SG10201400838PA - System for testing an integrated circuit of a device and its method of use - Google Patents

System for testing an integrated circuit of a device and its method of use

Info

Publication number
SG10201400838PA
SG10201400838PA SG10201400838PA SG10201400838PA SG10201400838PA SG 10201400838P A SG10201400838P A SG 10201400838PA SG 10201400838P A SG10201400838P A SG 10201400838PA SG 10201400838P A SG10201400838P A SG 10201400838PA SG 10201400838P A SG10201400838P A SG 10201400838PA
Authority
SG
Singapore
Prior art keywords
testing
integrated circuit
integrated
circuit
Prior art date
Application number
SG10201400838PA
Original Assignee
Aehr Test Systems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aehr Test Systems filed Critical Aehr Test Systems
Publication of SG10201400838PA publication Critical patent/SG10201400838PA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
SG10201400838PA 2009-03-25 2010-03-25 System for testing an integrated circuit of a device and its method of use SG10201400838PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/411,233 US8030957B2 (en) 2009-03-25 2009-03-25 System for testing an integrated circuit of a device and its method of use

Publications (1)

Publication Number Publication Date
SG10201400838PA true SG10201400838PA (en) 2014-07-30

Family

ID=42781520

Family Applications (5)

Application Number Title Priority Date Filing Date
SG10201912223SA SG10201912223SA (en) 2009-03-25 2010-03-25 System for testing an integrated circuit of a device and its method of use
SG10202108629YA SG10202108629YA (en) 2009-03-25 2010-03-25 System for testing an integrated circuit of a device and its method of use
SG2011068228A SG174890A1 (en) 2009-03-25 2010-03-25 System for testing an integrated circuit of a device and its method of use
SG10201801948WA SG10201801948WA (en) 2009-03-25 2010-03-25 System for testing an integrated circuit of a device and its method of use
SG10201400838PA SG10201400838PA (en) 2009-03-25 2010-03-25 System for testing an integrated circuit of a device and its method of use

Family Applications Before (4)

Application Number Title Priority Date Filing Date
SG10201912223SA SG10201912223SA (en) 2009-03-25 2010-03-25 System for testing an integrated circuit of a device and its method of use
SG10202108629YA SG10202108629YA (en) 2009-03-25 2010-03-25 System for testing an integrated circuit of a device and its method of use
SG2011068228A SG174890A1 (en) 2009-03-25 2010-03-25 System for testing an integrated circuit of a device and its method of use
SG10201801948WA SG10201801948WA (en) 2009-03-25 2010-03-25 System for testing an integrated circuit of a device and its method of use

Country Status (5)

Country Link
US (8) US8030957B2 (en)
EP (1) EP2411819A1 (en)
JP (4) JP5635586B2 (en)
SG (5) SG10201912223SA (en)
WO (1) WO2010111526A1 (en)

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US10401385B2 (en) 2019-09-03
JP2015053500A (en) 2015-03-19
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JP6013423B2 (en) 2016-10-25
SG10202108629YA (en) 2021-09-29
US20180113150A1 (en) 2018-04-26
EP2411819A1 (en) 2012-02-01
US20170176492A1 (en) 2017-06-22
JP2017022403A (en) 2017-01-26
SG174890A1 (en) 2011-11-28
JP2018032873A (en) 2018-03-01
US8030957B2 (en) 2011-10-04
JP2012522381A (en) 2012-09-20
US8947116B2 (en) 2015-02-03
JP5635586B2 (en) 2014-12-03
US20150109011A1 (en) 2015-04-23
SG10201801948WA (en) 2018-04-27
US20100244866A1 (en) 2010-09-30
US9880197B2 (en) 2018-01-30
US20230168277A1 (en) 2023-06-01
US20110316577A1 (en) 2011-12-29
US20210364549A1 (en) 2021-11-25
SG10201912223SA (en) 2020-02-27
US20190339303A1 (en) 2019-11-07
JP6239714B2 (en) 2017-11-29
WO2010111526A1 (en) 2010-09-30
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US11112429B2 (en) 2021-09-07
JP6465947B2 (en) 2019-02-06

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