WO2011007419A1 - 電子部品押圧装置、電子部品試験装置及びインタフェース装置 - Google Patents
電子部品押圧装置、電子部品試験装置及びインタフェース装置 Download PDFInfo
- Publication number
- WO2011007419A1 WO2011007419A1 PCT/JP2009/062734 JP2009062734W WO2011007419A1 WO 2011007419 A1 WO2011007419 A1 WO 2011007419A1 JP 2009062734 W JP2009062734 W JP 2009062734W WO 2011007419 A1 WO2011007419 A1 WO 2011007419A1
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- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- pressing device
- pressing
- plate
- base plate
- Prior art date
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Definitions
- the present invention relates to an electronic component pressing device that presses an electronic device under test such as a semiconductor integrated circuit element against a socket on a HiFix (interface device) mounted on a test head, an electronic component testing device including the electronic component pressing device, and
- the present invention relates to an interface device mounted on a test head.
- HiFix High Fidelity Tester Access Fixture
- the problem to be solved by the present invention is to provide an electronic component pressing device, an electronic component testing device, and an interface device that can suppress the occurrence of poor contact between the electronic device under test and the socket.
- an electronic component pressing device that presses the electronic device under test against a socket on an interface device mounted on a test head, and a plurality of pressing portions that contact the electronic device under test;
- a base plate provided with a plurality of the pressing portions, and the rigidity of the base plate is relatively lower than the rigidity of the holding member holding the socket in the interface device.
- An electronic component pressing device is provided (see claim 1).
- the pressing unit has a temperature adjusting plate for adjusting the temperature of the electronic device under test, and the temperature adjusting plate is laminated on the base plate ( (See claim 2).
- the temperature control plate has a flow path through which at least one of a refrigerant and a heating medium flows (see claim 3).
- the holding member is preferably a spacing frame holding a socket board on which the socket is mounted in the interface device (see claim 4).
- the rigidity of the plate laminate formed by laminating the base plate and the temperature control plate is preferably relatively lower than the rigidity of the holding member (see claim 5).
- the pressing unit includes a moving unit that moves the pressing unit toward the socket, and the pressing unit includes a cylinder that applies a predetermined pressure to the base plate (see claim 6). .
- the pressing unit includes a cylinder that applies a predetermined pressure to the base plate, and a shaft that is disposed between the cylinder and the base plate and passes through the temperature adjustment plate. It is preferable to have (refer to Claim 7).
- a moving means for moving the pressing unit toward the socket is provided (see claim 8).
- the pressing unit includes a heat transfer member that is stacked between the base plate and the temperature control plate, and thermally connects the base plate and the temperature control plate.
- the heat transfer body is preferably deformable together with the base plate (see claim 9).
- the heat transfer body is preferably a bag body into which a fluid is injected (see claim 10).
- the heat transfer body is preferably an elastically deformable sheet-like member (see claim 11).
- the pressing unit includes a moving unit that moves the pressing unit toward the socket, and the pressing unit includes a cylinder that applies a predetermined pressure to the base plate, and the cylinder and the base plate. It is preferable to have a shaft disposed and penetrating through the temperature control plate and the heat transfer body (see claim 12).
- an electronic component pressing device that presses an electronic device under test against a socket on an interface device mounted on a test head, comprising a plurality of pressing units that press the electronic device under test,
- the pressing unit includes a plurality of pressing portions that contact the electronic device under test and a base plate provided with the plurality of pressing portions, and the plurality of pressing units are independent of each other.
- An electronic component pressing device is provided that is movable (see claim 13).
- the holding member that holds the socket is preferably a spacing frame that holds a socket board on which the socket is mounted. reference).
- moving means for simultaneously moving a plurality of the pressing units toward the socket, and the pressing units each have a cylinder for applying a constant pressure to the base plate. Is preferable (see claim 15).
- the pressing unit has a temperature adjustment plate that is stacked on the base plate and adjusts the temperature of the electronic device under test (see claim 16).
- the temperature control plate has a flow path through which at least one of a refrigerant and a heating medium flows (see claim 17).
- a flow path connecting means for mutually connecting the flow paths of the temperature control jacket, and the flow path connecting means is interposed between the plurality of pressing units. Is preferred (see claim 18).
- each of the pressing units includes a heat transfer body that is stacked between the base plate and the temperature control plate and thermally connects the base plate to the temperature control plate. It is preferable (refer to claim 19).
- the heat transfer body is preferably a bag body into which a fluid is injected (see claim 20).
- the heat transfer body is preferably an elastically deformable sheet-like member (see claim 21).
- an electronic component pressing device that presses an electronic device under test against a socket on an interface device mounted on a test head, the pressing unit pressing the electronic device under test, and the pressing unit Moving means to move the socket toward the socket, and the pressing unit includes a plurality of base plates each provided with a plurality of pressing portions that contact the electronic device under test, and a predetermined pressure applied to the base plate.
- An electronic component pressing device comprising a plurality of cylinders to be applied and a plurality of shafts disposed between the base plate and the cylinders is provided (see claim 22).
- the pressing unit has a temperature adjustment plate for adjusting the temperature of the electronic device under test, and the shaft penetrates the temperature adjustment plate (See claim 23).
- the temperature adjustment plate preferably has a flow path through which at least one of a refrigerant and a heating medium flows (see claim 24).
- the pressing unit includes a heat transfer body that is stacked between the base plate and the temperature control plate and thermally connects the base plate and the temperature control plate.
- the shaft preferably passes through the heat transfer body (see claim 25).
- the heat transfer body is preferably a bag body into which a fluid is injected (see claim 26).
- the heat transfer body is preferably an elastically deformable sheet-like member (see claim 27).
- an electronic component pressing device that presses an electronic device under test against a socket on an interface device mounted on a test head, and a plurality of pressing portions that contact the electronic device under test are provided.
- An electronic component pressing device comprising: a base plate; a holding member holding the socket in the interface device; and a connecting means for connecting the base plate. reference).
- a temperature adjustment plate for adjusting the temperature of the electronic device under test is provided, and the temperature adjustment plate is laminated on the base plate (see claim 29).
- the temperature control plate preferably has a flow path through which at least one of a refrigerant and a heating medium flows (see claim 30).
- the holding member is preferably a spacing frame holding a socket board on which the socket is mounted in the test head (see claim 31).
- the pressing unit includes a moving unit that moves the pressing unit toward the socket, and the pressing unit includes a cylinder that applies a predetermined pressure to the base plate (see claim 32). .
- an electronic component test apparatus for testing an electronic device under test, wherein the test head is mounted with an interface device having a socket in electrical contact with the electronic device under test, and the socket And an electronic component pressing device that presses the electronic component under test onto the electronic component testing device (see claim 33).
- the socket having electrical contact with the electronic device under test is mounted on the test head, and electrical relay is performed between the electronic device under test and the test head.
- the interface device includes a holding member that holds the socket, and the rigidity of the holding member is relatively higher than the rigidity of a base plate provided with a plurality of pressing portions that press the electronic device under test.
- An interface device is provided (see claim 34).
- the holding member is preferably a spacing frame holding a socket board on which the socket is mounted (see claim 35).
- the base plate is deformed so as to follow the bending of the holding member by making the rigidity of the base plate of the pressing unit relatively lower than the rigidity of the holding member of the interface device. The occurrence of poor contact between the socket and the socket can be suppressed.
- the plurality of pressing units each having the plurality of pressing units can move independently of each other, the bending of the interface device can be absorbed, and the electronic device under test, the socket, The occurrence of poor contact can be suppressed.
- the deflection of the interface device can be absorbed, and the occurrence of poor contact between the electronic device under test and the socket can be suppressed. Can do.
- FIG. 1 is a schematic plan view showing the overall configuration of the electronic component testing apparatus according to the first embodiment of the present invention.
- FIG. 2 is a plan view showing the customer tray in the first embodiment of the present invention.
- FIG. 3 is a side view of FIG.
- FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.
- FIG. 5 is a plan view showing the contact plate in the first embodiment of the present invention.
- FIG. 6 is a plan view showing a state in which the contact plates shown in FIG. 5 are connected.
- FIG. 9 is a side view of the first device transfer apparatus according to the first embodiment of the present invention.
- FIG. 10 is a plan view of FIG.
- FIG. 11 is a perspective view showing a holding mechanism of the first device transfer apparatus shown in FIG.
- FIG. 12 is a plan view of the reinforcing plate in the first embodiment of the present invention.
- FIG. 13 is a side view of FIG. 14 is a plan view showing a state in which a contact plate is mounted on the reinforcing plate shown in FIG.
- FIG. 15 is a side view of FIG.
- FIG. 16 is a side view (part 1) illustrating the operation of the first device transfer apparatus according to the first embodiment of the present invention.
- FIG. 17 is a side view (No. 2) showing the operation of the first device transfer apparatus in the first embodiment of the present invention.
- FIG. 18 is a side view (No. 3) showing the operation of the first device transfer apparatus in the first embodiment of the present invention.
- FIG. 19 is a cross-sectional view showing the operation of placing the contact plate on the customer tray in the first embodiment of the present invention.
- FIG. 20 is a cross-sectional view showing a state in which the contact plate is put on the customer tray in the first embodiment of the present invention.
- FIG. 21 is a side view (No. 4) showing the operation of the first device transfer apparatus in the first embodiment of the present invention.
- FIG. 22 is a cross-sectional view showing the operation of inverting the contact plate and the customer tray in the first embodiment of the present invention.
- FIG. 23 is a side view (No. 5) showing the operation of the first device transfer apparatus in the first embodiment of the present invention.
- FIG. 24 is a cross-sectional view showing the operation of removing the customer tray from the contact plate after inversion in the first embodiment of the present invention.
- FIG. 25 is a plan view showing the first interval changing device in the first embodiment of the present invention.
- FIG. 26 is a side view of FIG.
- FIG. 27 is a side view showing the movable head of the first gap changing device in the first embodiment of the present invention.
- FIG. 28 is a plan view of the movable head as seen from a view A in FIG.
- FIG. 29 is a plan view (part 1) illustrating a contact plate transfer operation by the first gap changing device according to the first embodiment of the present invention.
- FIG. 30 is a plan view (part 2) illustrating the contact plate transfer operation by the first gap changing device according to the first embodiment of the present invention.
- FIG. 31 is a plan view showing the setting operation of the contact plate by the first gap changing device in the first embodiment of the present invention.
- FIG. 32 is a side view showing the plate moving device and the pressing device in the first embodiment of the present invention.
- FIG. 33 is a plan view showing the plate moving device and the pressing device in the first embodiment of the present invention.
- FIG. 34 is a cross-sectional view of the pressing device according to the first embodiment of the present invention.
- FIG. 35 is a side view (No. 1) illustrating operations of the plate moving device and the pressing device according to the first embodiment of the present invention.
- FIG. 36 is a side view (No. 2) showing operations of the plate moving device and the pressing device according to the first embodiment of the present invention.
- FIG. 37 is a side view (No.
- FIG. 38 is a side view (No. 4) showing operations of the plate moving device and the pressing device according to the first embodiment of the present invention.
- FIG. 39 is a side view (No. 5) showing the operations of the plate moving device and the pressing device in the first embodiment of the present invention.
- FIG. 40 is a side view (No. 6) showing operations of the plate moving device and the pressing device according to the first embodiment of the present invention.
- FIG. 41 is a side view (No. 7) showing the operations of the plate moving device and the pressing device in the first embodiment of the present invention.
- FIG. 42 is a side view (No.
- FIG. 43 is a plan view showing a second gap changing device in the first embodiment of the present invention.
- FIG. 44 is a plan view showing a second device transfer apparatus in the first embodiment of the present invention.
- FIG. 45 is a cross-sectional view showing a pressing device according to a second embodiment of the present invention.
- FIG. 46 is a diagram illustrating an operation of the pressing device illustrated in FIG. 45.
- FIG. 47 is a cross-sectional view showing a pressing device according to a third embodiment of the present invention.
- FIG. 48 is a diagram illustrating an operation of the pressing device illustrated in FIG. 47.
- FIG. 49 is a cross-sectional view showing a pressing device according to a fourth embodiment of the present invention.
- FIG. 50 is a diagram illustrating an operation of the pressing device illustrated in FIG. 49.
- FIG. 51 is a cross-sectional view showing a pressing device according to a fifth embodiment of the present invention.
- FIG. 52 is a diagram showing the operation of the pressing device shown in FIG.
- FIG. 53 is a cross-sectional view showing a pressing device according to a sixth embodiment of the present invention.
- FIG. 54 is a diagram showing the operation of the pressing device shown in FIG.
- FIG. 55 is a cross-sectional view showing a pressing device according to a seventh embodiment of the present invention.
- FIG. 56 is a diagram illustrating an operation of the pressing device illustrated in FIG. 55.
- FIG. 1 is a schematic plan view showing the overall configuration of the electronic component testing apparatus in the present embodiment.
- the electronic component test apparatus 1 in this embodiment is an apparatus for testing an electronic device under test (DUT) such as a semiconductor integrated circuit element. As shown in FIG. 1, a handler 20 for handling a DUT, and a test are performed. The test head 10 is electrically connected to the DUT via the HiFix 11 (see FIG. 32), and the tester main body 5 (see FIG. 32) that executes the DUT test.
- DUT electronic device under test
- the handler 20 in this embodiment includes a first device transfer device 30, a first interval changing device 40, a plate moving device 50, a pressing device 60 (electronic component pressing device), a second device An interval changing device 70, a second device transfer device 80, a plate returning device 90, and a tray forwarding device 95 are provided, and a plurality of (four in this example) contact plates 110 are provided from one customer tray 100.
- the DUTs are collectively transferred, and the DUTs are handled in the handler 20 in a state where the DUTs are accommodated in the contact plates 110.
- the handling of the contact plate 110 in the handler 20 will be outlined.
- the first device transfer device 30 has a plurality of DUTs on one contact tray 110 from one customer tray 100. Are transferred in bulk.
- the first interval changing device 40 transfers the contact plate 110 from the first device transfer device 30 to the plate moving device 50 while increasing the interval between the contact plates 110.
- the reason why the distance between the contact plates 110 is increased is to secure a necessary area for wiring or the like between the sockets 12 (see FIG. 33) on the HiFix 11.
- the plate moving device 50 supplies the contact plate 110 to the pressing device 60, and the pressing device 60 presses the DUT accommodated in the contact plate 110 against the socket 12 on the HiFix 11 attached to the test head 10.
- the tester body 5 executes the DUT test via the test head 10 and the HiFix 11.
- the contact plate 110 after the test is discharged from the pressing device 60 by the plate moving device 50, and the second device 70 is moved from the plate moving device 50 to the second device transfer device while the second interval changing device 70 narrows the interval between the contact plates 110.
- the contact plate 110 is transferred to 80.
- the second device transfer device 80 transfers the DUT from the contact plate 110 to the customer tray 100.
- the used contact plate 110 is returned from the second device transfer device 80 to the first device transfer device 30 by the plate return device 90.
- the customer tray 100 in which the DUT is empty is sent from the first device transfer device 30 to the second device transfer device 80 by the tray transfer device 95.
- FIGS. 5 to 7 show a contact plate in the present embodiment.
- FIG. 8 is a sectional view taken along line VIII-VIII in FIG.
- the customer tray 100 in this embodiment includes a flat tray body 101.
- a large number (136 in this example) of through holes 102 are formed on the main surface of the tray body 101.
- a large number of through holes 102 are arranged in a matrix (8 rows and 17 columns in this example) with a pitch in the X direction P 1 and a pitch in the Y direction P 2 .
- the through holes 102 each have a substantially rectangular opening 102a.
- substantially cross-shaped ribs 103 are erected.
- the first accommodating portion 104 is partitioned by the four ribs 103 surrounding the opening 102 a, and the DUT can be accommodated in the first accommodating portion 104.
- engagement holes 105 for engaging the first arms of the device transfer devices 30 and 80 are formed.
- the contact plate 110 includes a strip-shaped plate body 111 as shown in FIGS. As shown in FIG. 5, a convex portion 116 is formed on one side surface of the plate body 111, and a concave portion 117 is formed on the other side surface. By fitting the convex portion 116 of the contact plate 110 into the concave portion 117 of another contact plate 110, the contact plates 110 can be coupled to each other as shown in FIG.
- a large number (34 in this example) of through holes 112 are formed on the main surface of the plate body 11. These through holes 112 are arranged in a matrix (2 rows and 17 columns in this example) with a pitch of P 3 in the X direction and a pitch of P 4 in the Y direction. Further, in the present embodiment, as shown in FIG. 6, even when connecting the contact plate 110 to each other, the pitch between the through-hole 112 of an adjacent contact plate 110 is in the P 3.
- the through-holes 112 each have a substantially rectangular opening 112a. Ribs 113 are erected on four sides of the opening 112a.
- the second accommodating portion 114 is partitioned by four ribs 113 surrounding the opening 112a, and the DUT can be accommodated in the second accommodating portion 114.
- the number of second accommodating portions 114 is equal to the number of first accommodating portions 104 in one customer tray 100.
- the first storage part 104 and the second storage part 114 have the same arrangement. Therefore, a large number (136 in this example) of DUTs are simultaneously transferred between the customer tray 100 and the contact plate 110 by superimposing and reversing the four contact plates 110 on one customer tray 100. It is possible.
- the number of contact plates corresponding to one customer tray is not particularly limited. Further, the DUTs may be collectively transferred from the M customer trays to the N contact plates (however, M and N are natural numbers, and M ⁇ N). Further, the number of first accommodating portions formed on the customer tray and the number of second accommodating portions formed on the contact plate are not particularly limited.
- a groove 119 into which a shaft 123 of a reinforcing plate 120 described later is inserted is formed on the back surface of the plate body 111. Further, as shown in the figure, on both side surfaces of the plate main body 111, engagement holes 115 for engaging the second arms of the device transfer devices 30 and 80 are formed. Further, as shown in FIG. 5, insertion holes 118 into which the holding pins of the plate moving device 50 are inserted are formed in the vicinity of both ends of the plate main body 111.
- FIGS. 9 and 10 are a side view and a plan view of the first device transfer apparatus according to the present embodiment
- FIG. 11 is a perspective view showing a holding mechanism of the first device transfer apparatus shown in FIG. 9
- FIGS. 13 is a plan view and a side view of the reinforcing plate in the present embodiment
- FIGS. 14 and 15 are a plan view and a side view showing a state in which the contact plate is mounted on the reinforcing plate.
- the first device transfer device 30 of the handler 20 includes a holding mechanism 31 that holds the customer tray 100 and the contact plate 110 in an overlapping manner, and a reversing mechanism 36 that reverses the holding mechanism 31.
- An elevating mechanism 37 that elevates and lowers the reversing mechanism 36.
- the first device transfer device 30 inverts the contact plate 110 and the customer tray 100 in a state where the contact plate 110 is mounted on the reinforcing plate 120 shown in FIGS.
- the reinforcing plate 120 can mount four contact plates 110, and blocks 122 are provided at both upper and lower ends, and a shaft 123 is bridged between the blocks 122.
- the shaft 123 can be inserted into a groove 119 formed on the back surface of the contact plate 110.
- engagement holes 124 that can be engaged with the second arm 33 of the first device transfer device 30 are formed.
- the second device transfer apparatus 80 described later also uses the same material as the reinforcing plate 120.
- the holding mechanism 31 of the first device transfer device 30 includes a first arm 32 that grips the customer tray 100 and a substantially parallel arrangement with the first arm 32, and the four contact plates 110 are reinforced. And a second arm 33 for holding the plate 120.
- the first arm 32 has a pair of arm members 321 and 322 arranged to face each other with a predetermined interval.
- a gripping claw 323 that can be engaged with the engagement hole 105 of the customer tray 100 protrudes from the inner surface of each of the arm members 321 and 322.
- the pair of arm members 321 and 322 can be approached / separated from each other by the two first opening / closing cylinders 34.
- the customer tray 100 is gripped by the first arm 32 when the pair of arm members 321 and 322 sandwich the customer tray 100 therebetween.
- the customer tray 100 is set in the first device transfer apparatus 30 in a stacked state, and the uppermost customer tray 100 is positioned at a predetermined height by the elevator 39. It has become.
- the first arm 32 grips the customer tray 100 located at the uppermost stage.
- the second arm member 33 also has a pair of arm members 331 and 332 arranged to face each other with a predetermined interval. Grip claws 333 and 334 that can be engaged with the engagement holes 115 and 124 of the contact plate 110 and the reinforcing plate 120 protrude from the inner surfaces of the arms 331 and 332, respectively.
- the pair of arm members 331 and 332 included in the second arm 33 can be moved toward and away from each other by two opening / closing cylinders 35.
- the second arm 33 grips the four contact plates 110 and the reinforcing plate 120 by sandwiching the contact plate 110 and the reinforcing plate 120 supported by the support base 38 between the pair of arm members 331 and 332. .
- the reversing mechanism 36 of the first device transfer device 30 can rotate the holding mechanism 31 180 degrees by a motor or the like.
- the elevating mechanism 37 can elevate and lower the holding mechanism 31 and the reversing mechanism 36 with an air cylinder or the like.
- 16 to 24 are diagrams for explaining the operation of the first device transfer apparatus according to the present embodiment.
- the elevating device 37 lowers the holding mechanism 31 positioned above the reinforcing plate 120 and the contact plate 110 supported by the support base 38.
- the lifting mechanism 37 raises the holding mechanism 31 and the reversing mechanism 36 holds, as shown in FIG.
- the mechanism 31 is rotated 180 degrees.
- the elevating mechanism 37 lowers the holding mechanism 31 and puts the contact plate 110 on the customer tray 100 as shown in FIGS.
- the lifting mechanism 37 raises the holding mechanism 31, and the reversing mechanism 36 rotates the holding mechanism 31 again by 180 degrees. Let By this rotation, as shown in FIG. 22, all the DUTs accommodated in the first accommodating part 104 of one customer tray 100 are collectively put in the second accommodating parts 114 of the four contact plates 110. Are transferred.
- the elevating mechanism 37 lowers the holding mechanism 31 to place the reinforcing plate 120 on the support base 38, and the second arm 33 releases the reinforcing plate 120 and the contact plate 110.
- the lifting mechanism 37 raises the holding mechanism 31, and the reversing mechanism 36 rotates the holding mechanism 31 again by 180 degrees. Thereby, as shown in FIG. 24, the customer tray 100 is removed from the contact plate 110.
- the customer tray 100 in which the DUT is empty, as shown in FIG. 1 is transferred from the first device transfer device 30 to the second device transfer by a tray forwarding device 95 including a pick-and-place device or the like. It is forwarded to the device 80.
- FIGS. 25 and 26 are a plan view and a side view showing the first interval changing device in the present embodiment
- FIGS. 27 and 28 are a side view and a plan view showing the movable head of the first interval changing device.
- the first interval changing device 40 of the handler 20 includes a pair of Y-direction rails 41, a movable arm 42, an elevating actuator 43, and a movable head 45.
- the Y direction rail 41 is bridged between the first device transfer device 30 and the plate moving device 50 along the Y direction.
- the Y-direction rail 41 supports a movable arm 42, and the movable arm 42 can move in the Y direction.
- the movable arm 42 is provided with a lifting actuator 43 constituted by an air cylinder or the like, and this lifting actuator 43 can move in the X direction.
- a movable head 45 is attached to the tip of the lift actuator 43, and the movable head 45 can be moved up and down by the lift actuator 43.
- the movable head 45 includes a base member 46, a holding member 47 that holds the contact plate 110, an interval changing mechanism 48 that changes the interval between the holding members 47, the base member 46, and the like. And a connecting mechanism 49 that connects the holding member 47.
- the base member 46 is fixed to the tip of the drive shaft of the lift actuator 43. Then, four holding members 47 are attached to the base member 46 via an interval changing mechanism 48 and a connecting mechanism 49.
- Each holding member 47 has a strip shape corresponding to each contact plate 110, and gripping claws 471 for gripping the contact plate 110 are provided at both ends thereof so as to be openable and closable.
- the number of holding members 47 included in the movable head 45 is not particularly limited to the above number, and is set according to the number of contact plates 110 corresponding to one customer tray 100, for example.
- the interval changing mechanism 48 includes an air cylinder 481 provided on the base member 46, a cam plate 482 fixed to the tip of the drive shaft of the air cylinder 481, and a cam follower 472 provided on the upper surface of each contact plate 110. , Is composed of.
- the cam plate 482 has four cam grooves 482a.
- Pitch of cam groove 482a has a pitch S 1 of the relatively narrow first, continuously varies between a relatively wide second pitch S 2.
- Cam followers 472 protruding from the upper surface of each contact plate 110 are slidably inserted into the four cam grooves 482a.
- the connecting member 49 includes a connecting member 491 extending downward from the base member 46 and a linear guide 492 provided at the tip of the connecting member 491.
- the linear guide 492 is provided on the guide rail 493 fixed to the distal end of the connecting member 491 and the upper surface of each holding member 47, and is slidably engaged with the guide rail 493 along the X direction. And is composed of.
- the connecting mechanism 49 connects the holding member 47 to the base member 46 while allowing the interval changing mechanism 48 to change the interval between the holding members 47.
- FIG. 29 and FIG. 30 are plan views showing the contact plate conveying operation by the first interval changing device in the present embodiment
- FIG. 31 is a plan view showing the contact plate setting operation by the first interval changing device in the present embodiment. It is.
- the movable arm 42 moves on the Y-direction rail 41.
- the distance changing mechanism 48 of the movable head 45 by widening the pitch between the cam follower 472 from the first pitch S 1 in the second pitch S 2, increase the distance between the holding member 47.
- the movable arm 42 stops, and the elevating actuator 43 lowers the movable head 45, so that the four contact plates 110 are moved to the plate moving device 50. Placed on.
- the pitch between the cam follower 472 is changed to the second pitch S 2 by a distance changing mechanism 48, the spacing between the holding member 47 is spread, the sequence of the DUT that are accommodated in the contact plate 110, high This corresponds to the arrangement of the sockets 12 on the fix 11.
- interval change apparatus 40 makes the 1st contact plate 110 returned from the 2nd device transfer apparatus 80 by the plate return apparatus 90 comprised, for example from a rotating belt etc. for the 1st. It is also possible to move it onto the reinforcing plate 120 of the device transfer device 30.
- FIG. 32 and 33 are views showing a plate moving device and a pressing device according to this embodiment
- FIG. 34 is a cross-sectional view showing the pressing device according to this embodiment.
- the number of sockets and pressing portions is shown to be smaller than the actual number, and the same applies to FIGS. 45 to 56 described later.
- the plate moving device 50 of the handler 20 includes a pair of X direction rails 51 and two sets of moving bodies 52 and 55 as shown in FIGS. 32 and 33.
- the pair of X-direction rails 51 includes a first position L 1 that receives the contact plate 110 from the first interval changing device 40 and a third position L 3 that delivers the contact plate 110 to the second interval changing device 70. In between, they are provided substantially in parallel with a predetermined interval.
- a pressing device 60 is provided at a substantially central portion (second position L 2 ) of the X-direction rail 51, and the test head 10 faces the handler 20 from above so as to face the pressing device 60. .
- the first moving body 52 includes a pair of holding members 53 and 54 provided on the X direction rail 51 so as to be slidable along the X direction.
- the holding members 53 and 54 are each provided with four holding pins 531 and 541 that can be inserted into the insertion holes 118 of the contact plate 110. Therefore, the first moving body 52 can hold the four contact plates 110 simultaneously.
- the second moving body 55 includes a pair of holding members 56 and 57 provided on the X direction rail 51 so as to be movable along the X direction.
- the holding members 56 and 57 include a contact plate.
- Four holding pins 561 and 571 that can be inserted into the 110 insertion holes 118 are provided upright. Therefore, the second moving body 55 can also hold the four contact plates 110 simultaneously.
- the number of contact plates 110 that can be simultaneously held by the first and second moving bodies 52 and 55 is not particularly limited to the above number, and for example, the number of contact plates 110 corresponding to one customer tray 100. Is set according to
- the first movable member 52 moves the contact plate 110 between a first position L 1 and the second position L 2.
- the second moving body 55 moves the contact plate 110 and a second position L 2 and the third position L 3. Further, the first moving body 52 and the second moving body 55 can move on the X-direction rail 51 independently of each other.
- the pressing device 60 includes a pressing unit 61 that presses the DUT held by the contact plate 110 against the socket 12, and a Z-axis actuator (moving means) 69 that moves the pressing unit 61 up and down. .
- the pressing unit 61 in the present embodiment includes a plurality of pressing portions 62, a base plate 631, a temperature adjustment plate 641, and a bellowram cylinder 67.
- Each pressing portion 62 is made of a metal prismatic or columnar member having an upper surface having a shape corresponding to the DUT.
- the base plate 631 is made of a metal plate member.
- the plurality of pressing portions 62 are provided so as to protrude in a convex shape on one main surface of the base plate 631, and are arranged on the base plate 631 so as to correspond to the arrangement of the sockets 12 in the test head 10.
- the pressing unit 62 directly contacts each DUT when the pressing unit 61 presses the DUT against the socket 12.
- the temperature control plate 635 is a metal plate laminated on the lower side of the base plate 631 and is supplied with a refrigerant (for example, Fluorinert (registered by 3M) (registered) from a chiller (not shown) connected via a pipe 637.
- a refrigerant for example, Fluorinert (registered by 3M) (registered) from a chiller (not shown) connected via a pipe 637.
- a flow path 636 capable of circulating the trademark
- a heating medium may be circulated in the flow path 636 instead of the refrigerant, or a heater or the like may be embedded in the temperature adjustment plate 635.
- the rigidity of the plate laminate 63 composed of the base plate 631 and the temperature adjustment plate 635 is set to be relatively lower than the rigidity of the spacing frame 14 (described later) of the HiFix 11.
- the base plate 631 and the temperature adjustment plate 635 are thinned, a notch is formed in the base plate 631 and the temperature adjustment plate 635, or the base plate 631 and the temperature adjustment plate 635 are made of a low-strength material. The rigidity of the plate laminate 63 is reduced.
- the temperature adjustment plate 635 may not be provided in the pressing unit 61.
- the rigidity of the base plate 631 alone is set to be relatively lower than the rigidity of the spacing frame 14 of the HiFix 11.
- the belofram cylinder 67 presses the base plate 631 with a constant pressure via the temperature adjustment plate 635 and can absorb an excessive load applied to the DUT.
- This bellowram cylinder 67 is fixed to a lift plate 691 of the Z-direction actuator 69.
- the pressing unit 61 is disposed between the pair of X-direction rails 51 in a plan view, and even if the pressing unit 61 is moved up and down by the Z-direction actuator 69, There is no interference with the direction rail 51.
- Hifix (interface device) 11 is mounted on the upper part (lower part in FIG. 34) of the test head 10.
- the HiFix 11 includes a plurality of socket boards 15 on which the sockets 12 are mounted, and a frame-like spacing frame 14 that holds the plurality of socket boards 15.
- the socket 12 has a large number of contact pins 13 that are in electrical contact with the terminals HB of the DUT, and is arranged on the HiFix 11 so as to correspond to the DUTs held by the four contact plates 110. .
- the rigidity of the spacing frame 14 is set to be relatively higher than the rigidity of the plate laminate 63 of the pressing unit 61 by reducing the thickness of the plate laminate 63 of the pressing unit 61. ing.
- the rigidity of the spacing frame 14 is relatively higher than the rigidity of the plate laminate 63 of the pressing unit 61. You may set it high.
- 35 to 42 are diagrams for explaining the operation of the plate moving device and the pressing device in the present embodiment.
- the first movable member 52 located in the first position L 1 on the X-direction rails 51, the four contact plate 110 To do. Then, as shown in FIG. 36, the first movable member 52 is moved on the X-direction rails 51 from the first position L 1 to the second position L 2. By the operation of the first moving body 52, the contact plate 110 is positioned above the pressing unit 61 of the pressing device 60 as shown in FIG.
- the pressing device 60 raises the pressing unit 61 by the Z-direction actuator 69, and the pressing unit 61 receives the contact plate 110 from the first moving body 52. 61 is further raised.
- the DUT is lifted from the contact plate 110 by the pressing portion 62 of the pressing unit 61 and pressed against the socket 12 of the HiFix 11, and the terminal HB of the DUT and the contact pin 13 of the socket 12 are connected. Make electrical contact.
- the tester body 5 inputs / outputs a test signal to / from the DUT via the test head 10 and the HiFix 11, whereby the DUT test is executed.
- the spacing frame 14 of the HiFix 11 bends as the pressing device 60 is pressed.
- the rigidity of the plate laminate 63 of the pressing unit 61 is set to be relatively lower than the rigidity of the spacing frame 14 of the HiFix 11, so that the plate laminate 63 is the spacing frame. It deforms so as to follow the bending of 14. For this reason, it is possible to suppress the occurrence of contact failure between the terminal HB of the DUT and the contact pin 13 of the socket 12.
- the tester body 5 While the tester body 5 is running a test of the DUT, as shown in FIG. 40, the first moving body 52 is retracted from the second position L 2 to the first position L 1, the second mobile 55 moves from the third position L 3 to the second position L 2.
- the Z-direction actuator 69 of the pressing device 60 lowers the pressing unit 61, and the second moving body 55 removes the tested contact plate 110 from the pressing unit 61. receive.
- the second moving body 55 is moved from the second position L 2 in the third position L 3, the second interval changing device 70 from the second moving body 55 4
- the contact plates 110 are transferred to the second device transfer device 80.
- FIG. 43 is a plan view showing a second interval changing apparatus in the present embodiment
- FIG. 44 is a plan view showing a second device transfer apparatus in the present embodiment.
- the second interval changing device 70 of the handler 20 has a pair of Y-direction rails 71 and a Y-direction rail 71 along the Y direction, similar to the first interval changing device 40 described above.
- a movable arm 72 supported so as to be movable, a lift actuator supported so as to be movable along the X direction on the movable arm 72, and a movable head 75 movable up and down by the lift actuator are provided.
- the movable head 75 has an interval changing mechanism that changes the interval of the holding member that holds the contact plate 110, and moves the contact plate 110. While moving from the device 50 to the second device transfer device 80, the distance between the contact plates 110 can be reduced.
- the second interval changing device 70 transfers the contact plate 110 from the plate moving device 50 to the second device transfer device 80 while narrowing the interval between the four contact plates 110. Then, the second device transfer device 80 superimposes the customer tray 100 on the four contact plates 110 and inverts them, thereby reversing all of the ones accommodated in the second accommodation portions 114 of the four contact plates 110. Are collectively transferred to the first accommodating portion 104 of the customer tray 100.
- the customer tray 100 in which the DUT is empty is forwarded from the first device transfer device 30 to the second device transfer device 80 by the tray transfer device 95 as shown in FIG.
- the used contact plate 110 is returned from the second device transfer device 80 to the first device transfer device 30 by the plate return device 90.
- the customer tray 100 in which the tested DUT is accommodated is stored in a state of being stacked on the second device transfer device 80.
- the customer trays 100 are taken out from the handler 20 and inserted into, for example, a dedicated classification machine.
- DUTs are classified into categories according to the results of tests performed by the tester body 5 of the electronic component test apparatus 1.
- the rigidity of the plate laminate 63 of the pressing unit 61 is relatively lower than the rigidity of the spacing frame 14 of the HiFix 11, so that the plate laminate 63 is the spacing frame. 14 so that the contact failure between the DUT and the socket 12 can be suppressed.
- FIG. 45 is a cross-sectional view showing the pressing device according to the second embodiment of the present invention
- FIG. 46 is a diagram showing the operation of the pressing device shown in FIG.
- the configuration of the pressing unit 61B of the pressing device 60B is different from that of the first embodiment, but the other configuration is the same as that of the first embodiment.
- the same components as those in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.
- the rigidity of the base plate 631B is set to be relatively lower than the rigidity of the spacing frame 14 of the HiFix 11. Specifically, the rigidity of the base plate 631B is reduced by thinning the base plate 631B, forming cuts in the base plate 631B, or configuring the base plate 631B with a low-strength material.
- the rigidity of the temperature adjustment plate 635B is set to be relatively higher than the rigidity of the spacing frame 14. Specifically, the temperature adjustment plate 635B is thickened, or the temperature adjustment plate 635B is made of a high-strength material, thereby increasing the rigidity of the temperature adjustment plate 635.
- a heat transfer body 65B is interposed between the base plate 631B and the temperature adjustment plate 635B.
- the heat transfer body 65B is composed of a bellows 651 whose internal space is filled with, for example, a liquid 652 having excellent heat transfer properties (for example, Fluorinert (registered trademark) manufactured by 3M), and follows the base plate 631B. Deformable.
- the spacing frame 14 of the HiFix 11 is bent as the pressing device 60B is pressed, as shown in FIG.
- the rigidity of the base plate 631B is set to be relatively lower than the rigidity of the spacing frame 14, the base plate 631B is deformed so as to follow the bending of the spacing frame 14. For this reason, generation
- the temperature adjustment plate 635B since the rigidity of the temperature adjustment plate 635B is set to be relatively higher than the rigidity of the spacing frame 14, the temperature adjustment plate 635B is not deformed even if the spacing frame 14 is bent. However, since the heat transfer body 65B that deforms following the base plate 631B is interposed between the temperature control plate 635B and the base plate 631B, a heat transfer path from the temperature control plate 635B to the base plate 631B is secured. .
- FIG. 47 is a sectional view showing a pressing device according to the third embodiment of the present invention
- FIG. 48 is a diagram showing the operation of the pressing device shown in FIG.
- the configuration of the pressing device 60C is different from that of the first embodiment, but other configurations are the same as those of the first embodiment.
- the differences from the first embodiment of the electronic component testing apparatus according to the third embodiment will be described, and portions having the same configurations as those of the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.
- the rigidity of the base plate 631C is set to be relatively lower than the rigidity of the spacing frame 14 of the HiFix 11.
- the rigidity of the temperature adjustment plate 635C is set to be relatively higher than the rigidity of the spacing frame 14.
- the temperature adjustment plate 635C in the present embodiment also has a flow path through which the refrigerant can flow.
- a heat transfer body 65C is interposed between the base plate 631C and the temperature adjustment plate 635C.
- the heat transfer body 65C in the present embodiment is a sheet-like member composed of, for example, a rubber sheet containing conductive particles such as metal particles and carbon particles, and can be deformed following the base plate 631C.
- the heat transfer body 65B described in the second embodiment may be interposed between the base plate 631C and the temperature adjustment plate 635C instead of the heat transfer body 65C formed of the sheet-like member.
- a shaft 66 is interposed between the base plate 631C and the bellowram cylinder 67.
- Each shaft 66 has a shape branched at an intermediate portion so as to correspond to the pressing portion 62 on the base plate 631C.
- the shaft 66 is inserted into through-holes 638 and 653 formed in the temperature control sheet 635C and the heat transfer body 65C, respectively, so that the shaft 66 can move up and down. Is in contact with the base plate 631C at a position corresponding to the pressing portion 62.
- the spacing frame 14 of the HiFix 11 bends as the pressing unit 61C is pressed, as shown in FIG.
- the rigidity of the base plate 631C is set to be relatively lower than the rigidity of the spacing frame 14, the base plate 631C is deformed so as to follow the bending of the spacing frame 14. For this reason, generation
- the temperature adjustment plate 635C since the rigidity of the temperature adjustment plate 635C is set to be relatively higher than the rigidity of the spacing frame 14, the temperature adjustment plate 635C is not deformed even if the spacing frame 14 is bent. However, since the heat transfer body 65C that deforms following the base plate 631C is interposed between the temperature control plate 635C and the base plate 631C, a heat transfer path from the temperature control plate 635C to the base plate 631C is secured. .
- FIG. 49 is a cross-sectional view showing a pressing device according to the fourth embodiment of the present invention
- FIG. 50 is a diagram showing the operation of the pressing device shown in FIG.
- the configuration of the pressing unit 61D of the pressing device 60D is different from that of the first embodiment, but the other configuration is the same as that of the first embodiment.
- the same reference numerals will be given to portions having the same configuration as in the first embodiment, and description thereof will be omitted.
- the rigidity of the base plate 631D is set to be relatively lower than the rigidity of the spacing frame 14 of the HiFix 11.
- the rigidity of the temperature adjustment plate 635D is set to be relatively higher than the rigidity of the spacing frame 14. Note that, although not particularly shown in FIG. 49, similarly to the first embodiment, the temperature adjustment plate 635D in the present embodiment is also formed with a flow path capable of circulating the refrigerant.
- the shaft 66 is interposed between the base plate 631D and the bellowram cylinder 67. Similar to the third embodiment, the shaft 66 has a shape branched at an intermediate portion so as to correspond to the pressing portion 62 on the base plate 631D.
- the shaft 66 is inserted into a through-hole 638 formed in the temperature adjustment sheet 635D so as to be movable up and down, a rear end thereof is in contact with the bellowram cylinder 67, and a tip of the shaft 66 corresponds to the pressing portion 62. Is in contact with the base plate 631D.
- the spacing frame 14 of the HiFix 11 is bent as the pressing unit 60D is pressed as shown in FIG.
- the rigidity of the base plate 631D is set to be relatively lower than the rigidity of the spacing frame 14, the base plate 631D is deformed so as to follow the bending of the spacing frame 14. For this reason, generation
- the heat transfer path from the temperature adjustment plate 635D to the base plate 631D is secured by the shaft 66.
- FIG. 51 is a cross-sectional view showing a pressing device according to a fifth embodiment of the present invention
- FIG. 52 is a diagram showing the operation of the pressing device shown in FIG.
- the configuration of the pressing device 60E is different from that of the first embodiment, but the other configurations are the same as those of the first embodiment.
- the differences from the first embodiment of the electronic component testing apparatus according to the fifth embodiment will be described, and portions having the same configurations as those of the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.
- the pressing device 60E in the present embodiment includes a plurality of pressing units 61E.
- Each pressing unit 61E includes a predetermined number of pressing portions 62, a base plate 631E provided so that the pressing portions 62 protrude in a convex shape, a temperature adjustment plate 635E stacked on the base plate 631E, and a temperature adjustment plate.
- a bellowram cylinder 67 that applies a predetermined pressure to the base plate 631E via the 635E, and the pressing units 61E can move up and down independently of each other.
- the flow path 636 similar to that of the first embodiment is formed in the temperature adjustment plate 635E of each pressing unit 61E, and the bellows 64 (flow path connecting means) is interposed between the pressing units 61E.
- the flow path 636 of each pressing unit 61E communicates with each other by the bellows 64.
- the pressing unit 61E is divided into a plurality of units with a predetermined number of pressing parts 62 as a unit, and the plurality of pressing units 61E can move up and down independently of each other. Therefore, the height of each pressing unit 61E changes according to the bending of the spacing frame 14, so that the bending of the spacing frame 14 can be absorbed and the occurrence of poor contact between the DUT and the socket 12 is suppressed. be able to.
- each pressing unit 61E the heat transfer bodies 65B and 65C described in the second embodiment and the third embodiment may be interposed between the base plate 631E and the temperature adjustment plate 635E.
- FIG. 53 is a cross-sectional view showing a pressing device according to the sixth embodiment of the present invention
- FIG. 54 is a diagram showing the operation of the pressing device shown in FIG.
- the configuration of the pressing unit 61F of the pressing device 60F is different from that of the first embodiment, but the other configuration is the same as that of the first embodiment.
- the differences from the first embodiment of the electronic component testing apparatus in the sixth embodiment will be described, and portions having the same configurations as those of the first embodiment will be described with the same reference numerals.
- the base plate 631F is divided with a predetermined number of pressing portions 62 as a unit.
- a shaft 66 is interposed between each base plate 631F and the bellofram cylinder 67. Similar to the third and fourth embodiments, the shaft 66 has a shape branched at an intermediate portion so as to correspond to the pressing portion 62 on the base plate 631F. The shaft 66 is inserted into a through-hole 638 formed in the temperature adjustment sheet 635F so as to be movable up and down, a rear end thereof is in contact with the bellowram cylinder 67, and a front end thereof is a position corresponding to the pressing portion 62. Is in contact with the base plate 631F. Although not particularly shown in FIG. 53, similarly to the first embodiment, the temperature adjustment plate 635F in the present embodiment is also provided with a flow path capable of circulating the refrigerant.
- each base plate 631F changes its height in accordance with the bending of the spacing frame 14, and thereby the scanning is performed.
- the bending of the pacing frame 14 can be absorbed. For this reason, generation
- heat transfer bodies 65B and 65C described in the second embodiment and the third embodiment may be interposed between the base plate 631F and the temperature control plate 635F.
- FIG. 55 is a cross-sectional view showing the pressing device according to the seventh embodiment of the present invention
- FIG. 56 is a diagram showing the operation of the pressing device shown in FIG.
- the point where the engagement shaft 16 is provided on the HiFix 11 and the configuration of the pressing device 60G are different from those of the first embodiment, but other configurations are the same as those of the first embodiment. .
- the electronic component test apparatus according to the seventh embodiment will be described only with respect to differences from the first embodiment, and portions having the same configurations as those of the first embodiment will be described with the same reference numerals.
- the engagement shaft 16 is erected on the spacing frame 14.
- the engagement shaft 16 protrudes toward the pressing device 60G, has a tapered tip portion 161, and an engagement groove 162 is formed in the vicinity of the tip portion 161.
- through holes 632, 639, and 692 are formed at positions corresponding to the engagement shaft 16 in the base plate 631G, the temperature adjustment plate 635G, and the lifting plate 691 of the pressing device 60G, respectively.
- the temperature adjustment plate 635G in the present embodiment is also formed with a flow path capable of circulating the refrigerant.
- a lock plate 68 (connection means) is slidably inserted into the Z-axis actuator 69.
- An engagement hole 681 is formed in the lock plate 68 at a position corresponding to the engagement shaft 16.
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Abstract
Description
図1は本実施形態における電子部品試験装置の全体構成を示す概略平面図である。
図45は本発明の第2実施形態における押圧装置を示す断面図、図46は図45に示す押圧装置の作用を示す図である。
図47は本発明の第3実施形態における押圧装置を示す断面図、図48は図47に示す押圧装置の作用を示す図である。
図49は本発明の第4実施形態における押圧装置を示す断面図、図50は図49に示す押圧装置の作用を示す図である。
図51は本発明の第5実施形態における押圧装置を示す断面図、図52は図51に示す押圧装置の作用を示す図である。
図53は本発明の第6実施形態における押圧装置を示す断面図、図54は図53に示す押圧装置の作用を示す図である。
図55は本発明の第7実施形態における押圧装置を示す断面図、図56は図55に示す押圧装置の作用を示す図である。
11…ハイフィックス
12…ソケット
14…スペーシングフレーム
16…係合シャフト
20…ハンドラ
60,60B~60G…押圧装置
61,61B~61G…押圧ユニット
62…押圧部
63…プレート積層体
631,631B~631G…ベースプレート
635,635B~635G…温度調節プレート
64…ベローズ
65B,65C…伝熱体
66…シャフト
67…ベロフラムシリンダ
68…ロックプレート
69…Z方向アクチュエータ
691…昇降プレート
110…コンタクトプレート
Claims (35)
- テストヘッドに装着されたインタフェース装置上のソケットに前記被試験電子部品を押し付ける電子部品押圧装置であって、
前記被試験電子部品に接触する複数の押圧部と、
複数の前記押圧部が設けられたベースプレートと、を有する押圧ユニットを備えており、
前記ベースプレートの剛性は、前記インタフェース装置において前記ソケットを保持している保持部材の剛性よりも相対的に低いことを特徴とする電子部品押圧装置。 - 請求項1記載の電子部品押圧装置であって、
前記押圧ユニットは、前記被試験電子部品の温度を調節する温度調節プレートを有しており、
前記温度調節プレートは、前記ベースプレートに積層されていることを特徴とする電子部品押圧装置。 - 請求項2記載の電子部品押圧装置であって、
前記温度調節プレートは、冷媒又は温媒の少なくとも一方が流通する流路を有することを特徴とする電子部品押圧装置。 - 請求項1~3の何れかに記載の電子部品押圧装置であって、
前記保持部材は、前記インタフェース装置において、前記ソケットが実装されたソケットボードを保持しているスペーシングフレームであることを特徴とする電子部品押圧装置。 - 請求項2~4の何れかに記載の電子部品押圧装置であって、
前記ベースプレートと前記温度調節プレートを積層して構成されるプレート積層体の剛性は、前記保持部材の剛性よりも相対的に低いことを特徴とする電子部品押圧装置。 - 請求項5記載の電子部品押圧装置であって、
前記押圧ユニットを前記ソケットに向かって移動させる移動手段を備え、
前記押圧ユニットは、前記ベースプレートに所定圧力を印加するシリンダを有することを特徴とする電子部品押圧装置。 - 請求項2~4の何れかに記載の電子部品押圧装置であって、
前記押圧ユニットは、
前記ベースプレートに所定圧力を印加するシリンダと、
前記シリンダと前記ベースプレートとの間に配置され、前記温度調節プレートを貫通しているシャフトと、を有していることを特徴とする電子部品押圧装置。 - 請求項7記載の電子部品押圧装置であって、
前記押圧ユニットを前記ソケットに向かって移動させる移動手段を備えていることを特徴とする電子部品押圧装置。 - 請求項2~4の何れかに記載の電子部品押圧装置であって、
前記押圧ユニットは、前記ベースプレートと前記温度調節プレートとの間に積層され、前記ベースプレートと前記温度調節プレートとを熱的に接続する伝熱体を備えており、
前記伝熱体は、前記ベースプレートと共に変形可能であることを特徴とする電子部品押圧装置。 - 請求項9記載の電子部品押圧装置であって、
前記伝熱体は、流体が注入された袋体であることを特徴とする電子部品押圧装置。 - 請求項9記載の電子部品押圧装置であって、
前記伝熱体は、弾性変形可能なシート状部材であることを特徴とする電子部品押圧装置。 - 請求項10又は11記載の電子部品押圧装置であって、
前記押圧ユニットを前記ソケットに向かって移動させる移動手段を備え、
前記押圧ユニットは、
前記ベースプレートに所定圧力を印加するシリンダと、
前記シリンダと前記ベースプレートとの間に配置され、前記温度調節プレートと前記伝熱体を貫通しているシャフトと、を有していることを特徴とする電子部品押圧装置。 - テストヘッドに装着されたインタフェース装置上のソケットに被試験電子部品を押し付ける電子部品押圧装置であって、
前記被試験電子部品を押圧する複数の押圧ユニットを備え、
前記押圧ユニットは、
前記被試験電子部品に接触する複数の押圧部と、
複数の前記押圧部が設けられたベースプレートと、をそれぞれ有しており、
複数の前記押圧ユニットは、相互に独立して移動可能であることを特徴とする電子部品押圧装置。 - 請求項13記載の電子部品押圧装置であって、
前記インタフェース装置において、前記ソケットを保持している保持部材は、前記ソケットが実装されたソケットボードを保持しているスペーシングフレームであることを特徴とする電子部品押圧装置。 - 請求項13又は14記載の電子部品押圧装置であって、
複数の前記押圧ユニットを前記ソケットに向かって同時に移動させる移動手段を備え、
前記押圧ユニットは、前記ベースプレートに一定の圧力を印加するシリンダをそれぞれ有していることを特徴とする電子部品押圧装置。 - 請求項13~15の何れかに記載の電子部品押圧装置であって、
前記押圧ユニットは、前記ベースプレートに積層され、前記被試験電子部品の温度を調節する温度調節プレートをそれぞれ有することを特徴とする電子部品押圧装置。 - 請求項16記載の電子部品押圧装置であって、
前記温度調節プレートは、冷媒又は温媒の少なくとも一方が流通する流路を有することを特徴とする電子部品押圧装置。 - 請求項17記載の電子部品押圧装置であって、
前記温度調節ジャケットの流路を相互に連結する流路連結手段を備えており、
複数の前記押圧ユニットの間に前記流路連結手段が介装されていることを特徴とする電子部品押圧装置。 - 請求項16~18の何れかに記載の電子部品押圧装置であって、
前記押圧ユニットは、前記ベースプレートと前記温度調節プレートとの間に積層され、前記ベースプレート前記温度調節プレートとを熱的に接続する伝熱体をそれぞれ有していることを特徴とする電子部品押圧装置。 - 請求項19記載の電子部品押圧装置であって、
前記伝熱体は、流体が注入された袋体であることを特徴とする電子部品押圧装置。 - 請求項19記載の電子部品押圧装置であって、
前記伝熱体は、弾性変形可能なシート状部材であることを特徴とする電子部品押圧装置。 - テストヘッドに装着されたインタフェース装置上のソケットに被試験電子部品を押し付ける電子部品押圧装置であって、
前記被試験電子部品を押圧する押圧ユニットと、
前記押圧ユニットを前記ソケットに向かって移動させる移動手段と、を備えており、
前記押圧ユニットは、
前記被試験電子部品に接触する複数の押圧部がそれぞれ設けられた複数のベースプレートと、
前記ベースプレートに所定圧力を印加する複数のシリンダと、
前記ベースプレートと前記シリンダとの間に配置されている複数のシャフトと、を有することを特徴とする電子部品押圧装置。 - 請求項22記載の電子部品押圧装置であって、
前記押圧ユニットは、前記被試験電子部品の温度を調節する温度調節プレートを有しており、
前記シャフトは、前記温度調節プレートを貫通していることを特徴とする電子部品押圧装置。 - 請求項23記載の電子部品押圧装置であって、
前記温度調節プレートは、冷媒又は温媒の少なくとも一方が流通する流路を有することを特徴とする電子部品押圧装置。 - 請求項23又は24記載の電子部品押圧装置であって、
前記押圧ユニットは、前記ベースプレートと前記温度調節プレートとの間に積層され、前記ベースプレートと前記温度調節プレートとを熱的に接続する伝熱体を有しており、
前記シャフトは、前記伝熱体を貫通していることを特徴とする電子部品押圧装置。 - 請求項25記載の電子部品押圧装置であって、
前記伝熱体は、流体が注入された袋体であることを特徴とする電子部品押圧装置。 - 請求項25記載の電子部品押圧装置であって、
前記伝熱体は弾性変形可能なシート状部材であることを特徴とする電子部品押圧装置。 - テストヘッドに装着されたインタフェース装置上のソケットに被試験電子部品を押し付ける電子部品押圧装置であって、
前記被試験電子部品に接触する複数の押圧部が設けられたベースプレートと、
前記インタフェース装置において前記ソケットを保持している保持部材と、前記ベースプレートとを連結する連結手段と、を備えていることを特徴とする電子部品押圧装置。 - 請求項28記載の電子部品押圧装置であって、
前記被試験電子部品の温度を調節する温度調節プレートを備え、
前記温度調節プレートは、前記ベースプレートに積層されていることを特徴とする電子部品押圧装置。 - 請求項29記載の電子部品押圧装置であって、
前記温度調節プレートは、冷媒又は温媒の少なくとも一方が流通する流路を有することを特徴とする電子部品押圧装置。 - 請求項28~30の何れかに記載の電子部品押圧装置であって、
前記保持部材は、前記テストヘッドにおいて、前記ソケットが実装されたソケットボードを保持しているスペーシングフレームであることを特徴とする電子部品押圧装置。 - 請求項28~31の何れかに記載の電子部品押圧装置であって、
前記押圧ユニットを前記ソケットに向かって移動させる移動手段を備え、
前記押圧ユニットは、前記ベースプレートに所定圧力を印加するシリンダを有することを特徴とする電子部品押圧装置。 - 被試験電子部品をテストする電子部品試験装置であって、
前記被試験電子部品と電気的に接触するソケットを有するインタフェース装置が装着されたテストヘッドと、
前記ソケットに前記被試験電子部品を押し付ける請求項1~32の何れかに記載の電子部品押圧装置と、を備えたことを特徴とする電子部品試験装置。 - 被試験電子部品に電気的に接触するソケットを有し、テストヘッドに装着されて、前記被試験電子部品と前記テストヘッドとの間の電気的な中継を行うインタフェース装置であって、
前記ソケットを保持する保持部材を備えており、
前記保持部材の剛性は、前記被試験電子部品を押圧する複数の押圧部が設けられたベースプレートの剛性よりも相対的に高いことを特徴とするインタフェース装置。 - 請求項34記載のインタフェース装置であって、
前記保持部材は、前記ソケットが実装されたソケットボードを保持しているスペーシングフレームであることを特徴とするインタフェース装置。
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US13/383,537 US20120112777A1 (en) | 2009-07-14 | 2009-07-14 | Electronic device pushing apparatus, electronic device test apparatus, and interface device |
JP2011522645A JPWO2011007419A1 (ja) | 2009-07-14 | 2009-07-14 | 電子部品押圧装置、電子部品試験装置及びインタフェース装置 |
KR1020127002686A KR101313613B1 (ko) | 2009-07-14 | 2009-07-14 | 전자부품 압압장치, 전자부품 시험장치 및 인터페이스 장치 |
PCT/JP2009/062734 WO2011007419A1 (ja) | 2009-07-14 | 2009-07-14 | 電子部品押圧装置、電子部品試験装置及びインタフェース装置 |
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CN105992955A (zh) * | 2013-12-03 | 2016-10-05 | 株式会社幸福日本 | Ic处理装置 |
TWI846247B (zh) | 2022-03-16 | 2024-06-21 | 日商阿德潘鐵斯特股份有限公司 | 溫度調整裝置、電子元件處理裝置以及電子元件測試裝置 |
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US9341671B2 (en) | 2013-03-14 | 2016-05-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Testing holders for chip unit and die package |
KR102001468B1 (ko) * | 2013-05-09 | 2019-07-18 | 세메스 주식회사 | 전기 접속 장치 |
JP6209375B2 (ja) * | 2013-07-08 | 2017-10-04 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP6209376B2 (ja) * | 2013-07-08 | 2017-10-04 | 株式会社日本マイクロニクス | 電気的接続装置 |
US9285394B2 (en) * | 2014-01-09 | 2016-03-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Testing apparatus and method |
US10665489B2 (en) * | 2016-06-24 | 2020-05-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated chip die carrier exchanger |
CN106995107A (zh) * | 2017-04-28 | 2017-08-01 | 智宝电子(东莞)有限公司 | 一种用于电容充放电测试的半自动电容排列机 |
KR20210153787A (ko) * | 2020-06-10 | 2021-12-20 | 세메스 주식회사 | 기류 조절 장치 및 이를 포함하는 테스트 핸들러 |
KR102357723B1 (ko) * | 2021-09-15 | 2022-02-08 | (주)새한마이크로텍 | 신호 손실 방지용 테스트 소켓 |
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KR20120061815A (ko) | 2012-06-13 |
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