KR950034371U - 웨이퍼 홀더 - Google Patents

웨이퍼 홀더

Info

Publication number
KR950034371U
KR950034371U KR2019940011744U KR19940011744U KR950034371U KR 950034371 U KR950034371 U KR 950034371U KR 2019940011744 U KR2019940011744 U KR 2019940011744U KR 19940011744 U KR19940011744 U KR 19940011744U KR 950034371 U KR950034371 U KR 950034371U
Authority
KR
South Korea
Prior art keywords
wafer holder
wafer
holder
Prior art date
Application number
KR2019940011744U
Other languages
English (en)
Other versions
KR200187952Y1 (ko
Inventor
이대성
이성관
남윤석
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019940011744U priority Critical patent/KR200187952Y1/ko
Publication of KR950034371U publication Critical patent/KR950034371U/ko
Application granted granted Critical
Publication of KR200187952Y1 publication Critical patent/KR200187952Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
KR2019940011744U 1994-05-25 1994-05-25 웨이퍼 홀더 KR200187952Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940011744U KR200187952Y1 (ko) 1994-05-25 1994-05-25 웨이퍼 홀더

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940011744U KR200187952Y1 (ko) 1994-05-25 1994-05-25 웨이퍼 홀더

Publications (2)

Publication Number Publication Date
KR950034371U true KR950034371U (ko) 1995-12-18
KR200187952Y1 KR200187952Y1 (ko) 2000-07-15

Family

ID=19383993

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940011744U KR200187952Y1 (ko) 1994-05-25 1994-05-25 웨이퍼 홀더

Country Status (1)

Country Link
KR (1) KR200187952Y1 (ko)

Also Published As

Publication number Publication date
KR200187952Y1 (ko) 2000-07-15

Similar Documents

Publication Publication Date Title
DE69842191D1 (de) Halbleiterscheibenhaltevorrichtung
DE69500752D1 (de) Wafer Träger
DE59510304D1 (de) Bohrfutter
DE19581725T1 (de) Spannfutter
DE69528980D1 (de) Bohrfutter
DE69724663D1 (de) Abstandshalter
DE69514175T2 (de) Spannfutter
DE29521475U1 (de) Spannfutter
DE69630138D1 (de) Abstandshalter
DE9405935U1 (de) Spannfutter
KR960015613U (ko) 웨이퍼 척
KR950034371U (ko) 웨이퍼 홀더
KR960025264U (ko) 웨이퍼 홀더
KR950031497U (ko) 웨이퍼 홀더
KR950028699U (ko) 웨이퍼 홀더
KR960006359U (ko) 웨이퍼 홀딩 척
KR960025434U (ko) 웨이퍼 캐리어
KR950015662U (ko) 웨이퍼 홀더
KR960003065U (ko) 웨이퍼 카세트 호울더
SE9403278D0 (sv) Hållare
SE9400659D0 (sv) Hållare
KR960026344U (ko) 디지트론 고정용 홀더
KR960012675U (ko) 웨이퍼 척
KR960019141U (ko) 파티클 방지용 웨이퍼 척
DE9411541U1 (de) Dosenhalter

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20080320

Year of fee payment: 9

EXPY Expiration of term