19 2017-05-26 Halliburton Energy Services, Inc. Thermal management system for downhole tools

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4351580A (en) * 1980-05-15 1982-09-28 Augat Inc. Carrier socket for leadless integrated circuit devices
US5331507A (en) * 1991-05-15 1994-07-19 Dell Usa L.P. Clip for mounting a heat sink on an electronic device package
FR2679729B1 (fr) * 1991-07-23 1994-04-29 Alcatel Telspace Dissipateur thermique.
US5241453A (en) * 1991-11-18 1993-08-31 The Whitaker Corporation EMI shielding device
JPH05198714A (ja) * 1992-01-22 1993-08-06 Sharp Corp 電子機器の冷却構造
US5381305A (en) * 1993-12-22 1995-01-10 Wakefield Engineering, Inc. Clip for clamping heat sink module to electronic module
WO1996029850A1 (en) * 1995-03-22 1996-09-26 Tatsuro Iwaki Clip for preventing heat sink for cpu/mpu from coming off
DE19515073A1 (de) * 1995-04-28 1996-10-31 Thomson Brandt Gmbh Klipp zum Befestigen von Elektronikbauelementen

Also Published As

Publication number Publication date
EP0888039A2 (de) 1998-12-30
EP0888039B1 (de) 2004-03-31
EP0888039A3 (de) 1999-08-25
DE69822710T2 (de) 2005-02-10
US6134112A (en) 2000-10-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee