TW408468B - Bonded structure by a lead-free solder and electronic article - Google Patents
Bonded structure by a lead-free solder and electronic article Download PDFInfo
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- TW408468B TW408468B TW087120854A TW87120854A TW408468B TW 408468 B TW408468 B TW 408468B TW 087120854 A TW087120854 A TW 087120854A TW 87120854 A TW87120854 A TW 87120854A TW 408468 B TW408468 B TW 408468B
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/004—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a metal of the iron group
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H—ELECTRICITY
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
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- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
Description
4084C8 Λ 7 Β7 ____ 五、發明説明(1 ) 發明領域 本發明有關無鉛焊料之接合結構,其中電子裝置接合 至引線框之電極,係利用低毒性無鉛焊料》亦有關具此接 合結構之電子物品- 欲接合電子裝置(如L S I )至有機材料電路板而製 成電路板·,習知上使用共晶S η — P b合金焊料,另一 S η _ P b合金焊料之化學組成及.熔點均接近共晶S η -P b合金焊料,另一焊料合金係加入小量鉍及/或銀至上 述焊料中。這些焊料含約4〇wt%Pb,熔點約183 °C,可於220至240 °C焊接。 關於欲焊接之電子裝置之電極,如QFP (四平封) 一 LS I ,一般使用42合金,爲F e— N i合金,其上 形成一層9〇wt%Sn — 1 〇wt%Pb合金(ε後稱 Sη—10Pb)。此乃因電極濕性好,保存好,不會形 成細片。 -經濟部中夬標準局員工消f合作社印t 然而,Sn — Pb合金焊料之Pb爲重金屬,對人體 有害,含鉛物對全球環境污染。電子裝置引起之污染來自 雨中溶鉛,即廢棄含鉛電子物品曝露日曬雨淋之結果。近 來酸雨更加速P b溶解。爲減少環境污染,須用低毒性無 鉛焊料,取代大量使用之共晶S η - P b合金焊料,使用 不含鉛之元件電極結構’以取代S η — 1 〇 p b。S η _ A g - B i有具潛力之低毒性無鉛焊料,原料取得,生產 成本,濕性,機械性及可靠度均可。通常約2 2 0 -2 4 0 °C進行焊接,於元件電極與焊料間產生化合物,及 -4- 本紙恨尺度適用中國國家標準(CNS ) Λ4规格(公屋) 4(38細 A7 ___'____BT^ 五、發明説明g ) 電路板電極與焊料之間亦然。因此接合界面視焊料組合及 元件電極材料有所不同,須適合分別焊料之電極材料以取 得穩定接合界面。 發明槪述 本發明目的提供無鉛焊料之接合結構,其中就引線框 之電極使用低毒性無鉛S η - A g .- B i合金焊料,接合 界面穩定,接合強度大。 本發明另一目的提供利用低毒性S η — A g _ B i合 金無鉛焊料之電子物品,有關變化具穩定接合界面,就電 氣裝置與電路板間熱膨脹係數差所致焊接接合部之應力, 具足夠應力應付,焊接後電路板分割,測試時電路板彎曲 ,搬運等均無問題。 本發明再一目的提供利用低毒性S η _ A g — B i合 金無鉛焊料之電子物品,接合強度足以抵抗形成細片,焊 料濕性佳。 根據本發明第一特性,提供Sn — Ag-B i合金之 經濟部中央標準局員工消費合作社印裝 (請先閲讀背面之注意事項再填寫本頁) 無鉛焊料之接合結構,經由S η — B i合金層應用於電極 〇 以下爲接合結構例。 1 . Sn — B i 合金含 1 至 20wt%B i 。 2 .接合結構包含銅層於電極與S n_B i合金層之 間。 3 電極爲銅材。 本紙張尺度適用中國國家^準(CNS) Λ4规格(210x21)7公t ) : -5 - 經濟部中夬樣华局員工消费合作社印11 ,408468 A7 —〜一 _E____ 五、發明説明(3 ) 4 .電極爲F e — N i合金或銅合金之引線。 5 · Sn — Ag — B i合金無給焊料以Sn爲主成分 ,5 至 25wt%Bi ,1-5 至 3wt%Ag 及至多 1 w t % c u。 根據第二特性,提供電子物品包含第一電極形成於一 電子裝置上,及第二電極形成於電路板上’二種電極以焊 料彼此接合,其中第一電極上形成.S n — B〖合金層’電 極爲Sn — Ag — B i無鉛合金° 以下例爲電子物品例示。 1Sn—Bi合金含1至2〇wt%Bi 。 2 .電子物品包含銅層於第一電極與s n _B i合金 層之間。 3 .第一電極爲銅材。 4 . Sn_Ag_B i合金無鉛焊料以Sn爲主成分 ,5 至 25wt%Bi ,1 . 5 至 3wt%Ag 及至多 1 w t % C u。 根據本發明第三特性,提供包含電極之無鉛焊料之接 合結構,其中無鉛焊料爲Sn_Ag_B i合金’以Sn 爲主成分,5 至 25wt%Bi ,1 · 5 至 3wt%Ag ,及至少lwt%Cu ,應用於電極上。 由上可知,根據本發明,可確保穩定接合界面,利用 低毒性S η — A g - B 1合金無鉛焊料施加至孔線框電極 ,得到足夠接合強度。如此,所得接合界面隨時間經過極 穩定,強度足夠抵耐接合部因焊接所生應力,應力源於電 '本紙张尺度適用_1丨^"國_國家^準(CMS .)刎現格(2!()X 297公遲) Tfi" ' (請先閎讀背面之注φ?#-項再填寫本頁)
408468 A7 ________B7 五、發明説明# ) 子裝置與電路扳間熱膨脹係數差異,焊接後電路板分割, 測試時電路板變曲及搬運等。此外,利用低毒性s η -Ag_B i合金無鉛焊料,所得接合界面之強度大,形成 充分接邊防止細片產生,保持焊接溫度如2 2 0至2 4 0 °C良好濕性v 圖式簡要說明 圖1爲本發明Q F P - L S I所用引線截面圖; 發明TSOP所用引線截面圖; 圖3^育谦料接合強度之測法; 圖4爲本發明各式金屬化引線之接邊強度評估結果; 圖5爲本發明各式金屬化引線之沾濕時間評估結果; 圖6爲本發明各式金屬化引線之沾濕力評估結果: 圖7爲本發明金屬層下選用銅層之各式金屬化引線之 接邊強度評估結果; 圖8爲本發明金屬層下選用銅層之各式金屬化引線之 平部強度評估結果; 經濟部中央標準局員工消费合作社印裝 {請先閲請背面之注意事項再填寫本頁} 圖9Α爲焊料與Fe— Ni合金(即42合金)引線 界面部截面圖顯微照片(放大3000倍),根據習知技 術其上提供Sn—10Pb合金鍍層: 圖9 B爲引線折斷面顯微照片(放大1 2 0 0倍); 圖9 C爲焊料折斷面顯微照片(放大1 2 0 0倍); 圖1 0 A爲焊料與F e _N i合金之引線界面部截面 圖顯微照片(放大3 0 0 〇倍),根據本發明其上提供 本紙張尺度通用中國國家標共(CNS ) Μ規格U!〇X W公矩) ΓΥ- 408468 A7 B7 五、發明説明(5 )
Sn_4B i合金鍍層; 圖1 0 B爲引線折斷面顯微照片(放大1 2 0 0倍) > 圖1 0 C爲焊料折斷面顯微照片(放大1 2 0 0倍) r 圖1 1A爲焊料與Fe-Ni合金(即42合金)之 界面部截面圖顯微照片(放大3 0.0 0倍),根據本發明 ,其上提供一下銅層及S η - 4 B i合金鍍層重疊; 圖1 1 B爲引線折斷面顯微照片(放大1 2 0 0倍) ;及. 圖1 1 C爲焊料折斷面顯微照片.(放大1 2 0 0倍) L--------Oi衣---- (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部令央標隼局員工消f合作社印裝 主要元件對照表 電極 S η — B i 層 引線 焊料 墊片 基底 C u層 較佳實施例詳細說明 茲說明本發明實施例。 1 2 4 5 7 6 3
.WM 本紙张尺度適用中國國家標在(CMS )_ Λ4规格(2!0X.2们公莜) -8 - 4〇8紅8 αί ______ __B7___; 五、發明説明(6 ) 本發明一例爲電子物品,具有第一及第二電極,二者 以低毒性無鉛焊料彼此接合,第一電極爲Q F P引線’或 半導體裝置(LS I )等電子裝置中TSOP引線,第二 電極位於電路板上。 本發明另一例爲接合結構,具第一及第二電極’二者 以低毒性無鉛焊料彼此接合。 低毒性無鉛焊料可爲s η - A. g - B i合金。利用 S η - A g - B i合金,須取得相對時間經過穩定之接合 界面,其接合強度足以抵耐焊料接合部所生應力,應力係 源於電子裝置與電路·板間熱膨脹係數差異,電路板焊接後 分割,測試時電路板彎曲,及操作等。利用S η — A g —
I B i合金無鉛焊料,形成充分接邊形狀(或最佳接邊形狀 ),得到足夠接合強度,確保2 2 0 — 2 4 0 °C時濕性良 好,此爲電路板及電子裝置耐熱之適當焊接溫度。若焊料 濕性不良,不能取得充分接邊形狀,致接合強度不足,或 需更多活性熔劑,反而不當影響絕緣性。再者,須確保不 形成細片,若細片產生而生長於鍍層處理之電極表面,易 生短路。 經濟部中央標羋局員工消費合作社印裝 如圖1及2不,S η — B i層2形成於引線之電極1 表面上,如本發明電極結構取得足夠接合強度。接著說明 選擇本發明之接合結構。此選擇係根據評估接合強度,濕 性,不發生細片之抵耐性。 首先,說明S η — A g — B 1合金焊料與各式電極材 料間接合強度檢查結果。圖3說明實驗狀況。引線4樣本 本紙張尺度適用中國阎家標準(CNS .) A4ML格(2!0><;^7公趨) (請先閱讀背面之注意事項再填寫本頁) :9 - " 經濟部中央標準局員工消费合作社印敦 A7 ____ —_B7_________ 五、發明説明(7 ) 分別鍍上無鉛材料,Sn,Sn_B i ,Sn~Zn及 Sn-Ag合金,均爲習知Sn-1 OPb合金層替代材 料,鍍於F e~Ni合金(42合金)電極上。亦對與習 知Sn — l〇Pb合金鍍層組合評估各引線4樣本爲3 mm寬,.3 8mm長。將其彎成直角,故焊接區長度爲 2 2 m m。各袓成之鍍層厚度約爲1 〇 /z m。各引線4例 焊接至玻璃環氧樹脂基底6之Cu.墊片(Cu電極)7, 其爲電路板,利用無鉛焊料5,82 ♦ 2wt%Sn — 2 · 8wt%Ag— 15wt%B i 合金(之後稱 Sn-2.8Ag-15Bi)。 玻璃環氧樹脂基底6上C u墊片(C u電極)7大小 爲3 . 5mmx2 5mni。焊料5提供形式爲0 . lmm x25mmx3·5mm箔片。尤其,焊料箔片5置於基 底6上Cu墊片7,彎成直角之引線4置於焊料箔片5上 。1 4 0°C預熱6 0秒後於最高溫度2 2 0 °C空氣中焊接 。含氯松香熔劑於焊接時使用。焊接後,以有機溶劑淸洗 。以三例測試剝皮,即焊接後之引線樣本,焊接後.1 2 5 °C高溫曝露1 6 8小時之引線樣本,考慮接合強度隨時間 經過劣化,另一引線樣本於焊接後曝露於1 5 0 °C下 1 6 8小時了解濕性劣化之接合強度。剝皮測試中’固定 基底,抓住引線遠端以5 m m/分速率垂直拉引引線。然 後測出最大剝力及大致飽和之固定力分別爲接邊強度及平 部強度,就各組成之引線而言。各狀況測試十次決定平均 値< (請先閲讀背面之注意事項再填寫本頁)
本紙張尺度適用中國國家榇準(CNS )六4规格(2!«:<297公廢) -10-
經濟部中夬標準局員工消f合作杜印U ^〇84ββ ΑΊ 五、發明説明(8 ) 各組成之引線例之接邊強度測試結果示於圖4。如一 般QFP — L S I塑膠封裝元件中,考慮印刷電路板之端 子膨脹係數差,接邊強度至少須爲5 k g f。因此顯然 Sn — Zn,Sn — Ag及Sn-Pb合金層得不到適當 接合界面,雖然引線例接邊強度不小於5 k g f ,如S η 層或Sn — B i層,排除Sn-23B i層含23wt% Bi者,鍍於Fe-Ni合金(4.2合金)上。除此引線 例外,另準備三種引線例,即提供厚2 /z m之鍍N i層於 42合金上,並分別對鍍Ni層鍍以Au層,Pd層,及 P d層加上A u層。同樣進行焊接,了解其接合強度。無 法如圖4示取得足夠接邊強度。顯然必須利用S η - B i 層於電極之引線。 測試Sn — 2 . 8Ag — 15B i電極之濕性,就上 述各例組成剝皮測試中顯示足夠接合強度之S η _ B i合 金鍍引線爲之。使用活性較低之熔劑以了解濕性。切割上 述引線爲1 c m長度以取得試片。測試濕性之條件如下: 焊料浴池溫度220 °C,浸入速度1mm /分,浸入深度 2 m m,浸入時間2 0秒。負荷回復至〇經過之時間爲沾 濕時間,浸入後2 0秒之負荷視爲沾濕力。以二情況決定 濕性:鍍後之引線,及鍍後置於1 5 〇 °C經1 6 8小時之 引線。測量1 0次取其平均値。 圖5及6分別就各組成顯示沾濕時間及沾濕力。圖5 沾濕時間結果出現,B i含量愈高,鍍後隨即測試之S η ...... - .. ··*· -B i合金鍍引線濕性較佳,當引線置於1 5 0 °C高溫 本紙浪尺度適用中國國家標华(CNS ) Λ4觇格(2!Ox2(J7公难) 請先聞讀背面之注意事項再填寫本頁) 訂 m ^08468 A7 87 五、發明説明(9 ) (請先閱讀背面之注意事項再填寫本頁) 1 6 8小時i以下及2 3wt%B i時濕性 劣化。故可知B i含量小於1 w t %時,沾濕時間長,濕 性不佳,但沾濕力如圖6所示。顯然B i含量宜由1至 2 〇wt%,即使爲S η — B i合金層,濕性亦佳。 當接合熱膨脹係數差異大之.材料,或材料用於溫差大 環境時,界面處所生應力大。界面之接合強度必須約1 〇 k g ί以上,以確保足夠可靠性。圖4可見直接提供S η 一6丨層於1?6—>1丨合金(42合金)上,得不到1〇 k g f以上之接邊強度。據信係界面化合物未充分形成, 因此,平均約7 μιη之鍍C u層施加於F e - N i合金( 經濟部中央榡隼局負工消t合作社印製 4 2合金),S η — B i合金鍍層則加至此c u層,以提 高界面之焊料反應性,並測量接合強度,圖7亦顯示無 Cu層之接邊強度。除2 3wt%B i情形外,可得1 0 k g f以上之接合強度,但C u下層效應無法證實。採用 此電極結構,可得1/ · 1 k g f以上接合強度.,此锔焊 接4 2合金引線加上S η — 1 0 P b合金層可得者,且利 用共晶S η — P b合金焊料焊接,其接合強度亦顯示於圖 7供比較。如圖8示,形成Cu層於Sn -:B i合金層下. 方,可提昇平部強度。當使用42合tjLU線框時’ C u 可應用於4 2合金。但當使用C u引線框時,此引線框可 作爲C u層或另一 C u層可形成以消除其他加至引線框材 料提供剛性元素之效應。圖5及6亦顯示加有此c u層之 引線例濕性。.C u層幾乎無效果,1 — 2 0 w t % B i時 可得足夠濕性,當引線框置於高溫下B i含量不大於1 -12 - 本紙張尺度適用中國國家標準丨CNS ) Λ4現格(2!ΟΧ297公趙) ^08468 A7 _B7___ 五、發明説明(10 ) w t %時濕性劣化。圖7及8亦使用S η — 2 . 8 A g ~ 15 B i 。但形成C u下層可有效提高接合強度,即使
Bi 含量低,如 Sn — 2Ag — 7 5B i— 〇 . 5Cu (請先閲讀背面之注意事項再樓寫本頁) 合金。 應用上述S η — B i合金及C u層之方法不限於鍍層 ’亦可用浸入,蒸氣沈積,滾覆或金屬粉施加形成這些層 〇 爲了解各式電極材料具不同強度,拋光後觀察接合部 之截面。以S E Μ觀察經拉伸試驗之樣本折斷面。以下說 明所得結果。 圖9Α 1 93及9 0觀察結果爲利用Sn — Ag — B i合金焊料,對S η- 1 0 P b合金鍍層直接應用於習 .知:F e - N i合金(4 2合金)所得引線焊接。其中, 經濟部中央標準局員工消f合作社印製 P b -B i化合物集結於界面,斷裂發生於4 2合金與焊 料間界面。引線之折斷4 2合金面上測出少量S η,據信 焊料中S η與引線之4 2合金齡成化合物。故可信上述 Pb與B i化合物於界面集結,減少Sn與42合金,間接 觸面積,大幅降低接合強度。 , 圖1〇八,1.0B及10C顯不結果爲Sn — 4Bi 合金鍍層取代S η _ 1 Ο P b合金鍍層。界面所生化合物 層薄,斷裂類似發生於4 2合金與焊料間界面。但B i仍 爲晶粒,未減少S n與4 2合金間接合面積’及似S η _ 1 Ο P b例。故可知取得不小於5 k g ί之接合強度。分 析掲示化合物層約爲7 〇 n m S η - F e層。 本纸張尺度適用中國國f標準(CNS ) Λ4現格(2:0X 297公ϋ - 13 ' ~ A7 B7 408468 五、發明説明Ο1 ) 圖1 ΙΑ,I 1B及1 1 C顯示Sn — 4B i層下形 成C u層例。發現C u及S η化合物厚層形成於界面。化 合物層與焊料間界面或化合物中發生斷裂。圖1 〇 A, 10B及10C所示斷裂幾乎平坦,而Sn — B i合金層 直接形成於4 2合金引線上,若有C u層時則不平均。因 此,斷裂面不同導致接合強度提高。由其他S η — Ag -B i合金焊料組成可得類似結果。. 就上例各組成調查細片發生。加有S η _ Ζ η合金鍍 層之引線表面出現細片形成。迄今可知S η鍍層影響細片 形成之抵耐性。但S η — B i合金層中未見細片發生,無 此問題。 因此,若使用本發明電極結構’藉.由S η — A g. -B i合金焊料,可得不易發生細片之接合部’接合強度高 ,濕性佳。 選擇S η — A.g — B i焊料含S η爲主成分’ 5至 25wt%Bi ,1 . 5 至 3wt%Ag 及 0 至 lwt% C u原因在於,此範圍焊料組成允許2 2 0 — 2 4 0 °C時 焊接,此焊料與共晶S η - A g合金焊料具相同濕性’高 溫時可靠度高。尤其’ Sn—Ag-B i焊料之組成於 B i未少於1 0 w t %時,約於1 3 8。(:熔化(三元共晶 合金),故慮及此部分對高溫可靠度有不良影響。但控制 三元共晶組成沈析至實用上無問題,確保L 2 5 °C時高溫 強度。故可使用此組成焊料焊接以上電極得到極可罪電于 物品。 -----------0^— (請先閲讀背面之注意事項再填寫本頁) -訂 經濟部中夬標準局員工消费合作社印製 本紙張尺度適用中國國家標樂·( CNS )从规_格(21〇 ::< M7公淹) -14 - ^08468 37 五、發明説明(12 ) 實例1 Q F P — L S I用引線之截面結構示於圖1 ,例示引 線部分。S η — B i合金層2形成於引線1上,其爲F e —N i合金(42合金)。以鍍層形成S n_B i合金層 2 ’厚約10/zm。Sn — B i合金鍍層之B i含量爲8 w t %。焊接以上電極結構之Q F p — L S I至玻璃環氧 樹脂基底電路板,利用S n — 2 8Ag — 1 5 B i — Ο · 5 C u合金焊料。於頂値溫度2 2 0 °C氮氣氛中軟熔 爐焊接,所得焊接部接合強度大。同樣利用S η — 2 A g -7 . 5 B i - 〇 接於玻璃環氧樹脂基底上。軟熔加熱所成接合部 靠度尤佳。 實例2 圖2顯示T S Ο P引線之截面,爲部分引線結構。 C u層3形成於引線1上,其爲f e - N i合金(4 2合 金)’ Sn — B i合金餍2形成於此Cu層上。以鍍層形 成Sn — b i合金層3及Sn_B i層2。Cu層3厚約 "111,311 — :8 1鍍層約1〇 層之B i合量爲5 w t %。因τ S Ο P引線剛性高,當高 溫使用時或裝置本身發熱,界面所生應力較Q F P _ L s I爲大。如此,必須形成夠大之接合強度’以因應界 面應力,Sn—Bi層下Cu層實爲有效。 .i,. · · « . tj--111!- — (請先聞讀背面之注意事項再填寫本買) 合金焊料於2 4 0 °C空氣中軟熔焊 高溫時可 ,tr 經濟部中央標準局員工消費.合作社印製 S η - B i合金鍍 β m 本紙悵义度適用中國國家標準(CNS ) Λ4規格(2!〇:< 297公簏 15 ^08468 a? ______B7____ 五、發明説明(13 ) 利用s n — Ag- B i合金焊料,於蒸氣軟熔爐中焊 接T S 0 P至印刷電路板,進行熱循環測試°測試條件有 二:(1 ) 一小時周期 3 0 分一5 5 °C,3 0 分 1 2 5 °C ,(2) —小時周期30分125 °C及3 ◦分90 QC。 500次及1,000次後觀察截面,檢查裂痕形成。裂 痕發生循環測試結果與同一尺寸T S ◦ P相比,即其上 4 2合金直接形成S η — 1 〇 P b.合金屬,利用共晶S η -Pb合金焊料焊接。雖然—5 5°C/1 2 熱循環早 期出現裂痕| 0 °C / 9 0 °C熱循環則無問題,得到實用接 合界面。 _實例3 本發明電極結構亦可用於電路板上電極·例如焊料塗 覆可有效提升電略板焊接性。習知以共晶S η _ P b合金 焊料爲含鉛焊料。因此,本發明S η- B i合金層可作爲 無鉛塗覆之焊料。因電路板之電極爲銅,當使用S η — 經濟部中央標準局員工消費合作社印製 (褚先關讀背面之注意事項再填寫本X ) A g _ B i合金時可得足夠接合強度。一例使用本結構中 .,以滾覆形成約5 μ m,S η — 8 B i合金層於玻璃環氧 樹脂基底電路板之C u墊片(C u電極)上。 如此提高對電路板沾濕性,同時提高接合強度,因形 成焊料層。 由上可知,根據本發明,得到以下優點。 所實現電極結構適合S n - A g~B i合金焊料,爲 絕佳無鉛材料。 本纸張尺度適用中國國家梯.準(CNS ) Λ4現格(ϋ!0Χ U7公瘦) -16"- ~ — A7 B7 ^08468 五、發明説明(14 ) 利用Sn— Ag- B 1合金焊料完成無鉛焊料之接合 結構,其中接合界面穩定,接合強度充足。 利用低毒性無鉛共晶S η - A g — B i合金焊料,完 成電子物品,具有無鉛焊料之接合結構,提洪時間穩定上 接合界面,強度大,足以抵耐電子裝置與電路板間熱膨脹 係數間差異引起接合部所生應力,焊接後分割電路板,或 測試時彎曲電路板或搬運亦然。 利用低毒性S η — A g — B i合金無鉛焊料,可形成 適當接邊,確保足夠濕性,接合強度充足,如2 0 0 -2 4 0 °C足以防止彤成細片。 利用S n — Ag — B i焊料焊接電子裝置,得到接合 強度足夠之界面,.確保實用上濕性。完成環保無鉛電子物 品,即使使用相同設備及製程亦然。 ---------rk—— {請先閲讀背面之注意事項再填寫本頁) .1 -訂
經濟部中央標準局貝工消費合作社印IL 私紙浪尺度通用中國國家標準(CNS ) Λ4規格(2丨()κ 2y7公t ) -17-
Claims (1)
- 第87120854號專利申請案 中文申請毒赞正本合良國88年3月呈 C8 D8现請委員明示i<-:x-(^J; WI更原fffl内.容,, 經濟部t央橾毕局員工消贫合阼让印装 々、申請專利範圍 1·一種無鉛焊料之接合結構,爲Sn—Ag-Bi 合金經由S η — B i合金層應用於電極。 2 .如申請專利範圍第1項之接合結構,其中s ^ — B i合金含1至20\vt%B i。 3,如申請專利範圍第l或2項之接合結構,其中包 含銅層於電極與S η- B i合金層之間。 4 ·如申請專利範圍第1或2項之接合結構,其中電 極爲銅材。 _ 5 如申請專利範圍第1或2項之接合結構,其中電 極爲F e - N i合金及銅合金任一構成之引線。 6 如申請專利範圍第1項之接合結構,包含銅層於 電極與Sn — B i合金層之間,其中電極爲Fe— Ni合 金及銅合金任一構成之引線。 7 .如申請專利範圍第1或2項之接合結構,其中 S n-Ag — B i合金無錯焊料包含S η爲主成分,·5至 1 5 % Β 1 ,1 . 5至3 w t % A g,及選擇性至多1 w t % 之 C u。 8 .—種電子物品,包含第一電極彤成於電子裝置上 及第二電極形成於電路板上,二種電極以焊料彼此接合’ 其中S η - B i合金層形成於第一電極上’焊料爲無錯 Sn-Ag — B i 合金。 9 .如申請專利範園第8項之電子物品’其中S η — Βί合金含1至 1 0 .如申請鞟利範囹第8或9項之電子物品,包含 本紙法尺度通用中國圓家捕準(CNS ) A4見格· Π丨0X297公康) {諳先閎讀背面之注意事項再填寫本頁) 第87120854號專利申請案 中文申請毒赞正本合良國88年3月呈 C8 D8现請委員明示i<-:x-(^J; WI更原fffl内.容,, 經濟部t央橾毕局員工消贫合阼让印装 々、申請專利範圍 1·一種無鉛焊料之接合結構,爲Sn—Ag-Bi 合金經由S η — B i合金層應用於電極。 2 .如申請專利範圍第1項之接合結構,其中s ^ — B i合金含1至20\vt%B i。 3,如申請專利範圍第l或2項之接合結構,其中包 含銅層於電極與S η- B i合金層之間。 4 ·如申請專利範圍第1或2項之接合結構,其中電 極爲銅材。 _ 5 如申請專利範圍第1或2項之接合結構,其中電 極爲F e - N i合金及銅合金任一構成之引線。 6 如申請專利範圍第1項之接合結構,包含銅層於 電極與Sn — B i合金層之間,其中電極爲Fe— Ni合 金及銅合金任一構成之引線。 7 .如申請專利範圍第1或2項之接合結構,其中 S n-Ag — B i合金無錯焊料包含S η爲主成分,·5至 1 5 % Β 1 ,1 . 5至3 w t % A g,及選擇性至多1 w t % 之 C u。 8 .—種電子物品,包含第一電極彤成於電子裝置上 及第二電極形成於電路板上,二種電極以焊料彼此接合’ 其中S η - B i合金層形成於第一電極上’焊料爲無錯 Sn-Ag — B i 合金。 9 .如申請專利範園第8項之電子物品’其中S η — Βί合金含1至 1 0 .如申請鞟利範囹第8或9項之電子物品,包含 本紙法尺度通用中國圓家捕準(CNS ) A4見格· Π丨0X297公康) {諳先閎讀背面之注意事項再填寫本頁) A8 B8 C8 D8 ^08468 六、申請專利範圍 銅層於電極與Sn_B i合金層之間。 1 1 .如申請專利範圍第8或9項之電子物品,第一 電極爲銅材3 1 2 .如申請專利範圍第8或9項之電子物品,其中 第一電極爲F e — N i合金及銅合金任一_成之引線》 1 3 .如申請專利範圍第8項之電子物品,包含銅層 與第一電極與Sn — B i合金層之間.,其中第一電極爲 F e — N i合金及銅合金任一構成之引線。 1 4 .如申請專利範圍第8或9項之電子物品,其中 S n - Ag_B i合金無鉛焊料包含S n爲主成分,5至 乙5wt%Bi ,1 . 5至3〜vt%Ag及選擇性至多1 w t % C u a 1 5 .—種無鉛焊料之接合結構,包含一電極’其中 無鉛焊料爲Sn — Ag-B i合金,包含Sn爲主成分, 5至2'5wt%B i ,1 5至3wt%Ag及選擇性至 多l〜vt%Cu,應用於電極上。. 1- - -1 I 1^1 1.^1 —^1 - — 1- 衣- - !· - » »1 · J .·· ·-- -I » I (請先Η1讀背面之注意事項再填寫本頁) 經濟部令央標準局員工消f合作让印¾. 本紙浪尺度逋用中國國家梯準(CNS ) Λ4規格(210X297公釐) -
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CN (4) | CN101604668B (zh) |
AU (1) | AU1504699A (zh) |
CA (1) | CA2314116C (zh) |
DE (3) | DE69837224T2 (zh) |
MY (1) | MY130764A (zh) |
TW (1) | TW408468B (zh) |
WO (1) | WO1999030866A1 (zh) |
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1997
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- 1998-12-09 KR KR1020007006510A patent/KR100716094B1/ko not_active IP Right Cessation
- 1998-12-09 EP EP09013006.3A patent/EP2140963B1/en not_active Expired - Lifetime
- 1998-12-09 DE DE69841511T patent/DE69841511D1/de not_active Expired - Lifetime
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- 1998-12-09 DE DE69836230T patent/DE69836230T2/de not_active Expired - Lifetime
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