WO2007010610A1 - プッシャ、プッシャユニットおよび半導体試験装置 - Google Patents
プッシャ、プッシャユニットおよび半導体試験装置 Download PDFInfo
- Publication number
- WO2007010610A1 WO2007010610A1 PCT/JP2005/013409 JP2005013409W WO2007010610A1 WO 2007010610 A1 WO2007010610 A1 WO 2007010610A1 JP 2005013409 W JP2005013409 W JP 2005013409W WO 2007010610 A1 WO2007010610 A1 WO 2007010610A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor device
- pusher
- under test
- device under
- test
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Definitions
- the present invention relates to a pusher, a pusher unit, and a semiconductor test apparatus. More specifically
- the present invention also relates to a pusher unit that transports a semiconductor device to be tested and attaches it to a test socket, and a pusher that attaches to the pusher unit, and further relates to a semiconductor test apparatus that includes the pusher unit.
- a semiconductor test apparatus sequentially transports and presses a semiconductor device under test to a position of a test socket, and tests each semiconductor device under test according to a predetermined test program mounted on a test unit. Implement, transport and classify according to test results.
- the pusher unit pushes the semiconductor device under test to the transport and test socket.
- a pusher unit of a semiconductor test apparatus includes a holding unit that holds the semiconductor devices to be tested one by one when being transported.
- the holding unit is connected to a negative pressure source and holds the semiconductor device under test by the negative pressure adsorption force.
- the pusher unit also includes a pusher that presses the semiconductor device under test held by the holding portion toward the test socket.
- the pusher has a pressing portion that directly contacts and presses the semiconductor device under test or its substrate, and a main body that supports the pressing portion and transmits the pressing force applied to the pressing portion.
- Patent Document 1 a structure of a semiconductor test apparatus that can perform continuous processing by cooling a semiconductor device under test during transfer by providing a plurality of transfer means for delivering the semiconductor device under test is provided. Has been proposed. Further, Patent Document 2 below discloses the structure of an IC transfer apparatus corresponding to the inclination of the semiconductor device under test caused by the deformation of the tray accommodating the semiconductor device under test.
- Patent Document 3 discloses that an apparatus for sucking and transporting a semiconductor device under test using negative pressure blows air to the semiconductor device under test using negative pressure generating means. It has been proposed to provide a tight cooling function.
- Patent Document 4 proposes that the efficiency of the test process is improved by loading and unloading the semiconductor device under test with an individual transfer device.
- Patent Document 1 Japanese Patent Laid-Open No. 09-175647
- Patent Document 2 JP-A-10-058367
- Patent Document 3 Japanese Unexamined Patent Publication No. 2000-171521
- Patent Document 4 Japanese Patent Laid-Open No. 2002-174658
- the pusher has a part of the function of heating or cooling the semiconductor device under test.
- the semiconductor device under test is heated or cooled by transferring heat through the pusher.
- the heat generated by the semiconductor device under test itself during the test can be cooled to a desired temperature, or the semiconductor device under test can be heated to a desired temperature by providing a heat source in the pusher.
- the semiconductor device under test is tested while maintaining a desired low temperature state or high temperature state.
- the pusher is housed in a thermostatic chamber (chamber) that is cut off from the outside air.
- the number of simultaneous measurements tends to increase in the future due to the need to reduce test costs.
- each of a plurality of pushers is provided with a heating Z cooling structure.
- a plurality of device pressing portions thermally coupled to a common heat source are provided, and each of the plurality of device pressing portions is a device under test.
- a pusher is provided that presses each of the semiconductor devices under test against the test socket of the semiconductor test equipment and transmits heat from the heat source force to the semiconductor device under test.
- a plurality of semiconductor devices under test can be tested with a single pusher connected to one heat source, and the processing speed of the semiconductor test process can be improved.
- the power consumption for the heat source can be reduced compared to a pusher provided with a heat source according to the number of semiconductor devices to be tested.
- a main body portion and a device pressing portion supported by the main body portion so as to be swingable with respect to the main body portion are provided, and the device pressing portion is a semiconductor device under test.
- a pusher is provided that presses against the force. This prevents the contact area between the pusher and the semiconductor device under test due to the semiconductor device under test or the tilt of the pusher, etc., and prevents the heat source and the semiconductor device under test from being thermally coupled with high efficiency. Can do. Therefore, precise and quick temperature control is possible as well as high energy efficiency.
- a body part thermally coupled to a heat source, and a body part physically and thermally coupled to each other, each of which is pressed by the semiconductor device under test A plurality of device pressing portions that press the surface, and each of the device pressing portions abuts the pressed surface of the semiconductor device under test and presses the semiconductor device under test toward the test socket of the semiconductor test apparatus.
- a pusher that transfers heat from the heat source to the semiconductor device under test is provided. This prevents a decrease in the contact area between the pusher and the semiconductor device under test due to the inclination of the semiconductor device under test or the pusher, and allows the heat source and the semiconductor device under test to be thermally coupled with high efficiency. it can.
- a main body portion thermally coupled to a heat source, a physical and thermal coupling to the main body portion, and swinging with respect to the main body portion.
- a device pressing portion that is supported by the main body portion and presses the pressed surface of the semiconductor device under test, and the device pressing portion is in contact with the pressed surface of the semiconductor device under test to incline the pressed surface. Swings in accordance with the contact surface to be in close contact with the pressed surface, pressing the pressed surface uniformly and
- a pusher is provided for pressing the test semiconductor device against the test socket of the semiconductor test apparatus and transmitting heat from the heat source to the semiconductor device under test.
- the device pressing portion has a spherical end portion
- the main body portion has a seat portion complementary to the end portion
- the end portion The two parts are joined by fitting the part and the seat part.
- a fluid having high thermal conductivity is interposed between the main body portion and the device pressing portion in the pusher.
- the device pressing part swings smoothly and adheres well to the semiconductor device under test.
- the fine gap between the pusher body and the device pressing portion is filled with the fluid having high thermal conductivity, the thermal coupling efficiency between the two is also improved.
- the pusher is elastically supported from the main body so that the device pressing portion can be displaced with respect to the main body in the pressing direction. This prevents a decrease in the contact area between the pusher and the semiconductor device under test due to variations in the height (thickness) of the semiconductor device under test, tilt of the semiconductor device under test, etc. Can be combined thermally. Therefore, precise and quick temperature control is possible not only by high energy efficiency.
- a gap between the main body portion and the device pressing portion is filled with a fluid having high thermal conductivity.
- the thermal coupling between the pusher body and the device pressing portion is improved, and a highly efficient heat conduction path from the heat source to the semiconductor device under test is formed.
- the pusher is supported by the main body portion via a device pressing portion strength sheet.
- the pusher body and device pusher Since the thermal coupling between the pressure parts is maintained well and the displacement of the device pressing part is allowed by the elastic sheet, the device pressing part adheres according to the surface state of the semiconductor device under test. Therefore, a good thermal bond is formed between the pusher and the device pressing part.
- the main body portion is fastened so that the thin plate material and the plurality of elastically deformable thin plate materials stacked in the pressing direction to form a laminated body are in close contact with each other.
- a fastening member As a result, the pusher main body itself is elastically deformed, so that the device pressing portion is displaced according to the state of the surface of the semiconductor device under test, and at the same time, is urged toward the semiconductor device under test.
- the device is thermally coupled with high efficiency.
- the pusher body is deformed but the entire body is an integral member, so the thermal conductivity of the body will not decrease.
- the pusher The device pressing part force One end is thermally coupled to the body part, the other end forms a contact surface that contacts the semiconductor device under test, and the heat conducting part propagates the heat from the heat source to the semiconductor device under test At one end, the main body is biased toward the semiconductor device under test, and the other end of the semiconductor device under test is pressed against the test socket. A substrate pressing portion.
- the device pressing portion includes a sheet-like elastic member having a high thermal conductivity on its surface, and the semiconductor device under test is interposed through the elastic member. Press the device. As a result, even a slight gap between the device pressing portion of the pusher and the surface of the semiconductor device under test is filled with the elastic sheet, so that high efficiency is achieved between the pusher and the semiconductor device under test. Den is formed.
- the heat source force is also arranged on the path of heat conducted to the semiconductor device under test via the device pressing portion, and the location of the place where the heat source is arranged.
- a temperature sensor for measuring temperature is provided.
- the semiconductor test can be performed while monitoring whether the heat from the heat source is conducted to the pusher as expected.
- heat conduction is interrupted for some reason. When cut off, it is possible to easily identify the cut-off point.
- a device pressing portion can be attached to and detached from the pusher.
- the device pressing part that directly contacts the semiconductor device under test can be replaced, so that wear of the pusher can be easily dealt with, and the pusher can be replaced when testing semiconductor devices with different specifications. It can correspond only by.
- the pusher includes a thermal coupling portion in which one end is thermally coupled to a heat source and the other end is thermally coupled to the main body.
- the main body part and the device pressing part can be attached and detached, and other body parts and device pressing parts with different specifications can be attached. As a result, it is possible to perform the test by attaching an appropriate pusher according to the specifications of the semiconductor device under test and the test content.
- the pusher further includes a regulating member that regulates a displacement amount when the device pressing portion is displaced toward the test socket by a pressing force from the main body portion. .
- a regulating member that regulates a displacement amount when the device pressing portion is displaced toward the test socket by a pressing force from the main body portion.
- a plurality of device pressing portions are attached to one main body portion.
- a plurality of semiconductor devices under test can be tested with a single pusher connected to one heat source, and the processing speed of the semiconductor test process can be improved.
- the power consumption for the heat source can be reduced compared to a pusher provided with a heat source according to the number of semiconductor devices to be tested.
- the various forms described above can eliminate the occurrence of gaps due to various mismatches between the pressing surface of the device pressing portion and the pressed surface of the surface of the semiconductor device under test. Inconsistencies that are eliminated include variations in the contact state caused by pressing multiple semiconductor devices under test with a single pusher, and under favorable and uniform conditions for multiple semiconductor devices that press simultaneously. A test can be conducted.
- the pusher regulates the amount of displacement when the device pressing portion is displaced in the direction of the test socket by the pressing force of the main body force of each of the dehigh pressing portions.
- a restriction member is provided.
- a pusher unit for holding a semiconductor device under test and pressing it against a test socket in a semiconductor test apparatus, comprising a heat source, a heat source, A pusher having a body portion thermally coupled to a source and a plurality of device pressing portions physically and thermally coupled to the body portion, each of the device pressing portions being a semiconductor device under test A pusher that presses the semiconductor device under test against the test socket and transmits heat from the heat source to the semiconductor device under test, and a semiconductor device under test.
- a pusher unit including a plurality of holding portions held by the.
- a pusher unit for holding a semiconductor device to be tested and pressing it against a test socket in a semiconductor test apparatus, comprising: a heat source; a heat source; A pusher having a main body part thermally coupled to a power source and a device pressing part supported by the main body part so as to be swingable with respect to the main body part and thermally coupled to the main body part.
- a pusher unit including a pusher for transmitting to a device and a holding portion for holding a semiconductor device under test.
- a pusher unit for pressing a semiconductor device under test toward a test socket in a semiconductor test apparatus, the heat source and a heat source thermally.
- a device pusher that is elastically supported from the main body part and is thermally coupled to the main body part so as to be displaceable in a pressing direction with respect to the semiconductor device to be tested.
- a pusher having a pressure portion which is in close contact with the surface of the semiconductor device under test and presses the semiconductor device under test toward the test socket and transmits heat from the heat source force to the semiconductor device under test.
- a pusher unit including a holding unit for holding a semiconductor device under test.
- a heat source a main body part thermally coupled to the heat source, and a plurality of device pressing parts physically and thermally coupled to the main body part are provided.
- a plurality of device pressing portions abut against the pressed surface of the semiconductor device under test, press the semiconductor device under test toward the test socket, and each transfers heat from a heat source to the semiconductor device under test.
- a pusher unit including a pusher and a plurality of holding units each holding the semiconductor device under test, and a test unit for executing a test on the semiconductor device under test mounted in the test socket by the pusher unit.
- a semiconductor test apparatus is provided. As a result, a plurality of semiconductor devices under test can be tested with a single pusher connected to one heat source, and the processing speed of the semiconductor test process can be improved.
- a heat source a main body portion thermally coupled to the heat source, supported by the main body portion so as to be swingable with respect to the main body portion, and heated to the main body portion
- a pusher having a device pressing portion coupled thereto, and swinging according to the inclination of the surface of the semiconductor device under test so as to adhere to the surface of the semiconductor device under test and move the semiconductor device under test toward the test socket.
- a semiconductor test apparatus includes a test unit that performs a test on a semiconductor device. This prevents a decrease in the contact area between the pusher and the semiconductor device under test due to the inclination of the semiconductor device under test, etc. Semiconductor testing can be performed under precise and rapid temperature control.
- a heat source a main body portion thermally coupled to the heat source, and a main body portion elastically supported so as to be displaceable in a pressing direction with respect to the semiconductor device under test with respect to the main body portion.
- a pusher having a device pressing portion thermally coupled to the main body, and is closely attached to the surface of the semiconductor device under test while being displaced toward the test socket by the pressing force of the main body.
- a pusher unit that has a pusher that presses the semiconductor device and transmits heat from the heat source force to the semiconductor device under test, and a holding unit that holds the semiconductor device under test, and is attached to the test socket by the pusher unit.
- a semiconductor test apparatus including a test unit that executes a test on a semiconductor device under test. This prevents a decrease in the contact area between the pusher and the semiconductor device under test due to variations in the height (thickness) of the semiconductor device under test. Therefore, semiconductor testing can be carried out under precise and rapid temperature control as well as high energy efficiency.
- the pusher, the pusher unit, and the semiconductor test apparatus including the pusher as described above can handle a plurality of semiconductor devices under test with one pusher or the pusher unit, and one is used when the test is executed. Heat can be transferred from multiple heat sources to multiple semiconductor devices under test. Therefore, the energy consumed for heating is small even in the semiconductor test in which a thermal load is applied to the semiconductor device under test. Also, since the number of heat sources to be mounted can be reduced relative to the number of semiconductor devices under test handled at one time, the size of the apparatus does not increase. This can improve the productivity of semiconductor devices including semiconductor testing. Brief Description of Drawings
- FIG. 1 is a cross-sectional view showing an embodiment of a pusher unit 10.
- FIG. 2 is a diagram schematically showing the structure of a semiconductor test apparatus 20 having a pusher unit 10.
- FIG. 3 is a cross-sectional view showing a pusher unit 30 according to another embodiment.
- FIG. 4 is a cross-sectional view showing a pusher unit 40 according to another embodiment.
- FIG. 5 is a cross-sectional view showing a pusher unit 50 according to another embodiment.
- FIG. 6 is a cross-sectional view showing a pusher unit 60 according to another embodiment.
- FIG. 7 is a cross-sectional view showing a pusher unit 70 according to another embodiment.
- FIG. 8 is a cross-sectional view showing a pusher unit 80 according to another embodiment.
- FIG. 9 is a cross-sectional view showing a pusher unit 90 according to another embodiment.
- FIG. 10 is a cross-sectional view showing a pusher unit 15 according to another embodiment.
- FIG. 11 is a sectional view showing a state where the change kit 610 is separated from the pusher unit 15 shown in FIG.
- FIG. 12 is a cross-sectional view showing a pusher unit 16 formed by attaching another change kit 630 to the permanent portion 620 shown in FIG.
- FIG. 13 is a cross-sectional view showing a state where the change kit 630 is separated from the pusher unit 16 shown in FIG.
- FIG. 1 is a longitudinal sectional view showing the structure of the pusher unit 10.
- the pusher unit 10 includes a pusher 200 that is assembled to the unit case 100 and includes a pair of device pressing portions 220.
- the unit case 100 includes a case upper part 110 that receives a pressing force P that is not shown in the drawing, and a case lower part 120 to which a holding part 130 is attached.
- the case upper part 110 and the case lower part 120 are joined together.
- a holding part 130 is attached to the case lower part 120.
- the inside of the holding unit 130 is connected to a negative pressure source (not shown), whereby the holding unit 130 sucks and holds a flat substrate 320 of the semiconductor device 300 to be described later.
- the holding unit 130 may be provided in the device pressing unit 220.
- a pressing panel 140 is disposed between the case upper part 110 and the main body part 210, and the resultant force P of the pressing force P1 applied to the case upper part 110 and the pressing force P2 of the pressing panel 140 is transmitted to the main body part 210.
- the unit case 100 and the pusher 200 are lowered or raised together.
- a through hole is formed near the center of the case upper part 110 so that the upper surface of the main body part 210 can escape when the main body part 210 rises with respect to the unit case 100. Yes.
- the main body part 210 includes a thermal coupling part 201 on its upper surface, and is connected to an external heat source 400.
- the external heat source 400 is a heating or cooling source that maintains the semiconductor device under test 300 at a desired test temperature condition that is lower or higher than room temperature.
- a member that is connected to a medium pipe through which a fluid heated or cooled by the heat source 400 flows and that increases or decreases its temperature can be cited. wear.
- a thermal coupling unit 201 includes a Peltier element and a control device for controlling the current amount Z current direction as desired. .
- Such a thermal coupling part 201 transfers heat to and from the semiconductor device under test 300 via the main body part 210 of the pusher 200.
- the cooling source may be omitted if only the high temperature test is required.
- the thermal coupling portion 201 is further provided with a heater for calorie heat. Further, by additionally arranging a Peltier element in the thermal coupling portion 201, the thermal response can be made agile and more stable temperature control can be performed.
- thermal coupling portion 201 Since the thermal coupling portion 201 is disposed at the center of the main body 210, heat is evenly transmitted to both ends of the main body 210.
- heat is described, but when the temperature of the heat source 400 is lower than the temperature of the thermal coupling portion 201, the thermal coupling portion 201 is cooled and the main body portion 210 is also cooled.
- a pair of device pressing portions 220 mounted separately from each other are disposed in the vicinity of both ends in the horizontal direction on the lower surface of the main body 210.
- Each of the device pressing portions 220 extends to below the case lower portion 120 and has a flat pressing surface on the lower surface.
- the holding portion 130 is formed so as to surround the periphery of the pressing surface.
- the upper end of the device pressing part 220 forms a spherical end 222.
- Spherical end 222 abuts against the inner surface of a seat 212 formed on the lower surface of the main body 210 and having a spherical surface with the same curvature. Therefore, when the spherical end 222 is displaced along the inner surface of the seat portion 212, the device pressing portion 220 can smoothly swing. Therefore, even when there is an inclination in the contact surface between the lower surface of the device pressing portion 220 and the die 310, the device pressing portion 220 smoothly swings as the pusher 10 is pressed. The contact surface of 220 uniformly contacts the semiconductor device under test.
- the seat portion 212 of the main body portion 210 and the spherical end 222 of the device pressing portion 220 have a complementary shape and are in close contact with each other, there is almost no variation in heat conduction characteristics. Therefore, even if the device pressing part 220 swings as described above, the heat conduction characteristics between the main body part 210 and the device pressing part 220 do not change.
- a stopper 221 is mounted around the seat portion 212 to prevent the device pressing portion 220 from falling.
- the pusher 200 including the main body part 210 and the device pressing part 220 is preferably formed of a material having excellent thermal conductivity.
- the force that can exemplify ceramics such as copper or a copper-based alloy, aluminum or an aluminum-based alloy, alumina, or aluminum nitride is not limited thereto.
- the surface of the metal material is covered with a hard material such as ceramics for the purpose of improving wear resistance as the pusher 200, lubricity against sliding between the spherical end 222 and the seat portion 212, or the like. It is also preferable to treat the surface with hard metal.
- a lubricant having high thermal conductivity is interposed between the two. It is preferable to arrange it in As a lubricant having high thermal conductivity, silicon oil is used as a base material and ceramics such as alumina and titanium oxide are dispersed.
- the main body 210 and the device pressing portion 220 are in close contact with each other directly or via the lubricant. Thereby, the thermal coupling part 201, the main body part 210, and the device pressing part 220 are thermally coupled. In addition, it is desirable to press and support the device pressing portion 220 upward with a panel member (not shown) so that the spherical end 222 and the seat portion 212 always lightly contact each other.
- FIG. 1 also schematically shows a test area in a semiconductor test apparatus 20 described later.
- the pusher unit 10 is positioned above the pair of test sockets 500. It is location.
- Each of the test sockets 500 is formed by integrating a plurality of contact pins 510 with a frame 5 20.
- An example of a semiconductor device under test 300 to be tested using the test socket 500 includes a substrate 320 on which a die 310 is mounted, and device terminals (not shown) for obtaining an electrical connection on the lower surface of the substrate 320. ).
- the pusher unit 10 formed as described above has the test socket 500 in a state where the semiconductor device 300 to be tested is first adsorbed by the holding unit 130. Transported to test area.
- the pusher unit 10 starts pressing while descending.
- the device terminal of the semiconductor device 300 under test comes into contact with the contact pin 510.
- each device terminal is strongly pressed against the contact pin 510 when the pressing surface of the device pressing portion 220 presses the die 310.
- the pressing further proceeds.
- both of the two semiconductor devices under test 300 can maintain substantially the same temperature condition.
- the two semiconductor devices 300 to be tested have the advantage that the connection paths to one system of the thermal coupling section 201 and the heat source 400 can be shared by both. Therefore, it can be mounted at a higher density than the case where the connection paths to the two thermal coupling portions 201 and the heat source 400 are individually provided, and can be realized in a small size and at a low cost.
- the power consumption of the two semiconductor devices 300 under test during the test is an approximate power consumption, so that the temperature can be practically controlled with one thermal coupling unit 201.
- the pusher unit 10 according to this embodiment includes a pair of device pressing portions 220, it is possible to handle two semiconductor devices 300 under test simultaneously. As a result, high-density mounting can be performed in the test process in the semiconductor test apparatus 20, and the number of simultaneous measurement can be increased.
- the surface of the die 310 may be slightly inclined due to manufacturing variations or the like. Further, when the heights of the pair of semiconductor devices under test 300 are different from each other, the device pressing portion 230 may abut only on a part of the die 310. However, in the present embodiment, the device pressing portion 230 swings due to a reaction force received from the die 310 when pressing the die 310, so that the pressing surface follows the pressed surface of the inclined die 310. , Can adhere. Further, even when the device pressing part 220 swings, the main body part 210 and the device pressing part 220 can be in close contact with each other. Therefore, even when the device pressing portion 230 and the die 310 are inclined, good heat conduction can be maintained for each semiconductor device 300 under test.
- FIG. 2 is a diagram schematically showing the structure of the semiconductor test apparatus 20 including the pusher unit 10 described in FIG. As shown in the figure, the semiconductor test apparatus 20 includes a handler 610 including a push unit 10 and a test unit 620 connected thereto.
- the test unit 620 performs an electrical test on the semiconductor device under test 300 that is in contact with the test socket 500, and is a handler that controls communication with the pusher unit 10 and the node 610.
- a control unit 630 and a test execution unit 640 for executing a test on each of the semiconductor devices 300 to be tested loaded in the test socket 500 in the handler 610 are provided.
- the test unit (tester main body) 620 includes a device control unit 650 that controls the overall operation of the test unit 620 including the handler control unit 630 and the test execution unit 640.
- the node 610 carries a plurality of semiconductor devices 300 under test sequentially from a stock force (not shown) and presses them onto the test socket 500 to perform an electrical test.
- the stock force includes a plurality of transfer trays 550, and each transfer tray 550 has a large number of semiconductor devices 300 to be tested.
- the semiconductor device 300 to be tested is sequentially transferred from the transfer tray 550 by a transfer device (not shown), and passed to the pusher unit 10.
- a plurality of semiconductor devices 300 to be tested are transported by the pusher unit 10 and lowered while being sucked and held by the pusher unit 10 in the test area, so that the two semiconductor devices 300 to be tested move to the test socket 500. Press contact.
- the overall operation of the semiconductor test equipment 20 is as follows: the handler 610 side and the test unit 620 side exchange test start information, test end information, test result pass / fail judgment Z classification information, and other communication information.
- the transport control and device test are executed in synchronization.
- the pusher unit 10 In the test area, when the semiconductor device under test 300 reaches above the test socket 500, the pusher unit 10 is lowered, and the semiconductor device under test 300 comes into contact with the test socket 500. Furthermore, when the pusher unit 10 pushes the semiconductor device under test 300 against the test socket 500, the device terminal of the semiconductor device under test 300 and the corresponding contact pin 510 of the test socket 500 are electrically connected. To touch.
- the test execution unit 640 executes a test and obtains information such as pass / fail judgment information and electrical characteristics of each semiconductor device under test 300 from the test result. Classification information classified based on this information is transmitted to the in-handler control device via the handler control unit 630.
- the handler control unit 630 transports the tested semiconductor device 300 under test using the pusher unit 10 and another transport device (not shown), and accommodates the corresponding stock force based on the classification information.
- the semiconductor test apparatus 20 includes a pusher unit 10 including a pusher 200 including a plurality of device pressing portions 220 with respect to a single main body 210.
- each pusher 200 can maintain equal temperature control in the two semiconductor devices 300 under test by the single heat source 400 and the single thermal coupling part 201. Therefore, when compared with a semiconductor test apparatus having a single heat source and a device pressing portion, it can be mounted at a high density, and can be realized in a small size at low cost. In addition, even in the same test area, it is possible to simultaneously measure a larger number of semiconductor devices under test, thereby reducing test costs.
- FIG. 3 is a longitudinal sectional view showing a structure of a pusher unit 30 according to another embodiment. In the figure, components that are the same as those in FIG. Omitting the light.
- a pair of regulating members 530 are added to the outer side of the pair of test sockets 500 with respect to the structure of the test area shown in FIG.
- the regulating member 530 includes a bumper 532 fixed to the main body 210 of the pusher 200 and a bumper 534 fixed to the test socket 500 side, and is arranged on one straight line in the ascending / descending direction of the pusher unit 30. ing. Therefore, when the pusher unit 30 descends beyond a certain range, the bumpers 532 and 534 come into contact with each other to restrict further descending.
- the height at which the regulating member 530 regulates the descent does not prevent the device pressing unit 220 from pressing the semiconductor device 300 under test. Therefore, the height of the bumpers 532 and 534 is set so that the bumpers 532 and 534 do not abut at the height of the device pressing portion 220 when the semiconductor device under test 300 is normally loaded in the test socket 500. Yes.
- the above-described bumpers 532 and 534 are provided for each pressing member 220 one by one. As a result, even when the semiconductor device under test 300 is empty in one holding portion 130, the pressing condition of the semiconductor device 300 under test held in the other holding portion 130 can be maintained constant, resulting in an excessively large amount. It is possible to prevent a pressing force from being applied. Further, it is possible to avoid damage to the test socket 500 due to the device pressing portion 220 on the vacant side descending beyond the limit, and it is possible to prevent the other holding portion 130 from being significantly inclined.
- FIG. 4 is a longitudinal sectional view showing a structure of a pusher unit 40 according to another embodiment. Also in this figure, common reference numerals are assigned to components common to the other figures, and redundant explanations are omitted.
- the pusher unit 40 has the same structure as the pusher unit 10 shown in FIG. 1 except that the shape of the device pressing portion 240 and its mounting structure are different.
- each device pressing portion 230 has a flange portion 234 at the periphery of the upper end and a protrusion-like protrusion 232 at the center of the upper end.
- the top of the protrusion 232 is formed in a substantially spherical shape.
- the other region at the upper end of the device pressing portion 230 forms a substantially flat end surface.
- an accommodation chamber 214 having a diameter capable of accommodating the flange portion 234 of the device pressing portion 230 is formed on the lower surface of the main body portion 210, and the upper portion of the device pressing portion 230 is accommodated.
- a contact portion 215 is formed each time the protrusion 232 of the spring pressing portion 230 hits.
- an elastic sheet 236 having a high thermal conductivity is inserted between the top surface of the storage chamber 214 and the upper surface of the device pressing portion 230. Thereby, the device pressing portion 230 is pressed from the main body portion 210 via the elastic sheet 236. Further, the elastic sheet 236 thermally couples the device pressing part 230 and the main body part 210 together.
- a stopper 231 having an inner diameter smaller than the outer diameter of the flange portion 234 is mounted around the lower end of the accommodation chamber 214 to prevent the device pressing portion 230 from falling.
- the elastic sheet 236 having a high thermal conductivity is sometimes referred to as a thermal conductive sheet. Further, it is desirable that the gap between the stopper 231 and the flange portion 234 is such that the device pressing portion 230 is in a state where the elastic sheet 236 is lightly pressed so that the heat conduction is always maintained.
- the pusher unit 40 configured as described above When the pusher unit 40 configured as described above is lowered toward the test socket 500 while holding the semiconductor device 300 to be tested, first, the lower surface of the substrate 320 of the semiconductor device 300 to be tested is the test socket. Abuts on 500 contact bin 510. When the pusher unit 40 is further lowered in this state, the device pressing portion 230 gradually presses the die 310 gradually with its lower surface.
- the elastic sheet 236 is compressed, and the projection 232 contacts the inner surface of the contact portion 215 to function as a stopper and the position after contact is fixed, so that the elastic sheet 236 is covered at a desired height position.
- the test semiconductor device 300 can be kept pressed.
- the elastic sheet 236 can be tilted and rocked moderately with respect to the tilt direction.
- the device pressing portion 230 and the die 310 can come into close contact with each other. Therefore, stable heat conduction can be maintained.
- a good electrical connection is established between the device terminal of the semiconductor device under test 300 and the contact pin 510 of the test socket 500.
- the device pressing portion 230 may contact only a part of the die 310.
- the device pressing portion 230 can be tilted and swung with respect to the main body portion 210 by the expansion and contraction of the elastic sheet 236, the device pressing portion 230 is made to follow the inclination of the surface of the die 310. , Can be in close contact. Therefore, the device pressing part 230 and the semiconductor device under test Heat conduction is possible on the entire contact surface with 300.
- the elastic sheet 30 is pushed in the pressing direction of the device pressing portion 230 and contracts.
- the protrusion 232 hits the contact portion 215
- the elastic sheet 30 is not further contracted and the device pressing portion 230 is Press 310 further.
- FIG. 5 is a longitudinal sectional view showing the structure of a pusher unit 50 according to another embodiment. Also in this figure, common reference numerals are assigned to components common to the other figures, and redundant explanations are omitted.
- the pusher unit 50 is also characterized by the shape of the device pressing portion 240 and its mounting structure.
- each device pressing portion 240 has a flat end surface with a flange portion 242 formed on the periphery.
- a housing chamber 216 having a diameter that can accommodate the flange portion 242 of the device pressing portion 230 is formed on the lower surface of the main body portion 210, and the upper portion of the device pressing portion 240 is accommodated.
- the storage chamber 216 is filled with a fluid 246 having a high thermal conductivity, so that the thermal conductivity between the main body 210 and the device pressing portion 240 is kept good.
- a stopper 241 having an inner diameter smaller than the outer diameter of the flange portion 242 is attached around the lower end of the storage chamber 216 to prevent the device pressing portion 240 from falling. Further, an O-ring or the like (not shown) is attached to the device pressing portion 240 so that the fluid 246 does not flow outside.
- a fluid having excellent thermal conductivity such as silicone liquid, silicon grease, mercury, or the like can be suitably used.
- each of the device pressing portions 240 is elastically supported with respect to the main body portion 210 and is mounted so that it can be displaced in the pressing direction.
- the pusher unit 50 configured as described above When the pusher unit 50 configured as described above is lowered toward the test socket 500 while holding the semiconductor device under test 300, first, the lower surface of the substrate 320 of the semiconductor device under test 300 is the test socket. Abuts on 500 contact bin 510.
- the device pressing portion 240 biased by the pressing panel 244 gradually and strongly presses the die 310 with its lower surface. At this time, the fluid 246 As a result of tilting and swinging, the device pressing portion 240 and the die 310 can be in close contact with each other. Therefore, stable heat conduction can be maintained.
- the device pressing unit 220 is caused by the elasticity of the pressing panel 244. Displace individually and adhere to the surface of the semiconductor device under test 300. Therefore, heat is efficiently transferred from the device pressing portion 230 to the semiconductor device 300 to be tested. In addition, an excessive or excessive pressing force is not applied to one of the semiconductor devices under test 300.
- FIG. 6 is a longitudinal sectional view showing a structure of a pusher unit 60 according to another embodiment. Also in this figure, common reference numerals are assigned to components common to the other figures, and redundant explanations are omitted.
- the pusher unit 60 is also characterized by the shape of the device pressing portion 250 and its structure.
- the device pressing portion 250 and the main body portion 210 are integrally molded. Therefore, the heat conduction between the device pressing part 250 and the main body part 210 is good.
- an elastic sheet 252 having elasticity with high thermal conductivity is attached to the lower end surface of the device pressing portion 250. Therefore, the device pressing unit 250 presses the semiconductor device under test 300 via the elastic sheet 252.
- the elastic sheet 252 allows the pressing surface of the device pressing portion 250 and the surface of the die 310 to be in close contact regardless of the inclination and thickness variation of the die 310. Further, even if there is a fine undulation on the surface of the die 310, the device pressing portion 250 and the die 310 can be brought into close contact by the elasticity of the elastic sheet 252. Therefore, the heat conduction between the pusher 200 and the semiconductor device 300 under test can be increased.
- FIG. 7 is a longitudinal sectional view showing the structure of a pusher unit 70 according to another embodiment.
- the same reference numerals are assigned to the same components as those of the pusher unit 60 in FIG. 6, and duplicate descriptions are omitted.
- the main body portion 210 of the pusher 200 is formed by stacking a plurality of thin plate materials 218 that can be elastically deformed, each having good thermal conductivity, for example, a graphite sheet. Has been. Further, in the vicinity of both ends of the thin plate material 218, the device pressing portion 260 is provided. The thin plate material 218 is fastened to each other with a through portion 262 whose force extends upward and a nut 264 attached to the tip of the through portion 262 as a fastening member. Further, the thin plate member 218 is fastened to the central portion of the main body portion 210 by a through portion 266 extending downward from the thermal coupling portion 201 and a nut 268 attached to the tip thereof.
- the thin plate materials 218 are not bonded to each other at any fastening portion, and deformed independently of each other. On the other hand, since the thin plate materials 218 fastened at the fastening points are in strong contact with each other, they conduct heat well.
- Two pressing panels 140 are disposed between the main body 210 and the case upper portion 110 at positions corresponding to the device pressing portions 220. Therefore, when the unit case 100 is displaced downward, the pusher 210 is pressed through the pressing panel 140.
- the thin plate material 218 is pinched according to the reaction force received from the die 310 when the semiconductor device under test 300 is pressed. Accordingly, the surface of the die 310 is deformed according to the inclination, displacement, etc., so that the pressing surface of the device pressing portion 260 is brought into close contact with the die 310, and good heat conduction between the two is maintained.
- the main body 210 since the main body 210 itself has elasticity, the pressing panel between the unit case 100 and the main body 210 is omitted. In addition, the thermal coupling portion 201 located at the center of the main body 210 is directly pressed by the unit case 100.
- FIG. 8 is a longitudinal sectional view showing the structure of a pusher unit 80 according to another embodiment. Also in this figure, common reference numerals are assigned to components common to the other figures, and redundant explanations are omitted.
- the left side is a partial sectional view in which the center of the pusher 200 is cut in the vertical direction
- the right side is a partial front view as seen from the front.
- the device pressing portion presses the semiconductor device 300 under test toward the test socket 500 and the heat conducting portion 280 for transferring heat to the die 310 of the semiconductor device under test 300.
- a substrate pressing part 270 to be individually provided.
- the heat conducting part 280 is formed integrally with the main body part 210. Therefore, the thermal conductivity between the main body part 210 and the heat conduction part 280 is good.
- the substrate pressing portion 270 has a donut-shaped main body having a square cross section surrounding the heat conducting portion 280 and a leg portion 272 that stretches the main body. In addition, there is a weak space between the upper end of the substrate pressing part 270 and the upper part 110 of the case. An elastic pressing panel 274 is inserted. The lower end of the substrate pressing part 270 is supported by the case lower part 120.
- the pusher unit 80 formed as described above descends toward the test socket 500 while holding the semiconductor device 300 under test. At this time, the contact surface between the heat conducting unit 280 and the die 310 is in a non-contact state.
- a device terminal (not shown) on the lower surface of the substrate 320 of the semiconductor device 300 to be tested contacts the contact pin 510 of the test socket 500.
- the weak elastic pressing panel 274 of the substrate pressing portion 270 is contracted, so that the contact surface between the heat conducting portion 280 and the die 310 is brought into contact.
- a good electrical connection is established between the device terminal of the semiconductor device under test 300 and the contact pin 510 of the test socket 500.
- a pin having a long pressing stroke on the contact pin 510 side for example, a pogo pin.
- the semiconductor device under test 300 side is swung so that the contact surface between the heat conducting unit 280 and the die 310 can come into close contact.
- the fixed heat conducting portion 280 is not displaced with respect to the main body portion 210, it is preferentially brought into contact with the die 310 and contributes exclusively to heat conduction.
- the substrate pressing portion 270 elastically supported can be flexibly displaced even if the inclination and height of the substrate 320 vary, the heat conducting portion 280 and the die 310 can be in close contact with each other easily.
- the semiconductor test apparatus 20 can be heated or cooled uniformly with a single pusher unit 10, 30, 40, 50, 60, 70, 80. Is possible.
- a pusher unit can be formed by combining a plurality of structures from the above embodiments. For example, by combining the structure shown in FIG. 1 and the structure shown in FIG. 5, it is possible to cope with the inclination of the semiconductor device under test 300 and variations in thickness. Possible pusher unit is realized. Further, the regulating member 530 shown in FIG. 3 can be effectively applied to any of the embodiments.
- the device pressing part 220 uniformly contacts the semiconductor device under test 300 over the entire pressing surface, a large pressure is locally applied to the semiconductor device 300 under test, or The semiconductor device under test is not damaged by the corners. Therefore, a test can be performed with the same test quality as a pusher unit that presses a single semiconductor device under test 300, and a pusher unit that presses multiple semiconductor devices 300 under test with a single pusher 200 can be realized. .
- each of the embodiments so far includes a plurality of device pressing portions 220, 230, 240, 250, 260!
- the structure of these Denois pressing rods 220, 230, 240, 250, 260 is applicable to the pusher unit 90 having the single device pressing portion 220.
- FIG. 9 is a cross-sectional view showing an example of a pusher unit 90 that presses a single semiconductor device 300 to be tested.
- the pusher unit 90 includes one device pressing portion 220 mounted with the same structure as the pusher unit 10 shown in FIG.
- the device pressing portion 220 has its spherical end 222 supported by the spherical seat portion 212. Therefore, the device pressing portion 220 swings in accordance with the inclination of the semiconductor device 300 to be tested and adheres to the surface thereof. Thereby, both the heat conduction between the main body part 210 and the device pressing part 220 and the heat conduction between the device pressing part 220 and the die 310 are both kept good. Therefore, it is effective for a device with a large variation in inclination due to manufacturing variations of the semiconductor device 300 under test.
- the series of pusher units 10, 30, 40, 50, 60, 70, 80, 90 shown as the embodiment is supplied by being incorporated in the semiconductor test apparatus 20, and the pusher units 10, 30 as a change kit.
- 40, 50, 60, 70, 80, 90 can be supplied as a single unit, and 20 existing semiconductor test equipment can be mounted.
- the pusher 200 can be supplied alone and incorporated into an existing pusher unit.
- FIG. 10 is a cross-sectional view schematically showing the structure of one embodiment of the pusher 15 in which the change kit 610 including the pusher 200 can be easily replaced.
- the same components as those in the other figures are denoted by the same reference numerals, and redundant description is omitted.
- the pusher unit 15 includes a permanent part 620 including a thermal coupling part 201 and a change kit part 610 including a pusher 200 and attachable to and detachable from the permanent part 620.
- the permanent part 620 and the change kit part 610 are connected to each other by latches 622 and 612 mounted on the respective sides. However, the latches 622 and 612 can be opened, and in that case, the change kit portion 610 can be removed.
- the permanent part 620 includes a case part formed by stacking the lower case 621 and the upper case 623, and a thermal coupling part 201 having the flange part 203 integrally therewith. .
- the flange portion 203 is urged by the elastic member 624 from the upper side to the lower side with the pressure P, and the pusher 200 described later also lowers the upward force.
- the thermal coupling portion 201 rises following that and tilts.
- the permanent section 620 also includes a communication pipe 135 that vertically penetrates the upper case 623 and the lower case 621, and a connector 139 that is coupled to the lower end of the communication pipe 135 and opens to the lower surface of the lower case 621. I have.
- the upper end of the communication pipe 135 is coupled to a decompression source (not shown).
- the change kit section 610 includes a unit case 100 formed by the lower case 112 and the upper case, and a pusher 200 urged downward by the pressing panel 140 with respect to the unit case 100. It has. A plurality of holding portions 130 are also attached to the lower surface of the unit case 100.
- the inside 132 of the holding part 130 is moved to the lower case 112 and the case upper part 110. It communicates with a connector 138 opened on the upper surface of the case upper part 110 through communication pipes 134 and 136 formed respectively.
- the connector 138 is coupled to a connector 135 mounted on the lower surface of the permanent portion 620. Therefore, in a state where the permanent part 620 and the change kit part 610 are coupled, the interior 132 of the holding unit 130 is coupled to the reduced pressure source.
- the communication pipe 135 is coupled to a plurality of branch sections 137, and each of the plurality of holding sections 130 is coupled to a decompression source.
- a side wall member 114 is attached to the outside of each holding portion 130 to position the held semiconductor device 300 to be tested.
- the pusher unit 15 formed as described above can hold the semiconductor device under test 300 in the holding unit 130 by driving a reduced pressure source coupled to the holding unit 130.
- the semiconductor device 300 to be tested is lowered onto the test socket 500, and the pusher 200 is pushed by the force P generated in the pressing panel 140 by lowering the permanent portion 620 from above with the pressure P.
- the device under test 300 can be pressed toward the contact pin 510 of the test socket 500 via the device pressing portion 220.
- the thermal coupling portion 201 is in contact with the pusher 200 in contact with the semiconductor device under test 300 from above and is pressed by the biasing member 624. Further, since the thermal coupling portion 201 is elastically supported, it can follow the displacement and inclination of the pusher 200. Accordingly, since the lower surface of the thermal coupling portion 201 is in close contact with the pusher 200 as a whole, the pusher 200 is efficiently coupled to the heat source 400.
- the pusher 200 can be displaced with respect to the unit case 100, so that both semiconductor devices 300 to be tested are pressed evenly. it can. Further, even if each semiconductor device under test 300 is inclined for some reason, the contact pin expands and contracts due to its own elasticity, and can be handled within that range. Therefore, the lower surface of the device pressing portion 220 of the pusher 200 is in close contact with the semiconductor device 300 to be tested. Accordingly, the thermal coupling between the heat source 400 and the semiconductor device under test 300 is also tight.
- the device pressing portion 220 of the pusher 200 is connected to the other embodiments described above [pusher units 10, 30, 40, 50, 60, 70, 80, 9 Needless to say, the structure of the zero device pressing portion 220 can be applied. As described above, it is possible to improve the thermal coupling between the device pressing portion 220 and the semiconductor device 300 under test.
- a temperature sensor can be attached to the pusher unit 15. That is, as shown in FIG. 10, by providing the temperature sensors 710 and 720 near the joint between the thermal joint 201 and the pusher 200, the temperature during the semiconductor test can be precisely controlled.
- the temperature sensors 710 and 720 may be provided on the thermal coupling portion 201 side, the pusher 200 side, or both.
- the coupling between the two can be monitored by comparing the temperature generated by the heat source 400 with the temperature change of the thermal coupling unit 201. If the temperature sensor 710 is provided on the pusher 200 side, the amount of heat actually transmitted to the pusher 200 can be monitored. Furthermore, when the temperature sensors 720 and 710 are provided in both the thermal coupling unit 201 and the pusher 200, the thermal coupling state of the thermal coupling unit 201 and the pusher 200, which is not limited to the respective temperatures, is monitored. it can.
- a temperature sensor 710 mounted on the change kit section 610 side is coupled to the semiconductor test apparatus 10 via connectors 712 and 714. Therefore, as described later, even when the change kit section 610 is replaced, the temperature sensor 710 can be connected to the semiconductor test apparatus as necessary.
- FIG. 11 is a view showing a state where the latches 612 and 622 of the pusher unit 15 shown in FIG. 10 are opened and the change kit portion 610 is removed. As shown in the figure, the change kit part 610 can be separated from the permanent part 620. Therefore, as long as the positions of the latch 612 and the connector 138 are the same, other change kit parts 610 can be mounted.
- FIG. 12 is a diagram showing such an example. That is, the pusher unit 16 shown in FIG. 12 is formed by attaching a change kit portion 630 different from the pusher unit 15 to the permanent portion 620 common to the pusher unit 15 shown in FIGS. .
- the pusher 200 is pressed directly from the case upper part 110 without going through the pressing panel 140.
- the independent holding part 130 The device pressing portion 222 is formed so as to directly hold the semiconductor device under test 300.
- the device pressing portion 222 is provided with a through hole 133 that vertically penetrates the inside of the device pressing portion 222.
- the through hole 133 communicates with a communication hole 136 formed in the case upper portion 110, and further communicates with the connector 139 of the permanent portion 620 via the connector 138. Therefore, the through hole 133 is coupled to the reduced pressure source, and can hold the semiconductor device under test 300 by adsorbing it to the lower surface of the device pressing portion 222.
- the semiconductor device under test 300 handled here, the dimensions of the die 312 and the substrate 322 are substantially the same. Therefore, as shown in FIGS. 10 and 11, the semiconductor device under test 300 cannot be held in the structure in which the holding portions 130 are mounted at a wide interval. On the other hand, in the pusher unit 16 shown in FIG. 12, since the device pressing part 220 itself has an adsorption function, the semiconductor device under test 300 can be held regardless of the dimensions of the substrate 322.
- the device pressing part 222 directly adsorbs the semiconductor device under test 300, the heat conduction between the two is good. Therefore, the heat of the thermal coupling portion 201 is efficiently transferred to the semiconductor device under test 300.
- FIG. 13 shows a state where the permanent part 620 and the change kit part 630 of the pusher 16 shown in FIG. 12 are separated.
- the permanent part 620 is the permanent part 620 itself of the pusher unit 15 shown in FIGS.
- the change kit section 630 has a unique structure as described with reference to FIG. 12, and includes a pusher 200 that can directly hold the semiconductor device under test 300.
- the connector 138 is arranged at the same position as the change kit section 610 shown in FIGS. Therefore, by adopting a structure in which the change kit 610 or 630 can be replaced with the common permanent part 620, the semiconductor device 300 under test having various specifications can be easily tested.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007525477A JPWO2007010610A1 (ja) | 2005-07-21 | 2005-07-21 | プッシャ、プッシャユニットおよび半導体試験装置 |
PCT/JP2005/013409 WO2007010610A1 (ja) | 2005-07-21 | 2005-07-21 | プッシャ、プッシャユニットおよび半導体試験装置 |
KR1020097027388A KR20100017958A (ko) | 2005-07-21 | 2005-07-21 | 푸셔 |
MYPI20063467A MY148619A (en) | 2005-07-21 | 2006-07-20 | Pusher, pusher unit and semiconductor testing apparatus |
TW095126485A TW200704940A (en) | 2005-07-21 | 2006-07-20 | Pusher, pusher unit and semiconductor testing device |
US12/016,211 US7804316B2 (en) | 2005-07-21 | 2008-01-18 | Pusher, pusher unit and semiconductor testing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/013409 WO2007010610A1 (ja) | 2005-07-21 | 2005-07-21 | プッシャ、プッシャユニットおよび半導体試験装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/016,211 Continuation US7804316B2 (en) | 2005-07-21 | 2008-01-18 | Pusher, pusher unit and semiconductor testing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007010610A1 true WO2007010610A1 (ja) | 2007-01-25 |
Family
ID=37668499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/013409 WO2007010610A1 (ja) | 2005-07-21 | 2005-07-21 | プッシャ、プッシャユニットおよび半導体試験装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7804316B2 (ja) |
JP (1) | JPWO2007010610A1 (ja) |
KR (1) | KR20100017958A (ja) |
MY (1) | MY148619A (ja) |
TW (1) | TW200704940A (ja) |
WO (1) | WO2007010610A1 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008102581A1 (ja) * | 2007-02-23 | 2008-08-28 | Advantest Corporation | 電子部品押圧装置および電子部品試験装置 |
JP2009092489A (ja) * | 2007-10-09 | 2009-04-30 | Sumitomo Electric Ind Ltd | 光素子温度特性検査装置 |
WO2009101706A1 (ja) * | 2008-02-15 | 2009-08-20 | Advantest Corporation | マッチプレートベース部および本体部、電子部品ハンドリング装置、ならびにマッチプレート本体部およびテスト部ユニットの交換治具および交換方法 |
WO2011007419A1 (ja) * | 2009-07-14 | 2011-01-20 | 株式会社アドバンテスト | 電子部品押圧装置、電子部品試験装置及びインタフェース装置 |
JP2018081021A (ja) * | 2016-11-17 | 2018-05-24 | 三菱電機株式会社 | 押さえ治具 |
JP2018087796A (ja) * | 2016-11-30 | 2018-06-07 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
JP2021009146A (ja) * | 2019-07-02 | 2021-01-28 | セメス株式会社Semes Co., Ltd. | 半導体パッケージテスト装置 |
TWI734238B (zh) * | 2019-10-29 | 2021-07-21 | 鴻勁精密股份有限公司 | 分類設備及其溫控裝置 |
JP2022142694A (ja) * | 2021-03-16 | 2022-09-30 | 力成科技股▲分▼有限公司 | テストハンドラのための共用型マッチプレート |
US11977098B2 (en) | 2009-03-25 | 2024-05-07 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
US12007451B2 (en) | 2016-01-08 | 2024-06-11 | Aehr Test Systems | Method and system for thermal control of devices in an electronics tester |
JP7526772B2 (ja) | 2017-03-03 | 2024-08-01 | エイアー テスト システムズ | 電子試験器 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100066395A1 (en) | 2008-03-13 | 2010-03-18 | Johnson Morgan T | Wafer Prober Integrated With Full-Wafer Contacter |
KR101104413B1 (ko) * | 2009-09-25 | 2012-01-16 | 세크론 주식회사 | 반도체 소자 테스트용 접속 장치 및 이를 포함하는 테스트 핸들러 |
JP5910303B2 (ja) * | 2012-05-21 | 2016-04-27 | 三菱電機株式会社 | 半導体検査治具 |
KR101936348B1 (ko) * | 2012-09-17 | 2019-01-08 | 삼성전자주식회사 | 급속 온도 변환이 가능한 테스트 핸들러 및 그를 이용한 반도체 소자의 테스트 방법 |
KR101532391B1 (ko) * | 2014-04-10 | 2015-06-30 | 주식회사 아이에스시 | 푸셔 장치 |
JP6445340B2 (ja) * | 2015-02-06 | 2018-12-26 | 株式会社エンプラス | 電気部品用ソケット |
US9921265B2 (en) | 2015-12-18 | 2018-03-20 | Sensata Technologies, Inc. | Thermal clutch for thermal control unit and methods related thereto |
KR102295094B1 (ko) * | 2017-10-01 | 2021-08-31 | (주)아테코 | 전자부품소자 테스트 온도 조절 장치와 방법, 테스트 챔버의 푸싱 장치, 및 전자부품 테스트 장치 |
KR20200012211A (ko) | 2018-07-26 | 2020-02-05 | 삼성전자주식회사 | 반도체 소자 테스트 시스템, 반도체 소자 테스트 방법, 및 반도체 소자 제조 방법 |
JP7270348B2 (ja) * | 2018-09-10 | 2023-05-10 | 三菱電機株式会社 | 電気特性検査治具 |
KR102281297B1 (ko) * | 2019-11-13 | 2021-07-23 | 주식회사 아이에스시 | 전기적 검사를 위한 푸셔장치 |
KR102329619B1 (ko) * | 2020-01-20 | 2021-11-22 | 주식회사 제너릭스 | 반도체 소자 테스트 장비용 푸셔 장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07239362A (ja) * | 1994-02-28 | 1995-09-12 | Ando Electric Co Ltd | 浮動機構つき吸着ハンドおよび搬送接触機構 |
JPH0933606A (ja) * | 1995-07-20 | 1997-02-07 | Shin Etsu Polymer Co Ltd | 半導体素子検査用治具 |
JPH11329646A (ja) * | 1998-05-15 | 1999-11-30 | Jsr Corp | 検査装置 |
JPH11344527A (ja) * | 1998-06-02 | 1999-12-14 | Ando Electric Co Ltd | 高温ハンドラの測定機構 |
JP2002005990A (ja) * | 2000-06-23 | 2002-01-09 | Advantest Corp | コンタクトアームおよびこれを用いた電子部品試験装置 |
JP2002160187A (ja) * | 2000-11-24 | 2002-06-04 | Seiko Epson Corp | 保持装置、搬送装置、ic検査装置、保持方法、搬送方法及びic検査方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09175647A (ja) | 1995-10-27 | 1997-07-08 | Advantest Corp | 半導体デバイス搬送処理装置 |
US5640303A (en) * | 1995-10-30 | 1997-06-17 | Precision Connector Designs, Inc. | Interconnection apparatus for semiconductor/integrated circuit devices |
JPH1058367A (ja) | 1996-08-23 | 1998-03-03 | Advantest Corp | Ic搬送装置 |
JP3951436B2 (ja) * | 1998-04-01 | 2007-08-01 | 株式会社アドバンテスト | Ic試験装置 |
JP4100790B2 (ja) | 1998-12-08 | 2008-06-11 | 株式会社アドバンテスト | 電子部品吸着装置および電子部品試験装置 |
US6301097B1 (en) * | 1999-07-27 | 2001-10-09 | International Business Machines Corporation | Inflatable sealing system for low temperature electronic module |
JP2002174658A (ja) | 2000-12-05 | 2002-06-21 | Advantest Corp | ハンドラおよび電子部品試験装置 |
-
2005
- 2005-07-21 KR KR1020097027388A patent/KR20100017958A/ko not_active Application Discontinuation
- 2005-07-21 JP JP2007525477A patent/JPWO2007010610A1/ja not_active Abandoned
- 2005-07-21 WO PCT/JP2005/013409 patent/WO2007010610A1/ja active Application Filing
-
2006
- 2006-07-20 TW TW095126485A patent/TW200704940A/zh unknown
- 2006-07-20 MY MYPI20063467A patent/MY148619A/en unknown
-
2008
- 2008-01-18 US US12/016,211 patent/US7804316B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07239362A (ja) * | 1994-02-28 | 1995-09-12 | Ando Electric Co Ltd | 浮動機構つき吸着ハンドおよび搬送接触機構 |
JPH0933606A (ja) * | 1995-07-20 | 1997-02-07 | Shin Etsu Polymer Co Ltd | 半導体素子検査用治具 |
JPH11329646A (ja) * | 1998-05-15 | 1999-11-30 | Jsr Corp | 検査装置 |
JPH11344527A (ja) * | 1998-06-02 | 1999-12-14 | Ando Electric Co Ltd | 高温ハンドラの測定機構 |
JP2002005990A (ja) * | 2000-06-23 | 2002-01-09 | Advantest Corp | コンタクトアームおよびこれを用いた電子部品試験装置 |
JP2002160187A (ja) * | 2000-11-24 | 2002-06-04 | Seiko Epson Corp | 保持装置、搬送装置、ic検査装置、保持方法、搬送方法及びic検査方法 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5328638B2 (ja) * | 2007-02-23 | 2013-10-30 | 株式会社アドバンテスト | 電子部品押圧装置および電子部品試験装置 |
KR101153734B1 (ko) | 2007-02-23 | 2012-06-08 | 가부시키가이샤 어드밴티스트 | 전자부품 압압 장치 및 전자부품 시험장치 |
WO2008102581A1 (ja) * | 2007-02-23 | 2008-08-28 | Advantest Corporation | 電子部品押圧装置および電子部品試験装置 |
US8164355B2 (en) | 2007-02-23 | 2012-04-24 | Advantest Corporation | Electronic component pressing device and electronic component test apparatus |
JP2009092489A (ja) * | 2007-10-09 | 2009-04-30 | Sumitomo Electric Ind Ltd | 光素子温度特性検査装置 |
WO2009101706A1 (ja) * | 2008-02-15 | 2009-08-20 | Advantest Corporation | マッチプレートベース部および本体部、電子部品ハンドリング装置、ならびにマッチプレート本体部およびテスト部ユニットの交換治具および交換方法 |
TWI398637B (zh) * | 2008-02-15 | 2013-06-11 | Advantest Corp | Multi-plate base and body, electronic parts processing device, multi-plate body and the test unit of the exchange of governance and exchange method |
US11977098B2 (en) | 2009-03-25 | 2024-05-07 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
JPWO2011007419A1 (ja) * | 2009-07-14 | 2012-12-20 | 株式会社アドバンテスト | 電子部品押圧装置、電子部品試験装置及びインタフェース装置 |
WO2011007419A1 (ja) * | 2009-07-14 | 2011-01-20 | 株式会社アドバンテスト | 電子部品押圧装置、電子部品試験装置及びインタフェース装置 |
US12007451B2 (en) | 2016-01-08 | 2024-06-11 | Aehr Test Systems | Method and system for thermal control of devices in an electronics tester |
JP2018081021A (ja) * | 2016-11-17 | 2018-05-24 | 三菱電機株式会社 | 押さえ治具 |
JP2018087796A (ja) * | 2016-11-30 | 2018-06-07 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
JP7526772B2 (ja) | 2017-03-03 | 2024-08-01 | エイアー テスト システムズ | 電子試験器 |
JP2021009146A (ja) * | 2019-07-02 | 2021-01-28 | セメス株式会社Semes Co., Ltd. | 半導体パッケージテスト装置 |
JP7301795B2 (ja) | 2019-07-02 | 2023-07-03 | セメス株式会社 | 半導体パッケージテスト装置 |
TWI734238B (zh) * | 2019-10-29 | 2021-07-21 | 鴻勁精密股份有限公司 | 分類設備及其溫控裝置 |
JP2022142694A (ja) * | 2021-03-16 | 2022-09-30 | 力成科技股▲分▼有限公司 | テストハンドラのための共用型マッチプレート |
Also Published As
Publication number | Publication date |
---|---|
US7804316B2 (en) | 2010-09-28 |
MY148619A (en) | 2013-05-15 |
TW200704940A (en) | 2007-02-01 |
US20090102497A1 (en) | 2009-04-23 |
JPWO2007010610A1 (ja) | 2009-01-29 |
KR20100017958A (ko) | 2010-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2007010610A1 (ja) | プッシャ、プッシャユニットおよび半導体試験装置 | |
US8164355B2 (en) | Electronic component pressing device and electronic component test apparatus | |
US10126356B2 (en) | Systems and methods for conforming test tooling to integrated circuit device with whirlwind cold plate | |
JP4537394B2 (ja) | コンタクトプッシャ、コンタクトアーム及び電子部品試験装置 | |
TWI377005B (ja) | ||
US9279852B2 (en) | Systems and methods for conforming test tooling to integrated circuit device profiles with sockets having secured and replaceable bushings | |
KR20010024447A (ko) | 적응성 있는 방열 장치를 구비한 번인 보드 | |
WO2007023557A1 (ja) | 電子部品試験装置および電子部品試験装置における温度制御方法 | |
US8508245B1 (en) | Thermal control unit used to maintain the temperature of IC devices under test | |
KR101533735B1 (ko) | 전기적 접속 장치 | |
US11181576B2 (en) | Electronic component handling apparatus and electronic component testing apparatus | |
US9535090B2 (en) | Electric connecting apparatus | |
KR20010024445A (ko) | 높은 열 방출 능력을 갖는 번인 보드 | |
TW200946922A (en) | Test system and probe apparatus | |
KR19980079920A (ko) | 반도체 집적 회로의 검사 방법, 검사 장치 및 진공 컨택터 기구 | |
JP2012198240A (ja) | プッシャ、プッシャユニットおよび半導体試験装置 | |
US20180196084A1 (en) | Socket side thermal system | |
KR20080030046A (ko) | 푸셔, 푸셔 유닛 및 반도체 시험 장치 | |
US9229049B2 (en) | Systems and methods for conforming test tooling to integrated circuit device profiles with compliant pedestals | |
US9007080B2 (en) | Systems and methods for conforming device testers to integrated circuit device profiles with feedback temperature control | |
US20150022226A1 (en) | Systems and methods for conforming test tooling to integrated circuit device profiles with coaxial socket | |
CN101228448A (zh) | 推进机、推进机单元以及半导体测试装置 | |
US6975126B2 (en) | Contactor apparatus for semiconductor devices and a test method of semiconductor devices | |
JP5147192B2 (ja) | プローバにおけるウエハ保持方法、プローバ及び高熱伝導性シート | |
US20070132471A1 (en) | Method and apparatus for testing integrated circuits over a range of temperatures |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2007525477 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200580051125.6 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020087001919 Country of ref document: KR |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 05766346 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020097027387 Country of ref document: KR Ref document number: 1020097027388 Country of ref document: KR |