JP5391776B2 - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
- Publication number
- JP5391776B2 JP5391776B2 JP2009079985A JP2009079985A JP5391776B2 JP 5391776 B2 JP5391776 B2 JP 5391776B2 JP 2009079985 A JP2009079985 A JP 2009079985A JP 2009079985 A JP2009079985 A JP 2009079985A JP 5391776 B2 JP5391776 B2 JP 5391776B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat sink
- heat receiving
- plate
- chip package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims (5)
- 熱伝導素材から形成されて、仮想平面に沿って広がる接触面を規定する放熱板と、
熱伝導素材から形成されて、前記放熱板に結合されるフィンと、
熱伝導素材から形成されて、前記接触面から分離しつつ前記仮想平面に沿って広がる受熱面を有する受熱板と、
前記受熱板上に配置される温度検出素子とを備え、
前記受熱板は、
裏面で前記受熱面を規定する金属板と、
裏面で前記金属板の表面に重ね合わせられて表面で前記温度検出素子を受け止める絶縁性の基板と、
前記基板の表面から裏面まで貫通するスルーホールと
を備えることを特徴とするヒートシンク。 - 請求項1に記載のヒートシンクにおいて、前記基板の前記表面および前記裏面に形成される金属膜をさらに備えることを特徴とするヒートシンク。
- 請求項1または2に記載のヒートシンクにおいて、前記受熱板には、前記温度検出素子を支持する支持面が規定され、前記支持面および前記放熱板の間には空気層が形成されることを特徴とするヒートシンク。
- 請求項1〜3のいずれか1項に記載のヒートシンクにおいて、前記接触面が前記仮想平面に重なり、前記放熱板が前記仮想平面の表側に位置する際に、前記仮想平面に対して直交する方向に変位自在に前記放熱板に前記受熱板を連結し、前記仮想平面の表側から裏側に向かって前記受熱面を変位させる弾性力を前記受熱板に作用する連結機構をさらに備えることを特徴とするヒートシンク。
- 請求項4に記載のヒートシンクにおいて、前記連結機構は、前記仮想平面の裏面から所定の間隔で離れる仮想面に前記受熱面が重なる位置で前記受熱板の変位を規制する規制機構をさらに備えることを特徴とするヒートシンク。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009079985A JP5391776B2 (ja) | 2009-03-27 | 2009-03-27 | ヒートシンク |
US12/730,811 US8974116B2 (en) | 2009-03-27 | 2010-03-24 | Heat sink for measuring temperature of electronic component |
TW99108676A TWI417997B (zh) | 2009-03-27 | 2010-03-24 | 用於測量電子構件溫度之散熱器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009079985A JP5391776B2 (ja) | 2009-03-27 | 2009-03-27 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010232519A JP2010232519A (ja) | 2010-10-14 |
JP5391776B2 true JP5391776B2 (ja) | 2014-01-15 |
Family
ID=42826155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009079985A Expired - Fee Related JP5391776B2 (ja) | 2009-03-27 | 2009-03-27 | ヒートシンク |
Country Status (3)
Country | Link |
---|---|
US (1) | US8974116B2 (ja) |
JP (1) | JP5391776B2 (ja) |
TW (1) | TWI417997B (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005013762C5 (de) | 2005-03-22 | 2012-12-20 | Sew-Eurodrive Gmbh & Co. Kg | Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters |
TWI339737B (en) | 2005-04-27 | 2011-04-01 | Aehr Test Systems | Contactor assembly, cartridge, and apparatus and method for testing integrated circuit of device |
US7800382B2 (en) | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
CN101730448A (zh) * | 2008-10-24 | 2010-06-09 | 鸿富锦精密工业(深圳)有限公司 | 具有监测温度功能的散热装置 |
US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
JP5928233B2 (ja) * | 2012-08-03 | 2016-06-01 | 富士通株式会社 | 放熱器及び該放熱器を備えた電子装置 |
US9164142B2 (en) | 2012-11-07 | 2015-10-20 | International Business Machines Corporation | Testing electronic components on electronic assemblies with large thermal mass |
KR102123991B1 (ko) * | 2013-03-11 | 2020-06-17 | 삼성전자주식회사 | 반도체 패키지 및 이를 구비하는 전자 시스템 |
DE102014224995A1 (de) * | 2014-12-05 | 2016-06-09 | Siemens Aktiengesellschaft | Kühlkörper zur Kühlung eines elektrischen Geräts |
CN104602500A (zh) * | 2015-01-30 | 2015-05-06 | 周玉翔 | 一种温度可视双层散热片 |
US9887478B2 (en) * | 2015-04-21 | 2018-02-06 | Varian Semiconductor Equipment Associates, Inc. | Thermally insulating electrical contact probe |
TWM512883U (zh) * | 2015-05-05 | 2015-11-21 | Cooler Master Co Ltd | 散熱模組、水冷式散熱模組及散熱系統 |
KR20180101476A (ko) | 2016-01-08 | 2018-09-12 | 에어 테스트 시스템즈 | 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템 |
KR102495427B1 (ko) | 2017-03-03 | 2023-02-02 | 에어 테스트 시스템즈 | 일렉트로닉스 테스터 |
WO2019009088A1 (ja) * | 2017-07-07 | 2019-01-10 | 株式会社村田製作所 | 電力回路モジュール |
US10466299B2 (en) * | 2018-01-04 | 2019-11-05 | Winway Technology Co., Ltd. | Electronic test apparatus |
WO2019163862A1 (ja) * | 2018-02-22 | 2019-08-29 | 国立大学法人大阪大学 | 基板評価用チップ及び基板評価装置 |
CN108566765A (zh) * | 2018-04-20 | 2018-09-21 | 徐州云泰汽车电器有限公司 | 一种汽车调节器散热板与支架组合式连接结构 |
TWI686691B (zh) * | 2018-08-16 | 2020-03-01 | 緯穎科技服務股份有限公司 | 電子裝置及被動元件 |
US11733107B2 (en) * | 2020-10-10 | 2023-08-22 | Fortinet, Inc. | Thermistor sensor arrangement for measuring chipset temperature |
CN113539992A (zh) * | 2021-06-08 | 2021-10-22 | 吕友海 | 一种绝缘栅双极晶体管终端 |
TWI792358B (zh) * | 2021-06-18 | 2023-02-11 | 新加坡商鴻運科股份有限公司 | 具有卸除功能的散熱器 |
US11758690B2 (en) | 2021-06-18 | 2023-09-12 | Nanning Fulian Fugui Precision Industrial Co., Ltd. | Heat-dissipation device allowing easy detachment from heat-generating component |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE1000697A6 (fr) * | 1987-10-28 | 1989-03-14 | Irish Transformers Ltd | Appareil pour tester des circuits electriques integres. |
US5875096A (en) * | 1997-01-02 | 1999-02-23 | At&T Corp. | Apparatus for heating and cooling an electronic device |
SG98373A1 (en) * | 1998-11-25 | 2003-09-19 | Advantest Corp | Device testing apparatus |
JP2002124305A (ja) * | 2000-10-13 | 2002-04-26 | Matsushita Electric Ind Co Ltd | 電池パック |
JP2002261218A (ja) * | 2001-03-02 | 2002-09-13 | Hitachi Ltd | 熱伝対線付きヒートシンク |
JP2003234440A (ja) | 2002-02-08 | 2003-08-22 | Fujitsu Access Ltd | 温度検出器取付具 |
DE10225602A1 (de) * | 2002-06-07 | 2004-01-08 | Heraeus Sensor-Nite Gmbh | Halbleiterbauelement mit integrierter Schaltung, Kühlkörper und Temperatursensor |
US7123037B2 (en) * | 2004-02-27 | 2006-10-17 | Wells-Cti, Llc | Integrated circuit temperature sensing device and method |
US7347621B2 (en) * | 2004-07-16 | 2008-03-25 | International Business Machines Corporation | Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit |
DE102005013762C5 (de) * | 2005-03-22 | 2012-12-20 | Sew-Eurodrive Gmbh & Co. Kg | Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters |
JP2007234753A (ja) | 2006-02-28 | 2007-09-13 | Denso Corp | 半導体モジュール装置 |
JP2007234950A (ja) * | 2006-03-02 | 2007-09-13 | Yokogawa Electric Corp | 温度センサ付きヒートシンク |
US7856341B2 (en) * | 2008-02-19 | 2010-12-21 | International Business Machines Corporation | Heat sink |
CN101534624B (zh) * | 2008-03-14 | 2012-10-10 | 富准精密工业(深圳)有限公司 | 散热器组合 |
CN101730448A (zh) * | 2008-10-24 | 2010-06-09 | 鸿富锦精密工业(深圳)有限公司 | 具有监测温度功能的散热装置 |
CN101930951A (zh) * | 2009-06-25 | 2010-12-29 | 鸿富锦精密工业(深圳)有限公司 | 散热器组合 |
JP5928233B2 (ja) * | 2012-08-03 | 2016-06-01 | 富士通株式会社 | 放熱器及び該放熱器を備えた電子装置 |
-
2009
- 2009-03-27 JP JP2009079985A patent/JP5391776B2/ja not_active Expired - Fee Related
-
2010
- 2010-03-24 TW TW99108676A patent/TWI417997B/zh not_active IP Right Cessation
- 2010-03-24 US US12/730,811 patent/US8974116B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8974116B2 (en) | 2015-03-10 |
JP2010232519A (ja) | 2010-10-14 |
TWI417997B (zh) | 2013-12-01 |
TW201044520A (en) | 2010-12-16 |
US20100254426A1 (en) | 2010-10-07 |
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