AU2003249276A1 - Assembly for connecting a test device to an object to be tested - Google Patents

Assembly for connecting a test device to an object to be tested

Info

Publication number
AU2003249276A1
AU2003249276A1 AU2003249276A AU2003249276A AU2003249276A1 AU 2003249276 A1 AU2003249276 A1 AU 2003249276A1 AU 2003249276 A AU2003249276 A AU 2003249276A AU 2003249276 A AU2003249276 A AU 2003249276A AU 2003249276 A1 AU2003249276 A1 AU 2003249276A1
Authority
AU
Australia
Prior art keywords
tested
assembly
test device
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003249276A
Other versions
AU2003249276A8 (en
Inventor
Jovan Jovanovic
Donald P. Ii Richmond
Frank O. Uher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aehr Test Systems Inc
Original Assignee
Aehr Test Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/197,133 external-priority patent/US6853209B1/en
Priority claimed from US10/197,104 external-priority patent/US6867608B2/en
Application filed by Aehr Test Systems Inc filed Critical Aehr Test Systems Inc
Publication of AU2003249276A8 publication Critical patent/AU2003249276A8/en
Publication of AU2003249276A1 publication Critical patent/AU2003249276A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
AU2003249276A 2002-07-16 2003-07-15 Assembly for connecting a test device to an object to be tested Abandoned AU2003249276A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/197,133 2002-07-16
US10/197,104 2002-07-16
US10/197,133 US6853209B1 (en) 2002-07-16 2002-07-16 Contactor assembly for testing electrical circuits
US10/197,104 US6867608B2 (en) 2002-07-16 2002-07-16 Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
PCT/US2003/022125 WO2004008163A2 (en) 2002-07-16 2003-07-15 Assembly for connecting a test device to an object to be tested

Publications (2)

Publication Number Publication Date
AU2003249276A8 AU2003249276A8 (en) 2004-02-02
AU2003249276A1 true AU2003249276A1 (en) 2004-02-02

Family

ID=30117843

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003249276A Abandoned AU2003249276A1 (en) 2002-07-16 2003-07-15 Assembly for connecting a test device to an object to be tested

Country Status (6)

Country Link
EP (1) EP1523685A2 (en)
JP (1) JP2005533254A (en)
KR (1) KR20050029215A (en)
CN (1) CN100523826C (en)
AU (1) AU2003249276A1 (en)
WO (1) WO2004008163A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7762822B2 (en) * 2005-04-27 2010-07-27 Aehr Test Systems Apparatus for testing electronic devices
CN101051067B (en) * 2006-04-03 2010-08-11 航天科工防御技术研究试验中心 Comprehensive detection control device design method for electric connector
MY152599A (en) 2007-02-14 2014-10-31 Eles Semiconductor Equipment S P A Test of electronic devices at package level using test boards without sockets
EP1959265A1 (en) * 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof
US7557594B2 (en) * 2007-08-14 2009-07-07 Electro Scientific Industries, Inc. Automated contact alignment tool
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
CN101545926B (en) * 2008-03-25 2011-05-11 旺矽科技股份有限公司 Probe testing device
DE102009012021B4 (en) * 2009-03-10 2011-02-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Measuring device for the electrical measurement of a measurement structure that can be electrically contacted on one side of a measurement side
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
TWI440412B (en) * 2011-12-28 2014-06-01 Princo Corp Package method of thin multi-layer substrate
CN103808979A (en) * 2012-11-08 2014-05-21 富泰华工业（深圳）有限公司 Tool for bearing to-be-tested electronic device
CN103808969A (en) * 2012-11-08 2014-05-21 富泰华工业（深圳）有限公司 Tool for bearing to-be-tested electronic device
CN105548859A (en) * 2015-12-09 2016-05-04 上海精密计量测试研究所 Testing equipment and method for environment testing
CN106200239B (en) * 2016-09-14 2019-03-15 海信集团有限公司 Ray machine lighting system
US10782316B2 (en) 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
KR102495427B1 (en) 2017-03-03 2023-02-02 에어 테스트 시스템즈 electronics tester
WO2022076333A1 (en) 2020-10-07 2022-04-14 Aehr Test Systems Electronics tester
KR20240027784A (en) 2021-06-30 2024-03-04 델타 디자인, 인코포레이티드 Temperature control system including contactor assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148103A (en) * 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits
JPH0763788A (en) * 1993-08-21 1995-03-10 Hewlett Packard Co <Hp> Probe, electrical part / circuit inspecting device and electrical part / method of circuit inspection
US6028437A (en) * 1997-05-19 2000-02-22 Si Diamond Technology, Inc. Probe head assembly
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
JP2001013208A (en) * 1999-06-30 2001-01-19 Mitsubishi Electric Corp Semiconductor-testing tool

Also Published As

Publication number Publication date
AU2003249276A8 (en) 2004-02-02
CN1668929A (en) 2005-09-14
KR20050029215A (en) 2005-03-24
CN100523826C (en) 2009-08-05
WO2004008163A3 (en) 2004-06-10
WO2004008163A2 (en) 2004-01-22
JP2005533254A (en) 2005-11-04
EP1523685A2 (en) 2005-04-20

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase