MY148619A - Pusher, pusher unit and semiconductor testing apparatus - Google Patents

Pusher, pusher unit and semiconductor testing apparatus

Info

Publication number
MY148619A
MY148619A MYPI20063467A MYPI20063467A MY148619A MY 148619 A MY148619 A MY 148619A MY PI20063467 A MYPI20063467 A MY PI20063467A MY PI20063467 A MYPI20063467 A MY PI20063467A MY 148619 A MY148619 A MY 148619A
Authority
MY
Malaysia
Prior art keywords
pusher
semiconductor device
test
device under
under test
Prior art date
Application number
MYPI20063467A
Other languages
English (en)
Inventor
Akihiko Ito
Tsuyoshi Yamashita
Tomoyuki Kanaumi
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of MY148619A publication Critical patent/MY148619A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
MYPI20063467A 2005-07-21 2006-07-20 Pusher, pusher unit and semiconductor testing apparatus MY148619A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/013409 WO2007010610A1 (ja) 2005-07-21 2005-07-21 プッシャ、プッシャユニットおよび半導体試験装置

Publications (1)

Publication Number Publication Date
MY148619A true MY148619A (en) 2013-05-15

Family

ID=37668499

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20063467A MY148619A (en) 2005-07-21 2006-07-20 Pusher, pusher unit and semiconductor testing apparatus

Country Status (6)

Country Link
US (1) US7804316B2 (ja)
JP (1) JPWO2007010610A1 (ja)
KR (1) KR20100017958A (ja)
MY (1) MY148619A (ja)
TW (1) TW200704940A (ja)
WO (1) WO2007010610A1 (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY148803A (en) 2007-02-23 2013-05-31 Advantest Corp Electronic component pressing device and electronic component test apparatus
JP5282930B2 (ja) * 2007-10-09 2013-09-04 住友電気工業株式会社 光素子温度特性検査装置
WO2009101706A1 (ja) * 2008-02-15 2009-08-20 Advantest Corporation マッチプレートベース部および本体部、電子部品ハンドリング装置、ならびにマッチプレート本体部およびテスト部ユニットの交換治具および交換方法
US20100066395A1 (en) 2008-03-13 2010-03-18 Johnson Morgan T Wafer Prober Integrated With Full-Wafer Contacter
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
JPWO2011007419A1 (ja) * 2009-07-14 2012-12-20 株式会社アドバンテスト 電子部品押圧装置、電子部品試験装置及びインタフェース装置
KR101104413B1 (ko) * 2009-09-25 2012-01-16 세크론 주식회사 반도체 소자 테스트용 접속 장치 및 이를 포함하는 테스트 핸들러
JP5910303B2 (ja) * 2012-05-21 2016-04-27 三菱電機株式会社 半導体検査治具
KR101936348B1 (ko) * 2012-09-17 2019-01-08 삼성전자주식회사 급속 온도 변환이 가능한 테스트 핸들러 및 그를 이용한 반도체 소자의 테스트 방법
KR101532391B1 (ko) * 2014-04-10 2015-06-30 주식회사 아이에스시 푸셔 장치
JP6445340B2 (ja) * 2015-02-06 2018-12-26 株式会社エンプラス 電気部品用ソケット
US9921265B2 (en) 2015-12-18 2018-03-20 Sensata Technologies, Inc. Thermal clutch for thermal control unit and methods related thereto
KR20180101476A (ko) 2016-01-08 2018-09-12 에어 테스트 시스템즈 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
JP6790768B2 (ja) * 2016-11-30 2020-11-25 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP2018081021A (ja) * 2016-11-17 2018-05-24 三菱電機株式会社 押さえ治具
KR102295094B1 (ko) * 2017-10-01 2021-08-31 (주)아테코 전자부품소자 테스트 온도 조절 장치와 방법, 테스트 챔버의 푸싱 장치, 및 전자부품 테스트 장치
KR20200012211A (ko) 2018-07-26 2020-02-05 삼성전자주식회사 반도체 소자 테스트 시스템, 반도체 소자 테스트 방법, 및 반도체 소자 제조 방법
JP7270348B2 (ja) * 2018-09-10 2023-05-10 三菱電機株式会社 電気特性検査治具
KR102185035B1 (ko) * 2019-07-02 2020-12-01 세메스 주식회사 반도체 패키지 테스트 장치
TWI734238B (zh) * 2019-10-29 2021-07-21 鴻勁精密股份有限公司 分類設備及其溫控裝置
KR102281297B1 (ko) * 2019-11-13 2021-07-23 주식회사 아이에스시 전기적 검사를 위한 푸셔장치
KR102329619B1 (ko) * 2020-01-20 2021-11-22 주식회사 제너릭스 반도체 소자 테스트 장비용 푸셔 장치
TWI744205B (zh) * 2021-03-16 2021-10-21 力成科技股份有限公司 測試分類機的共用型匹配板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3099254B2 (ja) * 1994-02-28 2000-10-16 安藤電気株式会社 浮動機構つき吸着ハンドおよび搬送接触機構
JPH0933606A (ja) * 1995-07-20 1997-02-07 Shin Etsu Polymer Co Ltd 半導体素子検査用治具
JPH09175647A (ja) 1995-10-27 1997-07-08 Advantest Corp 半導体デバイス搬送処理装置
US5640303A (en) * 1995-10-30 1997-06-17 Precision Connector Designs, Inc. Interconnection apparatus for semiconductor/integrated circuit devices
JPH1058367A (ja) 1996-08-23 1998-03-03 Advantest Corp Ｉｃ搬送装置
JP3951436B2 (ja) * 1998-04-01 2007-08-01 株式会社アドバンテスト Ｉｃ試験装置
JPH11329646A (ja) * 1998-05-15 1999-11-30 Jsr Corp 検査装置
JPH11344527A (ja) * 1998-06-02 1999-12-14 Ando Electric Co Ltd 高温ハンドラの測定機構
JP4100790B2 (ja) 1998-12-08 2008-06-11 株式会社アドバンテスト 電子部品吸着装置および電子部品試験装置
US6301097B1 (en) * 1999-07-27 2001-10-09 International Business Machines Corporation Inflatable sealing system for low temperature electronic module
JP4327335B2 (ja) * 2000-06-23 2009-09-09 株式会社アドバンテスト コンタクトアームおよびこれを用いた電子部品試験装置
JP2002160187A (ja) * 2000-11-24 2002-06-04 Seiko Epson Corp 保持装置、搬送装置、ｉｃ検査装置、保持方法、搬送方法及びｉｃ検査方法
JP2002174658A (ja) 2000-12-05 2002-06-21 Advantest Corp ハンドラおよび電子部品試験装置

Also Published As

Publication number Publication date
US7804316B2 (en) 2010-09-28
TW200704940A (en) 2007-02-01
WO2007010610A1 (ja) 2007-01-25
US20090102497A1 (en) 2009-04-23
JPWO2007010610A1 (ja) 2009-01-29
KR20100017958A (ko) 2010-02-16

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